封面
市場調查報告書
商品編碼
1607657

印刷電路基板市場規模、佔有率、成長分析、按產品類型、按最終用戶、按產品、按層壓材料、按原料、按應用、按地區 - 產業預測,2024-2031年

Printed Circuit Board Market Size, Share, Growth Analysis, By Product Type, By End User, By Product, By Laminate Materials, By Raw Materials, By Application, By Region - Industry Forecast 2024-2031

出版日期: | 出版商: SkyQuest | 英文 165 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

2022年全球印刷基板市場規模為800億美元,預計從2023年的844億美元成長到2031年的1321億美元,在預測期內(2024-2031年)年複合成長率為5.7%。

截至2023年 10月,印刷基板(PCB)市場仍然是全球電子產業的基石,對幾乎所有電子設備和系統的運作非常重要。對智慧型手機和筆記型電腦等小工具的需求不斷成長是該成長的主要驅動力。此外,新興經濟體的人口成長和電子設備的激增推動對印刷基板的需求。由於工業自動化和下一代醫療設備等技術的進步,這些零件擴大應用於家電、汽車和IT/通訊等各種領域。特別是,印刷電路基板擴大在汽車領域得到採用,實現了行動裝置的無縫整合,並透過電池監控和氣候控制等功能改善了用戶體驗。

目錄

介紹

  • 研究目的
  • 調查範圍
  • 定義

調查方法

  • 資訊採購
  • 二級資料和一級資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 依細分市場的機會分析

市場動態及展望

  • 市場概況
  • 市場規模
  • 市場動態
    • 促進因素和機會
    • 抑制因素和挑戰
  • 波特分析與影響
    • 競爭公司之間的敵對關係
    • 替代品的威脅
    • 買方議價能力
    • 新進入者的威脅
    • 供應商的議價能力

主要市場考察

  • 關鍵成功因素
  • 競爭程度
  • 主要投資機會
  • 市場生態系統
  • 市場吸引力指數(2023)
  • PESTEL分析
  • 總體經濟指標
  • 價值鏈分析
  • 價格分析
  • 技術進步
  • 監管環境
  • 案例研究
  • 專利分析
  • 貿易分析

印刷電路基板市場規模:依產品類型及年複合成長率(2024-2031)

  • 市場概況
  • 標準多層PCB
  • 剛性1-2層PCB
  • HDI/微孔/堆積
  • 軟性PCB
  • 軟硬PCB
  • 其他

印刷基板市場規模:依最終用戶和年複合成長率(2024-2031)

  • 市場概況
  • 工業電子
  • 衛生保健
  • 航太和國防
  • 車輛
  • 家電
  • 其他

印刷基板市場規模:依產品及年複合成長率(2024-2031)

  • 市場概況
  • 剛性PCB
  • Standard Multiplayer
  • HDI/堆積/Macrovia
  • 軟性電路
  • IC基板
  • 其他

印刷基板市場規模:依層壓材料及年複合成長率(2024-2031)

  • 市場概況
  • FR-4
  • FR-4高Tg
  • FR-4 無鹵
  • 標準及其他
  • 撓性
    • PI
    • PET
  • 複合材料
  • 其他

印刷基板市場規模:依原料及年複合成長率(2024-2031)

  • 市場概況
  • 玻璃布
  • 環氧樹脂
  • 牛皮紙
  • 酚醛樹脂
  • 聚醯亞胺薄膜

印刷基板市場規模:依應用與年複合成長率(2024-2031)

  • 市場概況
  • 工業電子
  • 航太和國防
  • 資訊科技和通訊
  • 車輛
  • 家電
  • 其他

印刷基板市場規模:依地區及年複合成長率(2024-2031)

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 西班牙
    • 法國
    • 義大利
    • 其他歐洲國家地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地區
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東、非洲

競爭資訊

  • 前5名企業比較
  • 主要企業市場定位(2023年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市場佔有率分析(2023)
  • 主要企業簡介
    • 公司簡介
    • 產品系列分析
    • 依細分市場分類的佔有率分析
    • 收益與前一年同期比較(2021-2023)

主要企業簡介

  • Nippon Mektron Ltd.(Japan)
  • TTM Technologies, Inc.(United States)
  • Unimicron Technology Corporation(Taiwan)
  • Zhen Ding Technology Holding Limited(Hong Kong)
  • Young Poong Electronics Co., Ltd.(South Korea)
  • Samsung Electro-Mechanics Co., Ltd.(South Korea)
  • Ibiden Co., Ltd.(Japan)
  • Compeq Manufacturing Co., Ltd.(Taiwan)
  • Tripod Technology Corporation(Taiwan)
  • Daeduck GDS Co., Ltd.(South Korea)
  • Fujikura Ltd.(Japan)
  • Sumitomo Electric Industries, Ltd.(Japan)
  • CMK Corporation(Taiwan)
  • AT&S Austria Technologie & Systemtechnik AG(Austria)
  • Chin-Poon Industrial Co., Ltd.(Taiwan)
  • Kingboard Laminates Holdings Limited(Hong Kong)
  • Shennan Circuits Co., Ltd.(China)
  • WUS Printed Circuit Co., Ltd.(China)
  • KCE Electronics Public Company Limited(Thailand)
  • Multek Corporation(United States)

結論和建議

簡介目錄
Product Code: SQSG45K2010

Global Printed Circuit Board Market size was valued at USD 80 billion in 2022 and is poised to grow from USD 84.4 billion in 2023 to USD 132.1 billion by 2031, growing at a CAGR of 5.7% during the forecast period (2024-2031).

As of October 2023, the printed circuit board (PCB) market remains a cornerstone of the global electronics industry, vital for the functionality of nearly all electronic devices and systems. The rising demand for gadgets like smartphones and laptops is a primary driver of this growth. Additionally, population expansion and the increased adoption of electronics in developing economies are fueling the demand for PCBs. These components are increasingly utilized across diverse sectors, including consumer electronics, automotive, and IT & telecommunications, largely due to advancements in technology such as industrial automation and next-gen medical devices. Notably, the automotive sector is witnessing heightened PCB adoption, enabling seamless integration of mobile devices, enhancing user experience through features like battery monitoring and climate control.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Printed Circuit Board Market Segmental Analysis

Global Printed Circuit Board Market is segmented by Product Type, End User, Product, Laminate Materials, Raw Materials, Application and Region. Based on Product Type, the market is segmented into Standard Multiplayer PCBs, Rigid 1-2 Sided PCBs, HDI/Micro-via/Build-Up, Flexible PCBs, Rigid-Flex PCBs, Others. Based on End User, the market is segmented into Industrial Electronics, Healthcare, Aerospace& Defence, Automotive, Consumer Electronics, Others. Based on Product, the market is segmented into Rigid PCBs, Standard Multiplayer, HDI/Build-up/Microtia, Flexible Circuits, IC Substrate, Others. Based on Raw Material, the market is segmented into Glass Fabric, Epoxy Resin, Kraft Paper, Phenolic Resin, Polyimide Film. Based on Application, the market is segmented into Industrial Electronics, Aerospace & Defence, IT and Telecom, Automotive, Consumer Electronics, Others. Based on Region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Printed Circuit Board Market

One of the key drivers propelling the Global Printed Circuit Board (PCB) market is the increasing demand from the automotive sector. The integration of micro sensors allows automotive manufacturers to incorporate advanced technologies that enhance safety features and telecommunications capabilities. Modern vehicles are equipped with a wide array of electronic components, including sensors, cameras, various radar systems (such as ARRAD), infotainment systems, and sophisticated driver assistance systems (ADAS) for commercial vehicles. As these technological advancements continue to evolve, the need for high-performance, reliable PCBs is expected to rise significantly, further stimulating market growth in the industry.

Restraints in the Global Printed Circuit Board Market

The global Printed Circuit Board market faces significant restraints primarily due to the volatility in the supply and pricing of raw materials. This fluctuation imposes substantial cost pressures on manufacturers, hampering their growth potential. Additionally, unfavorable bilateral trade agreements, such as ongoing trade wars between major economies, adversely impact the broader electronic components market. Such deteriorating trade relations not only affect the overall demand for electronic products but also create imbalances in the supply-demand dynamics within the industry. Consequently, these factors collectively hinder the market's progress and development, posing challenges for manufacturers and stakeholders.

Market Trends of the Global Printed Circuit Board Market

The Global Printed Circuit Board (PCB) market is witnessing a significant trend towards the miniaturization of electronic components, driven by the rising demand for advanced electronic products that require power-efficient, low-data transfer capabilities. As industries increasingly prioritize compact, high-density circuit designs, the use of High-Density Interconnect (HDI) substrates has surged. These advanced PCBs enable complex interconnections between an array of miniature components, facilitating improved signal transmission and overall performance. Consequently, this trend enhances the functionality of modern devices across various sectors, positioning the PCB market for robust growth as manufacturers adapt to evolving technological demands and consumer preferences.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2023
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technological Advancement
  • Regulatory Landscape
  • Case Studies
  • Patent Analysis
  • Trade Analysis

Printed Circuit Board Market Size by Product Type & CAGR (2024-2031)

  • Market Overview
  • Standard Multilayer PCBs
  • Rigid 1-2 Sided PCBs
  • HDI/Micro-via/Build-up
  • Flexible PCBs
  • Rigid-Flex PCBs
  • Others

Printed Circuit Board Market Size by End User & CAGR (2024-2031)

  • Market Overview
  • Industrial Electronics
  • Healthcare
  • Aerospace & Defence
  • Automotive
  • Consumer Electronics
  • Others

Printed Circuit Board Market Size by Product & CAGR (2024-2031)

  • Market Overview
  • Rigid PCBs
  • Standard Multiplayer
  • HDI/Build-Up/ Microtia
  • Flexible Circuits
  • IC Substrate
  • Others

Printed Circuit Board Market Size by Laminate Materials & CAGR (2024-2031)

  • Market Overview
  • FR-4
  • FR-4 High Tg
  • FR-4 Halogen free
  • Standard and others
  • Flexible
    • PI
    • PET
  • Paper
  • Composites
  • Others

Printed Circuit Board Market Size by Raw Materials & CAGR (2024-2031)

  • Market Overview
  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Phenolic Resin
  • Polyimide Film

Printed Circuit Board Market Size by Application & CAGR (2024-2031)

  • Market Overview
  • Industrial Electronics
  • Aerospace and Defence
  • IT and Telecom
  • Automotive
  • Consumer Electronics
  • Others

Printed Circuit Board Market Size & CAGR (2024-2031)

  • North America, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • US
    • Canada
  • Europe, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Product Type, End User, Product Laminate Materials, Raw Materials, Application
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (Product Type, End User, Product Laminate Materials, Raw Materials, Application)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Nippon Mektron Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • TTM Technologies, Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Unimicron Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Zhen Ding Technology Holding Limited (Hong Kong)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Young Poong Electronics Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Samsung Electro-Mechanics Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ibiden Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Compeq Manufacturing Co., Ltd. (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tripod Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Daeduck GDS Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fujikura Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Sumitomo Electric Industries, Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • CMK Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AT&S Austria Technologie & Systemtechnik AG (Austria)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Chin-Poon Industrial Co., Ltd. (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kingboard Laminates Holdings Limited (Hong Kong)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shennan Circuits Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • WUS Printed Circuit Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KCE Electronics Public Company Limited (Thailand)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Multek Corporation (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation