蝕刻掩模材料的全球市場2024

蝕刻掩模材料市場經歷了顯著成長，預計將從 2022 年的 16 億美元增長到 2030 年的 34 億美元以上，複合年增長率約為 10%。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化的持續趨勢都促進了對蝕刻掩模的需求。

本報告提供蝕刻掩模材料市場詳細評估，並深入探討以下幾點:

產品概要

所使用的蝕刻掩模材料的種類定義

• 硬面罩
• 軟體面罩

蝕刻掩模材料的全球市場概要

蝕刻掩模材料的現在(2022年)與預測(2030年)的全球市場相關洞察。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

各材料類型全球市場市場區隔

主要蝕刻掩模材料各類型全球市場市場區隔- 硬面罩和軟體面罩

蝕刻抗性，含化學的穩定性等的參數相關之客戶迴響，材料選擇主要的選擇標準或性能參數

競爭概要:

主要的競爭企業的簡介和JSR Corporation, Samsung SDI, YC Chem, PiBond, DNF等的主要企業的競爭形勢分析。

專利概要:

過去4-5年主要的專利轉讓處的主要專利系列的分析。還有專利的研究焦點，也包含討論中的材料，相關用途相關洞察。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 蝕刻掩模材料

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Etch Mask materials market is poised for remarkable growth, projected to surpass USD 3.4 billion by 2030, with a compelling CAGR of approximately 10% from a value of USD 1.6 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Etch Mask.

This report provides a deep-dive into the following points in this detailed assessment of etch mask market:

Product Overview

Defining the type of etch mask used:

• Hard Mask
• Soft Mask

Global Etch Mask Market Overview

Insight on current (2022) and forecasted (2030) global market for Etch Mask Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key Etch Mask type – Hard Mask and Soft Mask

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Etching-resistance, Chemical stability, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of the major companies including JSR Corporation, Samsung SDI, YC Chem, PiBond, DNF, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Etch Mask

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Etch Mask Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Etch Mask
• Table 6.1: Patent Publications by Geography - Etch Mask
• Table 6.2: Patent Listing - Etch Mask

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Etch Mask Materials Market
• Chart 5.1.2: Global Etch Mask Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Etch Mask