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市場調查報告書
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1647423

雷射鑽孔、切割、打標和雕刻市場規模、佔有率、技術成長分析、雷射加工技術、機器配置、垂直和地區 - 產業預測 2025-2032

Laser Drilling, Cutting, Marking and Engraving Market Size, Share, and Growth Analysis, By Technology, By Laser Processing Techniques, By Machine Configuration, By Verticals, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 242 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

2023 年雷射鑽孔、切割、打標和雕刻市場規模價值 50 億美元,預計將從 2024 年的 53.5 億美元成長到 2032 年的 91.9 億美元,預測期內(2025-2032 年)的複合年成長率為 7.0%。

雷射技術的使用正在透過雷射焊接、切割、打標、鑽孔和微加工等工藝改變各個工業領域,所有這些工藝都是利用放大光精確完成的。雷射的多功能性,包括可移動、固定和混合光束,使其能夠實現雕刻和蝕刻等各種各樣的應用。高功率雷射因其聚焦的光束而特別有效地汽化材料,這使得它們在半導體、電子、軍事、航太、汽車和建築等行業中必不可少。雷射器卓越的光束品質、耐用性和效率使其在從材料加工和品牌標識到複雜的微加工等廣泛應用領域中具有吸引力。隨著各行各業擴大採用雷射技術,其潛在影響不斷擴大,塑造製造和生產技術的未來。

目錄

介紹

  • 調查目的
  • 研究範圍
  • 定義

調查方法

  • 資訊採購
  • 資料和主要資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 細分機會分析

市場動態及展望

  • 市場概況
  • 市場規模
  • 市場動態
    • 促進因素和機會
    • 限制與挑戰
  • 波特的分析

主要市場考察

  • 關鍵成功因素
  • 競爭程度
  • 主要投資機會
  • 市場生態系統
  • 市場吸引力指數(2024 年)
  • PESTEL 分析
  • 總體經濟指標
  • 價值鏈分析
  • 定價分析

雷射鑽孔、切割、打標及雕刻市場規模(依技術及複合年成長率) (2025-2032)

  • 市場概況
  • 氣體雷射
  • 固體雷射
  • 半導體雷射
  • 其他

雷射鑽孔、切割、打標及雕刻市場規模(依雷射加工技術分類)及複合年成長率(2025-2032)

  • 市場概況
  • 雷射切割
  • 雷射鑽孔
  • 雷射加工
  • 雷射雕刻
  • 雷射打標
  • 其他

雷射鑽孔、切割、打標和雕刻市場規模(按機器配置和複合年成長率) (2025-2032)

  • 市場概況
  • 固定樑
  • 移動光束
  • 混合
  • 光柵模式
  • 向量

雷射鑽孔、切割、打標和雕刻市場規模(按垂直產業和複合年成長率分類)(2025-2032)

  • 市場概況
  • 航太
  • 建築學
  • 工具機
  • 家電
  • 其他

雷射鑽孔、切割、打標及雕刻市場規模(按地區)及複合年成長率(2025-2032)

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 西班牙
    • 法國
    • 英國
    • 義大利
    • 其他歐洲國家地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲國家
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東和非洲地區

競爭資訊

  • 前 5 家公司對比
  • 主要企業市場定位(2024年)
  • 主要市場參與者所採用的策略
  • 近期市場趨勢
  • 公司市場佔有率分析(2024 年)
  • 主要企業簡介
    • 公司簡介
    • 產品系列分析
    • 按細分市場分析市場佔有率
    • 收益與前一年同期比較對比(2022-2024 年)

主要企業簡介

  • IPG Photonics Corporation(US)
  • Trumpf GmbH+Co. KG(Germany)
  • Han's Laser Technology Industry Group Co., Ltd.(China)
  • ROFIN-SINAR Technologies Inc.(US)
  • LaserStar Technologies Corporation(US)
  • Epilog Laser(US)
  • Gravotech Marking SAS(France)
  • Trotec Laser GmbH(Austria)
  • Universal Laser Systems(US)
  • Bystronic Laser AG(Switzerland)
  • Amada Co., Ltd.(Japan)
  • Mazak Optonics Corporation(Japan)
  • Mitsubishi Electric Corporation(Japan)
  • Preco, LLC(US)
  • Control Laser Corporation(US)
  • GF Machining Solutions(Switzerland)
  • Prima Industrie SpA(Italy)
  • Jenoptik AG(Germany)

結論和建議

簡介目錄
Product Code: SQMIG20C2031

Laser Drilling, Cutting, Marking and Engraving Market size was valued at USD 5.0 billion in 2023 and is poised to grow from USD 5.35 billion in 2024 to USD 9.19 billion by 2032, growing at a CAGR of 7.0% during the forecast period (2025-2032).

The utilization of laser technology is transforming various industrial sectors through processes such as laser welding, cutting, marking, drilling, and micro-processing, all performed with precision using amplified light. The versatility of laser types, including moving, stationary, and hybrid beams, enables diverse applications like engraving and etching. High-power lasers are particularly effective in vaporizing materials due to their ability to deliver concentrated levels of irradiance, making them indispensable in industries such as semiconductors, electronics, military, aerospace, automotive, and architecture. The superior beam quality, durability, and efficiency of lasers enhance their appeal in a wide range of applications, from material processing and branding to intricate micro-processing. As industries increasingly adopt laser technology, its potential impact continues to grow, shaping the future of manufacturing and production techniques.

Top-down and bottom-up approaches were used to estimate and validate the size of the Laser Drilling, Cutting, Marking And Engraving market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Laser Drilling, Cutting, Marking And Engraving Market Segments Analysis

Global Laser Drilling, Cutting, Marking and Engraving Market is segmented by Technology, Laser Processing Techniques, Machine Configuration, Verticals and region. Based on Technology, the market is segmented into Gas Laser, Solid State Laser, Semiconductor Lasers and others. Based on Laser Processing Techniques, the market is segmented into Laser Cutting, Laser Drilling, Laser Machining, Laser Engraving, Laser Marking and others. Based on Machine Configuration, the market is segmented into Fixed beam, Moving Beam, Hybrid, Raster mode and Vector. Based on Verticals, the market is segmented into Mode Automotive, Aerospace, Architecture, Machine Tools, Consumer Electronics and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Laser Drilling, Cutting, Marking And Engraving Market

The Laser Drilling, Cutting, Marking, and Engraving market is poised for significant growth driven by the increasing consumer demand for high-quality and authentic products. This growth is further supported by the trend of miniaturizing microelectronic devices and the shifting preference towards laser-based material processing technologies over traditional methods. Moreover, the rising demand for mobile electronics and vehicles, coupled with the adoption of green laser devices for projection applications, is expected to play a crucial role in propelling the market forward. These factors collectively indicate a robust trajectory for the laser processing industry in the coming years.

Restraints in the Laser Drilling, Cutting, Marking And Engraving Market

The Laser Drilling, Cutting, Marking, and Engraving market faces several constraints that could impede its growth. Key challenges include a shortage of skilled technicians, inconsistent macroeconomic conditions, and significant ownership costs that encompass maintenance, implementation, and initial investment. Additionally, the high-power laser technology used in these processes presents its own set of difficulties. Environmental concerns, particularly those related to the inappropriate use of rare earth metals, further complicate the landscape. Collectively, these factors pose substantial barriers to the overall advancement of the laser processing sector, hindering its potential development and market expansion.

Market Trends of the Laser Drilling, Cutting, Marking And Engraving Market

The Laser Drilling, Cutting, Marking, and Engraving market is witnessing a significant trend driven by advancements in femtosecond laser technology. These lasers, capable of delivering high power with exceptional precision, are transforming material processing across various industries, particularly in automotive and aerospace sectors that increasingly utilize carbon fiber composites. The integration of high-speed motion systems enhances throughput while maintaining superior machining quality, essential for applications like drilling rivet holes without compromising material integrity. As demand for intricate, efficient, and high-quality processing solutions grows, the adoption of femtosecond lasers is expected to expand, leading to diverse applications and substantial market growth in the coming years.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global Laser Drilling, Cutting, Marking and Engraving Market Size by Technology & CAGR (2025-2032)

  • Market Overview
  • Gas Laser
  • Solid State Laser
  • Semiconductor Lasers
  • others

Global Laser Drilling, Cutting, Marking and Engraving Market Size by Laser Processing Techniques & CAGR (2025-2032)

  • Market Overview
  • Laser Cutting
  • Laser Drilling
  • Laser Machining
  • Laser Engraving
  • Laser Marking
  • others

Global Laser Drilling, Cutting, Marking and Engraving Market Size by Machine Configuration & CAGR (2025-2032)

  • Market Overview
  • Fixed beam
  • Moving Beam
  • Hybrid
  • Raster mode
  • Vector

Global Laser Drilling, Cutting, Marking and Engraving Market Size by Verticals & CAGR (2025-2032)

  • Market Overview
  • Mode Automotive
  • Aerospace
  • Architecture
  • Machine Tools
  • Consumer Electronics
  • others

Global Laser Drilling, Cutting, Marking and Engraving Market Size & CAGR (2025-2032)

  • North America (Technology, Laser Processing Techniques, Machine Configuration, Verticals)
    • US
    • Canada
  • Europe (Technology, Laser Processing Techniques, Machine Configuration, Verticals)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Technology, Laser Processing Techniques, Machine Configuration, Verticals)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Technology, Laser Processing Techniques, Machine Configuration, Verticals)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Technology, Laser Processing Techniques, Machine Configuration, Verticals)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • IPG Photonics Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Trumpf GmbH + Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Han's Laser Technology Industry Group Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ROFIN-SINAR Technologies Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • LaserStar Technologies Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Epilog Laser (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Gravotech Marking SAS (France)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Trotec Laser GmbH (Austria)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Universal Laser Systems (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Bystronic Laser AG (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Amada Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mazak Optonics Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mitsubishi Electric Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Preco, LLC (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Control Laser Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • GF Machining Solutions (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Prima Industrie S.p.A. (Italy)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Jenoptik AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations