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圖：2024-2025年全球CMP漿料墊市場（關鍵材料）
市場調查報告書
商品編碼
1498831

圖：2024-2025年全球CMP漿料墊市場（關鍵材料）

CMP Slurry & Pads Market Report 2024-2025 (Critical Materials Report)
出版日期: | 出版商: TECHCET | 英文 384 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

CMP（化學機械拋光）漿料墊在半導體製造中非常重要。製程整合需要生產薄的、均勻的平面層，以在半導體晶圓上建構裝置結構。隨著新裝置技術的出現，CMP 製程步驟的數量不斷增加。新裝置技術具有更多的層數、新材料、更嚴格的製程控制要求以及先進封裝的新技術。解決這些製造課題需要開發新的 CMP 漿料墊。

範例視圖

本報告分析了半導體裝置製造中使用的CMP 耗材（特別是CMP 漿料和拋光墊）的市場和供應鏈，並分析了市場的基本結構、關鍵驅動因素以及漿料和拋光墊應用的細分預測、市場佔有率、討論了磨料供應商，特別關注先進封裝。

目錄

第 1 章執行摘要

第二章分析範圍、目的與方法

第三章產業/市場現況與展望

  • 世界經濟與展望
    • 半導體產業與全球經濟的聯繫
    • 半導體銷售額的成長
    • 台灣外包廠商每月銷售趨勢
  • 晶片銷售：依電子產品細分市場劃分
    • 電子產品的前景
    • 汽車產業的前景
    • 智慧型手機前景
    • 電腦展望
    • 伺服器/IT 市場
  • 半導體製造業的成長與擴張
    • 在晶片擴張方面投入巨資
    • 美國新廠
    • 世界各地製造工廠的擴張推動了成長
    • 資本投資趨勢
    • 製造工廠投資評估
  • 政策/貿易趨勢與影響
  • 半導體材料概述
    • 預測引入的晶圓數量（~2028 年）
    • 材料市場預測（~2028 年）

第 4 章 CMP 耗材趨勢

  • CMP 墊/漿料（消耗品）市場趨勢：概述
  • 區域趨勢
    • 區域趨勢與驅動因素
  • CMP耗材市場趨勢
    • 技術驅動因素/材料變化與過渡 - 高級邏輯
    • 技術驅動/材料變化與轉變 - 內存
    • 技術驅動/材料變化與轉型
    • 先進封裝技術趨勢
    • 先進封裝技術趨勢（續）
    • 化合物半導體技術趨勢
  • 新材料的 EHS（環境、健康與安全）問題
    • 與漿料處置、回收和再生相關的 EHS 問題
  • 物流問題

第五章CMP漿料供應商市場

  • CMP漿料利潤預測（5年）
  • CMP漿料預測（基於數量，5年）
  • CMP漿料市場的領導者
    • 漿料市場佔有率：依地區劃分
    • 漿料市場佔有率
  • CMP 漿料市場的併購 (M&A) 活動、投資、公告和合作夥伴關係
  • CMP 漿料廠關閉 - 無
  • 新進入公司
  • 供應商或零件/產品線面臨停產風險
  • CMP漿料價格趨勢
  • 分析師對CMP漿料市場的評價

第六章 CMP 拋光墊市場統計與預測

  • CMP 拋光墊獲利預測（5 年）
  • CMP 拋光墊獲利預測（5 年）
    • CMP 拋光墊預測（基於數量，5 年）
  • 煞車片供應商的競爭格局
  • 新進入公司
  • CMP 拋光墊物流問題、企業併購 (M&A) 活動、公告和合作夥伴關係
  • CMP 拋光墊趨勢
  • 分析師評估

第七章 下級（虛擬部門）物資供應

  • 磨料供應商
  • 垂直整合供應商
  • 原料供應鏈的破壞者
  • 原物料領域的併購活動
  • 磨料供應鏈中的 EHS 與物流問題
  • 磨料供應鏈中的 "新" 進入者 - 無
  • 磨料供應鏈的趨勢
  • 次級供應鏈：分析師評估

第 8 章供應商簡介

  • 3M Company
  • Abrasive Technology
  • Ace NanoChem
  • Anji Micro Shanghai
  • Asahi Glass
  • 另外 40 多個

第 9 章附錄

簡介目錄

This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers.

SAMPLE VIEW

The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

  • 1.1 CMP CONSUMABLES MARKET OVERVIEW
  • 1.2 CMP CONSUMABLES REVENUE TRENDS
  • 1.3 MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK
  • 1.4 YEAR 2023 IN REVIEW
  • 1.5 CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT
    • 1.5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST
    • 1.5.2 CMP PADS 5-YEAR REVENUE FORECAST
  • 1.6 TECHNOLOGY TRENDS
  • 1.7 SLURRY SUPPLIER COMPETITIVE LANDSCAPE
  • 1.8 PAD SUPPLIER COMPETITIVE LANDSCAPE
  • 1.9 ANALYST ASSESSMENT
    • 1.9.1 ANALYST ASSESSMENT CONTINUED SEMICONDUCTOR

2 SCOPE, PURPOSE AND METHODOLOGY

  • 2.1 SCOPE
  • 2.2 PURPOSE
  • 2.3 METHODOLOGY
  • 2.4 OVERVIEW OF OTHER TECHCET CMR OFFERINGS

3 INDUSTRY MARKET STATUS & OUTLOOK

  • 3.1 WORLDWIDE ECONOMY AND OUTLOOK
    • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2 SEMICONDUCTOR SALES GROWTH
    • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
  • 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
    • 3.2.1 ELECTRONICS OUTLOOK
    • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
      • 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
      • 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
    • 3.2.3 SMARTPHONE OUTLOOK
    • 3.2.4 PC OUTLOOK
    • 3.2.5 SERVERS / IT MARKET
  • 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
    • 3.3.2 NEW FABS IN THE US
    • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
    • 3.3.4 EQUIPMENT SPENDING TRENDS
      • 3.3.4.1 ADVANCED LOGIC TECHNOLOGY ROADMAPS
      • 3.3.4.2 DRAM TECHNOLOGY ROADMAPS
      • 3.3.4.3 3D NAND TECHNOLOGY ROADMAPS
    • 3.3.5 FAB INVESTMENT ASSESSMENT
  • 3.4 POLICY - TRADE TRENDS AND IMPACT
  • 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
    • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
    • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 CMP CONSUMABLES TRENDS

  • 4.1 CMP PADS AND SLURRIES (CONSUMABLES) MARKET TRENDS - OUTLINE
  • 4.2 REGIONAL TRENDS
    • 4.2.1 REGIONAL TRENDS AND DRIVERS
  • 4.3 CMP CONSUMABLES MARKET TRENDS
    • 4.3.1 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS - ADVANCED LOGIC
      • 4.3.1.1 ADVANCED LOGIC TRANSISTOR EST. ROADMAP
    • 4.3.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS - MEMORY
      • 4.3.2.1 3D NAND ROADMAP
      • 4.3.2.2 3D NAND STACKING
    • 4.3.3 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
    • 4.3.4 TECHNICAL TRENDS IN ADVANCED PACKAGING
    • 4.3.5 TECHNICAL TRENDS IN ADVANCED PACKAGING, CONTINUED
      • 4.3.5.1 CMP FOR TSV - GAA BACKSIDE POWER
    • 4.3.6 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
  • 4.4 EHS ISSUES FOR NEW MATERIALS
    • 4.4.1 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
  • 4.5 LOGISTIC ISSUES

5 CMP SLURRY SUPPLIER MARKET

  • 5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST
  • 5.2 CMP SLURRIES 5-YEAR FORECAST BY UNITS
  • 5.3 CMP SLURRY MARKET LEADERS
    • 5.3.1 TOTAL SLURRY MARKET SHARE BY REGION
    • 5.3.2 TOTAL SLURRY MARKET SHARE
      • 5.3.2.1 OXIDE (CERIA) SLURRY MARKET
      • 5.3.2.2 HKMG SLURRY MARKET
      • 5.3.2.3 POLYSILICON SLURRY MARKET
      • 5.3.2.4 OXIDE (SILICA) SLURRY MARKET
      • 5.3.2.5 TUNGSTEN SLURRY MARKET
      • 5.3.2.6 CU BULK SLURRY MARKET
      • 5.3.2.7 COPPER BARRIER SLURRY MARKET
      • 5.3.2.8 NEW METALS (CO, MO, RU, ETC.) SLURRY MARKET
      • 5.3.2.9 CU BACKSIDE POWER SLURRY MARKET
  • 5.4 CMP SLURRY M-A ACTIVITY, INVESTMENTS, ANNOUNCEMENTS AND PARTNERSHIPS
  • 5.5 CMP SLURRY PLANT CLOSURES - NONE
  • 5.6 NEW ENTRANTS
  • 5.7 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF DISCONTINUATIONS
  • 5.8 CMP SLURRY PRICING TRENDS
  • 5.9 TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET

6 CMP PAD MARKET STATISTICS & FORECASTS

  • 6.1 CMP PADS 5-YEAR REVENUE FORECAST
  • 6.2 CMP PADS 5-YEAR REVENUE FORECAST
    • 6.2.1 CMP PADS 5-YEAR FORECAST BY UNITS
  • 6.3 PAD SUPPLIER COMPETITIVE LANDSCAPE
  • 6.4 NEW ENTRANTS
  • 6.5 CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
  • 6.6 CMP PAD PRICING TRENDS
  • 6.7 TECHCET ANALYST ASSESSMENT

7 MATERIAL SUB-TIER SUPPLY

  • 7.1 ABRASIVE SUPPLIERS
  • 7.2 VERTICALLY INTEGRATED SUPPLIERS
  • 7.3 RAW SUPPLY CHAIN DISRUPTORS
  • 7.4 RAW MATERIALS M-A ACTIVITY
  • 7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
  • 7.6 ABRASIVE SUPPLY-CHAIN "NEW" ENTRANTS - NONE
  • 7.7 ABRASIVE SUPPLY-CHAIN PRICING TRENDS
  • 7.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

8 SUPPLIER PROFILES

  • 3M Company
  • Abrasive Technology
  • Ace NanoChem
  • Anji Micro Shanghai
  • Asahi Glass
  • ...and 40+ more

9 APPENDIX

  • 9.1 BACKSIDE TECHNOLOGY TRENDS
  • 9.2 CMP OF SILICON CARBIDE
    • 9.2.1 SILICON CARBIDE DEFECTS
    • 9.2.2 CMP CHALLENGES IN SILICON CARBIDE
  • 9.3 OXIDE (CERIA) SLURRY USES
  • 9.4 HKMG SLURRY MARKET
  • 9.5 POLYSILICON SLURRY FOR MEMS

TABLE OF FIGURES

  • FIGURE 1.1: FORECASTED 2024 MARKET SIZE
  • FIGURE 1.2: CMP CONSUMABLES FORECAST
  • FIGURE 1.3: CMP STEPS FOR ADVANCED DEVICES
  • FIGURE 1.4: 2023 CMP CONSUMABLES REVENUE
  • FIGURE 1.5: CMP CONSUMABLES REVENUE BY APPLICATION
  • FIGURE 1.6: CMP SLURRY REVENUE BY APPLICATION
  • FIGURE 1.7: CMP PAD REVENUE BY APPLICATION
  • FIGURE 1.8: CMOS TECHNOLOGY ROADMAP
  • FIGURE 1.9: 2023 SLURRY SUPPLIER MARKET SHARES
  • FIGURE 1.10: 2023 PAD SUPPLIER MARKET SHARES
  • FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
  • FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
  • FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
  • FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
  • FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
  • FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
  • FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
  • FIGURE 3.10: TSMC PHOENIX INVESTMENT ESTIMATED TO BE US $40 B
  • FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2022-2027
  • FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
  • FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
  • FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.18: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
  • FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
  • FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
  • FIGURE 4.1: SLURRY AND PAD REVENUE BY HQ REGION
  • FIGURE 4.2: CMP SLURRIES AND PADS REVENUE
  • FIGURE 4.3: CMP STEPS FOR LOGIC NODES
  • FIGURE 4.4: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
  • FIGURE 4.5: 3D NAND ROADMAP BY NODE
  • FIGURE 4.6: STACKING FOR 3D NAND
  • FIGURE 4.7: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
  • FIGURE 4.8: ADV LOGIC TRANSITION TO BACKSIDE POWER
  • FIGURE 4.9: CMP OPPORTUNITIES IN ADVANCED PACKAGING
  • FIGURE 4.10: KEY TRENDS IN ADVANCED PACKAGING
  • FIGURE 4.11: CMP OPPORTUNITIES IN ADVANCED PACKAGING
  • FIGURE 5.1: CMP SLURRY REVENUE BY APPLICATION
  • FIGURE 5.2: FORECASTED SLURRY VOLUME DEMAND
  • FIGURE 5.3: SLURRY REGIONAL MARKET SHARES IN 2023- $2B
  • FIGURE 5.4: SLURRY SUPPLIER MARKET SHARES IN 2023- $2B
  • FIGURE 5.5: OXIDE (CERIA) CMP SLURRY 2023 - $399M MARKET SHARE
  • FIGURE 5.6: HKMG/FRONT-END CMP SLURRY 2023 - $67M MARKET SHARE
  • FIGURE 5.7: POLYSILICON CMP SLURRY 2023 - $40M MARKET SHARE
  • FIGURE 5.8: OXIDE (SILICA) CMP SLURRY 2023 - $236M MARKET SHARE
  • FIGURE 5.9: TUNGSTEN CMP SLURRY 2023 - $429M MARKET SHARE
  • FIGURE 5.10: CU-BULK CMP SLURRY 2023 - $302M MARKET SHARE
  • FIGURE 5.11: CU-BARRIER CMP SLURRY 2023 SUPPLIER MARKET SHARE
  • FIGURE 5.12: NEW METALS CMP SLURRY 2023 MARKET SHARE - $3M
  • FIGURE 5.13: CU BACKSIDE POWER CMP SLURRY 2023 MARKET SHARE - $1M
  • FIGURE 6.1: CMP PAD REVENUE FORECAST BY APPLICATION
  • FIGURE 6.2: CMP PAD REVENUE BY WAFER SIZE
  • FIGURE 6.3: FORECASTED QUANTITY PAD USAGE
  • FIGURE 6.4: 2022 PAD SUPPLIER MARKET SHARES
  • FIGURE 9.1: LIMITATIONS OF FS-PDN
  • FIGURE 9.2: 2D DEVICE ARCHITECTURE EVOLUTION
  • FIGURE 9.3: SILICON CARBIDE-BASED POWER DEVICE
  • FIGURE 9.4: DEFECTS IN SILICON CARBIDE SUBSTRATES AND EPI WAFERS
  • FIGURE 9.5: SILICON CARBIDE DEFECTS
  • FIGURE 9.6: BATCH POLISH VS. CMP
  • FIGURE 9.7: STI CMP PROCESS
  • FIGURE 9.8: MEMS CMP CROSS SECTION

TABLES

  • TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
  • TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024)
  • TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
  • TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
  • TABLE 4.1: REGIONAL WAFER MARKETS
  • TABLE 4.2: REGIONAL WAFER MARKETS BY SUPPLIER HEADQUARTER REGION
  • TABLE 4.3: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
  • TABLE 5.1: 2023 SLURRY MARKET LEADERS AND TAM BY APPLICATION
  • TABLE 7.1: ABRASIVE SUPPLIERS
  • TABLE 7.2: VERTICALLY INTEGRATED SUPPLIERS