市場調查報告書
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2030 年粘合片市場預測 - 按黏合材料、最終用戶和地區分類的全球分析Bonding Sheet Market Forecasts to 2030 - Global Analysis By Adhesive Material, End User and By Geography |
根據 Stratistics MRC 的數據,2023 年全球粘合片市場規模為 4.2253 億美元,預計到 2030 年將達到 7.9247 億美元,預測期內年複合成長率為 9.4%。
粘結片材是一面具有水泥塗層、用於表面塗層或粘結的片材或黏合。還有另一個彈出層可以防止初始抓握。成品有多種,但它們通常是反光且光滑的。它有多種名稱,包括片狀黏劑、無添加劑水泥和純黏劑。粘合片通常用於多面覆蓋物以粘合軟性內層或硬蓋層。它經常用於製造強度水槽、剛柔結合 PCB、粘合加強筋以及其他用於將軟性電路連接到不可彎曲軟性片材的組件。此外,它還用於複雜的疊加。
顯示螢幕、電路基板和其他零件都黏合在這些板上。粘合片也擴大用於固定和固定電子控制和 ADAS(高級駕駛員輔助系統)零件的電子零件組件。由於全球汽車行業的擴張、對乘用車現代化的日益重視以及駕駛員輔助和監控系統等最尖端科技的整合,預計對粘合板的需求將在預測期內增加。
人工智慧、物聯網和通訊基礎設施的發展帶動了電子和半導體行業的繁榮。半導體零件的供應對該行業至關重要。中國和東南亞是這些零件的主要生產地區。半導體行業受到國際貿易問題以及美國技術優勢衝突的影響。 COVID-19 的爆發也對業務產生了未知的影響。由於國際合作和激烈競爭,半導體供應鏈不透明。
汽車行業正在經歷從傳統鋼鐵向複合材料、鋁和鎂等低密度合金以及超高強度鋼的轉變。與重型車輛相比,輕型車輛加速速度更快,能量更少,因此在提高車輛經濟性方面具有巨大潛力。這些新材料需要新的連接工藝。粘合板提供設計彈性,防止移動車輛產生的震動和壓力,並延長保存期限。通過使用粘合片可以顯著減少緊固件等車輛零件的數量。這正在加速市場擴張。
當水分進入纖維之間時,纖維之間的有效黏合面積減少,纖維降低紙張的挺度和強度。粘合劑層本身的性能也會因水分而減弱。水分管理不良可能會對黏合片材的許多品質產生不利影響。紙張老化速度更快,因為它將酸性分解產物保留在封閉、密閉的環境中。市場需求受到這些要素的阻礙。
COVID-19 的爆發影響了全球市場。供應鏈故障和工人中斷影響全球市場。全球許多國家實施了停工限制,導致生產工廠停止營運。疫情進一步影響了市場,包括旅行限制、原料供應有限、營運受限以及進出口減少。然而,疫情導致消費電子和醫療保健行業對座椅的需求激增。
由於其高效率、高性能和熱性能,聚醯亞胺領域預計將出現良好的成長。特別是,聚醯胺耐磨損和擦傷。卓越的強度就是這一特性的結果。聚醯胺耐化學品,適合在惡劣環境下保護電線和電纜。聚醯胺具有優異的機械性能、拉伸強度、耐熱性和耐化學性。聚醯胺優異的機械性能、拉伸強度、耐熱性和耐化學性正在推動市場擴張。
預計電子行業在預測期內將出現最快的年複合成長率。在電子行業中,晶片、硬盤驅動器、LED 模組和其他電子零件使用粘合片固定並黏合在一起。整合人工智慧(AI)、物聯網(IoT)和智慧小工具新趨勢的消費電子產品的發展增加了對電子和光電用途粘合片的需求。
預計亞太地區在預測期內將佔據最大的市場佔有率。該地區龐大的人口、加速的工業擴張以及嚴格的環境法規都直接導致了粘合片材需求的增加。此外,該地區用途數量的不斷增加正在推動粘結片行業的技術創新和進步,從而支持亞太地區粘結片市場的擴張。
預計亞太地區在預測期內年複合成長率最高。消費者可支配收入的增加、生活方式的改善以及移動設備使用的增加都有助於市場的擴張。該地區的市場擴張得益於中國、日本、澳大利亞和印度的經濟發展和工業化、乘用車銷量的增加以及建築業的崛起。為了利用新興國家廉價的勞動力和原料,跨國公司正在那裡建立製造設施。粘合片在電子和汽車領域的廣泛用途正在推動該地區的市場成長。
According to Stratistics MRC, the Global Bonding Sheet Market is accounted for $422.53 million in 2023 and is expected to reach $792.47 million by 2030 growing at a CAGR of 9.4% during the forecast period. A bonding sheet is a sheet or film used for surface covering or bonding that has a cement coating on one side. To prevent an early grip, it has a separate paper discharge layer. Despite occasionally is available in finished variations, it is often reflexive and smooth. It goes under a variety of names, including sheet glue, unadulterated cement, and just glue. A Bonding sheet is typically employed in multi-facet coverings to join flexible interior layers or stiff cap layers. It is frequently used for creating intensity sinks, rigid flex PCBs, bond stiffeners, and other components to attach flexible circuits to unbending flex sheets. In addition, it is used for elaborate overlays.
Display screens, circuit boards, and other components are adhered to these sheets. For holding and fixing electronics assemblies for electronic control and advanced driver assistance system components, bonding sheet is also being used more and more. The demand for bonding sheets is expected to increase throughout the projected period as a result of the expanding automotive sector globally, the growing emphasis on modernizing passenger vehicles, and the integration of cutting-edge technologies including driver assistance and monitoring systems.
The development of AI, IoT, and telecom infrastructure has led to a boom in the electronics and semiconductor industries. The supply of semiconductor components is crucial to the industry. China and Southeast Asia are the main manufacturing regions for these components. The semiconductor sector is being impacted by international trade issues as well as rivalries between the US and China over technological superiority. The COVID-19 epidemic has had an unknown impact on the business as well. Because of the presence of international cooperation and intense rivalry, the semiconductor supply chain is unclear.
The automobile industry is increasingly moving away from traditional steels in favour of composites, low-density alloys like aluminum and magnesium, and ultra-high strength steels. Lightweight cars have a considerable potential to increase vehicle economy since they accelerate more quickly with less energy than heavier ones. New bonding processes are needed for these new materials. Bonding sheet provides flexibility in design, defense against vibration and stress from moving vehicles, and extended shelf life. The amount of vehicle parts, such as fasteners, that are needed can be greatly reduced by the usage of bonding sheet. This factor is accelerating market expansion.
The effective bonded area between the fibers decreases as a result of moisture between the fiber-fiber linkages, which reduces the paper's stiffness and strength. The characteristics of the adhesive layer itself might be weakened by moisture. Numerous bonding sheet qualities might be negatively impacted by poor moisture management. The paper keeps the acidic breakdown products in an enclosed, airtight environment, which hastens aging. The market demand is being hampered by these factors.
The COVID-19 epidemic had an effect on the world market. Supply chain breakdowns and worker impairment have an impact on the worldwide market. A number of nations throughout the world imposed lockdown restrictions, which resulted in the shutdown of production plants. The epidemic further impacted the market with travel restrictions, restricted raw material supply, operating constraints, and decreased import and export activity. Nevertheless, the pandemic saw a spike in demand for these sheets from the consumer electronics and healthcare industries.
The polyimides segment is estimated to have a lucrative growth, due to its high efficiency, performance, and thermal properties. In particular, polyamide is resistant to wear and scrapes. Its exceptional strength is a result of this feature. Wires and cables in caustic environments are better protected by polyamides since they have a strong resilience to chemicals. It gives better mechanical characteristics, more tensile strength, and heat and chemical resistance. The market's expansion is being sped up by all these qualities.
The electronics segment is anticipated to witness the fastest CAGR growth during the forecast period. Chips, hard drives, LED modules, and other electronic components are held and adhered to one another using bonding sheets in the electronics industry. The demand for bonding sheets for electronics and optoelectronics applications is rising as a result of the development of consumer electronics products that integrate artificial intelligence (AI), the internet of things (IoT), and new trends of smart gadgets.
Asia Pacific is projected to hold the largest market share during the forecast period. The region's high population, accelerating industrial expansion, and strict environmental regulations can all be directly linked to the rise in demand for bonding sheet. Additionally, the increasing number of applications in the region is encouraging innovations and advances in the bonding sheet industry, which is supporting the expansion of the APAC bonding sheet market.
Asia Pacific is projected to have the highest CAGR over the forecast period. Consumer's rising disposable incomes, bettering lifestyles, and the growing use of mobile devices all contribute to the market's expansion. The expansion of the market in the region is supported by the economic development and industrialization of China, Japan, Australia, and India, the rising sales of passenger cars, and the thriving construction industry. To take advantage of the cheap labor and raw resources in emerging nations, multinational corporations are establishing manufacturing facilities there. The huge applications of bonding sheets in electronics and automotive sectors is driving the market growth in the region.
Some of the key players profiled in the Bonding Sheet Market include: DuPont, Namics Corporation, Fujikura Ltd, Nikkan Industries Co.,Ltd, Microcosm Technology Co., Ltd, Dexerials Corporation, Nitto Denko Corporation, Arisawa Manufacturing Corporation, Hanwha Solutions Advanced Materials Division, Shin-Etsu Polymer Co. Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd, Qinglong Adhesives, Nippon Mektron Ltd and Toray Industries, Inc.