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1517340

全球相機模組市場規模研究，按製程（板載相機模組、覆晶相機模組）、組件、介面、像素、應用和區域預測 2022-2032 年。

Global Camera Module Market Size study, by Process (Chip-On-Board Camera Module, Flip-Chip Camera Module), by Component, by Interface, by Pixel, by Application and Regional Forecasts 2022-2032.
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 200 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2023年全球相機模組市場價值約為363億美元，預計在2024-2032年預測期內將以超過7.55%的健康成長率成長。全球相機模組市場滿足了消費性電子和工業應用領域對卓越成像和感測解決方案不斷成長的需求。這些模組包括影像感測器、鏡頭組件、音圈馬達、紅外線截止濾光片和印刷電路板，對於捕捉高解析度影像和視訊至關重要。智慧型手機技術的快速進步和日益成長的安全問題推動了對先進監控系統和更高品質攝影機的需求。此外，汽車產業中先進駕駛輔助系統（ADAS）的日益整合進一步增加了對高效能攝影機模組的需求，從而推動市場成長。然而，與相機模組相關的高生產成本和品質問題對市場成長構成了重大挑戰。另一方面，智慧城市的出現需要視訊監控、3D 深度感測技術的進步以及穿戴式設備和物聯網應用的攝影機模組的小型化，預計將在市場上創造利潤豐厚的機會。

板載晶片 (COB) 和覆晶技術的普及為相機模組產業的特定應用提供了獨特的優勢。板載晶片 (COB) 模組提供緊湊、輕巧的解決方案，非常適合受空間限制的攜帶式設備，確保高速資料傳輸、卓越的熱性能，並因減少訊號干擾而增強影像品質。相反，覆晶相機模組採用一種稱為覆晶接合的先進封裝技術，無需引線接合即可將影像感測器晶片直接連接到印刷電路板(PCB)，從而實現更纖薄的外形和更快的資料傳輸。 COB 和覆晶相機模組之間的選擇取決於裝置尺寸限制、所需的影像品質、資料傳輸速度、功耗要求和成本考慮。

相機模組市場中的高品質影像和視訊製作取決於幾個關鍵組件，包括數位訊號處理 (DSP)、影像感測器、紅外線濾光片、鏡頭、軟板或印刷電路板 (PCB)。數位訊號處理 (DSP) 精煉原始影像資料，以確保清晰的影像和準確的色彩再現，支援降噪和鏡頭畸變校正等基本功能。影像感測器將光轉換為電子訊號，在確定相機模組產生的影像品質方面發揮關鍵作用。紅外線濾光片消除了不必要的紅外光，這些紅外線可能會導致戶外應用中的顏色失真。非球面鏡片以減少球面像差同時保持緊湊設計而聞名，越來越受歡迎。軟板或 PCB 行業對高密度互連 (HDI) 板的需求日益成長，以支援相機模組市場的小型化趨勢。

相機並行介面 (CPI) 和相機串列介面 (CSI) 代表了將相機模組連接到主機設備的兩種不同方法。相機並行介面（CPI）是一種傳統方法，採用多條資料線進行高速並行通訊，使其適合高頻寬和低延遲應用，例如工業視覺系統和高速視訊處理。相機串列介面 (CSI) 使用差分訊號方案透過更少的訊號線串列傳輸影像資料，從而減少電磁干擾 (EMI)、提高抗雜訊並延長電纜長度。 CSI 對於智慧型手機、平板電腦、無人機和物聯網設備等應用特別有利，在這些應用中，更小的外形尺寸和更低的功耗至關重要。

相機模組在汽車、消費性電子、國防、工業、醫療和個人運算設備等各個領域都是不可或缺的。在汽車行業，先進駕駛輔助系統(ADAS)、後視攝影機和自動駕駛汽車依靠攝影機模組來實現車道偏離警告和停車輔助等功能。消費性電子市場需要用於數位相機、運動相機、無人機和 VR 耳機的高品質相機模組。國防和太空應用將攝影機模組用於監視系統、偵察無人機/UAV（無人駕駛飛行器）和衛星成像系統。工業領域在機器視覺系統和自動化機器人中使用相機模組。醫療應用需要用於內視鏡檢查、顯微鏡、眼科設備以及其他診斷設備的專用相機模組。相機模組也是智慧型手機、平板電腦和個人電腦中用於拍攝照片和促進視訊通話的重要組件。

在美洲，對攝影機模組的需求受到智慧型手機、整合 ADAS 的汽車應用、安全和監控系統以及消費性電子產品等關鍵產業的推動。在美國和加拿大，消費者優先考慮高品質的影像捕捉和錄影功能。由於智慧型手機採用率上升和汽車產業不斷擴大，歐洲、中東和非洲地區呈現穩定成長。歐洲尤其注重強制車輛配備 ADAS 功能的嚴格法規，推動了對先進攝影機模組的需求。中東和非洲的安全問題日益嚴重，並且需要有效的監控系統。由於快速的城市化、可支配收入的增加以及推動汽車生產的強勁工業成長，亞太地區佔據了全球最大的市場佔有率。

目錄

第 1 章：全球相機模組市場執行摘要

  • 全球相機模組市場規模及預測（2022-2032）
  • 區域概要
  • 分部摘要
    • 按流程
    • 按組件
    • 透過介面
    • 按像素
    • 按申請
  • 主要趨勢
  • 經濟衰退的影響
  • 分析師推薦與結論

第 2 章：全球相機模組市場定義與研究假設

  • 研究目的
  • 市場定義
  • 研究假設
    • 包含與排除
    • 限制
    • 供給側分析
      • 可用性
      • 基礎設施
      • 監管環境
      • 市場競爭
      • 經濟可行性（消費者的角度）
    • 需求面分析
      • 監理框架
      • 技術進步
      • 環境考慮
      • 消費者意識和接受度
  • 估算方法
  • 研究涵蓋的年份
  • 貨幣兌換率

第3章：全球相機模組市場動態

  • 市場促進因素
    • 對高品質成像的需求不斷成長
    • 智慧型手機技術的快速進步
    • ADAS 在汽車領域的採用率不斷提高
  • 市場挑戰
    • 生產成本高
    • 相機模組相關品質問題
  • 市場機會
    • 智慧城市介紹
    • 3D 深度感測技術的進步
    • 相機模組的小型化

第 4 章：全球相機模組市場產業分析

  • 波特的五力模型
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭競爭
    • 波特五力模型的未來方法
    • 波特的五力影響分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社會的
    • 技術性
    • 環境的
    • 合法的
  • 頂級投資機會
  • 最佳制勝策略
  • 顛覆性趨勢
  • 產業專家視角
  • 分析師推薦與結論

第 5 章：2022-2032 年全球相機模組市場規模及流程預測

  • 細分儀表板
  • 全球相機模組市場：2022年及2032年製程收入趨勢分析
    • 板載晶片 (COB) 攝影機模組
    • 覆晶相機模組

第 6 章：2022-2032 年全球相機模組市場規模及按組件預測

  • 細分儀表板
  • 全球相機模組市場：2022年及2032年組件收入趨勢分析
    • 數位訊號處理
    • 影像感測器
      • CCD影像感測器
      • CMOS影像感測器
    • 紅外線濾光片
    • 鏡片
    • 軟板或PCB

第 7 章：2022-2032 年全球相機模組市場規模及介面預測

  • 細分儀表板
  • 全球相機模組市場：2022年及2032年介面收入趨勢分析
    • 相機並行介面
    • 相機串行介面

第 8 章：2022-2032 年全球相機模組市場規模及像素預測

  • 細分儀表板
  • 全球相機模組市場：2022年及2032年像素收入趨勢分析
    • 8 至 13 議員
    • 13 MP 以上
    • 高達 7 MP

第 9 章：2022-2032 年全球相機模組市場規模及應用預測

  • 細分儀表板
  • 全球相機模組市場：2022年和2032年應用收入趨勢分析
    • 汽車與運輸
    • 消費性電子產品
    • 國防與航太
    • 工業與安全
    • 醫療的
    • 智慧型手機、平板電腦和 PC

第 10 章：2022-2032 年全球相機模組市場規模及地區預測

  • 北美相機模組市場
    • 美國相機模組市場
      • 2022-2032 年流程分解規模與預測
      • 2022-2032 年組件細分尺寸與預測
    • 加拿大相機模組市場
  • 歐洲相機模組市場
    • 英國相機模組市場
    • 德國相機模組市場
    • 法國相機模組市場
    • 西班牙相機模組市場
    • 義大利相機模組市場
    • 歐洲其他地區相機模組市場
  • 亞太相機模組市場
    • 中國相機模組市場
    • 印度相機模組市場
    • 日本相機模組市場
    • 澳洲相機模組市場
    • 韓國相機模組市場
    • 亞太地區其他相機模組市場
  • 拉丁美洲相機模組市場
    • 巴西相機模組市場
    • 墨西哥相機模組市場
    • 拉丁美洲其他地區相機模組市場
  • 中東和非洲相機模組市場
    • 沙烏地阿拉伯相機模組市場
    • 南非相機模組市場
    • 中東和非洲其他地區相機模組市場

第 11 章：競爭情報

  • 重點企業SWOT分析
    • 三星馬達有限公司
    • 索尼集團公司
    • 豪威科技公司
  • 頂級市場策略
  • 公司簡介
    • LG Electronics Inc.
    • Fujifilm Holdings Corporation
    • STMicroelectronics NV
    • Toshiba Corporation
    • Panasonic Corporation
    • Canon Inc.
    • Sharp Corporation
    • LITE-ON Technology Corp.
    • Chicony Electronics Co., Ltd.
    • Cowell e Holdings Inc.
    • JENOPTIK AG
    • KYOCERA Corporation

第 12 章：研究過程

  • 研究過程
    • 資料探勘
    • 分析
    • 市場預測
    • 驗證
    • 出版
  • 研究屬性
簡介目錄

Global Camera Module Market is valued approximately at USD 36.30 billion in 2023 and is anticipated to grow with a healthy growth rate of more than 7.55% over the forecast period 2024-2032. The global camera module market serves the escalating demand for superior imaging and sensing solutions across both consumer electronics and industrial applications. These modules, comprising image sensors, lens assemblies, voice coil motors, infrared cut filters, and printed circuit boards, are essential in capturing high-resolution images and videos. The rapid technological advancements in smartphones and the growing security concerns drive the necessity for advanced surveillance systems and higher-quality cameras. Additionally, the increasing integration of advanced driver-assistance systems (ADAS) in the automotive industry further boosts the demand for efficient camera modules, thus propelling market growth. However, high production costs and quality issues related to camera modules pose significant challenges to market growth. On the flip side, the advent of smart cities necessitating video surveillance, advancements in 3D depth-sensing technologies, and the miniaturization of camera modules for wearables and IoT applications are expected to create lucrative opportunities in the market.

The proliferation of chip-on-board (COB) and flip-chip technologies offers distinct advantages for specific applications within the camera module industry. Chip-on-board (COB) modules provide compact and lightweight solutions ideal for portable devices constrained by space, ensuring high-speed data transfer, superior thermal performance, and enhanced image quality due to reduced signal interference. Conversely, flip-chip camera modules utilize an advanced packaging technique known as flip-chip bonding, which connects the image sensor die directly to the printed circuit board (PCB) without wire bonds, resulting in slimmer profiles and faster data transmission. The choice between COB and flip-chip camera modules depends on device size constraints, desired image quality, data transfer speeds, power consumption requirements, and cost considerations.

High-quality image and video production within the camera module market is contingent upon several key components, including digital signal processing (DSP), image sensors, infrared filters, lenses, soft boards or printed circuit boards (PCB). Digital signal processing (DSP) refines raw image data to ensure clear images with accurate color reproduction, supporting essential features such as noise reduction and lens distortion correction. Image sensors convert light into electronic signals, playing a critical role in determining the image quality produced by a camera module. Infrared filters eliminate unwanted infrared light that can cause color distortion in outdoor applications. Aspheric lenses, known for reducing spherical aberrations while maintaining a compact design, are gaining popularity. High-density interconnect (HDI) boards are increasingly demanded within the soft board or PCB industry to support miniaturization trends in the camera module market.

The camera parallel interface (CPI) and camera serial interface (CSI) represent two distinct methods for connecting camera modules to host devices. The camera parallel interface (CPI), a traditional approach, employs multiple data lines for high-speed parallel communication, making it suitable for high-bandwidth and low-latency applications, such as industrial vision systems and high-speed video processing. Camera serial interface (CSI) transmits image data serially over fewer signal lines using a differential signaling scheme, resulting in reduced electromagnetic interference (EMI), improved noise immunity, and longer cable lengths. CSI is particularly beneficial for applications like smartphones, tablets, drones, and IoT devices, where smaller form factors and reduced power consumption are crucial.

Camera modules are indispensable across various sectors, including automotive, consumer electronics, defense, industrial, medical, and personal computing devices. In the automotive industry, advanced driver assistance systems (ADAS), rearview cameras, and autonomous vehicles rely on camera modules for functions such as lane departure warnings and parking assistance. The consumer electronics market demands high-quality camera modules for digital cameras, action cameras, drones, and VR headsets. Defense and space applications utilize camera modules for surveillance systems, reconnaissance drones/UAVs (Unmanned Aerial Vehicles), and satellite imaging systems. The industrial sector employs camera modules in machine vision systems and automation robotics. Medical applications require specialized camera modules for endoscopy, microscopy, and ophthalmology devices, among other diagnostic equipment. Camera modules are also vital components in smartphones, tablets, and PCs for capturing photographs and facilitating video calls.

In the Americas, the demand for camera modules is driven by key industries such as smartphones, automotive applications integrating ADAS, security and surveillance systems, and consumer electronics. In the United States and Canada, consumers prioritize high-quality image capture and video recording capabilities. The EMEA region shows steady growth due to rising smartphone adoption rates and an expanding automotive sector. Europe, in particular, focuses on stringent regulations mandating ADAS features in vehicles, driving demand for advanced camera modules. The Middle East and Africa have seen increased security concerns and the need for effective surveillance systems. The APAC region holds the largest market share globally due to rapid urbanization, increasing disposable incomes, and strong industrial growth propelling automotive production.

Major market players included in this report are:

  • Samsung Electro-Mechanics Co., Ltd.
  • Sony Group Corporation
  • OmniVision Technologies, Inc.
  • LG Electronics Inc.
  • Fujifilm Holdings Corporation
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Panasonic Corporation
  • Canon Inc.
  • Sharp Corporation
  • LITE-ON Technology Corp.
  • Chicony Electronics Co., Ltd.
  • Cowell e Holdings Inc.
  • JENOPTIK AG
  • KYOCERA Corporation

The detailed segments and sub-segment of the market are explained below:

By Process:

  • Chip-On-Board (COB) Camera Module
  • Flip-Chip Camera Module

By Component:

  • Digital Signal Processing
  • Image Sensor
    • CCD Image Sensors
    • CMOS Image Sensors
  • Infrared Filter
  • Lens
  • Soft Board or PCB

By Interface:

  • Camera Parallel Interface
  • Camera Serial Interface

By Pixel:

  • 8 to 13 MP
  • Above 13 MP
  • Up to 7 MP

By Application:

  • Automotive & Transportation
  • Consumer Electronics
  • Defence & Space
  • Industrial & Security
  • Medical
  • Smartphone, Tablet, and PC

By Region:

  • North America
    • U.S.
    • Canada
  • Europe
    • UK
    • Germany
    • France
    • Spain
    • Italy
    • ROE
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
    • RoAPAC
  • Latin America
    • Brazil
    • Mexico
  • Middle East & Africa
    • Saudi Arabia
    • South Africa
    • RoMEA

Years considered for the study are as follows:

  • Historical year - 2022
  • Base year - 2023
  • Forecast period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.

Table of Contents

Chapter 1. Global Camera Module Market Executive Summary

  • 1.1. Global Camera Module Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Process
    • 1.3.2. By Component
    • 1.3.3. By Interface
    • 1.3.4. By Pixel
    • 1.3.5. By Application
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Camera Module Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Camera Module Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Growing Demand for High-Quality Imaging
    • 3.1.2. Rapid Smartphone Technology Advancements
    • 3.1.3. Increasing Adoption of ADAS in Automotive
  • 3.2. Market Challenges
    • 3.2.1. High Production Costs
    • 3.2.2. Quality Issues Related to Camera Modules
  • 3.3. Market Opportunities
    • 3.3.1. Introduction of Smart Cities
    • 3.3.2. Advancement in 3D Depth-Sensing Technologies
    • 3.3.3. Miniaturization of Camera Modules

Chapter 4. Global Camera Module Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top investment opportunity
  • 4.4. Top winning strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Camera Module Market Size & Forecasts by Process 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Camera Module Market: Process Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 5.2.1. Chip-On-Board (COB) Camera Module
    • 5.2.2. Flip-Chip Camera Module

Chapter 6. Global Camera Module Market Size & Forecasts by Component 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Camera Module Market: Component Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 6.2.1. Digital Signal Processing
    • 6.2.2. Image Sensor
      • 6.2.2.1. CCD Image Sensors
      • 6.2.2.2. CMOS Image Sensors
    • 6.2.3. Infrared Filter
    • 6.2.4. Lens
    • 6.2.5. Soft Board or PCB

Chapter 7. Global Camera Module Market Size & Forecasts by Interface 2022-2032

  • 7.1. Segment Dashboard
  • 7.2. Global Camera Module Market: Interface Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 7.2.1. Camera Parallel Interface
    • 7.2.2. Camera Serial Interface

Chapter 8. Global Camera Module Market Size & Forecasts by Pixel 2022-2032

  • 8.1. Segment Dashboard
  • 8.2. Global Camera Module Market: Pixel Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 8.2.1. 8 to 13 MP
    • 8.2.2. Above 13 MP
    • 8.2.3. Up to 7 MP

Chapter 9. Global Camera Module Market Size & Forecasts by Application 2022-2032

  • 9.1. Segment Dashboard
  • 9.2. Global Camera Module Market: Application Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 9.2.1. Automotive & Transportation
    • 9.2.2. Consumer Electronics
    • 9.2.3. Defence & Space
    • 9.2.4. Industrial & Security
    • 9.2.5. Medical
    • 9.2.6. Smartphone, Tablet, and PC

Chapter 10. Global Camera Module Market Size & Forecasts by Region 2022-2032

  • 10.1. North America Camera Module Market
    • 10.1.1. U.S. Camera Module Market
      • 10.1.1.1. Process breakdown size & forecasts, 2022-2032
      • 10.1.1.2. Component breakdown size & forecasts, 2022-2032
    • 10.1.2. Canada Camera Module Market
  • 10.2. Europe Camera Module Market
    • 10.2.1. UK Camera Module Market
    • 10.2.2. Germany Camera Module Market
    • 10.2.3. France Camera Module Market
    • 10.2.4. Spain Camera Module Market
    • 10.2.5. Italy Camera Module Market
    • 10.2.6. Rest of Europe Camera Module Market
  • 10.3. Asia-Pacific Camera Module Market
    • 10.3.1. China Camera Module Market
    • 10.3.2. India Camera Module Market
    • 10.3.3. Japan Camera Module Market
    • 10.3.4. Australia Camera Module Market
    • 10.3.5. South Korea Camera Module Market
    • 10.3.6. Rest of Asia Pacific Camera Module Market
  • 10.4. Latin America Camera Module Market
    • 10.4.1. Brazil Camera Module Market
    • 10.4.2. Mexico Camera Module Market
    • 10.4.3. Rest of Latin America Camera Module Market
  • 10.5. Middle East & Africa Camera Module Market
    • 10.5.1. Saudi Arabia Camera Module Market
    • 10.5.2. South Africa Camera Module Market
    • 10.5.3. Rest of Middle East & Africa Camera Module Market

Chapter 11. Competitive Intelligence

  • 11.1. Key Company SWOT Analysis
    • 11.1.1. Samsung Electro-Mechanics Co., Ltd.
    • 11.1.2. Sony Group Corporation
    • 11.1.3. OmniVision Technologies, Inc.
  • 11.2. Top Market Strategies
  • 11.3. Company Profiles
    • 11.3.1. LG Electronics Inc.
    • 11.3.2. Fujifilm Holdings Corporation
    • 11.3.3. STMicroelectronics N.V.
    • 11.3.4. Toshiba Corporation
    • 11.3.5. Panasonic Corporation
    • 11.3.6. Canon Inc.
    • 11.3.7. Sharp Corporation
    • 11.3.8. LITE-ON Technology Corp.
    • 11.3.9. Chicony Electronics Co., Ltd.
    • 11.3.10. Cowell e Holdings Inc.
    • 11.3.11. JENOPTIK AG
    • 11.3.12. KYOCERA Corporation

Chapter 12. Research Process

  • 12.1. Research Process
    • 12.1.1. Data Mining
    • 12.1.2. Analysis
    • 12.1.3. Market Estimation
    • 12.1.4. Validation
    • 12.1.5. Publishing
  • 12.2. Research Attributes