3D 列印電子市場：2023 年 - 市場研究與預測

3D Printed Electronics 2023: Market Study & Forecast

出版日期: 2023年10月13日 | 出版商:

Additive Manufacturing Research | 英文 106 Pages | 訂單完成後即時交付

價格

簡介目錄

3D電子列印（3DEP）的市場規模預計在未來幾年將顯著成長。這得益於3D電子列印應用的持續開發和演示，以及列印技術和平台能力的進步。預計該市場10年複合年增長率為37%。 3D電子列印的市場規模也不斷擴大，預計2023年市場規模將達3億美元，2033年將擴大至79億美元。

本報告檢視了 3D 列印電子市場，並解釋了市場成長面臨的挑戰、進入市場的主要參與者以及詳細的市場數據和預測。

本報告的背景與背景
閱讀本報告
3D列印電子領域的趨勢、機會與挑戰
3D列印電子技術和應用的當前和未來可能性
當前競爭格局圖
預測產業的未來和成長機會
目前的 3D 列印電子領域
內部 PCB 原型設計
影響產業方向的顯著趨勢
永續發展
減少原型製作過程中的材料消耗
設計上的可回收性
透過小型化設備減少對生命週期的影響
供應鏈安全與壓縮
透過傳統 3D 列印支援半導體製造
《半導體生產有益激勵法》(CHIP)
機會
物聯網
物聯網設備內天線的保形印刷
大規模物聯網
靈活的物聯網
多品種、小批量的電子產品將變得越來越可能
電子設備小型化
互連
被動
嵌入式和堆疊元件以及垂直整合IC
透過過渡到內部原型設計來保護智慧財產權
設計自由
頂部、底部和側面安裝的組件為您的電路板增添了另一個角度
透過多向通孔進行高密度佈線
作業
批量生產
透過印刷流程中的 SMT 整合克服產量問題
繼續材料開發
為 3D 列印電子產品建立無縫數位主線
電子設計輔助設計和機械輔助設計之間的界線變得模糊
新的軟體解決方案填補了空白

第二章技術、應用、市場

技術
導電材料印刷技術
聚合物粉末床熔融
還原光聚合
除靜電材料印刷技術
聚合物粉末床熔融
還原光聚合
材料擠出
3D電子列印技術
噴墨列印
氣溶膠噴射印刷
基於擠出的印刷
材料
導電油墨
銀奈米顆粒墨水
擠壓材料和限制
介電油墨和樹脂
申請
印刷電路板
3D列印多層PCB
印刷電路板的未來
連接器和互連
天線、放大器、收發器
3DEP 支援先進的天線生產
下一代天線的多材料列印
6G的崛起
電容器
感測器
量子感測器
超越 PCB：下一代元件和應用中的 3DEP 創新
光電
電池
晶片實驗室

第三章市場進入公司

Nano Dimension
Technology-Dragonfly IV
Optomec
Aerosol Jet
Bot Factory
Ceradrop
Chemcubed
NeoTech
PV Nanocell
Voltera
Fujifilm Corporation
Panasonic
Additive Electronics
Notion Systems
nScrypt
Nano3DPrint

第 4 章 10 年預測

調查方法
定價
服務收入
行業
3D印表機的分類
整個市場
關於積層製造研究
關於分析師
本報告中使用的首字母縮寫詞和縮寫詞

簡介目錄

Product Code: AMR-3DP-ELECT-1023

The 3D electronics printing (3DEP) market is expected to experience significant growth in the coming years. This is due to the advancements in printing technology and platform capability, alongside the ongoing development and demonstration of the applications of 3D electronics printing. The market is projected to achieve a 10-year CAGR of 37%. The market size for 3D electronics printing is also expanding, with an estimated total market value of $0.3 billion in 2023, which is expected to increase to $7.9 billion by 2033.

This report describes the value propositions of 3DEP, the challenges to market growth, key players in the 3DEP space, and detailed market data and forecasting.

Companies or organizations covered in this report include, but are not limited to: Ceradrop, Nano Dimension, NeoTech, Optomec, FujiFilm, Voltera, BotFactory, nScrypt, J.A.M.E.S., NextFlex, ChemCubed, PV Nanocell, Panasonic, Additive Electronics, Nano3DPrint, and Notion Systems.

Executive Summary

Defining the value propositions of 3D Electronics Printing
Miniaturisation
Design Freedom
Reshoring and localisation9
Sustainability
Challenges to market growth
Key players in the 3D Electronics Printing Space
The industry remains consolidated around a small number of player
Low-cost 3DEP providers reduce barriers to entry
Forecasting the growth of the market

Chapter One: Trends, opportunities and challenges

Background and context to this report
Reading this report
Trends, Opportunities, and challenges in the 3D printing electronics space
The current and future potential for 3D printing electronics technologies and applications
Mapping the current competitive landscape
Building a future view of the industry and forecasting its opportunity for growth
The current 3D printing electronics space
3D Electronics Printing prepares to move from the lab to the factory
Electronics prototyping remains the go-to application
Moving PCB prototyping in-house
Standing at the precipice of commercial 3D printed electronics
Notable trends driving the direction of the industry
Sustainability
Reducing material consumption in prototyping
Recyclability through design
Miniaturisation of devices reducing life cycle impact
Supply Chain security and compression
Supporting Semiconductor production using conventional 3D printing
Creating helpful incentives to produce semiconductors (CHIPs) act
Opportunities
Internet of things
Conformal printing of antenna within IoT devices
Volumetric IoT
Flexible IoT
Low volume, high mix electronics become increasingly viable
Miniaturisation of electronics
Off-setting the limitations of physics through compact circuit design
Interconnects
Passives
Embedded and stacked components and vertically integrated ICs
Protecting Intellectual Property via moving to in-house prototyping
Freedom of Design
Top, bottom and side-mounted components, adding another angle to circuit boards
Higher density routing with multi-directional vias
Challenges
Volume production
Overcoming production volume with SMT integration in the print process
Continuing materials development
Building a seamless digital thread for 3D printed electronics
Delineation of electronic computer-aided design and mechanical computer-aided design begin to blur
Emerging software solutions to bridge the gap

Chapter Two: Technology, Applications and Markets

Technologies
Technologies capable of printing conductive materials
Polymer Powder Bed Fusion
Vat Photopolymerization
Technologies capable of printing static-dissipative materials
Polymer Powder Bed Fusion
Vat Photopolymerisation
Material Extrusion
3D Electronic Printing Technologies
Inkjet Printing
Aerosol Jet Printing
Extrusion-Based Printing
Materials
Conductive Inks
Silver Nanoparticle Inks
Extrusion materials and limitations
Dielectric inks and resins
Applications
PCBs
3D printed multi-layer PCBs
Future of printed PCBs
Connectors and Interconnects
Antennas, Amplifiers and Transceiver
3DEP supporting advanced antenna production
Multi-material printing of next-generation antenna
Rise of 6G
Capacitors
Sensors
Quantum sensors
Beyond the PCB: 3DEP innovations in next-generation components and applications
Optoelectronics
Batteries
Lab-on-chips

Chapter Three: Market players

Nano Dimension, Israel, 2012
Nano Dimensions attempts to acquire Stratasys
Financial performance
Technology-Dragonfly IV
Materials
Partnerships
Optomec, United States, 1997
Technology
Aerosol Jet Printer Portfolio
Aerosol jet HD2
Aerosol Jet AJ Flex
Aerosol Jet Print Engine
Bot Factory, United States, 2013
Ceradrop, France, 2006
Ceradrop Technology
F-serie
X-Serie
Industrial platform
Chemcubed, United States, 2014
NeoTech, Germany, 2006
Technology
15X BT
45XG4
PV Nanocell, Israel, 2010
Voltera, Canada, 2013
Fujifilm Corporation, Japan, 1934
Technology
Panasonic, Japan, 1918
Additive Electronics, Germany, 2022
Notion Systems, Germany, 2012
nScrypt, United States, 2002
Nano3DPrint, United States, 2013
Entry into the professional space with the D4200S

Chapter Four: Ten year forecasts

Methodology
Pricing
Service revenue
Industry
3D printer categorisation
Total market
- Exhibit 4.1: Total market for 3D Electronics Printing, by USD$ revenue
- Exhibit 4.2: Total market for 3D Electronics Printing, by USD$ share
- Exhibit 4.3: Total market for 3D Electronics Printing, by YoY growth change Hardware
- Exhibit 4.4: 3D Electronics Printing Hardware Growth, by revenue and YoY change
- Exhibit 4.5: 3D Electronics Printing Hardware Growth, by printer type
- Exhibit 4.6: 3D Electronics Printing Hardware Shipments and Install Base
- Exhibit 4.7: 3D Electronics Printing Hardware Shipments by Printer Category
- Exhibit 4.8: 3D Electronics Printing Install Base by Printer Category
- Exhibit 4.9: 3D Electronics Printing Hardware, by Industry
- Exhibit 4.10: 3D Electronics Printing Hardware, by Industry Share Material
- Exhibit 4.11: 3D Electronics Printing Material Revenue Growth and Year-on-Year Growth
- Exhibit 4.12: 3D Electronics Printing Material Revenue by Material Type
- Exhibit 4.13: 3D Electronics Printing Material Revenue Share by Type
- Exhibit 4.14: 3D Electronics Printing Material Revenue by Printer Category
- Exhibit 4.15: 3D Electronics Printing Material Revenue by Printer Category Share
- Exhibit 4.16: 3D Electronics Printing Material Revenue by industry Services
- Exhibit 4.17: 3D Electronics Printing Service Revenue Growth and Year-on-Year Growth
- Exhibit 4.18: 3D Electronics Printing Service Revenue by provider
- Exhibit 4.19: 3D Electronics Printing Service Revenue by Share
About Additive Manufacturing Research
About the Analyst
Acronyms and Abbreviations Used In this Report