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市場調查報告書

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1402174

全球對流回流焊爐市場研究報告 - 2023 年至 2030 年產業分析、規模、佔有率、成長、趨勢與預測

Global Convection Reflow Soldering Oven Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2023 to 2030

出版日期: 2023年12月01日 | 出版商:

Value Market Research | 英文 171 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄圖表

全球對流回流焊爐市場的需求預計將從 2022 年的 10 億美元達到 2030 年近 15.6 億美元的市場規模，2023-2030 年研究期間CAGR為 5.78%。

對流回流焊爐是電子製造中用於將表面貼裝元件焊接到印刷電路板 (PCB) 上的關鍵設備。此過程涉及使用熱量來熔化焊膏，從而將元件固定到 PCB 上。

市場動態

不斷發展的電子產業（包括智慧型手機和電腦等設備）需要高效的焊接設備來將複雜的元件組裝到 PCB 上。隨著電子產品尺寸不斷縮小，對精確焊接解決方案的需求不斷增加，從而推動了對先進回流焊爐的需求。這些烤箱的技術進步，例如改進的加熱方法、增強的控制系統和能源效率，吸引了製造商尋求更有效率的生產流程。此外，逐步淘汰含鉛焊料的環境法規刺激了對能夠處理無鉛焊料材料的烤箱的需求。自動化和智慧製造（包括工業 4.0 整合）的推動推動了對具有連接和資料分析功能的回流焊爐的需求。品質和可靠性仍然至關重要，促使製造商尋求可靠的焊接解決方案，以確保高品質的組裝並最大限度地減少缺陷。最後，電子製造的全球化和新興經濟體的崛起有助於回流焊爐在各個地區的廣泛採用，進一步推動市場成長。

研究報告涵蓋波特五力模型、市場吸引力分析和價值鏈分析。這些工具有助於清晰地了解行業結構並評估全球範圍內的競爭吸引力。此外，這些工具也對全球對流回流焊爐市場的各個細分市場進行了包容性評估。對流回流焊爐產業的成長和趨勢為本研究提供了整體方法。

區域分析

本節涵蓋區域前景，重點介紹北美、歐洲、亞太地區、拉丁美洲以及中東和非洲對流回流焊爐市場當前和未來的需求。此外，該報告重點關注所有主要地區各個應用領域的需求、估計和預測。

該研究報告還涵蓋了市場主要參與者的全面概況以及對全球競爭格局的深入了解。對流回流焊爐市場的主要參與者包括 Nordson Corporation、JLW Electronics、PVA Tepla America、Heller、ANTOM、SEHO、VIRTRONIC、Tamura、Nihon Handa、BTU、Shenzhen Riding、Vitronics Soltec 等。本節包含競爭格局的整體視圖，包括各種策略發展，例如關鍵併購、未來產能、合作夥伴關係、財務概況、合作、新產品開發、新產品發布和其他發展。

如果您有任何客製化要求，請寫信給我們。我們的研究團隊可以根據您的需求提供客製化報告。

區域展望
介紹
北美銷售分析
- 概覽、歷史與預測資料銷售分析
- 北美按細分市場銷售分析
- 北美按國家銷售分析
- 美國銷售分析
- 加拿大銷售分析
- 墨西哥銷售分析
歐洲銷售分析
- 概覽、歷史與預測資料銷售分析
- 歐洲按細分市場銷售分析
- 歐洲按國家銷售分析
- 英國銷售分析
- 法國銷售分析
- 德國銷售分析
- 義大利銷售分析
- 俄羅斯銷售分析
- 歐洲其他地區銷售分析
亞太地區銷售分析
- 概覽、歷史與預測資料銷售分析
- 亞太地區按細分市場銷售分析
- 亞太地區國家/地區銷售分析
- 中國銷售分析
- 印度銷售分析
- 日本銷售分析
- 韓國銷售分析
- 澳洲銷售分析
- 東南亞銷售分析
- 亞太地區其他地區銷售分析
拉丁美洲銷售分析
- 概覽、歷史與預測資料銷售分析
- 拉丁美洲按細分市場銷售分析
- 拉丁美洲按國家銷售分析
- 巴西銷售分析
- 阿根廷銷售分析
- 秘魯銷售分析
- 智利銷售分析
- 拉丁美洲其他地區銷售分析
中東和非洲銷售分析
- 概覽、歷史與預測資料銷售分析
- 中東和非洲按細分市場銷售分析
- 中東和非洲國家銷售分析
- 沙烏地阿拉伯銷售分析
- 阿拉伯聯合大公國銷售分析
- 以色列銷售分析
- 南非銷售分析
- 中東其他地區和非洲銷售分析

第 8 章：對流回流焊爐公司的競爭格局

對流回流焊爐市場競爭
夥伴關係/協作/協議
併購
新產品發布
其他發展

第 9 章：公司簡介

頂級公司市佔率分析
市場集中度
Nordson Corporation

公司簡介
公司收入
產品
最近的發展

JLW Electronics

公司簡介
公司收入
產品
最近的發展

PVA Tepla America

公司簡介
公司收入
產品
最近的發展

Heller

公司簡介
公司收入
產品
最近的發展

ANTOM

公司簡介
公司收入
產品
最近的發展

SEHO

公司簡介
公司收入
產品
最近的發展

VIRTRONIC

公司簡介
公司收入
產品
最近的發展

Tamura

公司簡介
公司收入
產品
最近的發展

Nihon Handa

公司簡介
公司收入
產品
最近的發展

公司簡介
公司收入
產品
最近的發展

Shenzhen Riding

公司簡介
公司收入
產品
最近的發展

Vitronics Soltec

公司簡介
公司收入
產品
最近的發展

其他
- 公司簡介
- 公司收入
- 產品
- 最近的發展

注意 - 在公司概況中，財務詳細資訊和近期發展視情況而定，或者如果是私人公司，則可能不包括在內

簡介目錄圖表

Product Code: VMR112113018

The global demand for Convection Reflow Soldering Oven Market is presumed to reach the market size of nearly USD 1.56 BN by 2030 from USD 1 BN in 2022 with a CAGR of 5.78% under the study period 2023 - 2030.

A convection reflow soldering oven is a crucial piece of equipment used in electronics manufacturing to solder surface-mount components onto printed circuit boards (PCBs). This process involves the use of heat to melt solder paste, which attaches the components to the PCB.

MARKET DYNAMICS

The expanding electronics industry, encompassing devices like smartphones and computers, necessitates efficient soldering equipment for assembling intricate components onto PCBs. As electronics continue to shrink in size, there's a heightened demand for precise soldering solutions, driving the need for advanced reflow ovens. Technological advancements in these ovens, such as improved heating methods, enhanced control systems, and energy efficiency, attract manufacturers seeking more efficient production processes. Additionally, environmental regulations phasing out lead-based solder have spurred the need for ovens capable of handling lead-free solder materials. The push towards automation and smart manufacturing, including Industry 4.0 integration, fuels the demand for reflow ovens with connectivity and data analytics features. Quality and reliability remain crucial, prompting manufacturers to seek reliable soldering solutions to ensure high-quality assembly and minimize defects. Lastly, the globalization of electronics manufacturing and the rise of emerging economies contribute to the widespread adoption of reflow ovens across various regions, further bolstering market growth.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of convection reflow soldering oven. The growth and trends of convection reflow soldering oven industry provide a holistic approach to this study.

MARKET SEGMENTATION

This section of the convection reflow soldering oven market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Application

Automotive
Telecommunications
Consumer Electronics
Others

By Product Type

More Than 20 Heating Zones
10-20 Heating Zones
Less Than 10 Heating Zones

REGIONAL ANALYSIS

This section covers the regional outlook, which accentuates current and future demand for the Convection Reflow Soldering Oven market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Convection Reflow Soldering Oven market include Nordson Corporation, JLW Electronics, PVA Tepla America, Heller, ANTOM, SEHO, VIRTRONIC, Tamura, Nihon Handa, BTU, Shenzhen Riding, Vitronics Soltec, and others. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . CONVECTION REFLOW SOLDERING OVEN - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Application
- 3.7.2 Market Attractiveness Analysis By Product Type
- 3.7.3 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . GLOBAL CONVECTION REFLOW SOLDERING OVEN MARKET ANALYSIS BY APPLICATION

5.1 Overview by Application
5.2 Historical and Forecast Data
5.3 Analysis by Application
5.4 Automotive Historic and Forecast Sales by Regions
5.5 Telecommunications Historic and Forecast Sales by Regions
5.6 Consumer Electronics Historic and Forecast Sales by Regions
5.7 Others Historic and Forecast Sales by Regions

6 . GLOBAL CONVECTION REFLOW SOLDERING OVEN MARKET ANALYSIS BY PRODUCT TYPE

6.1 Overview by Product Type
6.2 Historical and Forecast Data
6.3 Analysis by Product Type
6.4 More Than 20 Heating Zones Historic and Forecast Sales by Regions
6.5 10-20 Heating Zones Historic and Forecast Sales by Regions
6.6 Less Than 10 Heating Zones Historic and Forecast Sales by Regions

7 . GLOBAL CONVECTION REFLOW SOLDERING OVEN MARKET ANALYSIS BY GEOGRAPHY

7.1. Regional Outlook
7.2. Introduction
7.3. North America Sales Analysis
- 7.3.1. Overview, Historic and Forecast Data Sales Analysis
- 7.3.2. North America By Segment Sales Analysis
- 7.3.3. North America By Country Sales Analysis
- 7.3.4. United State Sales Analysis
- 7.3.5. Canada Sales Analysis
- 7.3.6. Mexico Sales Analysis
7.4. Europe Sales Analysis
- 7.4.1. Overview, Historic and Forecast Data Sales Analysis
- 7.4.2. Europe by Segment Sales Analysis
- 7.4.3. Europe by Country Sales Analysis
- 7.4.4. United Kingdom Sales Analysis
- 7.4.5. France Sales Analysis
- 7.4.6. Germany Sales Analysis
- 7.4.7. Italy Sales Analysis
- 7.4.8. Russia Sales Analysis
- 7.4.9. Rest Of Europe Sales Analysis
7.5. Asia Pacific Sales Analysis
- 7.5.1. Overview, Historic and Forecast Data Sales Analysis
- 7.5.2. Asia Pacific by Segment Sales Analysis
- 7.5.3. Asia Pacific by Country Sales Analysis
- 7.5.4. China Sales Analysis
- 7.5.5. India Sales Analysis
- 7.5.6. Japan Sales Analysis
- 7.5.7. South Korea Sales Analysis
- 7.5.8. Australia Sales Analysis
- 7.5.9. South East Asia Sales Analysis
- 7.5.10. Rest Of Asia Pacific Sales Analysis
7.6. Latin America Sales Analysis
- 7.6.1. Overview, Historic and Forecast Data Sales Analysis
- 7.6.2. Latin America by Segment Sales Analysis
- 7.6.3. Latin America by Country Sales Analysis
- 7.6.4. Brazil Sales Analysis
- 7.6.5. Argentina Sales Analysis
- 7.6.6. Peru Sales Analysis
- 7.6.7. Chile Sales Analysis
- 7.6.8. Rest of Latin America Sales Analysis
7.7. Middle East & Africa Sales Analysis
- 7.7.1. Overview, Historic and Forecast Data Sales Analysis
- 7.7.2. Middle East & Africa by Segment Sales Analysis
- 7.7.3. Middle East & Africa by Country Sales Analysis
- 7.7.4. Saudi Arabia Sales Analysis
- 7.7.5. UAE Sales Analysis
- 7.7.6. Israel Sales Analysis
- 7.7.7. South Africa Sales Analysis
- 7.7.8. Rest Of Middle East And Africa Sales Analysis

8 . COMPETITIVE LANDSCAPE OF THE CONVECTION REFLOW SOLDERING OVEN COMPANIES

8.1. Convection Reflow Soldering Oven Market Competition
8.2. Partnership/Collaboration/Agreement
8.3. Merger And Acquisitions
8.4. New Product Launch
8.5. Other Developments

9 . COMPANY PROFILES OF CONVECTION REFLOW SOLDERING OVEN INDUSTRY

9.1. Top Companies Market Share Analysis
9.2. Market Concentration Rate
9.3. Nordson Corporation
- 9.3.1. Company Overview
- 9.3.2. Company Revenue
- 9.3.3. Products
- 9.3.4. Recent Developments
9.4. JLW Electronics
- 9.4.1. Company Overview
- 9.4.2. Company Revenue
- 9.4.3. Products
- 9.4.4. Recent Developments
9.5. PVA Tepla America
- 9.5.1. Company Overview
- 9.5.2. Company Revenue
- 9.5.3. Products
- 9.5.4. Recent Developments
9.6. Heller
- 9.6.1. Company Overview
- 9.6.2. Company Revenue
- 9.6.3. Products
- 9.6.4. Recent Developments
9.7. ANTOM
- 9.7.1. Company Overview
- 9.7.2. Company Revenue
- 9.7.3. Products
- 9.7.4. Recent Developments
9.8. SEHO
- 9.8.1. Company Overview
- 9.8.2. Company Revenue
- 9.8.3. Products
- 9.8.4. Recent Developments
9.9. VIRTRONIC
- 9.9.1. Company Overview
- 9.9.2. Company Revenue
- 9.9.3. Products
- 9.9.4. Recent Developments
9.10. Tamura
- 9.10.1. Company Overview
- 9.10.2. Company Revenue
- 9.10.3. Products
- 9.10.4. Recent Developments
9.11. Nihon Handa
- 9.11.1. Company Overview
- 9.11.2. Company Revenue
- 9.11.3. Products
- 9.11.4. Recent Developments
9.12. BTU
- 9.12.1. Company Overview
- 9.12.2. Company Revenue
- 9.12.3. Products
- 9.12.4. Recent Developments
9.13. Shenzhen Riding
- 9.13.1. Company Overview
- 9.13.2. Company Revenue
- 9.13.3. Products
- 9.13.4. Recent Developments
9.14. Vitronics Soltec
- 9.14.1. Company Overview
- 9.14.2. Company Revenue
- 9.14.3. Products
- 9.14.4. Recent Developments
9.15. Others
- 9.15.1. Company Overview
- 9.15.2. Company Revenue
- 9.15.3. Products
- 9.15.4. Recent Developments