光子積體電路市場:現狀分析與未來預測 (2024年～2032年)

Photonic Integrated Circuit Market: Current Analysis and Forecast (2024-2032)

出版日期: 2024年11月01日 | 出版商:

UnivDatos Market Insights Pvt Ltd | 英文 149 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

由於需要高速資料傳輸和低延遲通訊的 5G 基礎設施的快速擴張，預計光子積體電路市場在預測期內將以 12.9% 的複合年增長率強勁增長。這個市場有很多投資，近年來也有很多併購。例如，2024 年 8 月，Sivers Semiconductors 宣布計劃將其光子子公司 Sivers Photonics Limited 與 Binordic Acquisition Corporation 合併，以增加市場准入和投資者興趣。 2022 年 3 月，Luminar Technologies 收購 Freedom Photonics，專注於垂直整合，以提高雷射雷達和自動駕駛等高需求領域的性能。

在亞太地區，太平洋島國預計將經歷最高的成長，主要市場是中國、日本和印度。這是由於通訊系統的健康、政策支持以及對光子系統日益增長的興趣。例如，光子學被列為 "中國製造2025" 的戰略重要項目之一，以避免對外部半導體技術的嚴重依賴，促進國內生產。在北美，政府透過光子學資助計劃（例如美國 DARPA（國防高級研究計劃局）撥款）提供支持，支持國防和通訊領域高級用途的光子學研究。這些政策和舉措，加上私人投資的增加，正在改善 PIC 市場，並將其定位為一項關鍵技術，將在多個高需求領域實現未來的創新。

光子積體電路市場依原料分為III-V族材料、鈮酸鋰、矽基二氧化矽等。在預測期內，III-V族材料領域可能在光子積體電路市場的成長中發揮重要作用。 III-V族材料用於光子積體電路的主要原因是它們表現出優異的光學特性，這使得複雜的主動元件（例如雷射和調製器）能夠在大量資訊流的應用中實現高度整合。

光子積體電路市場依應用分為通訊、生物醫學、資料中心等。預計電信業在預測期內將呈現顯著成長。由於對高速資料傳輸、低延遲以及處理大量資料的方式的需求不斷增長，電信業被認為是光子積體電路（PIC）市場的最大驅動力。隨著現代社會人口密度的不斷增加、5G網路的出現以及光纖化的進一步發展，PIC被用來提高網路效能並支援複雜的多媒體服務。隨著視訊串流、線上遊戲和雲端運算服務等多媒體服務的客戶流量不斷增加，營運商正在加強其網絡，提高處理這些大量流量數據的能力，同時需要優化能源消耗。數據、語音和視訊傳輸等不斷發展的傳輸需要緊湊、低功耗的解決方案，能夠長距離提供高數據速率，而這正是由 PIC 提供的。這項需求是由物聯網和智慧城市專案推動的，這些專案將許多設備整合到必須可擴展、可靠和安全的網路中。

依照整合工藝，光子積體電路市場分為混合型和單片型。混合元件目前是光子積體電路市場中最大的部分。光子積體電路（PIC）市場混合部分的關鍵推動因素是能夠在一個晶片上混合不同的材料系統。這種整合使得高性能材料的應用成為可能，包括用於主動結構（雷射和調製器）的 III-V 族化合物和用於被動元件的矽，其功能和效率難以透過單片結構實現。混合 PIC 可以幫助設計和實現 5G 擴展、大規模資料中心和其他不斷發展的感測器應用所需的先進高速光通訊鏈路。混合 PIC 使用多種材料來滿足通訊、醫療和航空航太產業對可客製化、高性能產品的市場需求。這種靈活性和卓越的效率使得混合部分在需要靈活且節能的光子基板的行業中最受歡迎。

為了更了解光子積體電路產業的市場實施情況，市場有北美（美國、加拿大、北美其他地區）、歐洲（德國、英國、法國、西班牙、義大利、歐洲其他地區）、亞洲太平洋地區。由於通訊網路的增加、5G 普及率以及光整合系統的技術進步，亞太地區是一個持續成長的光子積體電路 (PIC) 市場。中國、日本、韓國和印度在這一擴張中處於領先地位，正在建立前所未有的能力，以滿足對數據通訊和高速網路服務不斷增長的需求。政府正在透過 "中國製造2025" 等計畫推動創新能力的發展，該計畫將幫助中國製造商推動通訊和數據中心技術等領域的光子技術進步。 .程式.此外，該地區消費性電子產業的成長和物聯網解決方案的投資要求 PIC 優化電路和資料傳輸速度。放眼亞太市場，由於該地區的技術進步不斷進步，且PIC的市場開發一直受到鼓勵，因此該公司肯定會成功進入該市場。

在進入到市場的主要企業裡(上)，有瑪維爾·科技，富士通，IBM，界內fineela·團體，英特爾·團體，rumentamu·opereshonzuLLC，Siena·團體，Cisco，EMCORE團體，ST微電子等。

The market of Photonic Integrated Circuit (PIC) is rapidly growing as the demand for high-speed data transmission, low power consumption, and high-performance optical components is increasing rapidly. PICs enable multiple photonic functions, with the result that these systems are used in telecommunications, data, center health care, and defense. Such devices open up opportunities that are superior to what can be achieved in traditional electronic circuits, they are faster and consume less energy. These are integral in managing the incoming demands that come along with the advanced digitized world. Big market forces include improvements in telecommunication technologies, 5G, IoT networks, and cloud computing among others. Also, the move to submicron scale as well as the configuration of different material types for better performance is fueling further adoption of PIC applications.

The Photonic Integrated Circuit Market is expected to grow at a robust CAGR of 12.9% during the forecast period, owing to the rapid expansion of 5G infrastructure, which demands high-speed data transfer and low-latency communication. There has been tremendous investment in this market and mergers and acquisitions in the last couple of years have been quite frequent. For instance, In August 2024, Sivers Semiconductors announced a merger plan for its photonics subsidiary, Sivers Photonics Ltd., with byNordic Acquisition Corporation to enhance market accessibility and investor interest. In March 2022, Luminar Technologies acquired Freedom Photonics, focusing on vertical integration to improve performance in high-demand sectors like lidar and autonomous driving.

The Pacific Island Countries are expected to experience the highest growth in Asia-Pacific, and their key markets will be China, Japan, and India due to sound telecommunication systems, policy support, and escalating interest in photonic systems. For example, photonics has been listed as one of the keys strategically important projects in 'Made in China 2025' to avoid heavily relying on external semiconductor technologies and advance domestic production. In North America, the government support of photonics funding programs like DARPA grants within the United States supports photonics research for advanced purposes within defense and telecommunication. These policies and initiatives coupled with rising private investments are improving the PIC market along with positioning it as an essential technology that will enable future innovations in several high demand sectors.

Based on Raw Material, the Photonic Integrated Circuit market is segmented into III-V Material, Lithium Niobate, Silica-on-silicon, and Others. The III-V Material segment seems to be a key player in the growth of Photonic Integrated Circuit market during the forecast period. The main incentive for III-V material in photonic integrated circuits is because it exhibits excellent optical characteristics allowing high integration of complex active elements such as lasers and modulators in applications with a large flow of information.

Based on Application, the Photonic Integrated Circuit market is divided into Telecommunications, Biomedical, Data Centers, and Others. The Telecommunications segment is expected to showcase a substantial growth rate during the forecast period. The telecommunications sector is considered to be the most significant driver of the Photonic Integrated Circuit (PIC) market, based on the increasing demand for high-speed data transfer, low latency and methods for dealing with enormous amounts of data. Denser population in modern society, the emergence of 5G networks, and further fiberization have led to the use of PICs for enhancing network performance and supporting complex multimedia services. With the growth of customer traffic loading multimedia services such as video streaming, online gaming, cloud computing services and others, the telecom operators are compelled to enhance the networks with improved capabilities to handle these high traffic data volumes while at the same time optimizing energy consumption. These evolving telecommunications such as data, voice and video transmission require a compact low power solution with high data rate over long distances and this is provided by PICs. This demand is fostered by the IoT and smart city projects that have integration of many devices into networks that have to be scalable, reliable and secure.

Based on Integration Process, the Photonic Integrated Circuit market is divided into Hybrid and Monolithic. The Hybrid is currently the largest segment in the Photonic Integrated Circuit Market. The key enabler for the hybrid segment of the Photonic Integrated Circuit (PIC) market is the capability of mixing different material systems on a single chip. This integration allows the application of high-performance materials, including III-V compounds for active structures (lasers and modulators) and Si for passive components with functionality and efficiency that are difficult to achieve with monolithic structures. Hybrid-PICs may be useful in designing and implementing sophisticated, high-speed optical communication links that are necessary for extension of 5G, large-scale data centers and other developing sensor applications. Hybrid PICs use multiple materials that fulfill the market's need for customizable, high-performance products use in telecommunication, healthcare and aerospace industries. This flexibility and better efficiency make the hybrid segment the most sought-after for industries demanding flexible and energy-efficient photonic substrates.

For a better understanding of the market adoption of the Photonic Integrated Circuit industry, the market is analyzed based on its worldwide presence in countries such as North America (U.S.A., Canada, and Rest of North America), Europe (Germany, United Kingdom, France, Spain, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, Australia, and Rest of Asia-Pacific), Rest of World. APAC is a continuously growing market for Photonic Integrated Circuits (PICs) due to the rising telecommunication networks, popular implementation of 5G, and technological advancement in photonic integrated systems. China, Japan, South Korea, and India are some of the leaders in this expansion as they progress in constructing ever-high capacities for growing demands in data and high-speed Internet services. Government drives towards innovative capabilities is promoted through programs such as the 'Made in China 2025' where Chinese manufacturing will drive photonics technology advances in sectors like telecommunications and Data center technologies; similarly, Japan, through the advanced manufacturing program is improving the photonics manufacturing industry. Furthermore, the region's growing consumer electronics industry and investments in IoT solutions require PICs to optimize circuits and data transmission rates. Looking at the APAC market, one is assured that the firm will succeed in leveraging in this market since the region has taken a step in technological advancement, and there is always encouragement for the development of PICs.

Some of the major players operating in the market include Marvell Technology, Fujitsu, IBM, Infinera Corporation, Intel Corporation, Lumentum Operations LLC, Ciena Corporation, Cisco Systems, Inc., EMCORE Corporation, and STMicroelectronics.

1.MARKET INTRODUCTION

1.1. Market Definitions
1.2. Main Objective
1.3. Stakeholders
1.4. Limitation

2.RESEARCH METHODOLOGY OR ASSUMPTION

2.1. Research Process of the Photonic Integrated Circuit Market
2.2. Research Methodology of the Photonic Integrated Circuit Market
2.3. Respondent Profile

3.EXECUTIVE SUMMARY

3.1. Industry Synopsis
3.2. Segmental Outlook
- 3.2.1. Market Growth Intensity
3.3. Regional Outlook

4.MARKET DYNAMICS

4.1. Drivers
4.2. Opportunity
4.3. Restraints
4.4. Trends
4.5. PESTEL Analysis
4.6. Demand Side Analysis
4.7. Supply Side Analysis
- 4.7.1. Analysis Merger & Acquisition
- 4.7.2. Investment Scenario
- 4.7.3. Industry Insights: Leading Startups and Their Unique Strategies

5.Pricing Analysis

5.1. Regional Pricing Analysis
5.2. Price Influencing Factors

6.GLOBAL PHOTONIC INTEGRATED CIRCUIT MARKET REVENUE (USD MN), 2022-2032F

7.MARKET INSIGHTS BY RAW MATERIAL

7.1. III-V Material
7.2. Lithium Niobate
7.3. Silica-on-silicon
7.4. Others

8.MARKET INSIGHTS BY APPLICATION

8.1. Telecommunications
8.2. Biomedical
8.3. Data Centers
8.4. Others

9.MARKET INSIGHTS BY INTEGRATION PROCESS

9.1. Hybrid
9.2. Monolithic

10.MARKET INSIGHTS BY REGION

10.1. North America
- 10.1.1. USA
- 10.1.2. Canada
- 10.1.3. Rest of NA
10.2. Europe
- 10.2.1. Germany
- 10.2.2. United Kingdom
- 10.2.3. Spain
- 10.2.4. France
- 10.2.5. Italy
- 10.2.6. Rest of Europe
10.3. Asia Pacific
- 10.3.1. China
- 10.3.2. India
- 10.3.3. Japan
- 10.3.4. Australia
- 10.3.5. Rest of APAC
10.4. Rest of World

11.VALUE CHAIN ANALYSIS

11.1. Marginal Analysis
11.2. List of Market Participants

12.COMPETITIVE LANDSCAPE

12.1. Competition Dashboard
12.2. Competitor Market Positioning Analysis
12.3. Porter Five Forces Analysis

13.COMPANY PROFILED

13.1. Marvell Technology
- 13.1.1. Company Overview
- 13.1.2. Key Financials
- 13.1.3. SWOT Analysis
- 13.1.4. Product Portfolio
- 13.1.5. Recent Developments
13.2. Fujitsu
13.3. IBM
13.4. Infinera Corporation
13.5. Intel Corporation
13.6. Lumentum Operations LLC
13.7. Ciena Corporation
13.8. Cisco Systems, Inc.
13.9. EMCORE Corporation
13.10. STMicroelectronics