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市場調查報告書
商品編碼
1503297
2030 年積體被動元件市場預測:按被動元件、基板、無線技術、最終用戶和地區進行的全球分析Integrated Passive Devices Market Forecasts to 2030 - Global Analysis By Passive Device, Substrate, Wireless Technology, End User and By Geography |
根據Stratistics MRC的數據,2024年全球積體被動元件市場規模為22.2億美元,預計到2030年將達到44.3億美元,預測期內複合年成長率為12.23%。
積體被動元件(IPD) 是通常使用半導體製造技術直接在基板上製造的微型電子元件。這些元件透過將多個被動元件(例如電阻器、電容器和電感器)整合到單一封裝中來減小尺寸、重量和製造複雜性。 IPD廣泛應用於空間受限的現代化電子系統,例如行動電話、穿戴式裝置和物聯網裝置。
根據印度品牌股權基金會(IBEF)統計,2021年印度家電和家用電子電器市場價值為98.4億美元,預計到2025年將成長至211.8億美元。
高頻應用的需求不斷成長
與分離式被動元件相比,積體被動元件由於尺寸更小、效能更高且成本效益更高,因此在行動通訊、物聯網設備和汽車電子中變得至關重要。這些裝置具有諸如更小的電路基板佔用空間、更高的可靠性和更好的完整性等優點,這對於高頻操作至關重要。隨著5G網路的普及和物聯網生態系統的擴展,對電子元件變得更小、更有效率的需求不斷增加。這一趨勢正在推動製造商創新並擴展其 IPD 產品,以滿足最新技術不斷變化的需求。
設計複雜性
然而,設計這些整合設備需要來自多個學科的複雜知識,包括材料科學、電路設計和製造流程。複雜性源自於需要最佳化電氣性能、溫度控管和可靠性,同時確保與現有電子系統的兼容性。此外,實現高產量比率並保持成本效益使設計過程更加複雜。因此,投資 IPD 的公司必須克服這些挑戰,以充分利用市場潛力。
射頻應用的增加
隨著 5G 等無線通訊技術的不斷普及,對緊湊、高效能射頻元件的需求不斷增加。將電阻器、電容器和電感器等被動元件整合到單一裝置中的 IPD 在尺寸、性能和可靠性方面具有顯著優勢。 IPD 能夠簡化製造流程並減少整體系統佔用空間,這對於智慧型手機、物聯網設備、汽車電子和醫療設備等 RF 應用尤其有吸引力。此外,RF 電路日益成長的複雜性和效能要求需要 IPD 提供的先進整合技術。
製造商利潤率下降
隨著製造商利潤率下降,積體被動元件將電容器、電阻器和電感器等組件組合在一個封裝中,面臨重大挑戰。較低的利潤率可能會導致製造商減少研發投資,從而限制創新和先進 IPD 技術的引入。此外,較低的盈利可能會導致行銷預算減少,並阻礙對潛在客戶進行宣傳和教育,讓他們了解 IPD 相對於傳統分立被動元件的優勢。
最初,全球供應鏈中斷導致製造延誤和零件短缺,影響了 IPD 生產和交貨計劃。全球範圍內實施的封鎖和限制導致家用電子電器的需求波動,造成了不確定的市場環境,並減少了技術升級的投資。此外,向遠端工作和數位化的轉變加速了對具有強大連接性和效率的設備的需求,影響了製造商尋求的 IPD 類型。儘管有這些挑戰,疫情也刺激了 IPD 設計的創新,重點是更小的外形尺寸、低耗電量和更高的效能,以滿足不斷變化的消費者需求。
Balan 部分預計將在預測期內成為最大的部分
預計巴倫部分在預測期內將是最大的部分。這些裝置對於射頻 (RF) 應用中的平衡和不平衡訊號轉換至關重要,有助於高效的訊號傳輸和接收。在將電阻器、電容器和電感器等多個被動元件整合到單一封裝中的 IPD 中,巴倫透過最大限度地減少訊號損耗並確保電阻來幫助最佳化電路性能。此功能在無線通訊系統中尤其有價值,在無線通訊系統中,保持完整性和最大化效率至關重要。
玻璃晶圓領域預計在預測期內複合年成長率最高。
預計玻璃晶圓產業在預測期內將經歷最高的複合年成長率。與矽和陶瓷等傳統基板相比,玻璃晶圓具有多種優勢,包括卓越的電氣性能、熱穩定性和小規模可製造性。玻璃晶圓能夠實現 IPD 的精密製造,具有更高的整合密度和更低的寄生效應,從而提高整體電路性能。與微影術和蝕刻等先進製造技術的兼容性進一步增強了玻璃在 IPD 應用中的吸引力。此外,玻璃在某些波長下優異的透明度也可用於 IPD 中的光電應用。
估計期間,亞太地區佔據市場最大佔有率。積體被動元件將多個被動元件組合到一個封裝中,在電子製造中變得越來越重要,特別是在亞太地區的消費性電子、通訊和汽車產業。這些裝置具有佔地面積更小、性能更高、組裝成本更低等優點,滿足了該地區對緊湊型高性能電子產品的重視。此外,亞太地區強大的製造基礎和技術專長使其成為 IPD 開發和製造的主要中心。
預計歐洲地區在預測期內將保持盈利成長。該地區的法規結構將環境保護放在首位,迫使IPD製造商開發節能環保的解決方案。支持技術進步和研究經費的政策將進一步刺激該行業的成長。這些法規使企業更容易投資 IPD 技術,從而提高競爭力並培養強大的市場生態系統。此外,遵守歐洲標準可以提高市場信譽,促進進入國際市場並吸引全球投資。
According to Stratistics MRC, the Global Integrated Passive Devices Market is accounted for $2.22 billion in 2024 and is expected to reach $4.43 billion by 2030 growing at a CAGR of 12.23% during the forecast period. Integrated Passive Devices (IPDs) refer to miniaturized electronic components that are fabricated directly onto a substrate, often using semiconductor fabrication techniques. These devices consolidate multiple passive components, such as resistors, capacitors, and inductors, into a single package, thereby reducing size, weight, and manufacturing complexity. IPDs are widely used in modern electronic systems where space is constrained, such as mobile phones, wearables, and IoT devices.
According to the India Brand Equity Foundation (IBEF), the Indian appliances and consumer electronics market was valued at US$ 9.84 billion in 2021 and is expected to be valued at US$ 21.18 billion by 2025.
Rising demand for high-frequency applications
Integrated Passive Devices are becoming integral in mobile communication, IoT devices, and automotive electronics due to their compact size, improved performance, and cost-effectiveness compared to discrete passive components. These devices offer advantages such as reduced footprint on circuit boards, enhanced reliability, and better signal integrity, crucial for high-frequency operations. With the proliferation of 5G networks and the expanding IoT ecosystem, the need for miniaturization and efficiency in electronic components has intensified. This trend is prompting manufacturers to innovate and expand their IPD offerings, catering to the evolving needs of modern technology.
Design complexity
However, designing these integrated devices requires intricate knowledge of various disciplines including materials science, circuit design, and manufacturing processes. The complexity arises from the need to optimize electrical performance, thermal management, and reliability while ensuring compatibility with existing electronic systems. Moreover, achieving high yields and maintaining cost-effectiveness further complicates the design process. As a result, companies investing in IPDs must navigate these challenges to capitalize on the market's potential.
Rising radio frequency applications
As wireless communication technologies like 5G continue to proliferate, there is a heightened demand for compact and efficient RF components. IPDs, which integrate passive components such as resistors, capacitors, and inductors into a single device, offer substantial advantages in terms of miniaturization, performance, and reliability. Their ability to streamline manufacturing processes and reduce overall system footprint makes them particularly attractive for RF applications in smartphones, IoT devices, automotive electronics, and medical devices. Moreover, the increasing complexity and performance requirements of RF circuits necessitate advanced integration techniques provided by IPDs.
Declining profit margins of manufacturers
Integrated Passive Devices, which include components like capacitors, resistors, and inductors integrated into a single package, face significant challenges due to reduced profitability among their producers. As profit margins shrink, manufacturers may cut back on research and development investments, limiting innovation and the introduction of advanced IPD technologies. Furthermore, reduced profitability can lead to constrained marketing budgets, hindering efforts to promote and educate potential customers about the benefits of IPDs over traditional discrete passive components.
Initially, disruptions in the global supply chain caused manufacturing delays and component shortages, affecting IPD production and delivery schedules. As lockdowns and restrictions were imposed worldwide, demand for consumer electronics fluctuated, leading to uncertain market conditions and reduced investments in technology upgrades. Additionally, the shift towards remote work and digitalization accelerated the demand for devices with robust connectivity and efficiency, influencing the types of IPDs sought by manufacturers. Despite these challenges, the pandemic also spurred innovation in IPD designs, emphasizing smaller form factors, lower power consumption, and enhanced performance to meet evolving consumer needs.
The Baluns segment is expected to be the largest during the forecast period
Baluns segment is expected to be the largest during the forecast period. These devices are crucial in converting between balanced and unbalanced signals in radio frequency (RF) applications, facilitating efficient signal transmission and reception. In IPD, which integrates multiple passive components like resistors, capacitors, and inductors into a single package, baluns serve to optimize circuit performance by minimizing signal loss and ensuring impedance matching. This capability is particularly valuable in wireless communication systems, where maintaining signal integrity and maximizing efficiency are paramount.
The Glass Wafer segment is expected to have the highest CAGR during the forecast period
Glass Wafer segment is expected to have the highest CAGR during the forecast period. Glass wafers offer several advantages over traditional substrates like silicon or ceramic, including superior electrical properties, thermal stability, and manufacturability at smaller scales. Glass wafers enable higher integration densities and precise fabrication of IPDs with reduced parasitic effects, enhancing overall circuit performance. Their compatibility with advanced manufacturing techniques such as photolithography and etching further boosts their appeal for IPD applications. Moreover, glass's excellent transparency in certain wavelengths can also be leveraged for optoelectronic applications in IPDs.
Asia Pacific region commanded the largest share of the market over the extrapolated period. Integrated Passive Devices, which combine multiple passive components into a single package, are becoming increasingly crucial in electronics manufacturing, particularly in consumer electronics, telecommunications, and automotive sectors across the region. These devices offer advantages such as smaller footprint, improved performance, and reduced assembly costs, aligning with the region's emphasis on compact, high-performance electronics in the region. Furthermore, Asia Pacific's robust manufacturing base and technological expertise make it a prime hub for IPD development and production.
Europe region is poised to hold profitable growth during the projection period. The region's regulatory framework prioritizes environmental conservation, which compels IPD manufacturers to develop energy-efficient and eco-friendly solutions. Policies supporting technological advancement and research funding further stimulate growth in the sector. These regulations create a conducive environment for businesses to invest in IPD technologies, driving competitiveness and fostering a robust market ecosystem. Moreover, compliance with European standards enhances market credibility and facilitates international market access, attracting global investments.
Key players in the market
Some of the key players in Integrated Passive Devices market include NXP Semiconductors, Murata Manufacturing Co., Ltd, Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company, Samsung Electro-Mechanics, Qualcomm Technologies, Inc, TDK Corporation, Yageo Corporation, Skyworks Solutions, API Technologies and Kyocera Corporation.
In May 2022, STMicroelectronics, an electronics and semiconductor manufacturing company, collaborated with Microsoft, an ST authorized company, for leading the development of the IoT devices. This collaboration has brought about security features, provided secure boot and storage, and fulfilled customer demands for efficient and trusted solutions.
In March 2022, MACOM Technology announced availability of its 128 GBaud Transimpedance Amplifiers (TIAs) and Modulator Drivers for coherent optical networking applications. MACOM's new products support long-haul, metropolitan and Data Center Interconnect (DCI) optical module applications.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.