市場調查報告書
商品編碼
1370863
矽光子市場- 2018-2028 年全球產業規模、佔有率、趨勢、機會和預測,按組件、按應用、波導、產品、材料、地區和競爭細分Silicon Photonics Market- Global Industry Size, Share, Trends, Opportunities, and Forecast, 2018-2028 Segmented By Component, By Application, By Waveguide, By Product, By Material, By Region and Competition |
由於5G產業的快速發展,加上雲端服務需求的激增,矽光子市場預計將在預測期內成長,這為在矽光子市場提供產品的公司提供了大量機會。多年來,主要參與者對矽光子技術表現出了興趣。英特爾公司、思科系統公司、IBM公司和瞻博網路公司等公司都進行了大量投資,以鞏固其在不斷成長的矽光子市場的主導地位。然而,即使有如此巨大的成長,矽光子市場也面臨許多挑戰,包括採用不同通訊系統的問題、熱效應的風險以及電信領域商業化的缺乏。
市場概況 | |
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預測期 | 2024-2028 |
2022 年市場規模 | 13.4億美元 |
2028 年市場規模 | 60.9億美元 |
2023-2028 年年複合成長率 | 28.79% |
成長最快的細分市場 | 汽車 |
最大的市場 | 北美洲 |
矽光子技術可望徹底改變電信業。到目前為止,資料都是透過銅線以電訊號的形式傳輸的。然而,諸如 5G 通訊等技術的出現,可以實現更快的資料速度,以及銅允許的最大吞吐量,可能會成為計算速度的瓶頸。因此,在矽光子學中,更多圖案化的矽將用於傳輸攜帶數據的雷射訊號,並有可能允許更多資料更快地移動,同時消耗更少的功率。此外,矽光子學可以輕鬆地以與目前矽基技術相同的質量規模製造。此外,英特爾公司等公司正在強化其 100G 矽光子收發器產品組合,以用於 5G 和物聯網應用。
矽光子技術因其頻寬、電磁場抗擾性、與光纖的兼容性和靈活性等有利特性而主要用於光通訊系統和網路。透過互補金屬氧化物半導體(CMOS)相容製程製造光子裝置為低成本和減少電路佔用面積鋪平了一條新途徑,使光學技術可用於眾多網路區段和新應用。 5G將4G基頻單元(BBU)、射頻拉遠單元(RRU)和天線重建為集中單元(CU)。另一方面,分散式單元(DU)和主動天線單元(AAU)確保網路將包含前傳、中傳和回傳。這些變化增加了對光收發器的需求,以滿足與 5G 網路架構中關鍵鏈路相關的高頻寬和距離要求。
智慧型手機和其他連網裝置數量的不斷增加增加了資料流量,因為這些設備在給定時間點透過網路傳輸大量資料,進一步創造了終端消費者對 5G 的需求。根據領先網路解決方案供應商 Telefonaktiebolaget LM Ericsson 的預測,到 2023 年底,全球每月行動資料流量預計將超過 100 ExaBytes (EB)。此外,醫療保健、消費性電子產品和行動裝置對高速網路解決方案的需求汽車產業為5G 服務提供者創造了巨大的機會。因此,對5G基礎設施的需求不斷成長將對矽光子市場的成長產生正面影響。
電信業已採用光纖技術作為改進的解決方案,以滿足透過銅線傳輸更高速度和大容量資料的不斷成長的需求。目前,大量資料透過長距離光纖傳輸和接收,這導致需要更換高耗電的電氣交換機,這些交換機需要光電轉換並導致訊號遺失。這導致了光子開關的出現,以提高傳輸質量並將單個傳輸連結到數十甚至數千個伺服器。
此外,矽基光子開關採用先進的CMOS技術,因其低成本和高容量而作為強大的平台而受到研究人員的巨大吸引力。此外,傳統銅纜由於資料傳輸能力緩慢,阻礙了資料中心的發展和高效能運算 (HPC)。此外,它被認為不足以滿足 HPC 應用程式、資料中心或有效管理不斷成長的資料量的需求。另一方面,在矽光子學的情況下,資料透過光線在電腦晶片之間傳輸,與電導體相比,它可以在更短的時間內傳輸大量資料。隨著矽光子技術的不斷進步,預計能夠以經濟高效的方式實現 1 tbps 的資料傳輸速度。
英特爾公司、IBM公司和思科系統公司等公司認為矽光子學是一項有前景的技術,可以重塑資料中心系統交換資料的方式並創建更精簡的機架設備。因此,這些公司正在投資技術。 IBM公司投資了矽奈米光子技術,該技術使用光而不是電訊號來傳輸資料,使得大量資料能夠透過光脈衝在伺服器、大型資料中心和超級電腦的電腦晶片之間快速傳輸。隨著矽光子晶片的整合,由於訊號強度很強,遠距離傳輸大塊資料(> 100 GB)變得更加容易。目前,矽光子技術在北美、歐洲等地區已廣泛應用。此外,隨著資料中心等應用程式對更高頻寬的需求增加,該產業將轉向垂直整合以推動製造流程。此外,預計未來幾年光電子產品開發的研究活動將會增加。
資料中心的部署不斷增加:資料中心在資訊的攝取、運算、儲存和管理方面發揮著至關重要的作用。然而,許多資料中心笨重、低效且過時。因此,為了保持它們的運行,資料中心營運商正在對其進行升級以適應不斷變化的世界。此外,思科系統公司聲稱,到 2021 年,資料中心內的流量將增加三倍,其中很大一部分佔有率歸因於超大規模設施,例如由谷歌、亞馬遜、Facebook、蘋果和微軟等領先企業開發的設施。由於其架構,超大規模資料中心幾乎可以擴展到任何所需的規模。這些中心需要高速連接來在其基本構建塊(例如各個伺服器及其支援設備)之間移動拋棄式資料。
資料中心最先進的傳輸速率大多為 100 Gb/s。然而,業界目前的目標是部署 400 Gb/s 左右的速度。預計該速度未來還會增加。成長速度意味著矽光子解決方案將能夠輕鬆深入通訊結構。此外,PIC 的最大需求量是資料和電信網路中的資料中心互連 (DCI),以及 5G 無線技術、汽車或醫療感測器等新應用的出現。磷化銦(InP)是最常用的,但矽光子學的成長速度較快。矽光子技術正在應用於各種資料中心的系統到系統連接。預計該技術還將在伺服器內晶片的各個部分之間移動。
矽光子學在高頻寬光通訊領域迅速成熟,應用於資料通訊、存取網路和頻寬密集型電子產品的 I/O 領域,以及光譜學和感測領域的新興應用。為了從光子學中獲得最佳性能,需要整合光子學和電子學,例如並排、堆疊或在同一晶片上。然而,光子學和電子學的結合可能會在設計方面產生一系列新問題,例如複雜光子和電子電路的協同設計和聯合模擬、可以處理光子電路的驗證演算法以及對可變性的容忍度。
系統級應用的製造流程、設計平台和特定裝置設計仍存在重大挑戰。矽光子學的基本價值主張是,與目前最先進的微電子晶片相比,它可以利用使用較低解析度 CMOS 處理的成熟製造製程。然而,現有的高品質電子裝置製造技術不一定能夠大批量地實現高品質光學元件。矽光子元件中 CMOS 與光子學的單晶片整合強烈依賴於特定製造製程的設計規則,導致裝置目前必須經過後處理才能實現高產量。
封裝在矽光子元件的系統級實現中發揮重要作用。矽光子裝置要上市,就需要經濟高效、堅固耐用的封裝。為了使矽光子成為一個可行的平台,需要實現封裝的自動化。封裝中的重要問題是大容量光學連接、熱穩定性以及電子元件的正確封裝。大多數商業矽光子元件都是收發器。光柵耦合器通常提供光學連接,因為與邊緣耦合相比,它們對未對準不太敏感。然而,光柵耦合器具有波長選擇性,這使得它們難以用於大光譜頻寬解決方案。
熱穩定性也是矽光子元件封裝中的重要問題。其中一些設備利用熱引起的較大折射率變化。裝置的封裝必須確保外部溫度波動不會改變裝置的運作。此外,導致這種過量熱產生的矽光子學的物理特性是雙光子吸收,這是一個電子-電洞對在一對光子的幫助下被激發的過程。然而,這個過程會產生不必要的熱量和光。由於產生熱量,矽光子技術被認為是一種不環保的技術,因為熱污染會顯著提高周圍溫度。因此,採用熱電冷卻器 (TEC) 的封裝變得越來越普遍。然而,這些組件增加了設備的整體功耗和成本。
全球矽光子市場分為組件、應用、波導、產品、材料和區域。根據組件,市場分為雷射、調變器、PIC、光電探測器、超低損耗波導。根據應用,市場分為資料中心、電信、消費性電子、醫療保健、汽車等。根據波導,市場分為400-1,500 NM、1,310-1,550 NM、900-7000 NM。根據產品,市場分為收發器、可變光衰減器、交換器、電纜、感測器。依材料,市場分為矽或矽基合金、磷化銦等。依地區分類,市場分為北美、亞太地區、歐洲、南美、中東和非洲。
全球矽光子市場的主要市場參與者包括英特爾公司、Luxtera Inc.(思科系統公司的子公司)、Acacia Communications, Inc.、Infinera Corporation、IBM Corporation、Finisar Corporation、STMicroElectronics NV、Fujitsu Ltd.、OneChip Photonics Inc .和NeoPhotonics Corporation
在本報告中,全球矽光子市場除了詳細介紹的產業趨勢外,還分為以下幾類:
(註:公司名單可依客戶要求客製化)
Silicon photonics market is expected to grow during the forecast period due to the rapid developments in the 5G industry, combined with the surge in demand for cloud-based services, which provide a plethora of opportunities to companies that offer products in the silicon photonics market. Over the years, major players have shown interest in the silicon photonics technology. Intel Corporation, Cisco Systems, Inc., IBM Corporation, and Juniper Networks, Inc., among other players, have invested heavily to assert their dominance in the growing silicon photonics market. However, even with such enormous growth, the silicon photonics market is facing many challenges, including problems in adopting different communication systems, risk of thermal effects, and lack of commercialization in the telecommunication sector.
The emerging technology that transmits data inside computer chips via optical beams is called silicon photonics. There is a significant opportunity in the future since silicon photonics. Due to this, can transfer more data while using less power and without any signal loss.
Market Overview | |
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Forecast Period | 2024-2028 |
Market Size 2022 | USD 1.34 Billion |
Market Size 2028 | USD 6.09 Billion |
CAGR 2023-2028 | 28.79% |
Fastest Growing Segment | Automotive |
Largest Market | North America |
Silicon photonics technology is expected to change the telecommunication industry completely. Until now, data was transmitted in the form of electrical signals through copper wiring. However, the emergence of technologies, such as 5G communication that enables faster data speeds, and the maximum throughput that copper allows for can potentially act as a bottleneck on computing speeds. Hence, with silicon photonics, more patterned silicon will be used to transmit data-carrying laser signals and carry the potential to allow more data to be moved around faster while also consuming less power. Moreover, silicon photonics can be easily manufactured at the same mass scale as current silicon-based technologies. Moreover, companies such as, Intel Corporation are intensifying their portfolio of 100G silicon photonics transceivers to be used for 5G and IoT applications.
Silicon photonic technologies are primarily used in optical communication systems and networks due to their favoring features such as bandwidth, immunity to electromagnetic fields, and compatibility with optical fiber and flexibility. The fabrication of photonic devices through complementary metal-oxide semiconductor (CMOS) compatible processes has paved a new path for low cost and reduced footprint circuits, making optical technologies available for numerous network segments and new applications. 5G rebuilds the 4G baseband unit (BBU), radio remote unit (RRU) and antenna into the centralized unit (CU). On the other hand, the distributed unit (DU) and active antenna unit (AAU) ensure that the network will incorporate fronthaul, midhaul, and backhaul. These changes have increased the demands for optical transceivers to meet the high bandwidth and distance requirements associated with critical links in the 5G network architecture.
The rising number of smart phones and other connected devices has increased the data traffic, as these devices transfer large amount data across a network at a given point of time, further creating the demand for 5G from end consumers. As per Telefonaktiebolaget LM Ericsson, a leading network solution provider, the monthly global mobile data traffic is expected to exceed 100 ExaBytes (EB) by the end of 2023. Furthermore, the need for high-speed network solutions from healthcare, consumer electronics, and automotive sectors has created an immense opportunity for 5G service providers. Hence, the increasing demand for 5G infrastructure is going to positively impact the growth of silicon photonics market.
The telecom industry has embraced fiber-optic technology as an improved solution to meet the surging demand for higher speeds and large-capacity data transmission over the electrical copper wires. At present, a huge amount of data is transmitted and received over long-haul fibers, which has led to the replacement of high power-consuming electrical switches that require optical-electrical-optical conversions and cause signal loss. This has led to the emergence of photonic switches to improve transmission quality and link a single transmission to tens and sometimes thousands of servers.
Moreover, silicon-based photonic switches use advanced CMOS technology to garner huge attraction from researchers as a powerful platform because of their low cost and high capacity. Moreover, traditional copper cabling is stifling datacenter evolution and high-performance computing (HPC) because of its slow data transfer capacity. Moreover, it is deemed inadequate for HPC applications, data centers, or efficiently managing growing data volumes. On the other hand, in the case of silicon photonics, data is transmitted among computer chips by optical rays, which can transmit large amounts of data in shorter time than electrical conductors. With the increasing advancements in silicon photonics technology, it is anticipated that it can realize data transfer speed at 1 tbps in a cost-effective manner.
Companies such as Intel Corporation, IBM Corporation, and Cisco Systems, Inc. consider silicon photonics as a promising technology that can reshape how datacenter systems exchange data and create leaner rack equipment. Therefore, these companies are investing in technology. IBM Corporation has invested in its silicon nano-photonics technology, which uses light instead of electrical signals to transfer data, enabling huge volumes of data to be transferred swiftly between computer chips in servers, large data centers, and supercomputers via pulses of light. With the integration of silicon photonics chips, it has become easier to transfer large chunks of data (>100 GB) from long distances because of the strong signal strength. Currently, silicon photonics technology is used extensively in regions such as North America and Europe. Furthermore, as the demand for higher bandwidth increases in applications such as data centers, the industry would be shifting toward vertical integration to drive the manufacturing process. In addition, it is expected that optoelectronics product development is going to witness an increased number of research activities in the coming years.
Rising Deployment of Data Centers: Data centers have witnessed a crucial role in the ingestion, computation, storage, and management of information. However, many data centers are clunky, inefficient, and outdated. Hence, to keep them running, data center operators are upgrading them to fit the ever-changing world. Additionally, in 2021, Cisco Systems, Inc. claimed that traffic within data centers will increase three times, with a high amount of share attributed in hyperscale facilities such as those developed by leading players including Google, Amazon, Facebook, Apple, and Microsoft. Hyperscale data centers can be expanded to virtually any desirable size due to their architecture. These centers require high-speed connections to move lump-sum data between their basic building blocks, such as the individual servers and their supporting equipment.
The state-of-the-art transmission rates in data centers are mostly of 100 Gb/s. However, the industry is currently aiming to deploy a speed of around 400 Gb/s. This speed is also anticipated to increase going forward. The growing speed signifies the fact that silicon photonics solutions would be able to proceed deeper into the communications structure easily. Moreover, the largest volume demand for PICs is for data center interconnects (or DCIs) in data and telecom networks, with new applications coming, such as 5G wireless technology, automotive or medical sensors. Indium phosphide (InP) is the most used, but silicon photonics is growing at a faster rate. Silicon photonics technology is being adopted in system-to-system connections in various data centers. The technology is further expected to move between the sections on the chips within the servers as well.
Silicon photonics is rapidly gaining maturity in high bandwidth optical communication, with applications in datacom, access networks, and I/O for bandwidth-intensive electronics along with emerging applications in spectroscopy and sensing. The integration of photonics and electronics is needed to get the most optimum performance out of the photonics, such as side-by-side, stacked, or on the same chip. However, the combination of photonics and electronics can create a range of new problems on the design side, such as codesign and co-simulation of complex photonic and electronic circuits, verification algorithms that can handle photonic circuits, and tolerance to variability.
There are still major challenges in the fabrication processes, design platforms, and specific device design for system-level applications. The fundamental value proposition of silicon photonics is that it can leverage mature fabrication processes using lower resolution CMOS processing compared to current state-of-the-art microelectronic chips. However, the existing fabrication techniques for high-quality electronic devices do not necessarily realize high-quality optical devices in large volumes. Monolithic integration of CMOS with photonics in silicon photonic devices is strongly dependent on the design rules of the specific fabrication processes, leading to devices that currently must be post-processed to achieve high yield.
Packaging plays a significant role in system-level implementations of silicon photonics devices. Cost-effective, robust packaging is required for silicon photonic devices to be marketable. For silicon photonics to be a viable platform, there is a requirement for the automation of packaging. Significant problems in packaging are high-volume optical connections, thermal stability, and proper packaging of electronic components. Most commercial silicon photonics devices are transceivers. Grating couplers typically provide optical connections, as they are less sensitive to misalignment, as compared to edge-coupling. However, grating couplers are wavelength-selective, making their use for large spectral-bandwidth solutions difficult.
Thermal stability is also a significant issue in the packaging of silicon photonic devices. Some of these devices use large thermally induced changes in the refractive index. The devices must be packaged such that external temperature fluctuations do not alter the operation of the device. Moreover, the physical properties of silicon photonics, which lead to this excess thermal generation, is two-photon absorption, a process in which an electron-hole pair is excited with the help of a pair of photons. This process, however, generates unwanted heat and light. Due to thermal heat generation, silicon photonics technology is considered a non-ecofriendly technology, as thermal pollution increases the surrounding temperature significantly. Therefore, packaging with thermal electric coolers (TEC) is becoming more common. However, these components add to the overall power and cost of the device.
The global silicon photonics market is segmented into component, application, waveguide, product, material, and region. Based on component, the market is segmented into lasers, modulators, PICs, photodetectors, ultra-low-loss waveguides. Based on application, the market is segmented into data centers, telecommunication, consumer electronics, healthcare, automotive, and others. Based on waveguide, the market is segmented into 400-1,500 NM, 1,310-1,550 NM, 900-7000 NM. Based on product, the market is segmented into transceivers, variable optical attenuators, switches, cables, sensors. Based on material, the market is segmented into silicon or silicon-based alloys, indium phosphide, and others. Based on region, the market is segmented into North America, Asia-Pacific, Europe, South America, and Middle East & Africa.
Major market players in the global silicon photonics market are Intel Corporation, Luxtera Inc. (Subsidiary of Cisco Systems, Inc.), Acacia Communications, Inc., Infinera Corporation, IBM Corporation, Finisar Corporation, STMicroelectronics N.V., Fujitsu Ltd., OneChip Photonics Inc., and NeoPhotonics Corporation
In this report, global silicon photonics market has been segmented into following categories, in addition to the industry trends which have also been detailed below:
(Note: The companies list can be customized based on the client requirements)