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1836410

汽車電力電子市場預測（至 2032 年）：按組件、材料、車輛類型、分銷管道、應用和地區進行的全球分析

Automotive Power Electronics Market Forecasts to 2032 - Global Analysis By Component, Material, Vehicle Type, Distribution Channel, Application, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球汽車電力電子市場預計在 2025 年達到 51 億美元，到 2032 年將達到 78 億美元，預測期內的複合年成長率為 6.2%。

汽車電力電子包括管理電動、混合動力汽車和傳統汽車中能量轉換、分配和控制的設備和系統。關鍵組件包括逆變器、轉換器、感測器和電池管理系統。電動車的普及、排放法規的日益嚴格以及對節能可靠車載系統日益成長的需求推動了汽車電力電子的成長。寬能能隙半導體、高效能轉換器和溫度控管解決方案的進步正在推動市場擴張。

根據國際能源總署（IEA）統計，全球電動車保有量已超過3000萬輛，單年銷量超過1000萬輛。

汽車電氣化

汽車電氣化是汽車電力電子的主要成長引擎。隨著原始設備製造商 (OEM) 從內燃機平台向電池電動和混合動力架構轉型，對高效逆變器、車載充電器、DC-DC 轉換器和牽引模組的需求正在顯著成長。此外，減少二氧化碳排放的監管壓力以及消費者對清潔出行方式的偏好，正在加速全球汽車電氣化計畫的進展。因此，先進封裝技術正優先整合更有效率的拓樸結構、先進封裝和寬能能隙半導體，以滿足下一代電動動力傳動系統所需的性能、尺寸和成本目標。這種結構性轉變正在支持整個價值鏈的資本投資以及供應商和原始設備製造商之間的夥伴關係。

溫度控管挑戰

高開關頻率、更高功率密度以及寬能能隙元件的整合增加了緊湊模組內的熱通量。此外，不均勻的溫度梯度和散熱不足會加速材料劣化，增加故障率，並迫使系統採用保守的降額運作。冷卻系統會增加重量、複雜性和成本，而封裝限制也使散熱路徑更加複雜。製造商必須追求先進的散熱材料、液體冷卻以及熱電架構的協同設計，才能達到所需的使用壽命和效率目標。

無線充電技術的發展

導引和諧振系統透過為乘用車和商用車實現無縫、免持的能源傳輸，減少了駕駛者的摩擦。此外，整合緊湊型電力電子設備和對準輔助裝置可提高效率，並將用例從私人車庫擴展到城市路邊和共用旅遊樞紐。標準化工作和試點部署正在推動投資，而模組化電源轉換器和控制電子設備正在為可擴展部署建立供應商手冊。雖然應用時間表取決於基礎設施投資和監管支持，但商業試點表明，全球範圍內的加速發展勢頭正在增強。

網路安全風險

如果軟體和通訊未被強化，電力​​電子介面（包括充電系統、Vehicle-to-Grid模組）將面臨新的攻擊面。成功的入侵可能會擾亂充電運行，危及車輛安全，甚至竊取敏感數據，損害消費者信任。此外，電動車生態系統中 OT（營運技術）和 IT（資訊技術）的整合，使原始設備製造商、供應商和基礎設施營運商之間的責任更加複雜。應對這些風險需要安全的電子設備、強大的身份驗證和協調一致的事件回應能力。

COVID-19的影響：

新冠疫情衝擊了供應鏈，擾亂了汽車電力電子系統。尤其是半導體短缺和生產延遲，限制了模組供應，並推遲了車輛的上市。封鎖和物流瓶頸延長了關鍵基板和封裝材料的前置作業時間，推高了成本，並迫使設計優先順序重新調整。然而，電氣化需求仍保持韌性，迫使製造商實現供應商多元化，並加速在地採購策略，以增強未來的韌性。這些調整促使整個產業加強了長期採購和庫存規劃。

預計電源模組市場在預測期內將佔據最大佔有率

預計在預測期內，功率模組將佔據最大的市場佔有率，因為它們將分立離散半導體、被動元件和封裝整合到緊湊的功能單元中，用於牽引和輔助應用。功率模組具有系統級優勢，例如縮短組裝時間、提高可靠性以及簡化熱電整合，對尋求擴充性解決方案的原始設備製造商 (OEM) 具有吸引力。此外，逆變式動力傳動系統的日益普及，增加了對車載充電器和直流-直流轉換器處理更高電流的需求，也支撐了模組需求。因此，供應商正在投資模組小型化、改進熱路徑和整合感測技術，以抓住這一重要的市場機會。

預計碳化矽 (SiC) 領域在預測期內將以最高複合年成長率成長

預計碳化矽 (SiC) 領域將在預測期內實現最高成長率，這得益於 SiC 在高壓、高效功率轉換方面的固有材料優勢。 SiC 裝置比傳統矽元件具有更低的開關損耗、更高的開關頻率，並且能夠承受更高的動作溫度，從而實現更小的濾波器和更輕的熱系統。追求更長續航里程和更快充電速度的汽車製造商擴大在牽引逆變器和車載充電器中採用 SiC。此外，晶圓成本下降、規模化生產以及供應商生態系統的完善正在加速 SiC 在汽車平台中的應用。這些趨勢使 SiC 成為整個電動車領域的首選。

佔比最大的地區：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這得益於其製造規模、強勁的國內電動車需求以及扶持性政策框架。中國龐大的電池和半導體生態系統、印度新興的電動車計畫以及日本和韓國成熟的供應鏈，為電力電子產品的生產創造了密集的區域能力。此外，積極的電氣化目標和電動車普及獎勵正在支撐持續的零件需求。因此，亞太地區仍然是電力電子產品的主要製造和消費中心，吸引全球供應商的投資和在地化努力。

複合年成長率最高的地區：

預計北美將在預測期內實現最高的複合年成長率，這得益於快速的技術應用、強大的研發生態系統以及廣泛的電氣化獎勵。快速充電器的部署不斷擴大、商用交通工具電氣化的不斷提升以及對國內半導體製造產能的政策支持，正在推動該地區的成長。此外，原始設備製造商 (OEM)、一級供應商和新興企業之間更緊密的合作正在加速寬能能隙裝置和先進模組的商業化。這些因素，加上供應鏈在地化和資本投資的增加，正在推動北美的複合年成長率。

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    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章市場走勢分析

  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

第5章全球汽車電力電子市場（按組件）

  • 電源模組
  • 功率分離式元件
  • 微控制器和 DSP
  • 感應器
  • 閘極驅動器積體電路
  • 其他組件

6. 全球汽車電力電子市場（依材料）

  • 矽（Si）
  • 碳化矽（SiC）
  • 氮化鎵（GaN）
  • 其他成分

7. 全球汽車電力電子市場（依車型）

  • 搭乘用車
  • 輕型商用車（LCV）
  • 重型商用車（HCV）

8. 全球汽車電力電子市場（依分銷管道）

  • 原始設備製造商（OEM）
  • 售後市場

9. 全球汽車電力電子市場（按應用）

  • 動力傳動系統和底盤
    • 逆變器
    • DC-DC轉換器
    • 車用充電器（OBC）
    • 電池管理系統（BMS）
    • 電動方向盤（EPS）
  • 車身電子
    • 照明系統
    • 暖通空調系統
    • 電動車窗和座椅
    • 車身控制模組
  • 安全與安保系統
    • ADAS 感測器
    • 安全氣囊控制單元
    • 防鎖死煞車系統（ABS）
  • 資訊娛樂和遠端資訊處理
    • 主機
    • 展示
    • 遠端資訊處理控制單元（TCU）

第 10 章全球汽車電力電子市場（按地區）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第 12 章：公司概況

  • Robert Bosch GmbH
  • Continental AG
  • Infineon Technologies AG
  • STMicroelectronics International NV
  • ON Semiconductor Corporation
  • NXP Semiconductors NV
  • Denso Corporation
  • Mitsubishi Electric Corporation
  • Renesas Electronics Corporation
  • Danfoss A/S
  • BorgWarner Inc.
  • Vishay Intertechnology, Inc.
  • Analog Devices, Inc.
  • Toshiba Corporation
  • Texas Instruments Incorporated
  • ABB Ltd.
  • Magna International Inc.
  • Hyundai Mobis
  • Panasonic Corporation
  • LG Electronics Inc.
Product Code: SMRC31534

According to Stratistics MRC, the Global Automotive Power Electronics Market is accounted for $5.1 billion in 2025 and is expected to reach $7.8 billion by 2032 growing at a CAGR of 6.2% during the forecast period. Automotive power electronics involves devices and systems managing energy conversion, distribution, and control in electric, hybrid, and conventional vehicles. Key components include inverters, converters, sensors, and battery management systems. Growth is fueled by increasing adoption of electric vehicles, stricter emission regulations, and rising demand for energy-efficient and reliable automotive systems. Advancements in wide-bandgap semiconductors, high-efficiency converters, and thermal management solutions are accelerating market expansion.

According to the International Energy Agency (IEA), the global electric car stock surpassed 30 million vehicles, with sales exceeding 10 million in a single year.

Market Dynamics:

Driver:

Electrification of Vehicles

Electrification of vehicles has become the primary growth engine for automotive power electronics. As OEMs transition from internal-combustion platforms to battery-electric and hybrid architectures, demand for efficient inverters, onboard chargers, DC-DC converters, and traction modules is rising markedly. Additionally, regulatory pressure to reduce CO2 emissions and consumer preference for cleaner mobility are accelerating vehicle electrification programs worldwide. Suppliers are therefore prioritizing higher-efficiency topologies, advanced packaging, and integration of wide-bandgap semiconductors to meet performance, size, and cost targets required by next-generation electric powertrains. This structural shift underpins capital investment and supplier-OEM partnerships across the value chain.

Restraint:

Thermal Management Challenges

High switching frequencies, greater power densities, and integration of wide-bandgap devices intensify heat fluxes within compact modules. Moreover, uneven temperature gradients and inadequate heat sinking can accelerate material degradation, elevate failure rates, and force conservatively derated operation. Cooling systems add weight, complexity, and cost, while packaging limits complicate thermal paths. Manufacturers must pursue advanced heat-spreading materials, liquid cooling, and co-design of thermal and electrical architectures to achieve required lifetime and efficiency targets.

Opportunity:

Development of Wireless Charging Technologies

Inductive and resonant systems reduce driver friction by enabling seamless, hands-free energy transfer for passenger cars and commercial fleets. Furthermore, integration of compact power electronics and alignment aides can improve efficiency and broaden use cases from private garages to urban curbside and shared mobility hubs. Standards work and pilot deployments are attracting investment, while modular power converters and control electronics create supplier playbooks for scalable rollouts. Adoption timelines hinge on infrastructure investment and regulatory support, but commercial pilots indicate accelerating momentum globally.

Threat:

Cybersecurity Risks

Power electronics interfaces including charging systems, inverters, and vehicle-to-grid modules can expose new attack surfaces if software and communications are not hardened. Successful intrusions could disrupt charging operations, degrade vehicle safety, or enable theft of sensitive data, undermining consumer trust. Moreover, the convergence of OT and IT within EV ecosystems complicates responsibility across OEMs, suppliers, and infrastructure operators. Addressing these risks requires secure-by-design electronics, robust authentication, and coordinated incident response capabilities.

Covid-19 Impact:

The COVID-19 pandemic disrupted automotive power electronics through supply-chain shocks, most notably semiconductor shortages and production delays that constrained module availability and slowed vehicle launches. Lockdowns and logistics bottlenecks amplified lead times for key substrates and packaging materials, raising costs and forcing design reprioritization. However, demand for electrification remained resilient, prompting manufacturers to diversify suppliers and accelerate local sourcing strategies to improve future resilience. These adjustments strengthened long-term procurement and inventory planning across the industry.

The power modules segment is expected to be the largest during the forecast period

The power modules segment is expected to account for the largest market share during the forecast period because modules aggregate discrete semiconductors, passive components, and packaging into compact functional units ready for traction and auxiliary applications. Power modules offer system-level advantages reduced assembly time, higher reliability, and simplified thermal and electrical integration which appeal to OEMs seeking scalable solutions. Additionally, rising adoption of inverterized drivetrains and the need for high-current handling in onboard chargers and DC-DC converters sustain module demand. Suppliers are therefore investing in module miniaturization, improved thermal paths, and integrated sensing to capture this sizable market opportunity.

The silicon carbide (SiC) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the silicon carbide (SiC) segment is predicted to witness the highest growth rate due to SiC's intrinsic material advantages for high-voltage, high-efficiency power conversion. SiC devices reduce switching losses, enable higher switching frequencies, and tolerate greater operating temperatures than legacy silicon, allowing smaller filters and lighter thermal systems. Automakers seeking extended range and faster charging are increasingly specifying SiC in traction inverters and onboard chargers. Furthermore, falling wafer costs, manufacturing scale-up, and supplier ecosystems are accelerating SiC adoption in vehicle platforms. These trends position SiC as the preferred choice across EV segments.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by a combination of manufacturing scale, strong domestic EV demand, and supportive policy frameworks. China's large battery and semiconductor ecosystems, India's emerging EV programs, and established supply chains in Japan and South Korea create dense regional capabilities for power electronics production. Additionally, aggressive electrification targets and incentives for EV adoption underpin sustained component demand. Consequently, Asia Pacific remains the primary manufacturing and consumption hub for power electronics, attracting supplier investments and localization efforts globally.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR due to rapid technology adoption, strong R&D ecosystems, and sizeable electrification incentives. Growing deployments of fast chargers, rising fleet electrification in commercial transport, and policy support for domestic semiconductor capacity bolster regional growth. Furthermore, close collaboration between OEMs, Tier-1 suppliers, and startups accelerates commercialization of wide-bandgap devices and advanced modules. These factors, combined with improving supply-chain localization and capital investment, position North America for accelerated compound annual growth.

Key players in the market

Some of the key players in Automotive Power Electronics Market include Robert Bosch GmbH, Continental AG, Infineon Technologies AG, STMicroelectronics International N.V., ON Semiconductor Corporation, NXP Semiconductors N.V., Denso Corporation, Mitsubishi Electric Corporation, Renesas Electronics Corporation, Danfoss A/S, BorgWarner Inc., Vishay Intertechnology, Inc., Analog Devices, Inc., Toshiba Corporation, Texas Instruments Incorporated, ABB Ltd., Magna International Inc., Hyundai Mobis, Panasonic Corporation, and LG Electronics Inc.

Key Developments:

In September 2025, Mitsubishi Electric Corporation announced that it has developed a new compact version of its DIPIPM power semiconductor modules specifically for use in consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems. The new Compact DIPIPM series of products comprises the PSS30SF1F6 (rated current 30A / rated voltage 600V) and the PSS50SF1F6 (rated current 50A / rated voltage 600V), and samples will begin shipping on September 22.

In August 2025, Dream Incubator Inc. and DENSO CORPORATION are pleased to announce that their joint initiative, "Digital Platform Development for Mobility Circular Economy and Integrated Manufacturing for India by Collaboration with Open API Network in India and Japan", has been selected under United Nations Industrial Development Organization's "Industrial cooperation programme in the Global South through technology transfer from Japan".

In December 2024, The U.S. Commerce Department reached a preliminary agreement to provide US $225 million in subsidies to Bosch for a planned transformation of its California facility into a silicon carbide (SiC) power semiconductor manufacturing plant. Bosch aims to start producing SiC chips on 200 mm wafers by 2026.

Components Covered:

  • Power Modules
  • Power Discrete
  • Microcontrollers & DSPs
  • Sensors
  • Gate Driver Ics
  • Other Components

Materials Covered:

  • Silicon (Si)
  • Silicon Carbide (SiC)
  • Gallium Nitride (GaN)
  • Other Materials

Vehicle Types Covered:

  • Passenger Cars
  • Light Commercial Vehicles (LCVs)
  • Heavy Commercial Vehicles (HCVs)

Distribution Channels Covered:

  • Original Equipment Manufacturer (OEM)
  • Aftermarket

Applications Covered:

  • Powertrain & Chassis
  • Body Electronics
  • Safety & Security Systems
  • Infotainment & Telematics

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Automotive Power Electronics Market, By Component

  • 5.1 Introduction
  • 5.2 Power Modules
  • 5.3 Power Discrete
  • 5.4 Microcontrollers & DSPs
  • 5.5 Sensors
  • 5.6 Gate Driver Ics
  • 5.7 Other Components

6 Global Automotive Power Electronics Market, By Material

  • 6.1 Introduction
  • 6.2 Silicon (Si)
  • 6.3 Silicon Carbide (SiC)
  • 6.4 Gallium Nitride (GaN)
  • 6.5 Other Materials

7 Global Automotive Power Electronics Market, By Vehicle Type

  • 7.1 Introduction
  • 7.2 Passenger Cars
  • 7.3 Light Commercial Vehicles (LCVs)
  • 7.4 Heavy Commercial Vehicles (HCVs)

8 Global Automotive Power Electronics Market, By Distribution Channel

  • 8.1 Introduction
  • 8.2 Original Equipment Manufacturer (OEM)
  • 8.3 Aftermarket

9 Global Automotive Power Electronics Market, By Application

  • 9.1 Introduction
  • 9.2 Powertrain & Chassis
    • 9.2.1 Inverter
    • 9.2.2 DC-DC Converter
    • 9.2.3 On-Board Charger (OBC)
    • 9.2.4 Battery Management System (BMS)
    • 9.2.5 Electric Power Steering (EPS)
  • 9.3 Body Electronics
    • 9.3.1 Lighting Systems
    • 9.3.2 HVAC Systems
    • 9.3.3 Power Windows & Seats
    • 9.3.4 Body Control Modules
  • 9.4 Safety & Security Systems
    • 9.4.1 ADAS Sensors
    • 9.4.2 Airbag Control Units
    • 9.4.3 Anti-lock Braking System (ABS)
  • 9.5 Infotainment & Telematics
    • 9.5.1 Head Units
    • 9.5.2 Displays
    • 9.5.3 Telematics Control Units (TCU)

10 Global Automotive Power Electronics Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Robert Bosch GmbH
  • 12.2 Continental AG
  • 12.3 Infineon Technologies AG
  • 12.4 STMicroelectronics International N.V.
  • 12.5 ON Semiconductor Corporation
  • 12.6 NXP Semiconductors N.V.
  • 12.7 Denso Corporation
  • 12.8 Mitsubishi Electric Corporation
  • 12.9 Renesas Electronics Corporation
  • 12.10 Danfoss A/S
  • 12.11 BorgWarner Inc.
  • 12.12 Vishay Intertechnology, Inc.
  • 12.13 Analog Devices, Inc.
  • 12.14 Toshiba Corporation
  • 12.15 Texas Instruments Incorporated
  • 12.16 ABB Ltd.
  • 12.17 Magna International Inc.
  • 12.18 Hyundai Mobis
  • 12.19 Panasonic Corporation
  • 12.20 LG Electronics Inc.

List of Tables

  • Table 1 Global Automotive Power Electronics Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Automotive Power Electronics Market Outlook, By Region (2024-2032) ($MN)
  • Table 3 Global Automotive Power Electronics Market Outlook, By Component (2024-2032) ($MN)
  • Table 4 Global Automotive Power Electronics Market Outlook, By Power Modules (2024-2032) ($MN)
  • Table 5 Global Automotive Power Electronics Market Outlook, By Power Discrete (2024-2032) ($MN)
  • Table 6 Global Automotive Power Electronics Market Outlook, By Microcontrollers & DSPs (2024-2032) ($MN)
  • Table 7 Global Automotive Power Electronics Market Outlook, By Sensors (2024-2032) ($MN)
  • Table 8 Global Automotive Power Electronics Market Outlook, By Gate Driver ICs (2024-2032) ($MN)
  • Table 9 Global Automotive Power Electronics Market Outlook, By Other Components (2024-2032) ($MN)
  • Table 10 Global Automotive Power Electronics Market Outlook, By Material (2024-2032) ($MN)
  • Table 11 Global Automotive Power Electronics Market Outlook, By Silicon (Si) (2024-2032) ($MN)
  • Table 12 Global Automotive Power Electronics Market Outlook, By Silicon Carbide (SiC) (2024-2032) ($MN)
  • Table 13 Global Automotive Power Electronics Market Outlook, By Gallium Nitride (GaN) (2024-2032) ($MN)
  • Table 14 Global Automotive Power Electronics Market Outlook, By Other Materials (2024-2032) ($MN)
  • Table 15 Global Automotive Power Electronics Market Outlook, By Vehicle Type (2024-2032) ($MN)
  • Table 16 Global Automotive Power Electronics Market Outlook, By Passenger Cars (2024-2032) ($MN)
  • Table 17 Global Automotive Power Electronics Market Outlook, By Light Commercial Vehicles (LCVs) (2024-2032) ($MN)
  • Table 18 Global Automotive Power Electronics Market Outlook, By Heavy Commercial Vehicles (HCVs) (2024-2032) ($MN)
  • Table 19 Global Automotive Power Electronics Market Outlook, By Distribution Channel (2024-2032) ($MN)
  • Table 20 Global Automotive Power Electronics Market Outlook, By Original Equipment Manufacturer (OEM) (2024-2032) ($MN)
  • Table 21 Global Automotive Power Electronics Market Outlook, By Aftermarket (2024-2032) ($MN)
  • Table 22 Global Automotive Power Electronics Market Outlook, By Application (2024-2032) ($MN)
  • Table 23 Global Automotive Power Electronics Market Outlook, By Powertrain & Chassis (2024-2032) ($MN)
  • Table 24 Global Automotive Power Electronics Market Outlook, By Inverter (2024-2032) ($MN)
  • Table 25 Global Automotive Power Electronics Market Outlook, By DC-DC Converter (2024-2032) ($MN)
  • Table 26 Global Automotive Power Electronics Market Outlook, By On-Board Charger (OBC) (2024-2032) ($MN)
  • Table 27 Global Automotive Power Electronics Market Outlook, By Battery Management System (BMS) (2024-2032) ($MN)
  • Table 28 Global Automotive Power Electronics Market Outlook, By Electric Power Steering (EPS) (2024-2032) ($MN)
  • Table 29 Global Automotive Power Electronics Market Outlook, By Body Electronics (2024-2032) ($MN)
  • Table 30 Global Automotive Power Electronics Market Outlook, By Lighting Systems (2024-2032) ($MN)
  • Table 31 Global Automotive Power Electronics Market Outlook, By HVAC Systems (2024-2032) ($MN)
  • Table 32 Global Automotive Power Electronics Market Outlook, By Power Windows & Seats (2024-2032) ($MN)
  • Table 33 Global Automotive Power Electronics Market Outlook, By Body Control Modules (2024-2032) ($MN)
  • Table 34 Global Automotive Power Electronics Market Outlook, By Safety & Security Systems (2024-2032) ($MN)
  • Table 35 Global Automotive Power Electronics Market Outlook, By ADAS Sensors (2024-2032) ($MN)
  • Table 36 Global Automotive Power Electronics Market Outlook, By Airbag Control Units (2024-2032) ($MN)
  • Table 37 Global Automotive Power Electronics Market Outlook, By Anti-lock Braking System (ABS) (2024-2032) ($MN)
  • Table 38 Global Automotive Power Electronics Market Outlook, By Infotainment & Telematics (2024-2032) ($MN)
  • Table 39 Global Automotive Power Electronics Market Outlook, By Head Units (2024-2032) ($MN)
  • Table 40 Global Automotive Power Electronics Market Outlook, By Displays (2024-2032) ($MN)
  • Table 41 Global Automotive Power Electronics Market Outlook, By Telematics Control Units (TCU) (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.