CMP材料的全球市場2024

化學機械拋光 (CMP) 材料市場正在經歷顯著成長，預計將從 2022 年的 37 億美元增長到 2030 年的 65 億美元以上，複合年增長率約為 8%。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化的持續趨勢都促進了對 CMP 材料的需求。

本報告提供化學的機器拋光(CMP)用材料詳細評估，並深入探討以下幾點:

產品概要

CMP所使用的主要零組件定義

• CMP墊片
• CMP泥漿

化學的機器拋光的全球市場概要

CMP材料的現在(2022年)與預測(2030年)的全球市場相關洞察。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

各材料類型的全球市場市場區隔

聚合物，金屬，陶瓷等，所使用的主要各材料的全球市場市場區隔

拋光消除率，平坦性，含均一性等的參數相關之客戶迴響，材料選擇的主要選擇標準或性能參數

競爭概要:

主要的競爭企業的簡介包含有3M, Dow, Merck, Resonac, DuPont等的10公司以上的競爭形勢分析。

專利概要:

過去4-5年主要的專利轉讓處的主要專利系列的分析。還有專利的調查對象，也包含討論中的材料，相關用途相關洞察。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• CMP材料(泥漿&墊片)

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Chemical Mechanical Planarization (CMP) materials market is poised for remarkable growth, projected to surpass USD 6.5 billion by 2030, with a compelling CAGR of approximately 8% from a value of USD 3.7 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for CMP materials.

This report provides a deep dive into the following points in this detailed assessment of materials for Chemical Mechanical Planarization:

Product Overview

Defining the major components used in CMP:

• CMP Pads
• CMP Slurries

Global Chemical Mechanical Planarization Market Overview

Insight on current (2022) and forecasted (2030) global market for CMP materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used ; Polymers, Metals, Ceramics, etc.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Polishing and Removal rate, Planarity, and Uniformity

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including 3M, Dow, Merck, Resonac, DuPont, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Materials for CMP (Slurries & pads)

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global CMP Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - CMP Materials
• Table 6.1: Patent Publications by Geography - CMP Slurries
• Table 6.2: Patent Listing - CMP Slurries
• Table 6.3: Patent Publications by Geography - CMP Polishing Pad
• Table 6.4: Patent Listing - CMP Polishing Pad

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global CMP Materials Market
• Chart 5.1.2: Global CMP Materials Market, By Material
• Chart 6.1: Patent Publication Trend - CMP Slurries
• Chart 6.2: Patent Publication Trend - CMP Polishing Pads