全球熱管理組件市場規模、佔有率、成長分析，依類型（硬體和軟體）、依應用（消費性電子產品、汽車）- 2024-2031 年產業預測

2022年全球熱管理組件市場規模為113.5億美元，預計將從2023年的124.7億美元成長到2031年的265.4億美元，預測期間（2024-2031年）複合年成長率為9.9%。

由於許多企業的快速數字化，對筆記型電腦、平板電腦和智慧型手機等電子產品的需求不斷成長。熱管理組件對於控制溫度和避免過熱是必要的，因為這些設備在運作時會產生熱量。因此，由於對這些設備的需求不斷成長，熱管理組件的市場正在擴大。對節能解決方案日益成長的需求也推動了該行業的發展。

由於能源效率降低了成本並且對環境的負面影響較小，因此已成為許多行業的主要關注點。由於熱管理組件控制電子系統和設備的溫度，因此它們對於實現能源效率至關重要。使用熱管理組件有助於降低電子設備的能耗，這一事實推動了對熱管理組件的需求。

然而，市場也面臨一些困難，例如熱管理零件的價格昂貴以及最終用戶對其優勢的忽視。儘管存在這些障礙，預計未來幾年仍將有一些重要的趨勢和機會推動市場的成長。全球汽車產業的一個新興趨勢是電動和混合動力汽車的日益普及。為了控制這些汽車中電池和其他組件的溫度，需要熱管理組件。預計熱管理組件市場將隨著電動和混合動力車的需求而大幅成長。此外，由於人工智慧在熱管理系統中的廣泛使用以及對較小熱管理組件的需求不斷成長等因素，市場正在看到許多機會。

目錄

執行摘要

• 市場概況
• 命運之輪

研究方法論

• 資訊採購
• 二手和主要資料來源
• 市場規模估計
• 市場假設與限制

母公司市場分析

• 市場概況
• 市場規模
• 市場動態
  • 促進要素
  • 機會
  • 限制
  • 課題

主要市場洞察

• 技術分析
• 定價分析
• 供應鏈分析
• 價值鏈分析
• 市場生態系統
• 智慧財產權分析
• 貿易分析
• 啟動分析
• 原料分析
• 創新矩陣
• 管道產品分析
• 總體經濟指標
• 頂級投資分析
• 成功的關鍵因素
• 競爭程度

市場動態與展望

• 市場動態
  • 促進要素
  • 機會
  • 限制
  • 課題
• 監管環境
• 波特分析
• 對未來顛覆的特別見解

依類型分類的全球熱管理組件市場

• 市場概況
• 硬體和軟體

全球熱管理元件市場（依應用）

• 市場概況
• 消費性電子產品
• 汽車
• 航空航太和國防
• 衛生保健
• 工業的
• 其他

全球熱管理組件市場規模（依地區）

• 市場概況
• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 德國
  • 西班牙
  • 法國
  • 英國
  • 歐洲其他地區
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 亞太其他地區
• 拉丁美洲
  • 巴西
  • 拉丁美洲其他地區
• 中東和非洲 (MEA)
  • 海灣合作理事會國家
  • 南非
  • MEA 的其餘部分

競爭格局

• 前 5 名企業比較
• 2021 年關鍵參與者的市場定位
• 主要市場參與者所採取的策略
• 最佳制勝策略
• 近期市集活動
• 主要公司市佔率（%），2021年

主要公司簡介

• Laird Thermal Systems (UK)
• Delta Electronics, Inc. (Taiwan)
• Advanced Cooling Technologies, Inc. (US)
• Parker Hannifin Corporation (US)
• Vertiv Holdings Co (US)
• Fujipoly America Corporation (US)
• European Thermodynamics Ltd (UK)
• Zalman Tech Co. Ltd. (South Korea)
• Boyd Corporation (US)
• Master Bond Inc. (US)
• Wakefield-Vette, Inc. (US)
• Thermacore, Inc. (US)
• Henkel AG & Co. KGaA (Germany)
• Aavid Thermalloy, LLC (US)
• Cool Innovations, Inc. (US)
• Nvent Electric Plc (UK)
• Jaro Thermal (US)
• CUI Devices (US)
• TE Connectivity Ltd. (Switzerland)
• Molex, LLC (US)

Global Thermal Management Components Market size was valued at USD 11.35 Billion in 2022 and is poised to grow from USD 12.47 Billion in 2023 to USD 26.54 Billion by 2031, at a CAGR of 9.9% during the forecast period (2024-2031).

The demand for electronics like laptops, tablets, and smartphones is rising as a result of the quick digitization of many businesses. Thermal management components are necessary to control the temperature and avoid overheating because these devices produce heat while they are operating. Thus, the market for thermal management components is expanding due to the rising demand for these devices. The industry is also being driven by the increasing need for energy-efficient solutions.

Since energy efficiency lowers costs and has a little negative impact on the environment, it has become a major concern for many sectors. Because thermal management components control the temperature of electronic systems and devices, they are essential to attaining energy efficiency. The need for thermal management components is being driven by the fact that using these components helps to lower the energy consumption of electronic equipment.

The market does, however, also confront certain difficulties, such as the high price of thermal management parts and end users' ignorance of their advantages. Not withstanding these obstacles, a number of important trends and opportunities are predicted to drive the market's growth in the upcoming years. An emerging trend in the worldwide automotive industry is the growing popularity of electric and hybrid cars. To control the temperature of the battery and other components in these cars, thermal management components are needed. It is anticipated that the market for thermal management components will grow significantly along with the demand for electric and hybrid cars. Additionally, the market is seeing a number of opportunities due to factors including the expanding use of artificial intelligence in thermal management systems and the growing need for smaller thermal management components.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Thermal Management Components Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Thermal Management Components Market Segmental Analysis

Global Thermal Management Components Market is segmented on the basis of type, application, and region. By type, the market is segmented into hardware and software. By application, the market is segmented into consumer electronics, automotive, aerospace and defense, healthcare, industrial, and others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Thermal Management Components Market

Thermal management component demand is being driven by the increasing use of electronic devices, such as laptops, gaming consoles, tablets, smartphones, and automobile electronics. The necessity for efficient heat dissipation increases as these devices get smaller and more potent in order to avoid overheating and guarantee dependable operation.

Restraints in the Global Thermal Management Components Market

Thermoelectric coolers and high-performance heat sinks are examples of pricey advanced thermal management components. They may not be adopted as widely as they may be, particularly in marketplaces where prices are crucial. To meet market demands, manufacturers must strike a compromise between the performance and cost of their thermal management technologies.

Market Trends of the Global Thermal Management Components Market

Growing use of liquid cooling solutions: In high-power electronic applications, liquid cooling devices like liquid heat exchangers and cold plates are becoming more and more common. Better heat dissipation is provided by them in comparison to conventional air-cooling techniques. Liquid cooling technologies, for example, provide increased power densities and efficient thermal management in data centers and electric car battery cooling.

increasing emphasis on environmentally and energy-friendly solutions The development of energy- and environmentally-efficient thermal management components is becoming more and more important. This involves integrating energy-saving technologies like phase-change materials (PCMs) or thermoelectric coolers (TECs), which use waste heat for cooling purposes, with sustainable materials like bio-based thermal interface materials.

Table of Contents

Executive Summary

• Market Overview
• Wheel of Fortune

Research Methodology

• Information Procurement
• Secondary & Primary Data Sources
• Market Size Estimation
• Market Assumptions & Limitations

Parent Market Analysis

• Market Overview
• Market Size
• Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges

Key Market Insights

• Technology Analysis
• Pricing Analysis
• Supply Chain Analysis
• Value Chain Analysis
• Ecosystem of the Market
• IP Analysis
• Trade Analysis
• Startup Analysis
• Raw Material Analysis
• Innovation Matrix
• Pipeline Product Analysis
• Macroeconomic Indicators
• Top Investment Analysis
• Key Success Factor
• Degree of Competition

Market Dynamics & Outlook

• Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges
• Regulatory Landscape
• Porters Analysis
  • Competitive rivalry
  • Threat of Substitute Products
  • Bargaining Power of Buyers
  • Threat of New Entrants
  • Bargaining Power of Suppliers
• Skyquest Special Insights on Future Disruptions
  • Political Impact
  • Economic Impact
  • Social Impact
  • Technical Impact
  • Environmental Impact
  • Legal Impact

Global Thermal Management Components Market by Type

• Market Overview
• Hardware and software

Global Thermal Management Components Market by Application

• Market Overview
• Consumer electronics
• automotive
• aerospace and defense
• healthcare
• industrial
• and others

Global Thermal Management Components Market Size by Region

• Market Overview
• North America
  • USA
  • Canada
• Europe
  • Germany
  • Spain
  • France
  • UK
  • Rest of Europe
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America
  • Brazil
  • Rest of Latin America
• Middle East & Africa (MEA)
  • GCC Countries
  • South Africa
  • Rest of MEA

Competitive Landscape

• Top 5 Player Comparison
• Market Positioning of Key Players, 2021
• Strategies Adopted by Key Market Players
• Top Winning Strategies
  • By Development
  • By Company
  • By Year
• Recent Activities in the Market
• Key Companies Market Share (%), 2021

Key Company Profiles

• Laird Thermal Systems (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Delta Electronics, Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Advanced Cooling Technologies, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Parker Hannifin Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Vertiv Holdings Co (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Fujipoly America Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• European Thermodynamics Ltd (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zalman Tech Co. Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Boyd Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Master Bond Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Wakefield-Vette, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Thermacore, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Henkel AG & Co. KGaA (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Aavid Thermalloy, LLC (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Cool Innovations, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nvent Electric Plc (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jaro Thermal (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• CUI Devices (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• TE Connectivity Ltd. (Switzerland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Molex, LLC (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments