蝕刻材料的全球市場2024

蝕刻材料市場經歷了顯著成長，預計到 2030 年將達到約 50 億美元，複合年增長率約為 6.5%，而 2022 年為 30 億美元。半導體技術的不斷進步、消費性電子產品使用的增加以及電子產品小型化的持續趨勢都促進了對蝕刻材料的需求。

本報告提供蝕刻材料市場詳細評估，並深入探討以下幾點:

產品概要

主要蝕刻劑所使用的主要材料定義

• 濕蝕刻劑
• 乾蝕刻劑

蝕刻劑的全球市場概要

蝕刻材料的現在(2022年)與預測(2030年)的全球市場相關洞察。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

各材料類型全球市場市場區隔

主要蝕刻劑類型市場區隔:濕蝕刻劑，乾蝕刻劑

異向性，蝕刻均一性，含蝕刻選擇性等的參數相關之客戶迴響，材料選擇的主要選擇標準或性能參數。

競爭概要:

主要的競爭企業的簡介和Morita Chemical, Kanto Chemical, Daikin, OCI 含Company, Honeywell等的10公司以上的競爭形勢分析。

專利概要:

過去4-5年主要的專利轉讓處的主要專利系列的分析。還有專利的研究焦點，討論中的材料，相關應用相關洞察也包含。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 蝕刻劑

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Etchant materials market is poised for remarkable growth, projected to reach approximately USD 5 billion by 2030, with a CAGR of approximately 6.5% from a value of USD 3 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Etchant materials.

This report provides a deep dive into the following points in this detailed assessment of etchant materials market:

Product Overview

Defining the key materials used for major etchant:

• Wet Etchant
• Dry Etchant

Global Etchant Market overview

Insight on current (2022) and forecasted (2030) global market for Etchant Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

market segmentation by key etchant type – Wet Etchant, Dry Etchant.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Anisotropy, Etch Uniformity, Etch Selectivity, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Morita Chemical, Kanto Chemical, Daikin, OCI Company, Honeywell, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Etchant

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Etchant Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Etchant
• Table 6.1: Patent Publications by Geography - Etchant
• Table 6.2: Patent Listing - Etchant

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Etchant Materials Market
• Chart 5.1.2: Global Etchant Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Etchant