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市場調查報告書
商品編碼
1662888
濺鍍靶材和沉澱材料市場預測至 2030 年:按產品類型、材料、技術、應用和地區進行的全球分析Sputtering Targets & Evaporation Materials Market Forecasts to 2030 - Global Analysis By Product Type (Sputtering Targets and Evaporation Materials), Material (Metal, Ceramic, Alloy and Advanced Materials), Technology, Application and By Geography |
根據 Stratistics MRC 的數據,全球濺鍍靶材和沉澱材料市場規模預計在 2024 年達到 31 億美元,到 2030 年將達到 43 億美元,預測期內的複合年成長率為 5.1%。
物理氣相澱積中使用的真空室內被高能量離子轟擊的固體材料稱為濺鍍靶。轟擊使原子從目標表面脫落,並沉積在基板上形成薄膜。蒸發是發生在液體表面的一種汽化。當液體分子碰撞並交換能量時,靠近表面的分子會獲得足夠的能量來克服蒸氣壓力,並以氣體的形式逸出到周圍的空氣中。
根據日本電子情報技術產業協會(JEITA)的數據,預計2022年全球電子和IT產業產值將達到34,368億美元。
電子產品需求不斷成長
電子產品需求的不斷成長是濺鍍靶和沉澱材料市場發展的主要驅動力。智慧型手機、平板電腦和穿戴式裝置等家用電子電器產品的進步推動了對高性能材料的需求,以使這些設備更加可靠和高效。隨著電子設備變得越來越小且功能越來越豐富,使用濺鍍靶和沉澱材料的薄膜形成過程變得越來越必要。此外,半導體製造和可再生能源技術的成長進一步推動了市場需求。
價格波動
技術發展、複雜的製造流程和原料採購成本直接影響最終產品的價格。全球供需波動加劇了這個問題,使製造商難以保持盈利。這種成本波動限制了中小企業的進入,並增加了整個價值鏈定價策略的壓力,從而限制了市場成長。
策略聯盟
製造商、研究機構和技術提供者之間的夥伴關係推動了材料配方和沈積技術的創新。這些合作有助於解決成本效率、材料純度和永續性等挑戰。此外,該合資企業將使該公司擴大其地理覆蓋範圍,以服務亞太地區等新興市場,這些市場對先進電子產品和可再生能源解決方案的需求正在迅速成長。
技術挑戰
實現均勻薄膜沉澱和最佳化材料利用率的技術挑戰威脅著濺鍍靶和沉澱材料市場的成長。沉積效率低、廢品率高以及生產規模的限制阻礙了半導體和太陽能板等應用的進步。此外,技術的快速進步需要持續投資研發才能保持競爭力。如果無法有效應對這些挑戰,採用率可能會放緩,市場擴張也可能受到限制。
COVID-19 疫情擾亂了全球供應鏈,導致濺鍍靶材和沉澱材料的生產和採購延遲。封鎖導致勞動力減少,並停止了電子等關鍵產業的製造活動。此外,對非必需品的限制暫時影響了需求。然而,疫情加速了數位化趨勢,增加了對半導體和電子產品的長期需求。疫情過後,隨著各行各業透過遠距工作和供應鏈多元化進行適應,市場開始變得良好復甦。
預計預測期內濺鍍靶材部分將成為最大的部分。
由於濺鍍靶材廣泛應用於半導體、電子和太陽能等行業的薄膜沉澱工藝,預計在預測期內將佔據最大的市場佔有率。高純度金屬靶材能夠實現對微晶片、顯示器和太陽能電池至關重要的精密塗層。該領域的成長得益於對先進製造技術的投資增加和對小型電子元件的需求不斷成長。濺鍍靶材由於能夠生產性能優異的均勻薄膜而佔據了市場的主導地位。
預計預測期內金屬部分將以最高的複合年成長率成長。
在預測期內,由於金屬在半導體、電子和可再生能源產業的廣泛應用,預計金屬部分將呈現最高的成長率。鋁、銅和金等金屬因其優異的電導性、熱穩定性和形成均勻薄膜的能力而受到重視。 5G網路和太陽能板等先進技術的日益普及也進一步推動了對金屬基濺鍍鍍靶材的需求。材料科學的創新也促進了這一領域的快速成長。
在預測期內,亞太地區預計將佔據最大的市場佔有率,因為它在半導體製造和電子產品生產方面佔據主導地位。中國、日本、韓國和台灣等國家在技術進步和研發投資方面處於領先地位。該地區強大的工業基礎支持家用電子電器、太陽能電池板和汽車應用領域的濺鍍靶和沉澱材料的大量生產。這個強大的生態系統鞏固了主導地位。
在預測期內,由於對可再生能源計劃和半導體製造設施的投資增加,預計亞太地區將呈現最高的複合年成長率。印度等國的政府都在「印度製造」等舉措下透過優惠政策推動國內製造業的發展。此外,消費者對先進電子設備的需求不斷成長,進一步推動了該地區的成長。不斷擴大的基礎設施和戰略投資相結合確保了亞太市場的快速擴張。
According to Stratistics MRC, the Global Sputtering Targets & Evaporation Materials Market is accounted for $3.1 billion in 2024 and is expected to reach $4.3 billion by 2030 growing at a CAGR of 5.1% during the forecast period. A solid substance used in physical vapor deposition that is subjected to high-energy ion bombardment in a vacuum chamber is called a sputtering target. Atoms that have been dislodged from the target surface by the bombardment move and deposit onto a substrate to create thin films. One kind of vaporization that takes place on liquid surfaces is evaporation. Molecules close to the surface that acquire sufficient energy to overcome vapor pressure escape into the surrounding air as gas when liquid molecules collide and exchange energy.
According to Japan Electronics and Information Technology Industries Association (JEITA), the production by the global electronics and IT industry was estimated at USD 3,436.8 billion in 2022.
Growing demand for electronics
The increasing demand for electronics is a key driver for the sputtering targets and evaporation materials market. With advancements in consumer electronics such as smartphones, tablets, and wearables, there is a rising need for high-performance materials that enhance device reliability and efficiency. The push for miniaturization and multifunctionality in electronics necessitates thin-film deposition processes using sputtering targets and evaporation materials. Additionally, the growth of semiconductor manufacturing and renewable energy technologies further boosts market demand.
Price volatility
The costs of technological development, complex manufacturing processes, and raw material procurement directly impact the end product's price. Fluctuating global supply-demand dynamics exacerbate this issue, making it challenging for manufacturers to maintain profitability. This cost variability restricts market growth by limiting accessibility for smaller players and increasing pressure on pricing strategies across the value chain.
Strategic collaborations
Partnerships between manufacturers, research institutions, and technology providers facilitate innovation in material formulations and deposition techniques. These collaborations help address challenges such as cost efficiency, material purity, and sustainability. Moreover, joint ventures enable companies to expand their geographic reach and cater to emerging markets like Asia-Pacific, where demand for advanced electronics and renewable energy solutions is rapidly growing.
Technological challenges
Technological challenges in achieving uniform thin-film deposition and optimizing material utilization threaten the growth of the sputtering targets and evaporation materials market. Issues such as low deposition efficiency, high wastage rates, and limitations in scaling up production hinder advancements in applications like semiconductors and solar panels. Additionally, rapid technological evolution requires continuous R&D investments to stay competitive. These challenges can delay adoption rates and limit market expansion if not addressed effectively.
The COVID-19 pandemic disrupted global supply chains, causing delays in production and procurement of sputtering targets and evaporation materials. Lockdowns led to reduced workforce availability and halted manufacturing activities in key sectors like electronics. Additionally, restrictions on non-essential goods affected demand temporarily. However, the pandemic accelerated digitalization trends, increasing long-term demand for semiconductors and electronic devices. As industries adapted through remote operations and supply chain diversification, the market began recovering steadily post-pandemic.
The sputtering targets segment is expected to be the largest during the forecast period
The sputtering targets segment is expected to account for the largest market share during the forecast period due to its extensive use in thin-film deposition processes across industries like semiconductors, electronics, and solar energy. High-purity metal targets enable precise coatings critical for microchips, displays, and photovoltaic cells. The segment's growth is driven by increasing investments in advanced manufacturing technologies and rising demand for miniaturized electronic components. Sputtering targets' versatility in creating uniform films with superior properties ensures their leading position in the market.
The metal segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the metal segment is predicted to witness the highest growth rate owing to its widespread application in semiconductors, electronics, and renewable energy industries. Metals like aluminum, copper and gold are valued for their excellent conductivity, thermal stability, and ability to form homogeneous thin films. The growing adoption of advanced technologies such as 5G networks and solar panels further drives demand for metal-based sputtering targets. Innovations in material science also contribute to this segment's rapid growth.
During the forecast period, the Asia Pacific region is expected to hold the largest market share due to its dominance in semiconductor manufacturing and electronics production. Countries like China, Japan, South Korea, and Taiwan lead in technological advancements and R&D investments. The region's strong industrial base supports high-volume production of sputtering targets and evaporation materials used in consumer electronics, solar panels, and automotive applications. This robust ecosystem solidifies Asia Pacific's leadership position.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR due to increasing investments in renewable energy projects and semiconductor manufacturing facilities. Governments across countries like India are promoting domestic production through favorable policies under initiatives like "Make in India." Additionally, rising consumer demand for advanced electronic devices drives regional growth further. The combination of expanding infrastructure and strategic investments ensures Asia Pacific's rapid market expansion.
Key players in the market
Some of the key players in Sputtering Targets & Evaporation Materials Market include Materion Corporation, ULVAC, Inc., Plansee SE, Tosoh Corporation, Hitachi Metals Ltd., JX Nippon Mining & Metals Corporation, Praxair Surface Technologies, Honeywell International, Inc., Heraeus Holding GmbH, Kurt J. Lesker Company, SCI Engineered Materials, Konfoong Materials International Co., Ltd., Soleras Advanced Coatings, Nichia Corporation, Umicore, Treibachner Industrie AG, Furuya Metal Co., Ltd. and Grinm Advanced Materials Co., Ltd.
In November 2024, Tosoh Corporation has unveiled its development of a gallium nitride (GaN) sputtering target, a new product being manufactured at Tosoh Specialty Materials Corporation, a subsidiary based in Yamagata City, Japan. GaN, a thin film semiconductor material, is widely used in applications like LED lighting and compact rapid chargers due to its lower energy loss compared to other materials. GaN thin films are gaining traction in energy-efficient power semiconductors, especially for data centers, as well as in micro-LED technology for wearable displays.
In April 2024, JX Nippon Mining & Metals USA, Inc., an industry leader in semiconductor materials, announced the completion of a $29 Million land acquisition deal in Mesa, Arizona. The 65-acre greenfield site will serve as JX's new base of operations for its semiconductor sputtering target business serving the North American and European markets. Furthermore, it will propel JX's business development and become the center for advanced materials in North America.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.