ALD/high-k金屬前驅體（重要材料）的全球市場，2024-2025

ALD / High K Metal Precursors Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年06月01日 | 出版商:

TECHCET | 英文 170 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

本報告涵蓋了半導體裝置製造中使用的前驅物的市場前景和供應鏈。它還包括有關主要供應商的資訊，材料供應鏈中的問題和趨勢，供應商市場佔有率的估計和預測以及材料細分市場的預測。

範例視圖

世界經濟與展望
- 半導體產業與全球經濟的聯繫
- 半導體銷售額成長
- 台灣外包廠商每月銷售趨勢
晶片銷售趨勢：以電子產品領域劃分
- 電子產品的前景
- 汽車產業的前景
- 智慧型手機前景
- 電腦展望
- 伺服器/IT 市場
半導體製造業的成長與擴張
- 在晶片擴張方面投入巨資
- 美國新廠
- 全球工廠擴編推動成長
- 資本投資趨勢
- 先進邏輯技術路線圖
- 工廠投資評估
政策/貿易趨勢及其影響
半導體材料概述
- 引進的晶圓數量：未來預測（~2028年）
- 材料市場預測（~2028年）

第4章材料市場趨勢

CVD/ALD 金屬/high-k/先進電介質前驅體的市場趨勢
- 前驅市場（2023年）：與2024年的聯繫
- 前驅體市場前景
- 金屬和high-k前驅物的出貨量預測：依細分市場（未來 5年）
前驅供應能力、需求與投資
- 主要供應商金屬及high-k前驅體產能
- 金屬/high-k產量：依地區劃分
- 擴大 ALD/CVD 材料產能
- 投資公告：概述
- 前驅供需平衡：概述
價格趨勢
技術趨勢/技術推廣因素：概述
- 前驅體的整體技術概述：技術趨勢
- 客戶驅動的技術
- NAND 路線圖與挑戰：堆疊/分層 3D NAND 級別
- 3D NAND 製程需要進步
- 新材料和蝕刻化學物質可實現 3D NAND 微縮－PF3（G）和 MOO2CL2（S）
- 鉬：基於 Lam 研究的半導體金屬化新前沿
- 需要在 DRAM 製程方面取得進展
- DRAM 未來的技術問題
- Micron推出突破性 NVDRAM：雙層 32 GB 非揮發性鐵電記憶體，具有類似 DRAM 的效能
- 先進邏輯路線圖與挑戰：邏輯電晶體EST.Roadmap
- 高階邏輯（Foundry）節點 HVM 估算
- 需要改進 ADV 邏輯流程
- 高階邏輯：未來的技術挑戰
- 光刻技術進步的影響
- CFET 架構：CFET 擴展的優勢
- 無機 EUV 光阻：ALD 沉積
- 分子層沉積（MLD）
- 區域選擇性沉積（ASD）
- 特殊/新興金屬及其用途
- 特殊/新興HIGH-K及其應用
區域考慮因素：金屬/high-k
- 區域因素與驅動因素
EHS 與貿易/物流問題：金屬、high-k、電介質
- ESH金屬
- ESH high-k
- ESH 回收
貿易/物流問題：金屬材料
- 貿易/物流問題：high-k材料
分析師對high-k市場趨勢的評估
- 分析師對金屬市場趨勢的評估

第5章供給面市場情勢

前驅體材料的市佔率
- 最新季活動：MERCK
- 最新季活動：AIR LIQUIDE
- 最新季活動：ENTEGRIS
- ADEKA
併購（M&A）活動與合作夥伴關係
工廠關閉
新進入公司
- MSP 推出 TURBO II（TM）蒸發器：半導體製造的下一代效率
- 新型 ZR 前驅體晶圓級二氧化鋯薄膜
- 鉬薄膜的進展：新型液體前驅體促進氣相沉積
- Hanwha為記憶體應用提供鉬沉積 ALD 設備
供應商或零件/產品線面臨停產風險
分析師對領先供應商的評估

第6章下游供應鏈：前驅物

下游（次級）供應鏈：供應商與市場概覽
- 下游供應鏈：供應商和市場概述－二級範例：NOURYON 和 GELEST
- 下游供應鏈：供應商和市場概況－化學品和氣體管理系統
- 下游供應鏈：供應商與市場概況－化學品配送櫃
- 下游供應鏈：供應商和市場概覽－閥門歧管盒（VMB）
- 下游供應鏈：供應商和市場概況－散裝規格氣體系統
- 下游供應鏈：供應商和市場概況－氣櫃
- 下游供應鏈：供應商和市場概況－成型氣體和摻雜劑氣體混合器
- 下游供應鏈：供應商和市場概覽：化學品－監測和分析系統
底層材質：CVD/ALD 前驅體的趨勢
底層材質：工業級與半導體級
半導體級底層材料供應商的國際網絡：Merck
半導體級底層材料供應商的國際網路：Air Liquide
半導體級下層材料供應商最新訊息
下游供應鏈中斷
下游供應鏈工廠最新訊息
下游供應鏈工廠的最新資訊：HAFNIA 和 REO（DUBBO PROJECT）
對半導體產業所使用的礦物的依賴
下游供應鏈的趨勢：鈷
下游供應鏈的趨勢：鋯/鉿
下游供應鏈的趨勢：鉿
下游供應鏈的趨勢：鎵
鋁
鈦
鎢
鉬
鈮鉭
稀土
下游供應鏈的趨勢：PGM
下游供應鏈的趨勢：鍺
下游供應鏈：分析師評估

第7章供應商簡介

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
20家以上其他公司

簡介目錄

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

SAMPLE VIEW

1 EXECUTIVE SUMMARY

1.1 PRECURSORS BUSINESS - MARKET OVERVIEW
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: METAL AND HIGH-K PRECURSORS
1.4 PRECURSOR TRENDS
1.5 PRECURSOR TECHNOLOGY TRENDS
1.6 COMPETITIVE LANDSCAPE METAL & HIGH-K PRECURSORS
1.7 PRECURSOR EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.8 ANALYST ASSESSMENT OF METAL AND HIGH-K PRECURSORS

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY AND OUTLOOK
- 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2 SEMICONDUCTOR SALES GROWTH
- 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1 ELECTRONICS OUTLOOK
- 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3 SMARTPHONE OUTLOOK
- 3.2.4 PC OUTLOOK
- 3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2 NEW FABS IN THE US
- 3.3.3 WW FAB EXPANSION DRIVING GROWTH
- 3.3.4 EQUIPMENT SPENDING TRENDS
- 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
  - 3.3.5.1 DRAM TECHNOLOGY ROADMAPS
  - 3.3.5.2 3D NAND TECHNOLOGY ROADMAPS
- 3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 MATERIAL MARKET TRENDS

4.1 CVD, ALD METAL & HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS
- 4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024
- 4.1.2 PRECURSOR MARKET OUTLOOK
- 4.1.3 METAL AND HIGH-K PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
4.2 PRECURSORS SUPPLY CAPACITY AND DEMAND, INVESTMENTS
- 4.2.1 METAL & HIGH-K PRECURSOR PRODUCTION CAPACITY OF TOP SUPPLIERS
- 4.2.2 METAL & HIGH-K PRODUCTION BY REGION
- 4.2.3 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS
- 4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW
- 4.2.5 PRECURSORS SUPPLY VS. DEMAND BALANCE - OVERVIEW
4.3 PRICING TRENDS
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
- 4.4.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS
- 4.4.2 CUSTOMER DRIVEN TECHNOLOGIES
- 4.4.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
- 4.4.4 3D NAND PROCESS ADVANCES REQUIRED
- 4.4.5 NEW MATERIALS AND ETCH CHEMISTRIES ENABLE 3D NAND SCALING - PF3(G) AND MOO2CL2(S)
- 4.4.6 MOLYBDENUM: THE NEW FRONTIER IN SEMICONDUCTOR METALLIZATION ACCORDING TO LAM RESEARCH
- 4.4.7 DRAM PROCESS ADVANCES REQUIRED
- 4.4.8 DRAM FUTURE TECHNOLOGY CHALLENGES
- 4.4.9 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
- 4.4.10 ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
- 4.4.11 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
- 4.4.12 ADV LOGIC PROCESS ADVANCES REQUIRED
  - 4.4.12.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
- 4.4.13 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
- 4.4.14 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
  - 4.4.14.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
  - 4.4.14.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
  - 4.4.14.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
- 4.4.15 CFET ARCHITECTURE: CFET SCALING ADVANTAGE
  - 4.4.15.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
  - 4.4.15.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS
- 4.4.16 INORGANIC EUV RESIST - ALD DEPOSITED
- 4.4.17 MOLECULAR LAYER DEPOSITION (MLD)
  - 4.4.17.1 TREND IS MLD COMBINED WITH ALD
  - 4.4.17.2 DIFFERENT TYPES OF MLD PRECURSORS AND MATERIALS
  - 4.4.17.3 MLD APPLICATIONS
- 4.4.18 AREA SELECTIVE DEPOSITION (ASD)
  - 4.4.18.1 AREA SELECTIVE DEPOSITION (ASD) - ADEKA PRESENT ASD HF-PRECURSOR
  - 4.4.18.2 AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
- 4.4.20 SPECIALTY/EMERGING METAL AND APPLICATIONS
- 4.4.21 SPECIALTY/EMERGING HIGH-K AND APPLICATIONS
4.5 REGIONAL CONSIDERATIONS - METAL AND HIGH-K
- 4.5.1 REGIONAL ASPECTS AND DRIVERS
4.6 EHS AND TRADE/LOGISTIC ISSUES - METALS, HIGH-K AND DIELECTRICS
- 4.6.1 ESH METALS
- 4.6.2 ESH HIGH-K
- 4.6.3 ESH RECYCLING
4.7 TRADE/LOGISTICS ISSUES - METAL MATERIALS
- 4.7.1 TRADE/LOGISTICS ISSUES - HIGH-K MATERIALS
4.8 ANALYST ASSESSMENT OF HIGH-K MARKET TRENDS
- 4.8.1 ANALYST ASSESSMENT OF METAL MARKET TRENDS

5 SUPPLY-SIDE MARKET LANDSCAPE

5.1 PRECURSOR MATERIAL MARKET SHARE
- 5.1.1 CURRENT QUARTER ACTIVITY - MERCK
  - 5.1.1.1 MERCK
- 5.1.2 CURRENT QUARTER ACTIVITY - AIR LIQUIDE
  - 5.1.2.1 AIR LIQUIDE
- 5.1.3 CURRENT QUARTER ACTIVITY -ENTEGRIS
  - 5.1.3.1 ENTEGRIS
- 5.1.4 ADEKA
  - 5.1.4.1 ADEKA
5.2 M&A ACTIVITY AND PARTNERSHIPS
5.3 PLANT CLOSURES
5.4 NEW ENTRANTS
- 5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION
- 5.4.2 A NEW ZR PRECURSOR WAFER-SCALE ZIRCONIUM DIOXIDE FILMS
- 5.4.3 ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION
- 5.4.4 HANWHA TO SUPPLY ALD EQUIPMENT FOR MOLYBDENUM DEPOSITION FOR MEMORY APPLICATIONS
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS

6 SUB-TIER SUPPLY-CHAIN, PRECURSORS

6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - TIER 2 EXAMPLES NOURYON AND GELEST
- 6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL & GAS MANAGEMENT SYSTEMS
- 6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL DELIVERY CABINETS
- 6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW VALVE MANIFOLD BOXES (VMB)
- 6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - BULK SPEC GAS SYSTEMS
- 6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - GAS CABINETS
- 6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - FORMING GAS & DOPANT GAS BLENDERS
- 6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS
6.2 SUB-TIER MATERIAL CVD & ALD PRECURSOR TRENDS
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS
6.7 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS
6.8 SUB-TIER SUPPLY-CHAIN PLANT UPDATES
6.9 SUB-TIER SUPPLY-CHAIN PLANT UPDATES - HAFNIA AND REO FROM THE DUBBO PROJECT
6.10 MINERAL USED IN THE SEMICONDUCTOR INDUSTRY DEPENDENCIES
6.11 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - COBALT
6.12 SUB-TIER SUPPLY-CHAIN PRICING TRENDS: ZIRCONIUM AND HAFNIUM
6.13 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - HAFNIUM
6.14 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - GALLIUM
6.15 ALUMINUM
6.16 TITANIUM
6.17 TUNGSTEN
6.18 MOLYBDENUM
6.19 NIOBIUM AND TANTALUM
6.20 RARE EARTHS
6.21 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - PGM
6.22 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - GERMANIUM
6.23 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 SUPPLIER PROFILES

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
...AND 20+ MORE

FIGURES

FIGURE 1.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 1.2: WW MARKET SHARE - METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 4.2: MEMORY SUPPLY/DEMAND SITUATION 2024
FIGURE 4.3: WW MARKET SHARE - METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)
FIGURE 4.4: REGIONAL MARKET SHARES
FIGURE 4.5: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
FIGURE 4.6: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
FIGURE 4.7: 3D NAND PROGRESSION
FIGURE 4.8: ETCH DEPTH PERFORMANCE
FIGURE 4.9: TOKYO ELECTRON'S NEW CRYOGENIC ETCH TOOL
FIGURE 4.10: DRAM MESH BY MICRON
FIGURE 4.11: IMEC CAPACITORLESS IGZO CELL FOR 3D STACKED DRAM
FIGURE 4.12: TRANSITION FROM 2D TO 3D DRAM
FIGURE 4.13: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
FIGURE 4.14: GATE STRUCTURE ROADMAP
FIGURE 4.15: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
FIGURE 4.16: LOGIC TRANSISTOR PROGRESSION
FIGURE 4.17: RIBBON FET
FIGURE 4.18: MONO LAYER NANO SHEETS CHANNELS
FIGURE 4.19: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
FIGURE 4.20: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
FIGURE 4.21: DIRECTED SELF-ASSEMBLY
FIGURE 4.22: DSA PATENT FILING BY COMPANY
FIGURE 4.23: DSA PATEN FILING SINCE 2023
FIGURE 4.24: WHAT IS PATTERN SHAPING?
FIGURE 4.25: REFINING EUV PATTERNING BY APPLIED MATERIALS
FIGURE 4.26: COMPLEMENTARY FET (CFET)
FIGURE 4.27: CFET IMPROVES PERFORMANCE IN TRACK SCALING
FIGURE 4.28: MONOLITHIC CFET PROCESS FLOW EXAMPLE
FIGURE 4.29: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION
FIGURE 4.30: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
FIGURE 4.31: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
FIGURE 4.32: BSPDN ADVANTAGE: IR DROP REDUCTION
FIGURE 4.33: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
FIGURE 4.34: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
FIGURE 4.35: PATENT FILING FOR MLD DEPOSITED EUV RESIST - SEARCH PERFORMED IN PATBASE
FIGURE 4.36: MOLECULAR LAYER DEPOSITION VS ATOMIC LAYER DEPOSITION
FIGURE 4.37: INCREASING TREND OF ALD/MLD PUBLICATIONS
FIGURE 4.38: ADEKA ASD-HF PRECURSORS
FIGURE 4.39: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
FIGURE 4.40: SPECIALTY/EMERGING METAL APPLICATIONS
FIGURE 4.41: SPECIALTY/EMERGING HIGH-K APPLICATIONS - NVM DRAM (MICRON IEDM2023)
FIGURE 4.42: 2023 METAL & HIGH-K REVENUE SHARE BY REGION
FIGURE 4.43: EHS ISSUES - HIGH-K: MINING IN CHINA
FIGURE 4.44: SK HYNIX'S RECYCLED AND RENEWABLE MATERIALS TARGETS
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT - SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)
FIGURE 5.6: NEW ZIRCONIUM PRECURSOR CLASS
FIGURE 5.7: ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024)
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024)
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)
FIGURE 6.5: PRICE TREND IN COBALT
FIGURE 6.6: HAFNIUM 5-YEAR PRICING
FIGURE 6.7: GALLIUM PRICE, 5 YEAR HISTORICAL
FIGURE 6.8: RUTHENIUM AND PLATINUM, 5-YEAR HISTORICAL PRICING
FIGURE 6.9: GERMANIUM PRICE, 5-YEAR HISTORICAL