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汽車電源管理 IC (PMIC) 產業 (2023)
市場調查報告書
商品編碼
1238861

汽車電源管理 IC (PMIC) 產業 (2023)

Automotive Power Management Integrated Circuits (PMIC) Industry Report, 2023
出版日期: | 出版商: ResearchInChina | 英文 280 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

本報告對全球和中國汽車電源管理集成電路 (PMIC) 行業進行了研究和分析，提供了市場規模、競爭格局、公司概況等信息。

內容

第 1 章汽車電源管理 IC (PMIC) 概述

  • 模擬芯片概述
    • 模擬芯片：電源管理 IC (PMIC) 和信號鏈 IC
    • 全球模擬芯片市場競爭格局
    • 全球模擬芯片市場規模
    • 中國模擬芯片市場競爭格局：國產化興起
    • 中國模擬芯片市場規模
    • 加速中國仿真芯片發展的主要因素
    • 中國模擬芯片廠商收入結構對比
    • 模擬芯片在汽車電子中的應用
  • 汽車 PMIC
    • 什麼是電源管理？
    • PMIC 分類
    • 全球 PMIC 競爭格局
    • 中國 PMIC 本土化的演變
    • 中國部分 PMIC 供應商
    • PMIC在汽車電子中的應用
    • 汽車 PMIC 需要高性能
    • 車用PMIC量產安裝
    • 中國PMIC企業快速進入汽車供應鏈
    • 中國PMIC企業密集推出產品
    • 中國PMIC企業汽車業務佈局
  • 中國汽車芯片的政策和認證標準
    • 中國汽車芯片標準化政策現狀及方向
    • 解讀汽車芯片要求
    • 中國汽車PMIC認證標準
    • 汽車 PMIC 功能安全標準 - ISO 26262
    • 汽車 PMIC 認證測試標準 - AEC-Q100
    • 汽車 PMIC 生產測試
  • PMIC在汽車上的應用
    • PMIC在汽車電子中的應用
    • 汽車PMIC應用場景一：智能座艙
    • 汽車PMIC應用場景二：電機控制器
    • 汽車PMIC應用場景三：車載充電器
    • 汽車PMIC應用場景四：域控制器
    • 汽車PMIC應用場景五：車載充電器

第2章汽車PMIC製造工藝

  • 汽車PMIC產業生產經營模式
  • 製造汽車 PMIC

第 3 章汽□□車 PMIC（按類型）

  • PMIC的分類及作用
  • PMIC 市場規模：按類型
  • 交流/直流芯片
  • DC/DC 芯片
  • 電池監控 IC (BMIC)
  • 驅動芯片

第4章車用PMIC的主要問題

  • 籌碼不足
  • 車用PMIC技術發展方針

第五章海外車用PMIC供應商

  • Texas Instruments
  • Infineon
  • ADI
  • MPS
  • STMicroelectronics
  • Onsemi
  • Renesas

第6章中國汽車PMIC供應商

  • Joulwatt
  • Halo Microelectronics
  • Shanghai YCT Electronics
  • SGMICRO
  • 3PEAK
  • Silicon Content Technology
  • Silergy
  • Awinic
  • ETA Semiconductor
簡介目錄
Product Code: XX002

Automotive PMIC research: the process of domestic automotive PMICs replacing foreign ones in China in the "crisis of chip shortage".

Automotive power management integrated circuits (PMIC) find broad application in vehicle intelligent cockpits, autonomous driving, body electronics, clusters and entertainment systems, lighting systems, and BMS. By product, PMICs fall into AC/DC, DC/DC, LDO, driver IC, and battery management IC.

The enormous supply gap in automotive power battery management system AFE ICs creates a strong desire to replace foreign products in China.

Among automotive PMICs, AFE ICs for battery management systems (BMS) are in the shortest supply. The analog front end (AFE) IC is the most important device in BMS, responsible for collecting voltage and temperature of battery cells. AFE IC uses specific algorithms to estimate battery parameters (e.g., SOC and SOH), and sends the results to the control chip.

(1) Demand for automotive AFE ICs: in the evolution from 400V to 800V platform, the demand for AFE ICs doubles.

Considering endurance range and charging efficiency of new energy vehicles, mainstream automakers have begun to deploy high-voltage platforms. The evolution from the current mainstream 400V platform to 800V platform has become a megatrend. For higher voltage requires an almost equal proportion of more battery cells in series, the demand for AFE ICs thus surges. It is expected that the platform voltage will increase from 400V to 800V, doubling the demand for automotive AFE ICs.

(2) Supply of automotive AFE ICs: the Chinese market relies on imports, creating a huge gap, so replacing foreign products with the homemade is a matter of great urgency.

High technical barriers, high automotive certification requirements, big challenges, and long cycle are constraints on the mass production of automotive AFE ICs in China. More than 90% of the AFE ICs used in vehicle power batteries still need to be imported. This market is monopolized by foreign analog chip giants like TI, ADI and Infineon. Chinese AFE IC vendors still make initial deployments in the automotive power battery field.

As a mainstream supplier in the automotive battery management integrated circuits (BMIC) market, TI has extended its order delivery time to 2023 as its BQ Series chips are out of stock and become more expensive, producing a large gap in the market.

Due to the gap between supply and demand in the Chinese automotive AFE IC market, domestic terminal manufacturers and lithium battery suppliers with strong demand for homemade chips are trying to enter the power BMIC segment from different angles.

Chipways: it has made several breakthroughs in core technologies of BMS chipsets, including automotive BMS AFE sampling chip (ASIL C/D), automotive BMS digital isolation and communication interface chip, and automotive 32-bit microcontroller unit (MCU), and can provide complete grouped software development tools for product development.

Chipways' XL8806/XL8812 series automotive battery pack monitor chips can meet both the AEC-Q100 automotive reliability standard and the ISO 26262 ASIL-C automotive functional safety standard. With LQFP 48 package, they can work in a temperature range of -40°C~125°C, single chip supporting 4 to 12 series of batteries. They adopt the high-precision Sigma Delta ADC method with measurement accuracy up to ±1.5mV, and support multiple series of chips and master-slave reversible two-way communication.

The XL8814/XL8816/XL8818 series automotive battery pack monitor chips can meet the AEC-Q100 automotive reliability standard and the ISO 26262 ASIL-D automotive functional safety standard. They add another more than 30 safety mechanisms, reaching the ASIL D functional safety level. While ensuring the measurement accuracy, they increase the monitoring strings on a single chip. They support up to 14/16/18 battery strings in series, and control the measurement time within 120us. They feature the maximum built-in equalizing current of 400mA, and also add such capabilities as busbar monitoring, sleep monitoring and reverse wake-up.

Datang NXP Semiconductors (DNS): DNB1168 is a BMS AFE IC that integrates voltage monitoring, temperature monitoring, and AC impedance monitoring. It supports 250 rings of cascading chips, and daisy chain communication, and meets automotive certification, having passed the ISO 26262:2018 ASIL-D certification. For example, for thermal runaway that is hard to control in power batteries, DNB1168 solution uses the AC impedance monitoring function for rapid detection of thermal runaway. Compared with the conventional NTC (thermocouple) method, AC impedance monitoring can provide a second-level response, which greatly improves the safety threshold of power batteries and prolongs the service life of batteries.

DNS DNB1168 series automotive AFE ICs offer three benefits in application, namely, material saving, space saving, and faster and safer 3D monitoring. They are applicable to the BMS of various types of electric vehicles like BEV, EREV, PHEV, and HEV. DNB1168 now has engineering samples available and will start volume production in 2023.

BYD Semiconductor: in 2020, it unveiled BF8X15A Series, its first-generation 16-section automotive AFE IC which delivers accuracy of ±2.5mV, conforms to the ISO 26262 functional safety standard, and meets the AEC-Q100 Grade 1.

In China automotive DC/DC ICs will enter the cycle of replacing foreign ones.

DC/DC ICs have a wide range of uses in automotive electronics, and apply to scenarios from vehicle intelligent cockpits, charging piles and motor controllers to on-board chargers and automotive lighting. At present, Chinese PMIC vendors successively achieve mass production of automotive products in categories like LDO and DC/DC.

For vehicle charging, Southchip has launched SC8101Q series automotive 32V/5A synchronous step-down converter, and SC8701Q series automotive buck-boost chip, which can be used in ECUs for 60W wired fast charging and ADAS 360° surround view system to power cameras, as well as vehicle wireless charging. Currently they have been adopted by many Tier 1 suppliers, and have been seen in models of multiple brands like BYD, SAIC-GM, FAW Hongqi and Hyundai. They will be mounted on several overseas models soon.

Chinese fabs make breakthroughs in BCD process, and the" crisis of chip shortage" revs up the localization of automotive PMICs.

PMICs pose relatively low requirements for manufacturing process instead of following Moore's Law. Compared with other types of integrated circuits, PMICs are a relatively mature and stable segment. At present, the mainstream mature process of PMICs is 8-inch process with nodes ranging from 0.32micro m to 90nm. Fabs often use the special fabrication process of BCD (Bipolar-CMOS-DMOS), with many product numbers and types available. The market is highly fragmented.

In 2022, there was a structural shortage of chips in the automotive industry. Wherein, the 8-inch PMIC production capacity with mature process nodes above 0.18um felt much pinch. Giant IDMs like TI, Infineon, ADI, STMicroelectronics and NXP boast most automotive PMIC capacity. Other chip design firms (Fabless mode) need to obtain capacity from wafer foundries.

In China, SMIC, GTA Semiconductor, HHGrace and Nexchip Semiconductor among others all can provide PMIC wafer foundry services, and they are also stepping up the expansion of production lines with mature and characteristic process. In 2022, SMIC completed development of 55nm BCD process platform (high-voltage display driver platform), and introduced to customers for mass production. The vendor will play an extremely important role in industrial control, intelligent vehicles, display drivers, and power management. The current mainstream BCD process in the world is 180/130/90nm, and the industry's top level is 60nm.

To deal with the surging demand from automotive and the insufficient capacity of automotive chips, wafer foundries like TSMC and UMC expand their automotive chip capacity. International IDMs have started large-scale capacity expansion while deploying their automotive chip capacity.

At present, the supply and demand in some automotive PMIC segments has improved, and the prices of some automotive chips have begun to be lowered, including driver ICs (e.g., LED driver and motor driver), PMICs, and some control ICs. Yet in the process of switching from fuel-powered vehicles to electric ones, the demand for the automotive products remains relatively stable, and the price will not take a nosedive.

This "crisis of chip shortage" buys more time for Chinese PMIC vendors to deploy automotive electronics and make breakthroughs in automotive PMICs, which accelerates the replacement of foreign automotive PMICs. Moreover, automakers also need to re-examine their industrial layout strategies in special circumstances, especially in cross-regional production and transportation of parts and components. The localization of the components supply chain may be more beneficial to organizing the whole supply chain, and build synergy with local vehicle dealers. Once force majeure hinders normal vehicle sales, components will also fell the pinch simultaneously. The big mismatch between supply and demand in the automotive PMIC market gives Chinese PMIC vendors scope for entry into the supply chain of the automotive industry.

Table of Contents

1 Overview of Automotive Power Management Integrated Circuits (PMIC)

  • 1.1 Overview of Analog Chips
    • 1.1.1 Analog Chips: Power Management Integrated Circuits (PMIC) and Signal Chain Integrated Circuits
    • 1.1.2 Competitive Landscape of Global Analog Chip Market
    • 1.1.3 Global Analog Chip Market Size
    • 1.1.4 Competitive Landscape of Chinese Analog Chip Market: Emerging Localization
    • 1.1.5 China's Analog Chip Market Size
    • 1.1.6 Main Factors for the Accelerated Development of Simulation Chips Made in China
    • 1.1.7 Revenue Structure of Chinese Analog Chip Vendors and Comparison between Them
    • 1.1.8 Application of Analog Chips in Automotive Electronics
  • 1.2 Automotive PMIC
    • 1.2.1 What Is Power Management?
    • 1.2.2 Classification of PMICs
    • 1.2.3 Global PMIC Competitive Landscape
    • 1.2.4 Evolution of PMIC Localization in China
    • 1.2.5 Some PMIC Vendors in China
    • 1.2.6 Application of PMICs in Automotive Electronics
    • 1.2.7 Automotive PMICs Require High Performance
    • 1.2.8 Mass Production and Installation of Automotive PMICs
    • 1.2.9 Chinese PMIC Companies Enter the Vehicle Supply Chain Quickly
    • 1.2.10 Chinese PMIC Companies Launch Products Intensively
    • 1.2.11 Automotive Business Layout of Chinese PMIC Companies
  • 1.3 China's Policies and Certification Standards for Automotive Chips
    • 1.3.1 Status Quo and Orientation of Automotive Chip Standardization Policies in China
    • 1.3.2 Interpretation of Automotive Chip Requirements
    • 1.3.3 China's Certification standards for Automotive PMICs
    • 1.3.4 Functional Safety Standard for Automotive PMICs - ISO 26262
    • 1.3.5 Certification Test Standard for Automotive PMICs - AEC-Q100
    • 1.3.6 Production Testing of Automotive PMICs
  • 1.4 Application of PMICs in Vehicles
    • 1.4.1 Application of PMICs in Automotive Electronics
    • 1.4.2 Automotive PMIC Application Scenario 1: Intelligent Cockpits
    • 1.4.3 Application Solutions of PMIC Vendors for Intelligent Cockpits
    • 1.4.4 Intelligent Cockpit PMIC Application Solutions: ETA Semiconductor Helps Tesla's Automotive Wireless Microphone
    • 1.4.5 Automotive PMIC Application Scenario 2: Motor Controllers
    • 1.4.6 Motor Controller PMIC Application Solutions (1)
    • 1.4.7 Motor Controller PMIC Application Solutions (2)
    • 1.4.8 Automotive PMIC Application Scenario 3: On-board Chargers
    • 1.4.9 Automotive PMIC Application Scenario 4: Domain Controllers
    • 1.4.10 Application Solutions of PMIC Vendors for Domain Controllers
    • 1.4.11 PMIC Solutions for Autonomous Driving Domains (1)
    • 1.4.12 PMIC Solutions for Autonomous Driving Domains (2)
    • 1.4.13 PMIC Solutions for Autonomous Driving Domains (3)
    • 1.4.14 PMIC Solutions for Autonomous Driving Domains (4)
    • 1.4.15 Automotive PMIC Application Scenario 4: Tail Lights and Ambient Lights
    • 1.4.16 Application Solutions of PMIC Vendors for Automotive Electronic Lighting
    • 1.4.17 Automotive Lighting PMIC Solutions: Microchip's Automotive LED Lighting Solutions
    • 1.4.18 Automotive PMIC Application Scenario 5: On-board Chargers
    • 1.4.19 Development History of On-board Wired Charging
    • 1.4.20 Development History of On-board Wireless Charging
    • 1.4.21 Application Solutions of PMIC Vendors for On-board Charging
    • 1.4.22 PMIC Application Solutions for On-board Wired Charging

2 Manufacturing Processes of Automotive PMICs

  • 2.1 Production and Operation Models of Automotive PMIC Industry
    • 2.1.1 Development History of Production Models in the Semiconductor Industry
    • 2.1.2 Production and Operation Models of PMICs
    • 2.1.3 IDM of PMICs Made in China
    • 2.1.4 Streamlining of IDM Vendors toward Fab-lite Models
    • 2.1.5 IDM Vendors Change to Fab-lite Strategies (1)
    • 2.1.6 IDM Vendors Change to Fab-lite Strategies (2)
    • 2.1.7 Fabless Vendors Change to Fab-lite Models
    • 2.1.8 Fabless Vendors Deploy Fabless-lite
    • 2.1.9 Virtual IDM Model: Proprietary Technology and Process Platforms
    • 2.1.10 Comparison between IDM, Fabless and Virtual IDM Models
    • 2.1.11 Development Path of Business Models of Chinese PMIC Vendors
  • 2.2 Manufacturing of Automotive PMICs
    • 2.2.1 Manufacturing of Automotive PMICs: Chip Design, Wafer Foundry, Packaging & Testing
    • 2.2.2 IC Design of Automotive PMICs
      • 2.2.2.1 Development of China's Automotive PMIC Design Industry
      • 2.2.2.2 Development of China's PMIC Design Industry: Most Chinese Companies Are in the Stage of Small Batch Supply and R&D
      • 2.2.2.3 Comparison between Foreign Automotive PMIC Vendors (1)
      • 2.2.2.4 Comparison between Foreign Automotive PMIC Vendors (2)
      • 2.2.2.5 Comparison between Chinese Automotive PMIC Vendors (1)
      • 2.2.2.6 Comparison between Chinese Automotive PMIC Vendors (2)
      • 2.2.2.7 Supply System of Automotive PMICs: The Bargaining Power of Upstream Chip Vendors Becomes Stronger
      • 2.2.2.8 Reconstruction of China's Automotive PMIC Industry Chain: from "Led by Automakers" to "Led by Companies That Master Core Technologies and Key Links"
    • 2.2.3 Wafer Foundry of Automotive PMICs
      • 2.2.3.1 Eight Manufacturing Processes of Automotive PMICs
      • 2.2.3.2 Evolution of Analog Chip Process Platforms
      • 2.2.3.3 Mainstream Manufacturing Processes of Automotive PMICs: BCD Process
      • 2.2.3.4 Development Direction of BCD Process: High Voltage, High Power and High Density
      • 2.2.3.5 Isolation Technology of BCD Process
      • 2.2.3.6 Status Quo of Global BCD Process Platforms (1): BCD Process Evolution Diagram of Wafer Fabs
      • 2.2.3.7 Status Quo of Global BCD Process Platforms (2): TSMC and UMC Rank among the First Echelon of BCD Process in the Field of Wafer Foundry
      • 2.2.3.8 Status Quo of Global BCD Process Platforms (3): The BCD Process Platforms of Chinese Wafer Fabs Break through 55nm
      • 2.2.3.9 BCD Process Platform Development of Chinese Wafer Fabs
      • 2.2.3.10 Automotive PMIC Process Node: The 0.18-0.11micro m Mature Process of 8-inch Production Lines is the Mainstream
      • 2.2.3.11 Wafer Foundry of Automotive PMICs: 12-inch Production Lines Represent the Future Trend
      • 2.2.3.12 Layout of 12-inch Production Lines of PMIC Vendors and Fabs
      • 2.2.3.13 Gross Margin and Net Margin of major Wafer Fabs
    • 2.2.4 Packaging and Testing of Automotive PMICs
      • 2.2.4.1 Chip Packaging & Testing Process Flow
      • 2.2.4.2 Packaging Types of PMICs: Mainly BGA, QFP, SO and DIP
      • 2.2.4.3 Layout of Chinese PMIC Companies in the Field of Packaging and Testing: Fabless + Testing/Packaging

3 Automotive PMICs (by Type)

  • 3.1 Classification and Functions of PMICs
  • 3.2 PMIC Market Size (by Type)
  • 3.3 AC/DC Chips
    • 3.3.1 AC/DC Chips: Structure and Working Principle
    • 3.3.2 AC/DC Chips: Classification by Isolation or Not
    • 3.3.3 Competitive Landscape of Automotive AC/DC Chips
    • 3.3.4 Application of AC/DC Chips in Automotive Electronics: Charging Piles
    • 3.3.5 AC/DC Chips: AC Slow Charging
    • 3.3.6 AC/DC Chips: DC Fast Charging
    • 3.3.7 Charging Piles for New Energy Vehicles
    • 3.3.8 Downstream Customer Base of AC/DC Converters for New Energy Vehicles
  • 3.4 DC/DC Chips
    • 3.4.1 DC/DC Converters
    • 3.4.2 Application of DC/DC Converters in Electric Vehicles
    • 3.4.3 Classification of DC/DC Converter Chips
    • 3.4.4 Main Supporting Modes of DC/DC converters for New Energy Vehicles
    • 3.4.5 Downstream Customer Base of Automotive DC/DC Chips (1)
    • 3.4.6 Downstream Customer Base of Automotive DC/DC Chips (2)
    • 3.4.7 Key Performance Indicators of DC/DC Chips
    • 3.4.8 How to Select DC/DC Chips?
    • 3.4.9 DC/DC Chips: Mainstream Buck, Boost and Buck-Boost Switching Regulators
    • 3.4.10 Layout of Chinese Automotive Power Management DC/DC Chip Vendors (1)
    • 3.4.11 Layout of Chinese Automotive Power Management DC/DC Chip Vendors (2)
    • 3.4.12 DC/DC Chips: LDO Linear Regulators
    • 3.4.13 Options of Automotive LDO Linear Regulators
    • 3.4.14 Layout of Chinese Automotive LDO Linear Regulator Chip Vendors
  • 3.5 Battery Monitoring Integrated Circuit (BMIC)
    • 3.5.1 Battery Management System (BMS)
    • 3.5.2 Working Principle of Automotive BMS
    • 3.5.3 Comparison between BMS Solutions for New Energy Vehicles
    • 3.5.4 BMS Architectures: BMS Architectures Develop toward Domain Controllers
    • 3.5.5 Battery Monitoring Integrated Circuit (BMIC): Chip Composition Structure
    • 3.5.6 Battery Monitoring Integrated Circuit (BMIC)
    • 3.5.7 Wired BMS Chip Solutions (1): Tesla's BMS Design
    • 3.5.8 Wired BMS Chip Solutions (2): Tesla's BMS Design
    • 3.5.9 Wired BMS Chip Solutions (3): Tesla's BMS Design
    • 3.5.10 Wired BMS Chip Solutions (4): Summary
    • 3.5.11 Wireless BMS Chip Solutions (1): GM's wBMS
    • 3.5.12 Wireless BMS Chip Solutions (2): GM's wBMS
    • 3.5.13 Wireless BMS Chip Solutions (3): LG Innotek Plans to Start Mass Production of the Wireless BMS in 2024
    • 3.5.14 BMS IC Solutions (1): PI 12V Emergency Power Supply Solution
    • 3.5.15 BMS IC Solutions (2)
    • 3.5.16 BMS IC Solutions (3)
    • 3.5.17 Application of SBC in BMS: Main Functional Components of SBC
    • 3.5.18 Application of SBC in BMS: Application Advantages of SBC
    • 3.5.19 Cases Reflecting Application Defects of SBC in BMS
    • 3.5.20 AFE Chip in BMIC: Working Principle
    • 3.5.21 AFE Chip in BMIC: Mainstream Automakers deploy 800V Platforms to Drive the Demand for AFE Chips to Grow
    • 3.5.22 AFE Chip in BMIC: Global Market Size and ASP Estimation
    • 3.5.23 AFE Chip in BMIC: Major Foreign Suppliers and Product Options (1)
    • 3.5.24 AFE Chip in BMIC: Major Foreign Suppliers and Product Options (2)
    • 3.5.25 AFE Chip in BMIC: Typical Foreign Automotive AFE Chips (1)
    • 3.5.26 AFE Chip in BMIC: Typical Foreign Automotive AFE Chips (2)
    • 3.5.27 Automotive BMIC Development in China: Preliminary Layout
    • 3.5.28 Automotive BMIC Development in China: Deployment and Mass Production Cases of Chinese Automotive BMIC Vendors (1)
    • 3.5.29 Automotive BMIC Development in China: Deployment and mass production Cases of Chinese Automotive BMIC Vendors (2)
    • 3.5.30 China's AFE Chip Solutions: Datang NXP Semiconductors (DNS) Introduced an Automotive Single-cell Monitoring Chip to Electric Vehicles
    • 3.5.31 Chinese AFE Chip Solutions (1)
    • 3.5.32 Chinese AFE Chip Solutions (2)
    • 3.5.33 Automotive BMIC Development in China: Development Bottlenecks for Chinese Automotive BMIC
    • 3.5.34 Downstream Customers of BMIC in China: TOP10 Companies in China by BMS Installed Capacity
  • 3.6 Driver Chips
    • 3.6.1 Driver Chips: Classification by Application Field
    • 3.6.2 Working Principle of Motor Drive Chips
    • 3.6.3 Motor Drive of Driver Chips: Types and application of DC Motors in Vehicles
    • 3.6.4 Main Application Scenarios of DC Motors (1): Intelligent Chassis
    • 3.6.5 Main Application Scenarios of DC Motors (2): Body Control
    • 3.6.6 Evolution of Motor Drive Modes: Relay Drive --> Chip Drive
    • 3.6.7 Automotive Motor Driver Chips: Strong Customer Stickiness
    • 3.6.8 Major Downstream Customers of Automotive Motor Driver Chips (1)
    • 3.6.9 Major Downstream Customers of Automotive Motor Driver Chips (2)
    • 3.6.10 Automotive Motor Driver Chips: Major Foreign Suppliers and Product Options
    • 3.6.11 Automotive Motor Driver Chips: Domestic development and Major suppliers
    • 3.6.12 Motor Driver Chip Solutions (1)
    • 3.6.13 Motor Driver Chip Solutions (2)

4 key Problems of Automotive PMICs

  • 4.1 Chip Shortage
    • 4.1.1 Factors Affecting the Shortage and Price Hike of Automotive PMICs: Squeezed Capacity, Increased Demand
    • 4.1.2 Impact of Chip Shortage on the Automotive Industry: Reduced Output, Price Hike, Extended Delivery Cycle
    • 4.1.3 Capacity Utilization Rate amid Chip Shortage
    • 4.1.4 Capacity Utilization rate of Major Wafer Fabs
    • 4.1.5 Production Expansion amid Chip Shortage: The New Capacity Will Be Gradually Released in 2024
    • 4.1.6 Production Line Expansion and Construction of Wafer Fabs (1)
    • 4.1.7 Production Line Expansion and Construction of Wafer Fabs (2)
    • 4.1.8 Production Line Expansion and Construction of Wafer Fabs (3)
    • 4.1.9 Capacity Forecast: Global Wafer Capacity and Growth Rate, 2021-2025E
    • 4.1.10 Factors Limiting Capacity Expansion of Wafer Fabs: Silicon Wafers and Equipment
    • 4.1.11 PMIC Shortage: Chinese Vendors Accelerate Localization
    • 4.1.12 Future Supply of Automotive PMICs
  • 4.2 Development Direction of Automotive PMIC Technology
    • 4.2.1 Technology 1: High- and Low-voltage IC Technology
    • 4.2.2 Technology 2: Ultra-low Current Burst Mode Technology
    • 4.2.3 Technology 3: High-brightness LED Technology
    • 4.2.4 Technology 4: Low EMI (Electromagnetic Interference)
    • 4.2.5 Ways to Reduce EMI: A filter May Reduce the Switching Slew Rate
    • 4.2.6 Low EMI Solutions: TI's Low EMI Innovative Solution

5 Foreign Suppliers of Automotive PMICs

  • 5.1 Texas Instruments
    • 5.1.1 Profile
    • 5.1.2 PMIC Layout
    • 5.1.3 Automotive BMIC Layout
    • 5.1.4 Capacity Expansion: Faster Deployment in the Field of Automotive Electronics
    • 5.1.5 New Technical Breakthrough of Power Management Products in the Field of Low Static Power Consumption (1)
    • 5.1.6 New Technical Breakthrough of Power Management Products in the Field of Low Static Power Consumption (2)
  • 5.2 Infineon
    • 5.2.1 Profile
    • 5.2.2 Presence of Plants Worldwide
    • 5.2.3 Distribution of Downstream Customers
    • 5.2.4 BMS Solution: Highly Integrated System Solutions
    • 5.2.5 Some New Automotive PMICs
  • 5.3 ADI
    • 5.3.1 Profile
    • 5.3.2 Automotive PMIC Layout
    • 5.3.3 Automotive PMIC Application Solutions
  • 5.4 MPS
    • 5.4.1 Profile
    • 5.4.2 BCD Plus and Mesh Connect
    • 5.4.3 Development History
    • 5.4.4 Automotive PMIC Portfolio
    • 5.4.5 Application Layout of Automotive PMICs
    • 5.4.6 Integration of PMICs
  • 5.5 STMicroelectronics
    • 5.5.1 Profile
    • 5.5.2 Business Layout
    • 5.5.3 Core R&D Technology
    • 5.5.4 BCD Process Flow Chart
    • 5.5.5 Automotive PMIC Products
    • 5.5.6 Roadmap of Automotive Linear Regulators
  • 5.6 Onsemi
    • 5.6.1 Profile
    • 5.6.2 Capacity Expansion: Taking the Layout of SiC Devices in the Electric Drive Field as an Example
    • 5.6.3 Layout in the Field of Automotive Electronics
    • 5.6.4 Power Packaging Technology of Main Drive Modules
    • 5.6.5 Some New Automotive PMICs
  • 5.7 Renesas
    • 5.7.1 Profile
    • 5.7.2 Product Layout in the Field of Automotive Electronics
    • 5.7.3 Electric Automotive BMS Layout
    • 5.7.4 ASIL B Compliant Automotive Camera Solutions

6 Chinese Automotive PMIC Suppliers

  • 6.1 Joulwatt
    • 6.1.1 Profile
    • 6.1.2 Development History of Products
    • 6.1.3 Virtual IDM Operation Model
    • 6.1.4 Three Process Platforms
    • 6.1.5 Iteration of 7-55V BCD Process Platform
    • 6.1.6 Iteration of 10-200V BCD Process Platform
    • 6.1.7 Iteration of 10-700V BCD Process Platform
    • 6.1.8 Revenue Contribution of Process Platforms, 2019-2021
    • 6.1.9 PMIC Layout
    • 6.1.10 Automotive PMIC Application Layout
    • 6.1.11 Development Process of Automotive Chips
    • 6.1.12 Certified Automotive Products
    • 6.1.13 Automotive DC/DC Chip: JWQ5103
    • 6.1.14 Average Selling Prices of Main Products
    • 6.1.15 Main Application Technologies in the Field of Automotive Electronics
  • 6.2 Halo Microelectronics
    • 6.2.1 Profile
    • 6.2.2 Supply Chain Model: Fabless Model
    • 6.2.3 Stable Supply Chain Architecture
    • 6.2.4 Gross margin of Products
    • 6.2.5 Layout of Main PMIC Product Lines
    • 6.2.6 Automotive Electronics Layout
    • 6.2.7 Block Diagram of Power Management Application in Automotive Infotainment System
    • 6.2.8 Automotive DC/DC Converter Chip: HL7509 FNQ
    • 6.2.9 Proposed R&D projects for Automotive power management
  • 6.3 Shanghai YCT Electronics
    • 6.3.1 Profile
    • 6.3.2 PMIC Supply Chain Model
    • 6.3.3 Automotive PMIC Product Layout
  • 6.4 SGMICRO
    • 6.4.1 Profile
    • 6.4.2 Electronic Analog Chip Layout
    • 6.4.3 Electric Operation Model
    • 6.4.4 Production Process of Main Products
    • 6.4.5 PMICs (1)
    • 6.4.6 PMICs (2)
    • 6.4.7 Automotive Voltage Reference Chips
  • 6.5 3PEAK
    • 6.5.1 Profile
    • 6.5.2 Production and Operation Model: Fabless Model
    • 6.5.3 PMIC Layout
    • 6.5.4 Automotive Product Layout: Transformation of Old Products, R&D of New Products
    • 6.5.5 Application of Automotive Products in Minimum Basic System
    • 6.5.6 Application Scenarios of Automotive PMIC Solutions (1)
    • 6.5.7 Application Scenarios of Automotive PMIC Solutions (2)
    • 6.5.8 Automotive PMICs
  • 6.6 Silicon Content Technology
    • 6.6.1 Profile
    • 6.6.2 Four Product Lines in the Field of PMICs
    • 6.6.3 Automotive PMIC Layout
    • 6.6.4 PMIC Application Solutions for Automotive Intelligent Rearview Mirrors
  • 6.7 Silergy
    • 6.7.1 Profile
    • 6.7.2 Application Scenarios of Automotive PMICs (1)
    • 6.7.3 Application Scenarios of Automotive PMICs (2)
    • 6.7.4 Some Automotive PMICs
    • 6.7.5 Ultra-small PMIC Automotive Camera Solutions
  • 6.8 Awinic
    • 6.8.1 Profile
    • 6.8.2 Automotive Electronics Layout
    • 6.8.3 PMIC Production Model
    • 6.8.4 Self-built Low-temperature, Normal-temperature and High-temperature Chip Prober Production Lines
  • 6.9 ETA Semiconductor
    • 6.9.1 Profile
    • 6.9.2 Technology Development and Product Evolution
    • 6.9.3 Business Model: Fabless
    • 6.9.4 Unit Cost of Main Products
    • 6.9.5 Automotive PMIC Layout
    • 6.9.6 Ongoing Automotive Power Management Projects