石英設備零件的全球市場:2024～2025年 (Critical Materials Report)

Quartz Equipment Components Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年08月28日 | 出版商:

TECHCET | 英文 241 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

本報告分析了半導體裝置製造中使用的石英製造零件的市場以及支援該市場的供應鏈。本報告包括 TECHCET 資料庫的數據和分析、高級分析師經驗以及一手和二手研究。主題包括高純度石英加工零件市場、潮模砂/粉末、基材等供應鏈。它還包括按供應商和地區劃分的供應和市場趨勢預測。預測基於半導體晶圓增長、設備系統預測、技術發展和區域趨勢。

信息圖形

世界經濟和產業整體展望
- 半導體產業和世界經濟的連鎖
- 半導體的銷售增加率
- 台灣的外包製造商月銷售趨勢
晶片的銷售:電子產品的各市場區隔
- 電子產品的展望
- 汽車產業的展望
- 智慧型手機的展望
- PC的展望
- 伺服器/IT市場
半導體製造的成長與擴大
- 在晶片擴張方面投入巨資
- 美國新廠
- 全球工廠擴編推動成長
- 資本投資趨勢
- 先進邏輯技術路線圖
- 工廠投資評估
政策/貿易趨勢與影響
半導體材料概述
- TECHCET晶圓輸入數量預測（至2028年）
- TECHCET材料市場預測（至2028年）

第四章石英零件市場趨勢

石英加工件業務：市場概況
- 石英加工零件市場的趨勢（2023 年）：2024 年之前的趨勢
- 石英加工件市場前景
- 石英加工零件收入預測：按細分市場（5 年）
- 石英加工件產能：依主要供應商劃分
- 石英加工件產量：依地區劃分
- 擴大石英加工零件的產能
- 投資公告：概述
- 石英加工零件的供需平衡：概述
物價水平趨勢
石英加工零件的一般技術概述
- 石英加工零件的一般技術概述
- 石英加工零件的應用
- 石英加工零件總結
- 石英製造零件：對晶圓尺寸和石英需求的影響
- 石英加工件的技術趨勢
石英預製件：區域考量因素
- 區域因素與驅動因素
EHS（環境、健康與安全）和貿易/物流問題
- 俄羅斯入侵烏克蘭
- 也門胡塞武裝在紅海和亞丁灣的罪行擾亂了全球航運
- 新興的中東衝突可能會擾亂全球技術供應鏈和英特爾的擴張計劃
- 巴拿馬運河歷史性乾旱
- EHS 問題：環境影響
- 貿易/物流問題
分析師對石英加工件市場趨勢的評估

第五章供給面市場狀況

石英加工件的市佔率：加工市場
- 石英加工零件市場佔有率：冷加工（機械加工）
- 石英加工件的市場佔有率：熱加工（熔化）
- 當前供應商當前活動和報告收入：Quartz（季度）
- 4家主要供應商的財務狀況（2024年第一季）
- 最新季度活動：SHIN-ETSU
- 最新季度活動：TOSOH QUARTZ
- 最新季度活動：FERROTEC
- 最新季度活動：WONIK
- 最新活動：賀利氏
併購 (M&A) 活動與合作夥伴關係
工廠關閉 - 無
新進入者
石英或零件/產品線面臨停產風險
TECHCET 分析師對石英供應商的評估

第 6 章次級供應鏈，Quartz

細分供應鏈：供應來源與市場概述
- 石英次級供應鏈：市場背景
- 石英次級供應鏈：市場趨勢
- 石英基材收入預測：按細分市場（5 年）
- 細分供應鏈：石英玻璃基板市場佔有率
- 次級供應鏈：石英玻璃基板 - 管/棒市場佔有率
- Subtier 供應鏈：石英玻璃基板 - 錠/晶錠市場佔有率
- Subtier 供應鏈：石英基材 - 砂/粉市場佔有率
- 半導體級石英二級供應商的最新訊息
次級供應鏈：顛覆
次級供應鏈併購或合作活動
次級供應鏈中的 EHS 與物流問題
次級供應鏈中的 "新" 進入者 - 無
次級供應鏈工廠的最新訊息
關閉下游供應鏈工廠 - 未報告
細分供應鏈趨勢
TECHCET 分析師對供應鏈進行細化評估

第 7 章供應商簡介（製造商）

應用陶瓷有限公司
北京凱德石英有限公司
東海市宏偉石英製品有限公司
迪斯科技有限公司
FERROTEC 控股公司
…其他20多項

第 8 章附錄

技術趨勢/技術推廣因素 - 概述
3D NAND 製程需要進步

簡介目錄

This report covers the market and supply-chain for Quartz Fabricated Parts used in semiconductor device fabrication, and the supporting supply chain. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. Topics include High Purity Fabricated Quartz Parts market, supply chain from raw sand/powder, and base materials. Effort has been made to provide breakdown of the supply and market by supplier as well as region. Forecasts are based on semiconductor wafer starts growth and equipment systems forecast as well as technology developments and regional dynamics.

INFOGRAPHICS

1. EXECUTIVE SUMMARY

1.1. QUARTZ FABRICATED PARTS BUSINESS - MARKET OVERVIEW
- 1.1.1. QUARTZ FABRICATED PARTS BUSINESS - MARKET STRUCTURAL OVERVIEW
1.2. MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3. QUARTZ FABRICATED PARTS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
1.4. QUARTZ FABRICATED PARTS SEGMENT TRENDS
1.5. TECHNOLOGY TRENDS - QUARTZ FABRICATED PARTS
1.6. COMPETITIVE LANDSCAPE - QUARTZ FABRICATED PARTS
1.7. FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS
1.8. EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS - QUARTZ FABRICATED PARTS
1.9. ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS

2. SCOPE, PURPOSE AND METHODOLOGY

2.1. SCOPE
2.2. PURPOSE & METHODOLOGY
2.3. OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1. WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK
- 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2. SEMICONDUCTOR SALES GROWTH
- 3.1.3. TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1. ELECTRONICS OUTLOOK
- 3.2.2. AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1. ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2. INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3. SMARTPHONE OUTLOOK
- 3.2.4. PC OUTLOOK
- 3.2.5. SERVERS / IT MARKET
3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1. IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2. NEW FABS IN THE US
- 3.3.3. WW FAB EXPANSION DRIVING GROWTH
- 3.3.4. EQUIPMENT SPENDING TRENDS
- 3.3.5. ADVANCED LOGIC TECHNOLOGY ROADMAPS
  - 3.3.5.1. DRAM TECHNOLOGY ROADMAPS
  - 3.3.5.2. 3D NAND TECHNOLOGY ROADMAPS
- 3.3.6. FAB INVESTMENT ASSESSMENT
3.4. POLICY & TRADE TRENDS AND IMPACT
3.5. SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1. TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2. TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4. QUARTZ PARTS MARKET TRENDS

4.1. QUARTZ FABRICATED PARTS BUSINESS - MARKET OVERVIEW
- 4.1.1. 2023 QUARTZ FABRICATED PARTS MARKET LEADING INTO 2024
- 4.1.2. QUARTZ FABRICATED PARTS MARKET OUTLOOK
- 4.1.3. QUARTZ FABRICATED PARTS 5-YEAR REVENUE FORECAST BY SEGMENT
- 4.1.4. QUARTZ FABRICATED PARTS PRODUCTION CAPACITY OF TOP SUPPLIERS
- 4.1.5. QUARTZ FABRICATED PARTS PRODUCTION BY REGION
- 4.1.6. QUARTZ FABRICATED PARTS PRODUCTION CAPACITY EXPANSIONS
- 4.1.7. INVESTMENT ANNOUNCEMENTS OVERVIEW
- 4.1.8. QUARTZ FABRICATED PARTS SUPPLY VS. DEMAND BALANCE - OVERVIEW
  - 4.1.8.1. SUPPLY VS. DEMAND BALANCE - QUARTZ FABRICATED PARTS
4.2. PRICING TRENDS
4.3. QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW
- 4.3.1. QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW
- 4.3.2. QUARTZ FABRICATED PARTS APPLICATIONS
- 4.3.3. QUARTZ FABRICATED PARTS GENERAL DESCRIPTION
- 4.3.4. QUARTZ FABRICATED PARTS - WAFER SIZE AND EFFECT ON QUARTZ REQUIREMENTS
- 4.3.5. QUARTZ FABRICATED PARTS TECHNOLOGY TRENDS
4.4. REGIONAL CONSIDERATIONS - QUARTZ FABRICATED PARTS
- 4.4.1. REGIONAL ASPECTS AND DRIVERS
4.5. EHS AND TRADE/LOGISTIC ISSUES
- 4.5.1. RUSSIA INVASION OF UKRAINE
- 4.5.2. YEMEN'S HOUTHI ATTACKS IN THE RED SEA AND GULF OF ADEN DISRUPT GLOBAL SHIPPING
- 4.5.3. NEW MIDDLE EAST CONFLICT COULD DISRUPT GLOBAL TECH SUPPLY CHAIN AND INTEL'S EXPANSION PLANS
- 4.5.4. PANAMA CANAL HISTORIC DROUGHT
- 4.5.5. EHS ISSUES - ENVIRONMENTAL IMPACT
- 4.5.6. TRADE/LOGISTICS ISSUES
4.6. ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS MARKET TRENDS

5. SUPPLY-SIDE MARKET LANDSCAPE

5.1. QUARTZ FABRICATED PARTS MARKET SHARE - FABRICATION MARKET
- 5.1.1. QUARTZ FABRICATED PARTS MARKET SHARE - COLD FABRICATION (MACHINING)
- 5.1.2. QUARTZ FABRICATED PARTS MARKET SHARE - HOT FABRICATION (FUSED)
- 5.1.3. CURRENT QUARTER - SUPPLIERS' ACTIVITIES & REPORTED REVENUES - QUARTZ
- 5.1.4. FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS
- 5.1.5. CURRENT QUARTER ACTIVITY - SHIN-ETSU
- 5.1.6. CURRENT QUARTER ACTIVITY - TOSOH QUARTZ
- 5.1.7. CURRENT QUARTER ACTIVITY - FERROTEC
- 5.1.8. CURRENT QUARTER ACTIVITY - WONIK
- 5.1.9. CURRENT ACTIVITY - HERAEUS
5.2. M&A ACTIVITY AND PARTNERSHIPS
5.3. PLANT CLOSURES - NONE
5.4. NEW ENTRANTS
5.5. SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.6. TECHCET ANALYST ASSESSMENT OF QUARTZ SUPPLIERS

6. SUB-TIER SUPPLY-CHAIN, QUARTZ

6.1. SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1. QUARTZ SUB-TIER SUPPLY-CHAIN MARKET BACKGROUND
- 6.1.2. QUARTZ SUB-TIER SUPPLY-CHAIN MARKET TRENDS
- 6.1.3. QUARTZ BASE MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT
- 6.1.4. SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS MARKET SHARE
- 6.1.5. SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS - TUBES AND RODS MARKET SHARE
- 6.1.6. SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS - INGOTS AND BOULES MARKET SHARE
- 6.1.7. SUB-TIER SUPPLY CHAIN: QUARTZ BASE MATERIALS - SAND/POWDER MARKET SHARE
- 6.1.8. SEMICONDUCTOR-GRADE QUARTZ SUB-TIER SUPPLIER NEWS
6.2. SUB-TIER SUPPLY-CHAIN - DISRUPTIONS
6.3. SUB-TIER SUPPLY-CHAIN M&A OR PARTNERSHIP ACTIVITY
6.4. SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES - SEE SECTION 4.5
6.5. SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS - NONE
6.6. SUB-TIER SUPPLY-CHAIN PLANT UPDATES
6.7. SUB-TIER SUPPLY-CHAIN PLANT CLOSURES - NONE REPORTED
6.8. SUB-TIER SUPPLY-CHAIN PRICING TRENDS
6.9. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7. SUPPLIER PROFILES (FABRICATORS)

APPLIED CERAMICS, INC.
BEIJING KAIDE QUARTZ CO., LTD
DONGHAI HONGWEI QUARTZ PRODUCTS CO., LTD.
DS TECHNO CO., LTD.
FERROTEC HOLDINGS CORPORATION
...AND 20+ MORE

8. APPENDIX

8.1. TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
- 8.1.1. QUARTZ GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS
- 8.1.2. CUSTOMER DRIVEN TECHNOLOGIES
- 8.1.3. NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
8.1.4 3D NAND PROCESS ADVANCES REQUIRED
- 8.1.5. MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
- 8.1.6. ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
- 8.1.7. ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
  - 8.1.7.1. THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
- 8.1.8. ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
- 8.1.9. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
  - 8.1.9.1. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
  - 8.1.9.2. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
  - 8.1.9.3. ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
- 8.1.10. CFET ARCHITECTURE: CFET SCALING ADVANTAGE
  - 8.1.10.1. CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
  - 8.1.10.2. CFET ARCHITECTURE: CFET FUTURE PROSPECTS
- 8.1.11. INORGANIC EUV RESIST - SPIN ON DEPOSITION
  - 8.1.11.1. INORGANIC EUV RESIST - ALD DEPOSITED
- 8.1.12. SELF ALIGNED MULTI PATTERNING - SADP
  - 8.1.12.1. SELF ALIGNED MULTI PATTERNING - SAQP
  - 8.1.12.2. SELF ALIGNED MULTI PATTERNING - PEALD EQUIPMENT
  - 8.1.12.3. SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM?
- 8.1.13. EUV, MULTI PATTERNING AND GEOPOLITICS
- 8.1.14. AREA SELECTIVE DEPOSITION (ASD)
  - 8.1.14.1. AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
- 8.1.15. SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS

FIGURES

FIGURE 1.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT
FIGURE 1.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE
FIGURE 1.3: TOP-4 QUARTZ MAKERS' QUARTERLY COMBINED SALES (US$M)
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY HAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000'S OF NTD
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT
FIGURE 4.2: FABRICATED QUARTZ COMPONENTS MARKET SHARE % BY SUPPLIER
FIGURE 4.3: 2023 FABRICATED QUARTZ COMPONENTS BY REGION
FIGURE 4.4: QUARTZ FABRICATED PARTS CAPACITY/DEMAND FORECAST
FIGURE 4.5: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS
FIGURE 4.6: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS
FIGURE 4.7: QUARTZ PRODUCTS FOR DRY ETCH APPLICATIONS
FIGURE 4.8: QUARTZ PRODUCTS FOR EPI APPLICATIONS
FIGURE 4.9: 2023 QUARTZ FABRICATED PARTS REVENUE SHARE BY REGION
FIGURE 4.10: ASSESSED CONTROL OF TERRAIN AROUND DONETSK
FIGURE 4.11: YEMEN'S HOUTHI ATTACKS DISRUPTING GLOBAL SHIPPING
FIGURE 4.12: MIDDLE EAST CONFLICT
FIGURE 4.13: PANAMA CANAL SHIPPING
FIGURE 4.14: GREENHOUSE GAS PROTOCOL, DETAILED CATEGORIES
FIGURE 4.15: SCOPE 3 EMISSIONS FOR SEMICONDUCTOR COMPANIES
FIGURE 5.1: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE (HOT & COLD)
FIGURE 5.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.3: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.4: TOP-4 QUARTZ MAKERS' QUARTERLY COMBINED SALES (US$M)
FIGURE 5.5: TOSS CORP 2024 FINANCIALS
FIGURE 5.6: WONIK CURRENT QUARTER FINANCIALS
FIGURE 5.7: #2 HERAEUS CONSOLIDATED 2023 FINANCIALS
FIGURE 6.1: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS
FIGURE 6.2: QUARTZ BASE MATERIALS REVENUE FORECAST BY SEGMENT
FIGURE 6.3: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS UPPLIER RANKING- BASE MATERIAL
FIGURE 6.4: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- TUBES AND RODS
FIGURE 6.5: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- INGOT/BOULE
FIGURE 6.6: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 2023 QUARTZ POWDER
FIGURE 8.1: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
FIGURE 8.2: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
FIGURE 8.3: 3D NAND PROGRESSION
FIGURE 8.4: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
FIGURE 8.5: GATE STRUCTURE ROADMAP
FIGURE 8.6: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
FIGURE 8.7: RIBBON FET
FIGURE 8.8: MONO LAYER NANO SHEETS CHANNELS
FIGURE 8.9: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
FIGURE 8.10: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
FIGURE 8.11: DIRECTED SELF-ASSEMBLY
FIGURE 8.12: DSA PATENT FILING BY COMPANY
FIGURE 8.13: DSA PATEN FILING SINCE 2023
FIGURE 8.14: WHAT IS PATTERN SHAPING?
FIGURE 8.15: REFINING EUV PATTERNING BY APPLIED MATERIALS
FIGURE 8.16: COMPLEMENTARY FET (CFET)
FIGURE 8.17: CFET IMPROVES PERFORMANCE IN TRACK SCALING
FIGURE 8.18: MONOLITHIC CFET PROCESS FLOW EXAMPLE
FIGURE 8.19: MCFET NEW FEATURE- MIDDLE DIELECTRIC ISOLATION
FIGURE 8.20: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
FIGURE 8.21: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
FIGURE 8.22: BSPDN ADVANTAGE- IR DROP REDUCTION
FIGURE 8.23: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
FIGURE 8.24: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
FIGURE 8.25: INPRIA EUV MOR
FIGURE 8.26: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST
FIGURE 8.27: PATENT FILING FOR MLD DEPOSITED EUV RESIST SEARCH PERFORMED IN PATBASE
FIGURE 8.28: SADP PROCESS FLOW USING ALD SPACER
FIGURE 8.29: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW
FIGURE 8.30: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
FIGURE 8.31: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS)

TABLES

TABLE 1.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
TABLE 4.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION
TABLE 4.2: ESTIMATED FABRICATED QUARTZ COMPONENTS SHARE BY SUPPLIER
TABLE 4.3: QUARTZ FABRICATED PARTS SUPPLIER MANUFACTURING LOCATIONS
TABLE 4.4: OVERVIEW OF ANNOUNCED 2023/2024 QUARTZ FABRICATED PARTS SUPPLIER INVESTMENTS
TABLE 4.5: COMPARISON OF TUBES AND BOATS ATTRIBUTES FOR 200MM AND 300MM PROCESSES
TABLE 4.6: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (1 OF 2)
TABLE 4.7: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (2 OF 2)
TABLE 5.1: MOST RECENT QUARTERLY QUARTZ SUPPLIER SALES (IN US$M)
TABLE 5.2: SHIN-ETSU CURRENT QUARTER FINANCIALS (ANNUAL RESULTS)
TABLE 5.3: FERROTEC YOY FINANCIALS
TABLE 5.4: FERROTEC ANNUAL (ENDING 3/2024) FINANCIALS
TABLE 8.1: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL)
TABLE 8.2: MULTIPATTERNING AT 7NM BY TSMC
TABLE 8.3: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS