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1530859

2030 年積體電路 (IC) 市場預測：按產品類型、封裝類型、設計方法、技術、最終用戶和地區進行的全球分析

Integrated Circuits Market Forecasts to 2030 - Global Analysis By Product Type, Packaging Type, Design Approach, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，2024 年全球積體電路 (IC) 市場規模為 7,426 億美元，預計到 2030 年將達到 17,087 億美元，預測期內複合年成長率為 14.9%。

積體電路 (IC) 是一種小型電子電路，它將許多元件（例如電晶體、電阻器和電容器）整合到單一半導體晶片上。這種緊湊且多功能的設備構成了現代電子產品的基礎，為從智慧型手機到工業設備的一切設備提供動力。 IC 市場涵蓋各種應用的晶片設計、製造和銷售，包括家用電子電器、汽車、通訊和其他各個領域。

根據半導體產業協會（SIA）的資料，2022年汽車IC銷售額達341億美元，與前一年同期比較增29.2%。

電子設備需求增加

智慧型手機、平板電腦、穿戴式裝置和其他消費性電子產品的激增正在推動對 IC 的巨大需求。此外，物聯網、人工智慧和 5G 等新興技術正在創造需要先進 IC 解決方案的新應用。汽車產業向電動和自動駕駛汽車的轉變也推動了積體電路的使用。多個最終用途行業不斷成長的需求是推動市場成長的主要因素。

研發成本高

開發新的 IC 設計和製造流程需要大量的研發投資。隨著 IC 技術的進步，與晶片設計和製造相關的複雜性和成本不斷增加。這種高進入障礙限制了創新和市場准入，特別是對於中小企業而言。此外，對專用器材與設備的需求增加了總體成本，並可能限制市場成長。

新興國家市場拓展

亞洲、非洲和拉丁美洲的新興國家為IC市場提供了巨大的成長機會。在這些地區，可支配收入的增加、都市化的加快以及技術採用的擴大正在推動對家用電子電器和其他 IC 產品的需求。此外，印度和越南等國政府提高國內製造能力的努力可能為積體電路公司創造新的市場機會。

智慧財產權盜竊

IC 產業競爭激烈，智慧財產權 (IP) 成為重要資產。然而，智慧財產權盜竊的風險，特別是企業間諜活動和國家主導的活動，對公司的競爭優勢和創新努力構成了重大威脅。這可能會限制研發投資並減緩產業的技術進步。

COVID-19 的影響：

疫情最初擾亂了全球供應鏈和製造業務，導致生產延誤和短缺。然而，對支援遠端工作和數位服務的電子設備的需求增加部分抵消了這些挑戰。這場危機也可能加速數位轉型趨勢，為市場創造長期成長機會。

專用積體電路（ASIC）領域預計將在預測期內成為最大的領域

ASIC 領域預計將主導市場。 ASIC 專為特定應用而設計，與通用 IC 相比，可提供最佳化的效能、效能和成本效率。人工智慧、加密貨幣挖礦和物聯網等領域對客製化解決方案的需求不斷成長，推動了 ASIC 的採用。此外，ASIC 增強安全性和 IP 保護的能力使其對各個行業都具有吸引力，並有助於其市場主導地位。

矽鍺 (SiGe) 領域預計在預測期內複合年成長率最高

預計 SiGe 領域的複合年成長率最高。與傳統矽相比，SiGe 技術在高頻和高速應用中具有卓越的性能。這使得它特別適合 5G 基礎設施、汽車雷達系統和衛星通訊。對這些應用不斷成長的需求，加上 SiGe 能夠實現更小、更節能的設備，正在推動市場快速成長。

佔比最大的地區：

預計亞太地區將主導積體電路（IC）市場。這一優勢得益於台灣、韓國和中國等國家的主要半導體製造地。該地區強大的消費電子市場，加上政府促進國內積體電路生產的舉措，為該地區帶來了巨大的市場佔有率。此外，主要參與者的存在和成熟的供應鏈進一步鞏固了亞太地區的主導地位。

複合年成長率最高的地區：

預計亞太地區積體電路（IC）市場將出現良好成長。高成長率是由半導體製造能力投資增加所推動的，特別是在印度和越南等國家。該地區的家用電子電器市場正在迅速擴張，再加上 5G 和物聯網等新興技術的採用，正在推動對 IC 的需求。政府對國內晶片生產的支持以及全球供應鏈向亞洲的轉移也促進了該地區的加速成長。

免費客製化服務

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 產品分析
  • 技術分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球積體電路（IC）市場：依產品類型

  • 數位IC
    • 微處理器
    • 微控制器
    • 數位訊號處理器（DSP）
    • 邏輯積體電路
  • 類比IC
    • 線性積體電路
    • 電源管理IC
  • 記憶體IC
    • 記憶
    • 貧民窟
    • 快閃記憶體
    • 唯讀記憶體
  • 混合訊號IC
  • 其他IC

第6章全球積體電路（IC）市場：依封裝類型

  • 表面黏著型元件(SMD)
    • 四方扁平封裝 (QFP)
    • 球柵陣列 (BGA)
    • 晶片級封裝 (CSP)
    • 板載晶片(COB)
    • 其他SMD封裝
  • 通孔裝置
    • 雙列直插式封裝 (DIP)
    • 針柵陣列 (PGA)
    • 其他通孔元件封裝
  • 積體電路模組
    • 系統級封裝(SiP)
    • 多晶片模組（MCM）
    • 2.5D 和 3D IC封裝
  • 先進封裝
    • 扇出層壓板封裝 (FOPL)
    • 整合扇出 (IFO)
    • 晶圓上晶片 (CoW)
    • 其他先進封裝

第7章 全球積體電路 (IC) 市場：依設計方法論

  • 通用IC
  • 專用積體電路 (ASIC)
  • 現場可程式閘陣列(FPGA)
  • 系統晶片(SoC)
  • 特定應用標準產品 (ASSP)
  • 自訂IC

第8章全球積體電路 (IC) 市場：依技術分類

  • 互補型金屬氧化物半導體 (CMOS)
  • 雙極互補型金屬氧化物半導體（BiCMOS）
  • 雙極性
  • 砷化鎵 (GaAs)
  • 矽鍺 (SiGe)
  • 其他技術

第9章 全球積體電路 (IC) 市場：依最終使用者分類

  • 家電
  • 車
  • 資訊科技和通訊
  • 製造與自動化
  • 衛生保健
  • 航太和國防
  • 其他最終用戶

第10章全球積體電路（IC）市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第11章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第12章 公司概況

  • AMD
  • Analog Devices
  • Broadcom Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Marvell Technology, Inc.
  • MediaTek Inc.
  • Micron Technology, Inc.
  • Nvidia Corporation
  • NXP Semiconductors NV
  • ON Semiconductor Corporation
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics
  • SK Hynix
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Company（TSMC）
  • Texas Instruments
Product Code: SMRC26971

According to Stratistics MRC, the Global Integrated Circuits (ICs) Market is accounted for $742.6 billion in 2024 and is expected to reach $1,708.7 billion by 2030, growing at a CAGR of 14.9% during the forecast period. Integrated circuits (ICs) are miniaturized electronic circuits containing numerous components, such as transistors, resistors, and capacitors, fabricated on a single semiconductor chip. These compact, versatile devices form the foundation of modern electronics, powering everything from smartphones to industrial equipment. The IC market encompasses the design, manufacturing, and sale of these chips across various applications, including consumer electronics, automotive, telecommunications, and other various sectors.

According to data from the Semiconductor Industry Association (SIA), sales of automotive ICs increased by 29.2% year-over-year in 2022, reaching $34.1 billion.

Market Dynamics:

Driver:

Increasing demand for electronics

The growing adoption of smartphones, tablets, wearables, and other consumer electronics is driving significant demand for ICs. Additionally, emerging technologies like IoT, AI, and 5G are creating new applications that require advanced IC solutions. The automotive sector's shift towards electric and autonomous vehicles is also boosting IC usage. This rising demand across multiple end-use industries is a major factor propelling market growth.

Restraint:

High R&D costs

Developing new IC designs and manufacturing processes requires substantial investments in research and development. As IC technology advances, the complexity and costs associated with designing and fabricating chips continue to increase. This high barrier to entry can limit innovation and market participation, especially for smaller companies. The need for specialized equipment and facilities also adds to the overall costs, potentially restraining market growth.

Opportunity:

Market expansion in developing countries

Emerging economies in Asia, Africa, and Latin America present significant growth opportunities for the IC market. Rising disposable incomes, increasing urbanization, and growing technology adoption in these regions are driving demand for consumer electronics and other IC-enabled products. Additionally, government initiatives to boost domestic manufacturing capabilities in countries like India and Vietnam could create new market opportunities for IC companies.

Threat:

Intellectual property theft

The highly competitive nature of the IC industry makes intellectual property (IP) a critical asset. However, the risk of IP theft, especially through corporate espionage or state-sponsored activities, poses a significant threat to companies' competitive advantages and innovation efforts. This can discourage investments in R&D and potentially slow down technological advancements in the industry.

Covid-19 Impact:

The pandemic initially disrupted global supply chains and manufacturing operations, causing production delays and shortages. However, increased demand for electronics supporting remote work and digital services partially offsets these challenges. The crisis also accelerated digital transformation trends, potentially creating long-term growth opportunities for the market.

The application-specific integrated circuits (ASICs) segment is expected to be the largest during the forecast period

The ASICs segment is expected to dominate the market. ASICs are designed for specific applications, offering optimized performance, power efficiency, and cost-effectiveness compared to general-purpose ICs. The growing demand for customized solutions in areas like AI, cryptocurrency mining, and IoT is driving ASIC adoption. Additionally, ASICs' ability to provide enhanced security and IP protection makes them attractive for various industries, contributing to their market dominance.

The silicon-germanium (SiGe) segment is expected to have the highest CAGR during the forecast period

The SiGe segment is projected to experience the highest CAGR. SiGe technology offers superior performance in high-frequency and high-speed applications compared to traditional silicon. This makes it particularly suitable for 5G infrastructure, automotive radar systems, and satellite communications. The growing demand for these applications, coupled with SiGe's ability to enable smaller, more energy-efficient devices, is driving its rapid market growth.

Region with largest share:

Asia Pacific is expected to dominate the integrated circuits (ICs) market. The dominance is driven by the presence of major semiconductor manufacturing hubs in countries like Taiwan, South Korea, and China. The region's strong consumer electronics market, coupled with government initiatives to boost domestic IC production, contributes to its large market share. Additionally, the presence of key players and a well-established supply chain further solidify Asia Pacific's leading position.

Region with highest CAGR:

Asia Pacific is anticipated to witness lucrative growth in the integrated circuits (ICs) market. The high growth rate is fueled by increasing investments in semiconductor manufacturing capabilities, particularly in countries like India and Vietnam. The region's rapidly expanding consumer electronics market, coupled with the adoption of emerging technologies like 5G and IoT, is driving demand for ICs. Government support for domestic chip production and the shift of global supply chains towards Asia are also contributing to the region's accelerated growth.

Key players in the market

Some of the key players in Integrated Circuits (ICs) market include AMD, Analog Devices, Broadcom Inc., Infineon Technologies AG, Intel Corporation, Marvell Technology, Inc., MediaTek Inc., Micron Technology, Inc., Nvidia Corporation, NXP Semiconductors N.V., ON Semiconductor Corporation, Qualcomm Technologies, Inc., Renesas Electronics Corporation, Samsung Electronics, SK Hynix, STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company (TSMC), and Texas Instruments.

Key Developments:

In June 2024, Intel Corporation has achieved a revolutionary milestone in integrated photonics technology for high-speed data transmission. At the Optical Fiber Communication Conference (OFC) 2024, Intel's Integrated Photonics Solutions (IPS) Group demonstrated the industry's most advanced and first-ever fully integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU and running live data. Intel's OCI chiplet represents a leap forward in high-bandwidth interconnect by enabling co-packaged optical input/output (I/O) in emerging AI infrastructure for data centers and high performance computing (HPC) applications.

In May 2024, MediaTek held the MediaTek Dimensity Developer Conference (MDDC) 2024 in Shenzhen, where the Taiwan-based semiconductor company unveiled its latest flagship 5G chipset, the Dimensity 9300+. With a theme of "AI Empowers Everything," MDDC 2024 delved into the applications and advances in artificial intelligence technology across various domains, and the possibilities it brings to terminal devices. The Dimensity 9300+ has adopted TSMC's third-generation 4nm process technology, according to MediaTek. The new chip boasts big-core CPU architecture, housing an octa-core CPU comprising four Cortex-X4 ultra-large cores clocked at up to 3.4 GHz, and four Cortex-A720 large cores operating at 2.0 GHz.

Product Types Covered:

  • Digital ICs
  • Analog ICs
  • Memory ICs
  • Mixed-Signal ICs
  • Other ICs

Packaging Types Covered:

  • Surface-Mount Devices (SMD)
  • Through-Hole Devices
  • Integrated Circuit Modules
  • Advanced Packaging

Design Approaches Covered:

  • General-Purpose ICs
  • Application-Specific Integrated Circuits (ASICs)
  • Field-Programmable Gate Arrays (FPGAs)
  • System-on-Chip (SoC)
  • Application-Specific Standard Products (ASSPs)
  • Custom ICs

Technologies Covered:

  • Complementary Metal-Oxide-Semiconductor (CMOS)
  • Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS)
  • Bipolar
  • Gallium Arsenide (GaAs)
  • Silicon-Germanium (SiGe)
  • Other Technologies

End Users Covered:

  • Consumer Electronics
  • Automotive
  • IT & Telecommunications
  • Manufacturing & Automation
  • Healthcare
  • Aerospace & Defense
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Technology Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Integrated Circuits (ICs) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Digital ICs
    • 5.2.1 Microprocessors
    • 5.2.2 Microcontrollers
    • 5.2.3 Digital Signal Processors (DSPs)
    • 5.2.4 Logic ICs
  • 5.3 Analog ICs
    • 5.3.1 Linear ICs
    • 5.3.2 Power Management ICs
  • 5.4 Memory ICs
    • 5.4.1 DRAM
    • 5.4.2 SRAM
    • 5.4.3 Flash Memory
    • 5.4.4 ROM
  • 5.5 Mixed-Signal ICs
  • 5.6 Other ICs

6 Global Integrated Circuits (ICs) Market, By Packaging Type

  • 6.1 Introduction
  • 6.2 Surface-Mount Devices (SMD)
    • 6.2.1 Quad Flat Packages (QFP)
    • 6.2.2 Ball Grid Array (BGA)
    • 6.2.3 Chip-Scale Package (CSP)
    • 6.2.4 Chip-on-Board (COB)
    • 6.2.5 Other SMD Packages
  • 6.3 Through-Hole Devices
    • 6.3.1 Dual In-line Packages (DIP)
    • 6.3.2 Pin Grid Array (PGA)
    • 6.3.3 Other Through-Hole Device Packages
  • 6.4 Integrated Circuit Modules
    • 6.4.1 System-in-Package (SiP)
    • 6.4.2 Multi-Chip Modules (MCM)
    • 6.4.3 2.5D & 3D IC Packaging
  • 6.5 Advanced Packaging
    • 6.5.1 Fan-out Package on Laminate (FOPL)
    • 6.5.2 Integrated Fan-Out (IFO)
    • 6.5.3 Chip-on-Wafer (CoW)
    • 6.5.4 Other Advanced Packaging

7 Global Integrated Circuits (ICs) Market, By Design Approach

  • 7.1 Introduction
  • 7.2 General-Purpose ICs
  • 7.3 Application-Specific Integrated Circuits (ASICs)
  • 7.4 Field-Programmable Gate Arrays (FPGAs)
  • 7.5 System-on-Chip (SoC)
  • 7.6 Application-Specific Standard Products (ASSPs)
  • 7.7 Custom ICs

8 Global Integrated Circuits (ICs) Market, By Technology

  • 8.1 Introduction
  • 8.2 Complementary Metal-Oxide-Semiconductor (CMOS)
  • 8.3 Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS)
  • 8.4 Bipolar
  • 8.5 Gallium Arsenide (GaAs)
  • 8.6 Silicon-Germanium (SiGe)
  • 8.7 Other Technologies

9 Global Integrated Circuits (ICs) Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive
  • 9.4 IT & Telecommunications
  • 9.5 Manufacturing & Automation
  • 9.6 Healthcare
  • 9.7 Aerospace & Defense
  • 9.8 Other End Users

10 Global Integrated Circuits (ICs) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 AMD
  • 12.2 Analog Devices
  • 12.3 Broadcom Inc.
  • 12.4 Infineon Technologies AG
  • 12.5 Intel Corporation
  • 12.6 Marvell Technology, Inc.
  • 12.7 MediaTek Inc.
  • 12.8 Micron Technology, Inc.
  • 12.9 Nvidia Corporation
  • 12.10 NXP Semiconductors N.V.
  • 12.11 ON Semiconductor Corporation
  • 12.12 Qualcomm Technologies, Inc.
  • 12.13 Renesas Electronics Corporation
  • 12.14 Samsung Electronics
  • 12.15 SK Hynix
  • 12.16 STMicroelectronics N.V.
  • 12.17 Taiwan Semiconductor Manufacturing Company (TSMC)
  • 12.18 Texas Instruments

List of Tables

  • Table 1 Global Integrated Circuits (ICs) Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Integrated Circuits (ICs) Market Outlook, By Product Type (2022-2030) ($MN)
  • Table 3 Global Integrated Circuits (ICs) Market Outlook, By Digital ICs (2022-2030) ($MN)
  • Table 4 Global Integrated Circuits (ICs) Market Outlook, By Microprocessors (2022-2030) ($MN)
  • Table 5 Global Integrated Circuits (ICs) Market Outlook, By Microcontrollers (2022-2030) ($MN)
  • Table 6 Global Integrated Circuits (ICs) Market Outlook, By Digital Signal Processors (DSPs) (2022-2030) ($MN)
  • Table 7 Global Integrated Circuits (ICs) Market Outlook, By Logic ICs (2022-2030) ($MN)
  • Table 8 Global Integrated Circuits (ICs) Market Outlook, By Analog ICs (2022-2030) ($MN)
  • Table 9 Global Integrated Circuits (ICs) Market Outlook, By Linear ICs (2022-2030) ($MN)
  • Table 10 Global Integrated Circuits (ICs) Market Outlook, By Power Management ICs (2022-2030) ($MN)
  • Table 11 Global Integrated Circuits (ICs) Market Outlook, By Memory ICs (2022-2030) ($MN)
  • Table 12 Global Integrated Circuits (ICs) Market Outlook, By DRAM (2022-2030) ($MN)
  • Table 13 Global Integrated Circuits (ICs) Market Outlook, By SRAM (2022-2030) ($MN)
  • Table 14 Global Integrated Circuits (ICs) Market Outlook, By Flash Memory (2022-2030) ($MN)
  • Table 15 Global Integrated Circuits (ICs) Market Outlook, By ROM (2022-2030) ($MN)
  • Table 16 Global Integrated Circuits (ICs) Market Outlook, By Mixed-Signal ICs (2022-2030) ($MN)
  • Table 17 Global Integrated Circuits (ICs) Market Outlook, By Other ICs (2022-2030) ($MN)
  • Table 18 Global Integrated Circuits (ICs) Market Outlook, By Packaging Type (2022-2030) ($MN)
  • Table 19 Global Integrated Circuits (ICs) Market Outlook, By Surface-Mount Devices (SMD) (2022-2030) ($MN)
  • Table 20 Global Integrated Circuits (ICs) Market Outlook, By Quad Flat Packages (QFP) (2022-2030) ($MN)
  • Table 21 Global Integrated Circuits (ICs) Market Outlook, By Ball Grid Array (BGA) (2022-2030) ($MN)
  • Table 22 Global Integrated Circuits (ICs) Market Outlook, By Chip-Scale Package (CSP) (2022-2030) ($MN)
  • Table 23 Global Integrated Circuits (ICs) Market Outlook, By Chip-on-Board (COB) (2022-2030) ($MN)
  • Table 24 Global Integrated Circuits (ICs) Market Outlook, By Other SMD Packages (2022-2030) ($MN)
  • Table 25 Global Integrated Circuits (ICs) Market Outlook, By Through-Hole Devices (2022-2030) ($MN)
  • Table 26 Global Integrated Circuits (ICs) Market Outlook, By Dual In-line Packages (DIP) (2022-2030) ($MN)
  • Table 27 Global Integrated Circuits (ICs) Market Outlook, By Pin Grid Array (PGA) (2022-2030) ($MN)
  • Table 28 Global Integrated Circuits (ICs) Market Outlook, By Other Through-Hole Device Packages (2022-2030) ($MN)
  • Table 29 Global Integrated Circuits (ICs) Market Outlook, By Integrated Circuit Modules (2022-2030) ($MN)
  • Table 30 Global Integrated Circuits (ICs) Market Outlook, By System-in-Package (SiP) (2022-2030) ($MN)
  • Table 31 Global Integrated Circuits (ICs) Market Outlook, By Multi-Chip Modules (MCM) (2022-2030) ($MN)
  • Table 32 Global Integrated Circuits (ICs) Market Outlook, By 2.5D & 3D IC Packaging (2022-2030) ($MN)
  • Table 33 Global Integrated Circuits (ICs) Market Outlook, By Advanced Packaging (2022-2030) ($MN)
  • Table 34 Global Integrated Circuits (ICs) Market Outlook, By Fan-out Package on Laminate (FOPL) (2022-2030) ($MN)
  • Table 35 Global Integrated Circuits (ICs) Market Outlook, By Integrated Fan-Out (IFO) (2022-2030) ($MN)
  • Table 36 Global Integrated Circuits (ICs) Market Outlook, By Chip-on-Wafer (CoW) (2022-2030) ($MN)
  • Table 37 Global Integrated Circuits (ICs) Market Outlook, By Other Advanced Packaging (2022-2030) ($MN)
  • Table 38 Global Integrated Circuits (ICs) Market Outlook, By Design Approach (2022-2030) ($MN)
  • Table 39 Global Integrated Circuits (ICs) Market Outlook, By General-Purpose ICs (2022-2030) ($MN)
  • Table 40 Global Integrated Circuits (ICs) Market Outlook, By Application-Specific Integrated Circuits (ASICs) (2022-2030) ($MN)
  • Table 41 Global Integrated Circuits (ICs) Market Outlook, By Field-Programmable Gate Arrays (FPGAs) (2022-2030) ($MN)
  • Table 42 Global Integrated Circuits (ICs) Market Outlook, By System-on-Chip (SoC) (2022-2030) ($MN)
  • Table 43 Global Integrated Circuits (ICs) Market Outlook, By Application-Specific Standard Products (ASSPs) (2022-2030) ($MN)
  • Table 44 Global Integrated Circuits (ICs) Market Outlook, By Custom ICs (2022-2030) ($MN)
  • Table 45 Global Integrated Circuits (ICs) Market Outlook, By Technology (2022-2030) ($MN)
  • Table 46 Global Integrated Circuits (ICs) Market Outlook, By Complementary Metal-Oxide-Semiconductor (CMOS) (2022-2030) ($MN)
  • Table 47 Global Integrated Circuits (ICs) Market Outlook, By Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS) (2022-2030) ($MN)
  • Table 48 Global Integrated Circuits (ICs) Market Outlook, By Bipolar (2022-2030) ($MN)
  • Table 49 Global Integrated Circuits (ICs) Market Outlook, By Gallium Arsenide (GaAs) (2022-2030) ($MN)
  • Table 50 Global Integrated Circuits (ICs) Market Outlook, By Silicon-Germanium (SiGe) (2022-2030) ($MN)
  • Table 51 Global Integrated Circuits (ICs) Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 52 Global Integrated Circuits (ICs) Market Outlook, By End User (2022-2030) ($MN)
  • Table 53 Global Integrated Circuits (ICs) Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 54 Global Integrated Circuits (ICs) Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 55 Global Integrated Circuits (ICs) Market Outlook, By IT & Telecommunications (2022-2030) ($MN)
  • Table 56 Global Integrated Circuits (ICs) Market Outlook, By Manufacturing & Automation (2022-2030) ($MN)
  • Table 57 Global Integrated Circuits (ICs) Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 58 Global Integrated Circuits (ICs) Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 59 Global Integrated Circuits (ICs) Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.