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市場調查報告書

商品編碼

1471958

3D 堆疊市場規模和預測、全球和區域佔有率、趨勢和成長機會分析報告範圍：按互連技術、設備類型、最終用戶和地理位置

3D Stacking Market Size and Forecast, Global and Regional Share, Trend, and Growth Opportunity Analysis Report Coverage: By Interconnecting Technology, Device Type, End User, and Geography

出版日期: 2024年03月20日 | 出版商:

The Insight Partners | 英文 150 Pages | 商品交期: 1-5個工作天內

價格

簡介目錄

2022年全球3D堆疊市場估值為18.1億美元，預計2030年將達59.3億美元；預計 2022 年至 2030 年複合年成長率為 16.0%。

亞太地區 3D 堆疊市場因台積電和三星半導體等知名公司在該地區擁有完善的製造設施而獲得了突出地位。此外，中國、台灣、韓國和日本等國家是全球半導體和電子元件的製造中心。對智慧型手機、平板電腦和穿戴式裝置等更小、更強大、更節能的裝置的需求推動了該產業採用 3D 堆疊技術。

亞太地區 3D 堆疊技術的工業應用取得了顯著成長。航空航太、汽車和醫療保健等產業擴大將 3D 堆疊用於各種目的。例如，在航空航太工業中，對輕型飛機零件的需求導致了積層製造的廣泛採用，其中包括 3D 堆疊技術。因此，3D 堆疊在航空航太工業中的日益成長的應用預計將成為該地區 3D 堆疊市場的關鍵趨勢之一。

台積電股份有限公司；英特爾公司； Advanced Micro Devices公司;恩智浦半導體；博通公司；日月光科技；德州儀器公司；聯發科技、Amkor 科技；和三星半導體公司是 3D 堆疊市場報告中介紹的幾位參與者。市場參與者專注於新產品的推出、擴張和多元化以及收購，這使他們能夠獲得現有的商機。

整體 3D 堆疊市場分析是使用主要和次要來源得出的。為了開始 3D 堆疊市場研究過程，我們利用內部和外部來源進行了詳盡的次要研究，以獲得與 3D 堆疊市場相關的定性和定量資訊。此流程還可用於獲取所有細分市場的 3D 堆疊市場成長概況和市場預測。此外，我們還與行業參與者和評論員進行了多次主要訪談，以驗證資料並獲得有關該主題的更多分析見解。此流程的參與者包括副總裁、業務開發經理、市場情報經理和國家銷售經理等行業專家，以及估值專家、研究分析師和關鍵意見領袖等外部顧問，專門從事 3D 堆疊市場預測。

歐洲
- 德國
- 法國
- 義大利
- 英國
- 俄羅斯
- 歐洲其他地區
亞太
- 澳洲
- 中國
- 印度
- 日本
- 韓國
- 台灣
- 亞太其他地區
中東和非洲
- 南非
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
- 中東和非洲其他地區
南美洲和中美洲
- 巴西
- 阿根廷
- 南美洲和中美洲其他地區

第 11 章：產業格局

併購
協議、合作、合資企業
新產品發布
擴張和其他策略發展

第 12 章：競爭格局

關鍵參與者的熱圖分析
公司定位與專注

第 13 章：3D 堆疊市場 - 主要公司簡介

Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
Advanced Micro Devices
NXP Semiconductors
Broadcom Inc.
ASE Technology
Texas Instruments Incorporated
MediaTek Inc.
Amkor Technology
Samsung Semiconductor, Inc.

第 14 章：附錄

簡介目錄

Product Code: TIPRE00039036

The global 3D stacking market was valued at US$ 1.81 billion in 2022 and is expected to reach US$ 5.93 billion by 2030; it is projected to register a CAGR of 16.0% from 2022 to 2030. The 3D stacking market report emphasizes the key factors driving the market and showcases the developments of prominent players.

The Asia Pacific 3D stacking market has gained prominence owing to the presence of well-established manufacturing facilities of renowned companies-such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Semiconductor, Inc.-in the region. Moreover, countries such as China, Taiwan, South Korea, and Japan are global manufacturing hubs for semiconductors and electronic components. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones, tablets, and wearables, drives the adoption of 3D stacking technologies in this industry.

Asia Pacific has witnessed remarkable growth in the industrial applications of 3D stacking technologies. Industries such as aerospace, automotive, and healthcare are increasingly utilizing 3D stacking for various purposes. For instance, in the aerospace industry, the demand for lightweight aircraft components has led to the widespread adoption of additive manufacturing, which includes 3D stacking techniques. Thus, the growing application of 3D stacking in the aerospace industry is anticipated to be one of the key 3D stacking market trends in the region.

Taiwan Semiconductor Manufacturing Company Limited; Intel Corporation; Advanced Micro Devices; NXP Semiconductors; Broadcom Inc.; ASE Technology; Texas Instruments Incorporated; MediaTek Inc., Amkor Technology; and Samsung Semiconductor, Inc. are a few players profiled in the 3D stacking market report. The market players focus on new product launches, expansion and diversification, and acquisition, which allow them to access prevailing business opportunities.

The overall 3D stacking market analysis has been derived using both primary and secondary sources. To begin the 3D stacking market research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the 3D stacking market. The process also serves the purpose of obtaining an overview and market forecast for the 3D stacking market growth with respect to all market segments. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data and gain more analytical insights about the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers-along with external consultants such as valuation experts, research analysts, and key opinion leaders-specializing in the 3D stacking market forecast.

1. Introduction

1.1 Scope of the Study
1.2 Market Definition, Assumptions and Limitations
1.3 Market Segmentation

2. Executive Summary

2.1 Key Insights
2.2 Market Attractiveness Analysis

3. Research Methodology

4. 3D Stacking Market Landscape

4.1 Overview
4.2 PEST Analysis
4.3 Ecosystem Analysis
- 4.3.1 List of Vendors in the Value Chain

5. 3D Stacking Market - Key Market Dynamics

5.1 Key Market Drivers
5.2 Key Market Restraints
5.3 Key Market Opportunities
5.4 Future Trends
5.5 Impact Analysis of Drivers and Restraints

6. 3D Stacking Market - Global Market Analysis

6.1 3D Stacking - Global Market Overview
6.2 3D Stacking - Global Market and Forecast to 2031

7. 3D Stacking Market - Revenue Analysis (USD Million) - By Interconnecting Technology, 2020-2030

7.1 Overview
7.2 Through-Silicon Via
7.3 Monolithic 3D Integration
7.4 3D Hybrid Bonding

8. 3D Stacking Market - Revenue Analysis (USD Million) - By Device Type, 2020-2030

8.1 Overview
8.2 Memory Devices
8.3 MEMS/Sensors
8.4 LEDs
8.5 Imaging and Optoelectronics
8.6 Others

9. 3D Stacking Market - Revenue Analysis (USD Million) - By End User, 2020-2030

9.1 Overview
9.2 Consumer Electronics
9.3 Telecommunication
9.4 Automotive
9.5 Manufacturing
9.6 Healthcare
9.7 Others

10. 3D Stacking Market - Revenue Analysis (USD Million), 2020-2030 - Geographical Analysis

10.1 North America
- 10.1.1 North America 3D Stacking Market Overview
- 10.1.2 North America 3D Stacking Market Revenue and Forecasts to 2031
- 10.1.3 North America 3D Stacking Market Revenue and Forecasts and Analysis - By Interconnecting Technology
- 10.1.4 North America 3D Stacking Market Revenue and Forecasts and Analysis - By Device Type
- 10.1.5 North America 3D Stacking Market Revenue and Forecasts and Analysis - By End User
- 10.1.6 North America 3D Stacking Market Revenue and Forecasts and Analysis - By Countries
  - 10.1.6.1 United States 3D Stacking Market
    - 10.1.6.1.1 United States 3D Stacking Market, by Interconnecting Technology
    - 10.1.6.1.2 United States 3D Stacking Market, by Device Type
    - 10.1.6.1.3 United States 3D Stacking Market, by End User
  - 10.1.6.2 Canada 3D Stacking Market
    - 10.1.6.2.1 Canada 3D Stacking Market, by Interconnecting Technology
    - 10.1.6.2.2 Canada 3D Stacking Market, by Device Type
    - 10.1.6.2.3 Canada 3D Stacking Market, by End User
  - 10.1.6.3 Mexico 3D Stacking Market
    - 10.1.6.3.1 Mexico 3D Stacking Market, by Interconnecting Technology
    - 10.1.6.3.2 Mexico 3D Stacking Market, by Device Type
    - 10.1.6.3.3 Mexico 3D Stacking Market, by End User

Note - Similar analysis would be provided for below mentioned regions/countries

10.2 Europe
- 10.2.1 Germany
- 10.2.2 France
- 10.2.3 Italy
- 10.2.4 United Kingdom
- 10.2.5 Russia
- 10.2.6 Rest of Europe
10.3 Asia-Pacific
- 10.3.1 Australia
- 10.3.2 China
- 10.3.3 India
- 10.3.4 Japan
- 10.3.5 South Korea
- 10.3.6 Taiwan
- 10.3.7 Rest of Asia-Pacific
10.4 Middle East and Africa
- 10.4.1 South Africa
- 10.4.2 Saudi Arabia
- 10.4.3 U.A.E
- 10.4.4 Rest of Middle East and Africa
10.5 South and Central America
- 10.5.1 Brazil
- 10.5.2 Argentina
- 10.5.3 Rest of South and Central America

11. Industry Landscape

11.1 Mergers and Acquisitions
11.2 Agreements, Collaborations, Joint Ventures
11.3 New Product Launches
11.4 Expansions and Other Strategic Developments

12. Competitive Landscape

12.1 Heat Map Analysis by Key Players
12.2 Company Positioning and Concentration

13. 3D Stacking Market - Key Company Profiles

13.1 Taiwan Semiconductor Manufacturing Company Limited
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments

Note - Similar information would be provided for below list of companies