家用電子電器包裝市場：依材料類型、依產品類型、按地區

家用電子電器封裝市場預計2024年為226.3億美元，預計2031年將達到687.1億美元， 年複合成長率（CAGR）預計將成長17.2%。

家用電子電器封裝市場佔有率(%)，依地區分類，2024 年

家用電子電器包裝市場是指用於智慧型手機、筆記型電腦、穿戴式裝置和家用電器等家用電子電器運輸和分銷的包裝解決方案。有效的包裝在保護電子設備在運輸過程中免受損​​壞、同時改善整體產品體驗方面發揮著重要作用。製造商依賴耐用、永續、永續的自訂型態，使用紙板、塑膠和瓦楞紙箱等材料。對優質電子產品的需求不斷成長、智慧包裝和互動包裝等創新包裝型態的引入、電子商務銷售的成長以及對永續性的關注正在推動家用電子電器包裝市場的成長。

市場動態：

全球家用電子電器包裝市場受到對優質智慧型手機、穿戴式裝置和其他智慧型裝置不斷成長的需求的推動。科技的快速進步、5G網路的引入以及消費者頻繁升級設備的趨勢正在促進電子設備的銷售。此外，電子零售業線上線下的擴張也推動了市場的成長。然而，供應鏈中斷導致的原物料價格波動已成為一個主要問題。此外，有關非生物分解塑膠的嚴格環境法規在一定程度上限制了市場成長。同時，對永續和智慧包裝的關注正在創造利潤豐厚的機會。製造商正在投資可回收和環保的材料，同時實施2D碼等智慧互動功能，以實現無縫的購物體驗。注重運輸安全的電子設備海外出貨量的增加預計將在未來幾年進一步刺激市場需求。

本研究的主要特點

本報告對全球家用電子電器封裝市場進行了詳細分析，並提供了以2023年為基準年的預測期（2024-2031年）的市場規模和年複合成長率（CAGR%）。

它還強調了各個細分市場的潛在收益成長機會，並說明了該市場有吸引力的投資提案矩陣。

它還提供了有關市場促進因素、限制因素、機會、新產品發布和核准、市場趨勢、區域前景、主要企業採取的競爭策略等的重要見解。

它根據公司亮點、產品系列、主要亮點、財務表現和策略等參數，介紹了全球家用電子電器封裝市場的主要企業。

本研究報告中介紹的一些主要企業包括杭州迅達包裝有限公司、Smurfit Kappa Group PLC、DS Smith Plc、Pregis Corporation、Dunapack Packaging Group、Sonoco Products Company、Stora Enso Oyi、WestRock Company、Mondi Group、JJX Packaging LLC 、Huhtamaki Oyj、Dordan Manufacturing Company、深圳Hoicow Packing Manufacturing Ltd.、UFP Technologies, Inc.、International Paper Company 和Sealed Air Corporation。

該報告的見解將幫助負責人和公司經營團隊就未來的產品發布、類型升級、市場擴張和行銷策略做出明智的決策。

本研究報告針對該產業的各個相關人員，如投資者、供應商、產品製造商、經銷商、新進業者和財務分析師。

相關人員可以透過用於分析全球家用電子電器封裝市場的各種策略矩陣來促進他們的決策。

第1章 研究目的與前提

• 研究目標
• 先決條件

第2章 市場概況

• 報告說明
  • 市場定義和範圍
• 執行摘要
• 市場機會藍圖

第3章市場動態與趨勢分析

• 市場動態
  • 促進因素
  • 抑制因素
  • 機會
• 影響分析
• PEST分析
• 波特分析
• COVID-19 影響分析
• 新產品核准
• 促銷和行銷工作
• 不同國家的市場吸引力
• 按細分市場分類的市場吸引力
• 主要進展及交易
• 趨勢分析—過去與未來的趨勢評估
• 主要進展

第4章全球家用電子電器封裝市場，材料類型，2019-2031

• 2024 年及 2031 年市場佔有率(%) 分析
• 市場與前一年同期比較增速對比（%）
• 細分市場趨勢
• 塑膠
  • 市場規模及預測
• 金屬
  • 市場規模及預測
• 紙和紙板
  • 市場規模及預測
• 發泡聚苯乙烯包裝
  • 市場規模及預測

第5章全球家用電子電器封裝市場，產品類型，2019-2031

• 2024 年及 2031 年市場佔有率(%) 分析
• 市場與前一年同期比較增速對比（%）
• 細分市場趨勢
• 瓦楞紙箱
  • 市場規模及預測
• 瓦楞紙箱
  • 市場規模及預測
• 熱成型托盤
  • 市場規模及預測
• 泡殼包裝與翻蓋
  • 市場規模及預測
• 其他
  • 市場規模及預測

第6章2019-2031年全球家用電子電器封裝市場（按地區）

• 北美洲
• 美國
• 加拿大
• 歐洲
• 英國
• 德國
• 義大利
• 法國
• 西班牙
• 俄羅斯
• 歐洲其他地區
• 亞太地區
• 中國
• 印度
• 日本
• 澳洲
• 韓國
• ASEAN
• 其他亞太地區
• 中東/非洲
• 波灣合作理事會
• 南非
• 以色列
• 其他中東地區
• 拉丁美洲
• 巴西
• 墨西哥
• 阿根廷
• 其他拉丁美洲

第7章 競爭格局

• Competitive Snapshot
• What Market Participants are Saying?
• Competitive Dashboard
• Company Market Share Analysis, 2024-Global

第8章公司簡介-全球消費性電子封裝市場

• Hangzhou Xunda Packaging Co.
  • 公司簡介
  • 產品/服務組合
  • 財務績效
  • 最新動態/更新
  • 策略概覽
• Smurfit Kappa Group PLC
• DS Smith Plc
• Pregis Corporation
• Dunapack Packaging Group
• Sonoco Products Company
• Stora Enso Oyi
• WestRock Company
• Mondi Group
• JJX Packaging LLC
• Huhtamaki Oyj
• Dordan Manufacturing Company
• Shenzhen Hoichow Packing Manufacturing Ltd.
• UFP Technologies, Inc.
• International Paper Company
• Sealed Air Corporation

第9章 命運之輪

• 命運之輪
• 分析師觀點
• 一致的機會圖

第10章 參考文獻與調查方法

• 參考
• 調查方法

The consumer electronics packaging market is estimated to be valued at USD 22.63 Bn in 2024 and is expected to reach USD 68.71 Bn by 2031, growing at a compound annual growth rate (CAGR) of 17.2% from 2024 to 2031.

Consumer Electronics Packaging Market Share (%), By Region, 2024

The consumer electronics packaging market refers to the packaging solutions used for shipping and distributing consumer electronic products such as smartphones, laptops, wearables, and home appliances. Effective packaging plays a crucial role in protecting electronics from damage during transportation while also enhancing the overall product experience. Manufacturers rely on sturdy, sustainable, and custom-fit packaging formats made using materials such as paperboards, plastics, and corrugated boxes. The rising demand for premium electronics, implementation of innovative packaging formats like smart and interactive packaging, growing e-commerce sales, and focus on sustainability are some key factors fueling growth in the consumer electronics packaging Market.

Market Dynamics:

The global consumer electronics packaging market is driven by the growing demand for premium smartphones, wearables, and other smart devices. Rapid technological advancements, introduction of 5G networks, and consumers' tendency to frequently upgrade devices contribute to the sale of electronic devices. Furthermore, the expanding electronics retail industry, both online and offline, bolsters the market growth. However, volatility in raw material prices due to supply chain disruptions poses a major challenge. Also, stringent environmental regulations regarding non-biodegradable plastics curb the market progression to some extent. Meanwhile, focus towards sustainable and smart packaging creates lucrative opportunities. Manufacturers invest in recyclable and eco-friendly materials while implementing smart interactive features like QR codes for seamless shopping experience. Rising overseas shipments of electronics with emphasis on security and safety during transportation will further stimulate the market demand over the coming years.

Key Features of the Study:

This report provides an in-depth analysis of the global consumer electronics packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2024-2031), considering 2023 as the base year

It elucidates potential revenue growth opportunities across different segments and explains attractive investment proposition matrices for this market

This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, market trends, regional outlook, and competitive strategies adopted by key players

It profiles key players in the global consumer electronics packaging market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies

Key companies covered as a part of this study include Hangzhou Xunda Packaging Co., Smurfit Kappa Group PLC, DS Smith Plc, Pregis Corporation, Dunapack Packaging Group, Sonoco Products Company, Stora Enso Oyi, WestRock Company, Mondi Group, JJX Packaging LLC, Huhtamaki Oyj, Dordan Manufacturing Company, Shenzhen Hoichow Packing Manufacturing Ltd., UFP Technologies, Inc., International Paper Company, and Sealed Air Corporation are the major players operating in the market.

Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics

The global consumer electronics packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global consumer electronics packaging market

Market Segmentation:

• By Material Type
  • Plastic
  • Metal
  • Paper and Paperboard
  • Foam Packaging
• By Vehicle Type
  • Corrugated Boxes
  • Paperboard Boxes
  • Thermoformed Trays
  • Blister Packs and Clamshells
  • Others
• By Regional
  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East
• Key Players Insights
  • Hangzhou Xunda Packaging Co.
  • Smurfit Kappa Group PLC
  • DS Smith Plc
  • Pregis Corporation
  • Dunapack Packaging Group
  • Sonoco Products Company
  • Stora Enso Oyi
  • WestRock Company
  • Mondi Group
  • JJX Packaging LLC
  • Huhtamaki Oyj
  • Dordan Manufacturing Company
  • Shenzhen Hoichow Packing Manufacturing Ltd.
  • UFP Technologies, Inc.
  • International Paper Company
  • Sealed Air Corporation

Table of Content

1. Research Objectives and Assumptions

• Research Objectives
• Assumptions

2. Market Overview

• Report Description
  • Market Definition and Scope
• Executive Summary
  • Market Snapshot, By Material Type
  • Market Snapshot, By Product Type
  • Market Snapshot, By Region
  • Market Scenario - Conservative, Likely, Opportunistic
• Market Opportunity Map

3. Market Dynamics and Trend Analysis

• Market Dynamics
  • Drivers
  • Restraints
  • Opportunities
• Impact Analysis
• Pest Analysis
• Porters Analysis
• COVID-19 Impact Analysis
• New Product Approvals
• Promotion and Marketing Initiatives
• Market Attractiveness, By Country
• Market Attractiveness, By Market Segment
• Key Developments & Deals
• Trend Analysis - Historic and Future Trend Assessment
• Key Developments

4. Global Consumer Electronics Packaging Market, Material Type, 2019 - 2031 (US$ Billion)

• Introduction
  • Market Share (%) Analysis, 2024 and 2031
  • Market Y-o-Y Growth Comparison (%), 2020 - 2031
  • Segment Trends
• Plastic, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Metal, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Paper and Paperboard, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Foam Packaging, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)

5. Global Consumer Electronics Packaging Market, Product Type, 2019 - 2031 (US$ Billion)

• Introduction
  • Market Share (%) Analysis, 2024 and 2031
  • Market Y-o-Y Growth Comparison (%), 2020 - 2031
  • Segment Trends
• Corrugated Boxes, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Paperboard Boxes, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Thermoformed Trays, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Blister Packs and Clamshells, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Others, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)

6. Global Consumer Electronics Packaging Market, By Region, 2019 - 2031 (US$ Billion)

• Introduction
  • Market Share (%) Analysis, 2024 and 2031, (US$ Billion)
  • Market Y-o-Y Growth Comparison (%), 2024 - 2031, (US$ Billion)
  • Regional Trends
• North America
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• U.S.
• Canada
• Europe
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• U.K.
• Germany
• Italy
• France
• Spain
• Russia
• Rest Of Europe
• Asia Pacific
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• China
• India
• Japan
• Australia
• South Korea
• Asean
• Rest Of Asia Pacific
• Middle East & Africa
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country/Sub-region, 2019 - 2031, (US$ Billion)
• GCC
• South Africa
• Israel
• Rest Of Middle East
• Latin America
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• Brazil
• Mexico
• Argentina
• Rest of Latin America

7. Competitive Landscape

• Competitive Snapshot
• What Market Participants are Saying?
• Competitive Dashboard
• Company Market Share Analysis, 2024 - Global

8. Company Profiles - Global Consumer Electronics Packaging Market

• Hangzhou Xunda Packaging Co.*
  • Company Overview
  • Product/Service Portfolio
  • Financial Performance
  • Recent Developments/Updates
  • Strategic Overview
• Smurfit Kappa Group PLC
• DS Smith Plc
• Pregis Corporation
• Dunapack Packaging Group
• Sonoco Products Company
• Stora Enso Oyi
• WestRock Company
• Mondi Group
• JJX Packaging LLC
• Huhtamaki Oyj
• Dordan Manufacturing Company
• Shenzhen Hoichow Packing Manufacturing Ltd.
• UFP Technologies, Inc.
• International Paper Company
• Sealed Air Corporation

9. Wheel of Fortune

• Wheel of Fortune
• Analyst View
• Coherent Opportunity Map

10. References and Research Methodology

• References
• Research Methodology
• About us and Sales Contact