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市場調查報告書
商品編碼
1288896

全球電子保險絲市場研究報告 - 行業分析、規模、佔有率、成長、趨勢和2023年至2030年預測

Global eFuse Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2023 to 2030

出版日期: | 出版商: Value Market Research | 英文 249 Pages | 商品交期: 最快1-2個工作天內

價格

據推測,到2030年,全球電子保險絲市場的需求將從2022年的358億美元達到近50.9億美元的市場規模,在2023-2030年的研究期間,年復合成長率為4.5%。

電子保險絲(eFuse)是一種嵌入電腦晶片的小型保險絲。 IBM開發了這種技術,以實現半導體的動態即時重新編程。電子保險絲,或稱eFuse,是一種整合電路,可以取代傳統的保險絲或其他保護裝置,如可複位的聚合物保險絲。它們包括一個控制電路和一個低電阻的電源開關,連接輸入端口和負載,採用緊湊的塑膠封裝,如DFN和覆晶。

市場動態:

在預測期內,全球電子保險絲市場可能會受益於全球雲端運算需求的上升,汽車行業接受度的提高,以及電子保險絲IC在智慧電子設備和VR/AR應用中的出現。電子保險絲在汽車應用中的使用越來越多,如汽車電子保險絲盒、車身控制模組和汽車電子子組件,如ABS卡、引擎控制單元、音頻系統、導航系統和安全系統,推動了市場的發展。

該研究報告涵蓋了波特五力模型、市場吸引力分析和價值鏈分析。這些工具有助於清楚地了解行業結構,並在全球範圍內評估競爭的吸引力。此外,這些工具還對全球efuse市場的每個細分市場進行了全面評估。保險絲行業的成長和趨勢為這項研究提供了一個全面的方法。

區域分析:

本節涵蓋了區域前景,強調了北美、歐洲、亞太、拉丁美洲以及中東和非洲的電子保險絲市場的當前和未來需求。此外,報告重點關注所有重要地區的個別應用部門的需求、估計和預測。

該研究報告還涵蓋了市場主要參與者的全面概況以及對全球競爭格局的深入看法。保險絲市場的主要參與者包括Analog Devices Inc., Diodes Incorporated, Microsemi Corporation, On Semiconductor Corporation, Qorvo, Inc., STMicroelectronics NV, Texas Instruments Incorporated, Toshiba Electronic Devices & Storage Corporation。這一部分包括對競爭格局的整體看法,其中包括各種戰略發展,如主要的合併和收購,未來的能力,夥伴關係,財務概況,合作,新產品的開發,新產品的推出,以及其他發展。

  • 如果你有任何定製要求,請寫信給我們。我們的研究團隊可以根據您的需要提供定製報告。

目錄

第1章:前言

  • 報告描述
    • 目的
    • 目標受眾
    • 獨特的銷售主張(USP)和產品
  • 研究範圍
  • 研究方法
    • 市場研究過程
    • 市場研究方法

第二章:執行摘要

  • 市場的亮點
  • 全球市場簡介

第三章:efuse - 行業分析

  • 簡介- 市場動態
  • 市場驅動力
  • 市場限制因素
  • 機會
  • 行業趨勢
  • 波特的五力分析
  • 市場吸引力分析
    • 按類型
    • 按包裝類型
    • 按應用分類
    • 按最終使用行業分類
    • 按地區

第四章:價值鏈分析

  • 價值鏈分析
  • 原料分析
    • 原料清單
    • 原料製造商名單
    • 關鍵原料的價格趨勢
  • 潛在買家名單
  • 行銷管道
    • 直接行銷
    • 間接行銷
    • 行銷管道的發展趨勢

第五章:Covid-19爆發的影響分析

第六章:全球電子保險絲市場分析:按類型分類

  • 按類型概述
  • 歷史和預測數據
  • 按類型分析
  • 鎖存型電子保險絲市場:按地區分類
  • 自動重試型電子保險絲市場:按地區分類

第7章:全球電子保險絲市場分析:按封裝類型分類

  • 按封裝類型概述
  • 歷史和預測數據
  • 按封裝類型分析
  • 小尺寸無引線(SON)市場:按地區分類
  • 雙平面無引線(DFN)市場:按地區分類
  • 四平無引線(QFN)市場:按地區分類
  • 薄型無引線封裝(TSSOP)市場:按地區分類
  • 其他市場:按地區分類

第八章:全球電子保險絲市場分析:按應用分類

  • 概述:按應用分類
  • 歷史和預測數據
  • 分析:按應用分類
  • 固態硬盤市場:按地區分類
  • 硬盤驅動器市場:按地區分類
  • 伺服器和資料中心設備市場:按地區分類
  • 汽車電子市場:按地區分類
  • 其他市場:按地區分類

第九章:全球電子保險絲市場分析:按終端行業分類

  • 按最終用途行業概述
  • 歷史和預測數據
  • 按最終用途行業的分析
  • 汽車和運輸市場:按地區分類
  • 航太和國防市場:按地區分類
  • 消費電子市場:按地區分類
  • 醫療保健市場:按地區分類
  • IT和電信市場:按地區分類
  • 其他市場:按地區分類

第十章:全球電子保險絲市場分析:按地域分類

  • 區域展望
  • 簡介
  • 北美洲
    • 概述、歷史和預測數據
    • 北美:按細分市場分類
    • 北美洲:按國家分類
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 概述、歷史和預測數據
    • 按部門分類的歐洲
    • 歐洲:按國家分類
    • 英國
    • 法國
    • 德國
    • 義大利
    • 俄羅斯
    • 歐洲其他地區
  • 亞太地區
    • 概述、歷史和預測數據
    • 亞太地區按細分市場分類
    • 亞太地區:按國家分類
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳大利亞
    • 亞太其他地區
  • 拉美地區
    • 概述、歷史和預測數據
    • 按部門分類的拉美地區
    • 拉丁美洲:按國家分類
    • 巴西
    • 阿根廷
    • 秘魯
    • 智利
    • 拉美其他地區
  • 中東和非洲
    • 概述、歷史和預測數據
    • 中東和非洲,按部門分類
    • 中東和非洲:按國家分類
    • 沙烏地阿拉伯
    • 阿拉伯聯合酋長國
    • 以色列
    • 南非
    • 其他中東和非洲國家

第11章:保險絲公司的競爭格局

  • EFuse的市場競爭
  • 夥伴關係/合作/協議
  • 合併和收購
  • 新產品發布
  • 其他方面的發展

第十二章:公司簡介

  • 公司佔有率分析
  • 市場集中度
  • Analog Devices Inc.
    • 公司概況
    • 產品
    • 近期發展情況
  • Diodes Incorporated
    • 公司概況
    • 產品
    • 近期發展
  • Microsemi Corporation
    • 公司概況
    • 產品
    • 近期發展
  • On Semiconductor Corporation
    • 公司概況
    • 產品
    • 近期發展
  • Qorvo, Inc.
    • 公司概況
    • 產品
    • 近期發展
  • STMicroelectronics NV
    • 公司概況
    • 產品
    • 近期發展
  • Texas Instruments Incorporated
    • 公司概況
    • 產品
    • 近期發展
  • Toshiba Electronic Devices & Storage Corporation
    • 公司概況
    • 產品
    • 近期發展情況

注意- 在公司簡介中,財務細節和最近的發展情況取決於可用性,可能不包括私人公司在內。

Product Code: VMR11216854

The global demand for eFuse Market is presumed to reach the market size of nearly USD 5.09 BN by 2030 from USD 3.58 BN in 2022 with a CAGR of 4.5% under the study period 2023 - 2030.

An electronic fuse (eFuse) is a small fuse embedded in a computer chip. IBM developed this technique to enable dynamic real-time reprogramming of semiconductors. Electronic fuses, or eFuses, are integrated circuits that can replace traditional fuses or other protective devices like resettable polymeric fuses. They include a control circuit and a low-on-resistance power switch, connecting the input port to the load, in compact plastic packages such as DFN and Flip-chip.

Market Dynamics:

During the forecast period, the worldwide eFuse market is likely to benefit from rising demand for cloud computing across the globe, increased acceptance in the automotive industry, and the advent of eFuse ICs for intelligent electronic devices and VR/AR applications. The market has been propelled by the increasing use of eFuses in automotive applications such as the automobile eFuse box, body control module, and automotive electronic subassemblies such as ABS cards, engine control units, audio systems, navigation systems, and security systems.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of efuse. The growth and trends of efuse industry provide a holistic approach to this study.

Market Segmentation:

This section of the efuse market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Type

  • Latched Type Efuse
  • Auto-Retry Type Efuse

By Package Type

  • Small Outline No Lead (SON)
  • Dual Flat No Leads (DFN)
  • Quad Flat No-Lead (QFN)
  • Thin Shrink Small Outline Package (TSSOP)
  • Others (Chip Scale Package [CSP], Ceramic Flat-Pack [CFP], Etc.)

By Application

  • Solid State Drives
  • Hard Disk Drives
  • Servers And Data Center Equipment
  • Automotive Electronics
  • Others (Power Tools, Surveillance Equipment, Networking Etc.)

By End-Use Industry

  • Automotive & Transportation
  • Aerospace & Defense
  • Consumer Electronics
  • Healthcare
  • It & Telecommunication
  • Others (Manufacturing, Agriculture, Etc.)

Regional Analysis:

This section covers the regional outlook, which accentuates current and future demand for the eFuse market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the efuse market include Analog Devices Inc., Diodes Incorporated, Microsemi Corporation, On Semiconductor Corporation, Qorvo, Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Electronic Devices & Storage Corporation. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

  • In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

TABLE OF CONTENTS

1 . PREFACE

  • 1.1. Report Description
    • 1.1.1. Objective
    • 1.1.2. Target Audience
    • 1.1.3. Unique Selling Proposition (USP) & offerings
  • 1.2. Research Scope
  • 1.3. Research Methodology
    • 1.3.1. Market Research Process
    • 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

  • 2.1. Highlights of Market
  • 2.2. Global Market Snapshot

3 . EFUSE - INDUSTRY ANALYSIS

  • 3.1. Introduction - Market Dynamics
  • 3.2. Market Drivers
  • 3.3. Market Restraints
  • 3.4. Opportunities
  • 3.5. Industry Trends
  • 3.6. Porter's Five Force Analysis
  • 3.7. Market Attractiveness Analysis
    • 3.7.1 By Type
    • 3.7.2 By Package Type
    • 3.7.3 By Application
    • 3.7.4 By End-use Industry
    • 3.7.5 By Region

4 . VALUE CHAIN ANALYSIS

  • 4.1. Value Chain Analysis
  • 4.2. Raw Material Analysis
    • 4.2.1. List of Raw Materials
    • 4.2.2. Raw Material Manufactures List
    • 4.2.3. Price Trend of Key Raw Materials
  • 4.3. List of Potential Buyers
  • 4.4. Marketing Channel
    • 4.4.1. Direct Marketing
    • 4.4.2. Indirect Marketing
    • 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL EFUSE MARKET ANALYSIS BY TYPE

  • 6.1 Overview by Type
  • 6.2 Historical and Forecast Data
  • 6.3 Analysis by Type
  • 6.4 Latched Type eFuse Market by Regions
  • 6.5 Auto-retry Type eFuse Market by Regions

7 . GLOBAL EFUSE MARKET ANALYSIS BY PACKAGE TYPE

  • 7.1 Overview by Package Type
  • 7.2 Historical and Forecast Data
  • 7.3 Analysis by Package Type
  • 7.4 Small Outline No Lead (SON) Market by Regions
  • 7.5 Dual Flat No Leads (DFN) Market by Regions
  • 7.6 Quad Flat No-lead (QFN) Market by Regions
  • 7.7 Thin Shrink Small Outline Package (TSSOP) Market by Regions
  • 7.8 Others Market by Regions

8 . GLOBAL EFUSE MARKET ANALYSIS BY APPLICATION

  • 8.1 Overview by Application
  • 8.2 Historical and Forecast Data
  • 8.3 Analysis by Application
  • 8.4 Solid State Drives Market by Regions
  • 8.5 Hard Disk Drives Market by Regions
  • 8.6 Servers and Data Center Equipment Market by Regions
  • 8.7 Automotive Electronics Market by Regions
  • 8.8 Others Market by Regions

9 . GLOBAL EFUSE MARKET ANALYSIS BY END-USE INDUSTRY

  • 9.1 Overview by End-use Industry
  • 9.2 Historical and Forecast Data
  • 9.3 Analysis by End-use Industry
  • 9.4 Automotive & Transportation Market by Regions
  • 9.5 Aerospace & Defense Market by Regions
  • 9.6 Consumer Electronics Market by Regions
  • 9.7 Healthcare Market by Regions
  • 9.8 IT & Telecommunication Market by Regions
  • 9.9 Others Market by Regions

10 . GLOBAL EFUSE MARKET ANALYSIS BY GEOGRAPHY

  • 10.1. Regional Outlook
  • 10.2. Introduction
  • 10.3. North America
    • 10.3.1. Overview, Historic and Forecast Data
    • 10.3.2. North America By Segment
    • 10.3.3. North America By Country
    • 10.3.4. United State
    • 10.3.5. Canada
    • 10.3.6. Mexico
  • 10.4. Europe
    • 10.4.1. Overview, Historic and Forecast Data
    • 10.4.2. Europe by Segment
    • 10.4.3. Europe by Country
    • 10.4.4. United Kingdom
    • 10.4.5. France
    • 10.4.6. Germany
    • 10.4.7. Italy
    • 10.4.8. Russia
    • 10.4.9. Rest Of Europe
  • 10.5. Asia Pacific
    • 10.5.1. Overview, Historic and Forecast Data
    • 10.5.2. Asia Pacific by Segment
    • 10.5.3. Asia Pacific by Country
    • 10.5.4. China
    • 10.5.5. India
    • 10.5.6. Japan
    • 10.5.7. South Korea
    • 10.5.8. Australia
    • 10.5.9. Rest Of Asia Pacific
  • 10.6. Latin America
    • 10.6.1. Overview, Historic and Forecast Data
    • 10.6.2. Latin America by Segment
    • 10.6.3. Latin America by Country
    • 10.6.4. Brazil
    • 10.6.5. Argentina
    • 10.6.6. Peru
    • 10.6.7. Chile
    • 10.6.8. Rest of Latin America
  • 10.7. Middle East & Africa
    • 10.7.1. Overview, Historic and Forecast Data
    • 10.7.2. Middle East & Africa by Segment
    • 10.7.3. Middle East & Africa by Country
    • 10.7.4. Saudi Arabia
    • 10.7.5. UAE
    • 10.7.6. Israel
    • 10.7.7. South Africa
    • 10.7.8. Rest Of Middle East And Africa

11 . COMPETITIVE LANDSCAPE OF THE EFUSE COMPANIES

  • 11.1. EFuse Market Competition
  • 11.2. Partnership/Collaboration/Agreement
  • 11.3. Merger And Acquisitions
  • 11.4. New Product Launch
  • 11.5. Other Developments

12 . COMPANY PROFILES OF EFUSE INDUSTRY

  • 12.1. Company Share Analysis
  • 12.2. Market Concentration Rate
  • 12.3. Analog Devices Inc.
    • 12.3.1. Company Overview
    • 12.3.2. Financials
    • 12.3.3. Products
    • 12.3.4. Recent Developments
  • 12.4. Diodes Incorporated
    • 12.4.1. Company Overview
    • 12.4.2. Financials
    • 12.4.3. Products
    • 12.4.4. Recent Developments
  • 12.5. Microsemi Corporation
    • 12.5.1. Company Overview
    • 12.5.2. Financials
    • 12.5.3. Products
    • 12.5.4. Recent Developments
  • 12.6. On Semiconductor Corporation
    • 12.6.1. Company Overview
    • 12.6.2. Financials
    • 12.6.3. Products
    • 12.6.4. Recent Developments
  • 12.7. Qorvo, Inc.
    • 12.7.1. Company Overview
    • 12.7.2. Financials
    • 12.7.3. Products
    • 12.7.4. Recent Developments
  • 12.8. STMicroelectronics N.V.
    • 12.8.1. Company Overview
    • 12.8.2. Financials
    • 12.8.3. Products
    • 12.8.4. Recent Developments
  • 12.9. Texas Instruments Incorporated
    • 12.9.1. Company Overview
    • 12.9.2. Financials
    • 12.9.3. Products
    • 12.9.4. Recent Developments
  • 12.10. Toshiba Electronic Devices & Storage Corporation
    • 12.10.1. Company Overview
    • 12.10.2. Financials
    • 12.10.3. Products
    • 12.10.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies

LIST OF TABLES

  • Market Snapshot
  • Drivers : Impact Analysis
  • Restraints : Impact Analysis
  • List of Raw Material
  • List of Raw Material Manufactures
  • List of Potential Buyers
  • Analysis by Type (USD MN)
  • Latched Type eFuse Market by Geography (USD MN)
  • Auto-retry Type eFuse Market by Geography (USD MN)
  • Analysis Market by Package Type (USD MN)
  • Small Outline No Lead (SON) Market by Geography (USD MN)
  • Dual Flat No Leads (DFN) Market by Geography (USD MN)
  • Quad Flat No-lead (QFN) Market by Geography (USD MN)
  • Thin Shrink Small Outline Package (TSSOP) Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Analysis by Application (USD MN)
  • Solid State Drives Market by Geography (USD MN)
  • Hard Disk Drives Market by Geography (USD MN)
  • Servers and Data Center Equipment Market by Geography (USD MN)
  • Automotive Electronics Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Analysis by End-use Industry (USD MN)
  • Automotive & Transportation Market by Geography (USD MN)
  • Aerospace & Defense Market by Geography (USD MN)
  • Consumer Electronics Market by Geography (USD MN)
  • Healthcare Market by Geography (USD MN)
  • IT & Telecommunication Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global EFuse Market by Geography (USD MN)
  • North America Market Analysis (USD MN)
  • United State Market Analysis (USD MN)
  • Canada Market Analysis (USD MN)
  • Mexico Market Analysis (USD MN)
  • Europe Market Analysis (USD MN)
  • Europe Market Estimate by Country (USD MN)
  • United Kingdom Market Analysis (USD MN)
  • France Market Analysis (USD MN)
  • Germany Market Analysis (USD MN)
  • Italy Market Analysis (USD MN)
  • Russia Market Analysis (USD MN)
  • Spain Market Analysis (USD MN)
  • Rest of Europe Market Analysis (USD MN)
  • Asia Pacific Market Analysis (USD MN)
  • China Market Analysis (USD MN)
  • Japan Market Analysis (USD MN)
  • India Market Analysis (USD MN)
  • South Korea Market Analysis (USD MN)
  • Australia Market Analysis (USD MN)
  • Rest of Asia Pacific Market Analysis (USD MN)
  • Latin America Market Analysis (USD MN)
  • Brazil Market Analysis (USD MN)
  • Argentina Market Analysis (USD MN)
  • Peru Market Analysis (USD MN)
  • Chile Market Analysis (USD MN)
  • Rest of Latin America Market Analysis (USD MN)
  • Middle East & Africa Market Analysis (USD MN)
  • Saudi Arabia Market Analysis (USD MN)
  • UAE Market Analysis (USD MN)
  • Israel Market Analysis (USD MN)
  • South Africa Market Analysis (USD MN)
  • Rest of Middle East and Africa Market Analysis (USD MN)
  • Partnership/Collaboration/Agreement
  • Mergers And Acquisiton

LIST OF FIGURES

  • Research Scope of EFuse Report
  • Market Research Process
  • Market Research Methodology
  • Global EFuse Market Size, by Region (USD MN)
  • Porters Five Forces Analysis
  • Market Attractiveness Analysis by Type
  • Market Attractiveness Analysis by Package Type
  • Market Attractiveness Analysis by Application
  • Market Attractiveness Analysis by End-use Industry
  • Market Attractiveness Analysis by Region
  • Value Chain Analysis
  • Global Market Analysis by Type (USD MN)
  • Latched Type eFuse Market by Geography (USD MN)
  • Auto-retry Type eFuse Market by Geography (USD MN)
  • Global Market Analysis by Package Type (USD MN)
  • Small Outline No Lead (SON) Market by Geography (USD MN)
  • Dual Flat No Leads (DFN) Market by Geography (USD MN)
  • Quad Flat No-lead (QFN) Market by Geography (USD MN)
  • Thin Shrink Small Outline Package (TSSOP) Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global Market Analysis by Application (USD MN)
  • Solid State Drives Market by Geography (USD MN)
  • Hard Disk Drives Market by Geography (USD MN)
  • Servers and Data Center Equipment Market by Geography (USD MN)
  • Automotive Electronics Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global Market Analysis by End-use Industry (USD MN)
  • Automotive & Transportation Market by Geography (USD MN)
  • Aerospace & Defense Market by Geography (USD MN)
  • Consumer Electronics Market by Geography (USD MN)
  • Healthcare Market by Geography (USD MN)
  • IT & Telecommunication Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global Market by Revenue
  • North America Market by Revenue
  • Europe Market by Revenue
  • Asia Pacific Market by Revenue
  • Latin America Market by Revenue
  • Middle East & Africa Market by Revenue
  • Recent Development in Industry
  • Company Market Share Analysis
  • Kindly note that the above listed are the basic tables and figures of the report and are not limited to the TOC.