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1625314

至 2030 年晶圓層次電子構裝市場預測：按封裝類型、互連技術、最終用戶和地區分類的全球分析

Wafer Level Packaging Market Forecasts to 2030 - Global Analysis By Package Type, Interconnect Technology, End User and by Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC預測，2024年全球晶圓層次電子構裝市場規模將達95.8億美元，預計2030年將達到297.8億美元，預測期內複合年成長率為20.8%。

晶圓層次電子構裝（WLP）是一種先進的半導體封裝方法，在封裝晶圓級封裝。透過消除通常在晶圓切割後執行的傳統封裝步驟，該技術具有更小的尺寸、更高的性能和更低的生產成本等優勢。此外，WLP 將元件放置得更緊密，從而實現更密集的互連、更好的溫度控管和更快的訊號傳輸，使其成為小型高性能設備（例如穿戴式設備、智慧型手機和汽車電子產品）的理想選擇。

根據世界半導體貿易統計（WSTS），包括晶圓層次電子構裝在內的全球半導體市場預計將大幅成長，2021年銷售額預計將達到5,510億美元。

對性能優越的晶片的需求

現代電子設備對更高頻寬、更快處理速度和更低功耗的需求不斷成長，推動了晶圓層次電子構裝的採用。隨著晶片變得越來越複雜，特別是在遊戲、通訊和高效能運算等行業，需要封裝解決方案來滿足這些需求。此外，與傳統封裝技術相比，WLP 具有許多優勢，包括提高電源效率、提高訊號完整性和提高電氣性能。

初期投資成本高

專用工具和技術的初始成本高昂是採用晶圓層次電子構裝的主要障礙之一。實施晶圓層次電子構裝需要先進的製造基礎設施，包括用於晶片測試、封裝和晶圓鍵合技術的專用工具。此外，這些系統可能很昂貴，特別是對於缺乏資金購買必要機械的中小型企業。此過程還涉及高昂的研發 (R&D) 成本，以改進方法並實現目標性能標準。

穿戴式科技和醫療設備的發展

晶圓層次電子構裝在醫療設備領域具有巨大潛力，尤其是隨著穿戴式醫療技術的日益普及。這些小型輕量設備需要強大的感測器、處理器和通訊模組來追蹤血糖值、心率和大腦活動等健康資訊。非侵入式穿戴式健康監測設備的開發取決於將這些不同組件組合成單一緊湊封裝的能力，而 WLP 使這成為可能。此外，WLP還可應用於需要小型電子設備安裝在有限空間內的診斷設備，以及必須在有限空間內可靠運作的植入式醫療設備。

其他封裝技術的競爭壓力

可以提供類似優勢的替代先進封裝技術對晶圓層次電子構裝市場構成了嚴重威脅。系統級封裝(SiP)、3D 封裝、覆晶和板載晶片(COB) 等技術正在憑藉減少環境影響、提高性能和成本效益等類似優勢來爭奪市場佔有率。此外，在需要垂直整合的應用中，例如記憶體模組和高效能運算，垂直堆疊多個晶片的3D封裝可能是更好的選擇。

COVID-19 的影響：

晶圓層次電子構裝(WLP) 受到 COVID-19 大流行的嚴重影響，該流行病主要擾亂了全球供應鏈和半導體製造流程。勞動力短缺、旅行限制和工廠關閉導致生產延遲和重要材料的前置作業時間延長，影響了 WLP 解決方案的及時交付。此外，在疫情初期，經濟不確定性和消費者對電子產品的需求下降暫時減緩了市場擴張。然而，隨著企業適應新常態，對醫療、汽車和家用電子電器的需求增加，需要使用 WLP 等尖端封裝技術。

晶圓級晶片規模封裝 (WLCSP) 領域預計將在預測期內成為最大的領域

晶圓級構裝（WLP）市場預計將由晶圓級構裝（WLCSP）領域主導。 WLCSP 被廣泛使用，因為它提供了一種緊湊、經濟且有效的封裝解決方案來取代傳統封裝技術。 WLCSP 將晶片直接整合到封裝中，幾乎不需要額外的元件，從而顯著減小了設備尺寸和重量，使其成為穿戴式裝置、智慧型手機和消費性電子應用的理想選擇。此外，對更小、更強大的電子設備的需求不斷成長，推動了 WLCSP 的普及。

預計銅柱細分市場在預測期間內複合年成長率最高

在晶圓層次電子構裝（WLP）市場中，銅柱細分市場預計複合年成長率最高。銅柱技術可以提高半導體裝置的性能和可靠性，因此迅速普及，特別是在高密度和高性能應用中。此外，此封裝技術使用銅柱代替傳統的焊料凸塊，從而具有出色的抗電遷移性、增加的機械強度和改善的導熱性。這些優點使得銅柱封裝特別適合高效能運算、汽車電子和5G等尖端應用。

佔比最大的地區：

由於存在中國、日本、韓國和台灣等重要的半導體製造地，亞太地區 (APAC) 佔據了晶圓層次電子構裝(WLP) 市場的最大佔有率。日月光集團、三星、台積電等電子和半導體領域的大公司都位於亞洲。為了滿足對更快、更緊湊、更有效的電子設備不斷成長的需求，這些公司正在大力投資 WLP 等尖端封裝技術。此外，該地區強大的製造基礎，以及汽車、通訊和消費電子產業的快速創新和採用，支持亞太地區在 WLP 市場的持續主導地位。

複合年成長率最高的地區：

晶圓層次電子構裝(WLP) 市場預計將以北美地區最高的複合年成長率成長。特別是隨著5G、無人駕駛汽車和物聯網（IoT）的普及，消費性電子、醫療保健、汽車和通訊等領域對先進半導體封裝的需求不斷增加。許多處於封裝創新前沿的頂級半導體公司和研究機構都位於北美。此外，資料中心、人工智慧 (AI) 和高效能運算的使用不斷增加，進一步加速了對複雜 WLP 解決方案的需求。

提供免費客製化：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場公司的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭標基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球晶圓層次電子構裝市場：依封裝類型

  • 扇入晶圓層次電子構裝(FI-WLP)
  • 扇出晶圓層次電子構裝(FO-WLP)
  • 3D TSV晶圓層次電子構裝
  • 2.5D TSV晶圓層次電子構裝
  • 晶圓級晶片尺寸封裝 (WLCSP)

第6章全球晶圓層次電子構裝市場：依互連技術分類

  • 直通矽晶穿孔(TSV)
  • 焊料凸塊
  • 銅柱
  • 覆晶

第7章全球晶圓層次電子構裝市場：依最終用戶分類

  • 家電
  • 資訊科技/通訊
  • 車
  • 產業
  • 航太和國防
  • 衛生保健
  • 其他最終用戶

第8章全球晶圓層次電子構裝市場：依地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第9章 主要進展

  • 合約、夥伴關係、合作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第 10 章 公司概況

  • Amkor Technology, Inc.
  • Fujitsu Limited
  • Nordson Corporation
  • Toshiba Corporation
  • Lam Research Corporation
  • Qualcomm Technologies, Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Deca Technologies, Inc
  • Nemotek Technology Inc.
  • Infineon Technologies AG
  • Taiwan Semiconductor Manufacturing Company Limited
  • KLA Corporation
  • Applied Materials, Inc.
  • ChipMOS Technologies Inc.
  • Tokyo Electron Ltd.
Product Code: SMRC28269

According to Stratistics MRC, the Global Wafer Level Packaging Market is accounted for $9.58 billion in 2024 and is expected to reach $29.78 billion by 2030 growing at a CAGR of 20.8% during the forecast period. Wafer Level Packaging (WLP) is a state-of-the-art semiconductor packaging method that encapsulates chips at the wafer level prior to their separation into separate pieces. By doing away with the need for conventional packaging procedures, which are typically performed after the wafer is cut, this technique offers benefits like smaller size, improved performance, and cheaper production costs. Moreover, WLP is particularly well suited for small, high-performing devices like wearables, smartphones, and automotive electronics because it positions components close together, allowing for high-density interconnections, better thermal management, and faster signal transmission.

According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market, which includes wafer level packaging, is expected to grow significantly, with sales expected to reach $551 billion in 2021.

Market Dynamics:

Driver:

Demand for chips with superior performance

Wafer-level packaging adoption is being driven by the growing demand for modern electronics to have higher bandwidth, faster processing speeds, and lower power consumption. As chips get more sophisticated, particularly in industries like gaming, telecommunications, and high-performance computing, they need packaging solutions that can meet these demands. Additionally, WLP offers a number of advantages over conventional packaging techniques, including improved power efficiency, higher signal integrity, and better electrical performance.

Restraint:

Expensive initial investment costs

The high upfront cost of specialized tools and technologies is one of the major obstacles to Wafer Level Packaging adoption. Advanced manufacturing infrastructure, such as specialized tools for die testing, encapsulation, and wafer bonding, is required to implement WLP. Furthermore, these systems can be costly, especially for small and mid-sized businesses that might lack the funds to purchase the required machinery. In order to improve methods and reach targeted performance standards, the process also entails high research and development (R&D) expenses.

Opportunity:

Developments in wearable technology and medical devices

Wafer Level Packaging has significant prospects in the medical device sector, especially given the growing popularity of wearable medical technology. These small, light devices need powerful sensors, processors, and communication modules to track health information like blood sugar, heart rate, and even brain activity. The development of non-invasive, wearable health monitoring devices depends on the ability to combine these diverse components into a single, compact package, which WLP makes possible. Moreover, WLP is also applicable to diagnostic equipment that needs small electronics to fit into limited spaces and implantable medical devices that must function dependably in confined spaces.

Threat:

Competitive pressure from other packaging technologies

Alternative cutting-edge packaging technologies that can provide comparable advantages pose a serious threat to the wafer-level packaging market. With comparable benefits like lower environmental impact, enhanced performance, and cost-effectiveness, technologies like System-in-Package (SiP), 3D packaging, flip-chip, and Chip-on-Board (COB) are vying for market share. Additionally, in some applications, like memory modules or high-performance computing, where vertical integration is desired, 3D packaging, which entails stacking multiple chips vertically, may be more appropriate.

Covid-19 Impact:

Wafer Level Packaging (WLP) was significantly impacted by the COVID-19 pandemic, which mainly disrupted global supply chains and semiconductor manufacturing processes. Production delays and longer lead times for essential materials resulted from labor shortages, travel restrictions, and factory closures, which impacted the timely delivery of WLP solutions. Furthermore, a brief slowdown in market expansion was caused by the economic uncertainty and a decline in consumer demand for electronic products during the early stages of the pandemic. But as businesses adjusted to the new normal, the demand for medical, automotive, and consumer electronics devices increased, necessitating the use of cutting-edge packaging technologies like WLP.

The Wafer Level Chip Scale Packaging (WLCSP) segment is expected to be the largest during the forecast period

The Wafer Level Packaging (WLP) market is expected to be dominated by the Wafer Level Chip Scale Packaging (WLCSP) segment. Because it offers a small, affordable, and effective substitute for conventional packaging techniques, WLCSP is a widely used packaging solution. It entails putting the chip straight onto the package with few extra parts, greatly reducing the device's size and weight, making it perfect for wearables, smartphones, and consumer electronics applications. Moreover, the widespread use of WLCSP is being driven by the increasing demand for more compact, powerful electronic devices that perform better and use less energy.

The Copper Pillar segment is expected to have the highest CAGR during the forecast period

In the Wafer Level Packaging (WLP) market, the Copper Pillar segment is expected to have the highest CAGR. Because copper pillar technology can enhance semiconductor devices' performance and dependability, especially in high-density and high-performance applications, it is rapidly gaining popularity. Additionally, this packaging technique offers superior electro migration resistance, increased mechanical strength, and improved thermal conductivity by substituting copper pillars for conventional solder bumps. Because of these benefits, copper pillar packaging is especially well-suited for cutting-edge uses like high-performance computing, automotive electronics, and 5G.

Region with largest share:

Due to the presence of important semiconductor manufacturing hubs, such as China, Japan, South Korea, and Taiwan, the Asia-Pacific (APAC) region commands the largest share of the Wafer Level Packaging (WLP) market. Large companies in the electronics and semiconductor sectors, including ASE Group, Samsung, and TSMC, are based in Asia. To keep up with the increasing demand for faster, more compact, and more effective electronic devices, these companies make significant investments in cutting-edge packaging technologies like WLP. Furthermore, the region's robust manufacturing base, along with rapid technological innovation and adoption in the automotive, telecommunications, and consumer electronics industries, supports APAC's ongoing dominance in the WLP market.

Region with highest CAGR:

The Wafer Level Packaging (WLP) market is anticipated to grow at the highest CAGR in the North American region. The demand for sophisticated semiconductor packaging is rising in sectors like consumer electronics, healthcare, automotive, and telecommunications, especially as 5G, driverless cars, and the Internet of Things (IoT) become more prevalent. Numerous top semiconductor companies and research institutes that are at the forefront of packaging technology innovation are based in North America. Moreover, the need for sophisticated WLP solutions is further accelerated by the expanding use of data centers, artificial intelligence (AI), and high-performance computing.

Key players in the market

Some of the key players in Wafer Level Packaging market include Amkor Technology, Inc., Fujitsu Limited, Nordson Corporation, Toshiba Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Siliconware Precision Industries Co., Ltd., Deca Technologies, Inc, Nemotek Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company Limited, KLA Corporation, Applied Materials, Inc., ChipMOS Technologies Inc. and Tokyo Electron Ltd.

Key Developments:

In September 2024, Fujitsu Limited and Stellar Science Foundation, a General Incorporated Association have entered into a partnership focused on discovering and supporting the next generation of scientific researchers and fostering the creation of cutting-edge research topics.

In May 2024, Nordson Corporation announced that it has entered into a definitive agreement to acquire Atrion Corporation, a leader in proprietary medical infusion fluid delivery and niche cardiovascular solutions, for $460.00 per share in cash. This reflects a valuation of 15X Atrion's 2024 full-year estimated EBITDA, inclusive of synergies Nordson expects to generate in the first two years of its ownership.

In May 2024, Amkor Technology, Inc. announced that it has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Under the long-term supply agreement, Amkor will receive the substantial majority of IBM's subcontract wire bond and flip chip assembly and final test.

Package Types Covered:

  • Fan-in Wafer Level Packaging (FI-WLP)
  • Fan-out Wafer Level Packaging (FO-WLP)
  • 3D TSV WLP
  • 2.5D TSV WLP
  • Wafer Level Chip Scale Package (WLCSP)

Interconnect Technologies Covered:

  • Through-Silicon Via (TSV)
  • Solder Bumping
  • Copper Pillar
  • Flip Chip

End Users Covered:

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Wafer Level Packaging Market, By Package Type

  • 5.1 Introduction
  • 5.2 Fan-in Wafer Level Packaging (FI-WLP)
  • 5.3 Fan-out Wafer Level Packaging (FO-WLP)
  • 5.4 3D TSV WLP
  • 5.5 2.5D TSV WLP
  • 5.6 Wafer Level Chip Scale Package (WLCSP)

6 Global Wafer Level Packaging Market, By Interconnect Technology

  • 6.1 Introduction
  • 6.2 Through-Silicon Via (TSV)
  • 6.3 Solder Bumping
  • 6.4 Copper Pillar
  • 6.5 Flip Chip

7 Global Wafer Level Packaging Market, By End User

  • 7.1 Introduction
  • 7.2 Consumer Electronics
  • 7.3 IT and Telecommunication
  • 7.4 Automotive
  • 7.5 Industrial
  • 7.6 Aerospace & Defense
  • 7.7 Healthcare
  • 7.8 Other End Users

8 Global Wafer Level Packaging Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Amkor Technology, Inc.
  • 10.2 Fujitsu Limited
  • 10.3 Nordson Corporation
  • 10.4 Toshiba Corporation
  • 10.5 Lam Research Corporation
  • 10.6 Qualcomm Technologies, Inc.
  • 10.7 Siliconware Precision Industries Co., Ltd.
  • 10.8 Deca Technologies, Inc
  • 10.9 Nemotek Technology Inc.
  • 10.10 Infineon Technologies AG
  • 10.11 Taiwan Semiconductor Manufacturing Company Limited
  • 10.12 KLA Corporation
  • 10.13 Applied Materials, Inc.
  • 10.14 ChipMOS Technologies Inc.
  • 10.15 Tokyo Electron Ltd.

List of Tables

  • Table 1 Global Wafer Level Packaging Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 3 Global Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 4 Global Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 5 Global Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 6 Global Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 7 Global Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 8 Global Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 9 Global Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 10 Global Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 11 Global Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 12 Global Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 13 Global Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 14 Global Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 15 Global Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 16 Global Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 17 Global Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 18 Global Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 19 Global Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 20 Global Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 21 North America Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 22 North America Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 23 North America Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 24 North America Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 25 North America Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 26 North America Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 27 North America Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 28 North America Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 29 North America Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 30 North America Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 31 North America Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 32 North America Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 33 North America Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 34 North America Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 35 North America Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 36 North America Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 37 North America Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 38 North America Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 39 North America Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 40 North America Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 41 Europe Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 42 Europe Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 43 Europe Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 44 Europe Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 45 Europe Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 46 Europe Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 47 Europe Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 48 Europe Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 49 Europe Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 50 Europe Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 51 Europe Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 52 Europe Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 53 Europe Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 54 Europe Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 55 Europe Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 56 Europe Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 57 Europe Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 58 Europe Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 59 Europe Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 60 Europe Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 61 Asia Pacific Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 62 Asia Pacific Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 63 Asia Pacific Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 64 Asia Pacific Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 65 Asia Pacific Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 66 Asia Pacific Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 67 Asia Pacific Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 68 Asia Pacific Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 69 Asia Pacific Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 70 Asia Pacific Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 71 Asia Pacific Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 72 Asia Pacific Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 73 Asia Pacific Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 74 Asia Pacific Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 75 Asia Pacific Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 76 Asia Pacific Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 77 Asia Pacific Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 78 Asia Pacific Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 79 Asia Pacific Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 80 Asia Pacific Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 81 South America Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 82 South America Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 83 South America Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 84 South America Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 85 South America Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 86 South America Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 87 South America Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 88 South America Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 89 South America Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 90 South America Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 91 South America Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 92 South America Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 93 South America Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 94 South America Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 95 South America Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 96 South America Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 97 South America Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 98 South America Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 99 South America Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 100 South America Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 101 Middle East & Africa Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 102 Middle East & Africa Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 103 Middle East & Africa Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 104 Middle East & Africa Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 105 Middle East & Africa Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 106 Middle East & Africa Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 107 Middle East & Africa Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 108 Middle East & Africa Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 109 Middle East & Africa Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 110 Middle East & Africa Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 111 Middle East & Africa Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 112 Middle East & Africa Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 113 Middle East & Africa Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 114 Middle East & Africa Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 115 Middle East & Africa Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 116 Middle East & Africa Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 117 Middle East & Africa Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 118 Middle East & Africa Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 119 Middle East & Africa Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 120 Middle East & Africa Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)