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半導體生產設備矽晶圓

市場調查報告書

商品編碼

1474055

全球碳化矽晶圓拋光市場 - 2024-2031

Global SiC Wafer Polishing Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 187 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

概述

全球SiC晶圓拋光市場2023年達3億美元，預計2031年將達38億美元，2024-2031年預測期間複合年成長率為37.3%。

電力電子、汽車、電信和再生能源等各行業擴大採用碳化矽半導體元件，有助於推動預測期內的市場成長。 SiC 晶圓具有卓越的電氣性能和耐用性，對於製造高性能電力電子裝置、射頻元件和感測器至關重要。全球電動車普及率的激增推動了對碳化矽晶圓和拋光基板的需求。基於 SiC 的電力電子裝置由於其效率和快速切換能力，對於電動車動力傳動系統和充電基礎設施至關重要。

主要參與者不斷成長的併購策略有助於推動預測期內的市場成長。例如，2021年12月2日，Soitec收購了NovaSiC，有助於加強SiC晶圓技術。新聞稿稱，此次收購使 Soitec 能夠推動電動車和工業應用電源系統半導體的開發。收購 NovaSiC 並整合其在晶圓、拋光和回收方面的專業知識，為 Soitec 帶來了最新的技術構建模組，以提供最佳的最終產品，並為我們的 SmartSiC 產品線的工業化階段做好準備。

北美是市場的主導地區，因為在消費者永續交通環境法規的推動下，美國和加拿大電動車的採用率不斷上升。 SiC 晶圓在製造電力電子元件（例如電動車傳動系統中使用的逆變器和轉換器）方面發揮著重要作用。不斷擴大的電動車產業推動了該地區對優質碳化矽晶圓服務的需求。風能和太陽能等大量財政資源已投入北美的再生能源領域。由於碳化矽電力電子元件具有出色的耐溫度變化能力，因此非常適合再生能源系統。隨著再生能源產業的發展，北美地區涉及功率轉換和能源管理的應用對碳化矽晶圓的需求日益成長。

動力學

全球電動車 (EV) 採用率上升

先進的電力電子元件對於電動車的推進系統、電池管理和充電基礎設施至關重要。與傳統的矽基功率元件相比，碳化矽功率元件具有多種優勢，例如更高的效率、更快的開關時間和更好的熱性能。隨著電動車使用量的增加，用於生產高功率和高頻電源模組、逆變器和車載充電器的碳化矽晶圓和拋光組件的需求量越來越大。根據Virta Global給出的資料，2021年全球電動車銷量為67.5億輛，2022年電動車銷量將成長100億輛。中國是電動車銷量的主導地區，2022 年銷量約 138 億輛。

使用基於碳化矽的電力電子裝置可以提高電動車的整體效率和續航里程。 SiC 晶圓用於電力轉換器和逆變器，以改善再生煞車、降低電力轉換過程中的能量損失，並在不犧牲效率的情況下允許更高的工作溫度。這些效率優勢推動了電動車市場中基於 SiC 的解決方案的成長，這些優勢轉化為更長的行駛里程、更長的電池壽命和更高的車輛性能。

電力電子和半導體裝置擴大採用 SiC 晶圓

由於其卓越的品質，包括低開關損耗、高導熱性和高擊穿電壓，SiC 晶圓在電力電子領域很受歡迎。由於這些特性，基於 SiC 的功率元件非常高效，並且可以在更高的溫度和功率密度下運作。隨著產業對節能解決方案的需求日益增加，電力電子元件中碳化矽晶圓的使用增加了對精確拋光的需求，以確保這些設備的最佳效率和可靠性。汽車產業，尤其是電動車和混合動力車，其車載充電基礎設施、電池管理系統和傳動系統嚴重依賴基於碳化矽的電力電子設備。

基於碳化矽的功率元件有利於再生能源領域，因為它們為風能和儲能等系統提供高效的能量轉換和功率調節。 SiC 晶圓可為再生能源系統提供更高的轉換效率、更低的損耗並提高供電可靠性。全球再生能源專案的擴張推動了對各種應用的拋光碳化矽晶圓的需求。

初始投資高

SiC 晶圓拋光所需的機械和設備，例如拋光墊、計量儀器和化學機械平坦化系統，需要大量的財務投資。專業工具對於精確實現半導體產業所需的表面光滑度和平整度至關重要。 SiC 晶圓拋光通常需要具有調節濕度和顆粒水平的無塵室條件，以防止污染並確保製程的可重複性。初始投資費用隨著無塵室設施的維護和建立而增加，其中包括暖通空調系統、過濾裝置和持續的無塵室維護。

SiC 晶圓拋光中使用的磨料和拋光墊是消耗品，會增加營運費用。採購符合行業標準和製程要求的高品質材料和消耗品會增加拋光設施的初始投資和持續營運成本。操作 SiC 晶圓拋光設備需要熟練的技術人員、工程師和操作員，他們具有材料科學、半導體製造、拋光技術和計量方面的專業知識。培訓人員和建立一支能夠操作和維護複雜拋光系統的合格勞動力團隊意味著額外的成本和人力資本投資。

The rising adoption of SiC-based semiconductor devices in various industries like power electronics, automotive, telecommunications and renewable energy help to boost market growth over the forecast period. SiC wafers are essential for manufacturing high-performance power electronics, Radio Frequency components and sensors due to their superior electrical properties and durability. The surge in electric vehicle adoption globally is fueling the demand for SiC wafers and polished substrates. SiC-based power electronics are crucial for EV drivetrains and charging infrastructure due to their efficiency and fast-switching capabilities.

Growing merger and acquisition strategies by the major key players help to boost market growth over the forecast period. For instance, on December 02, 2021, Soitec, acquired NovaSiC which helps to strengthen SiC wafer technology. The acquisition allows Soitec to drive the development of semiconductors for power supply systems in electromobility and industrial applications, a press release reads. The acquisition of NovaSiC and the integration of its expertise in wafering, polishing and reclaiming brings the latest technology building block for Soitec to deliver an optimal final product and prepare the industrialization phase of our SmartSiC product line.

North America is the dominating region in the market due to the growing adoption of electric vehicles is on the rise in U.S. and Canada driven by consumer environmental regulations for sustainable transportation. SiC wafers play an important role in manufacturing power electronics components like inverters and converters used in EV drivetrains. The demand in the region for superior SiC wafer services is fueled by the expanding EV industry. Significant financial resources like wind and solar energy, have been poured into renewable energy sources in North America. Because of their remarkable resistance to temperature changes, SiC-based power electronics are a good fit for renewable energy systems. SiC wafers are growing increasingly in demand in North America for applications involving power conversion and energy management as the renewable energy industry develops.

Dynamics

Rise in Electric Vehicle (EV) Adoption Globally

Advanced power electronics components are crucial to the propulsion systems, battery management and charging infrastructure of electric vehicles. Compared to their conventional silicon-based counterparts, SiC-based power devices provide several benefits, such as increased efficiency, faster switching instances and better thermal performance. SiC wafers and polished components, which are used for producing high-power and high-frequency power modules, inverters and onboard chargers, are becoming increasingly in demand as EV usage rises. According to the data given by Virta Global in 2021, 6.75 Billion EVs were sold globally and in 2022, EV sales increased by 10 Billion. China is a dominating region in the sales of EV accounted around sales of around 13.8 Billion cars in 2022.

The overall efficiency and range of electric automobiles are enhanced using SiC-based power electronics. SiC wafers are used in power converters and inverters to improve regenerative braking, lower energy losses during power conversion and allow for greater operating temperatures without sacrificing efficiency. The growth of SiC-based solutions in the EV market is being driven by these efficiency benefits, which translate into longer driving ranges, better battery life and greater vehicle performance.

Growing Adoption of SiC Wafers in Power Electronics and Semiconductor Devices

Due to its remarkable qualities, which include low switching losses, high thermal conductivity and high breakup voltage, SiC wafers are popular in power electronics. Because of these characteristics, SiC-based power devices are very efficient and can function at greater temperatures and power densities. The use of SiC wafers in power electronics increases the need for accurate polishing to guarantee the best efficiency and reliability of these devices as industries demand increasingly power-efficient solutions. The automobile industry and EVs and HEVs in particular, is significantly dependent on SiC-based power electronics for its onboard charging infrastructure, battery management systems and drivetrains.

SiC-based power devices are beneficial to the renewable energy sector because they offer efficient energy conversion and power conditioning for systems including wind and energy storage. SiC wafers offer greater conversion efficiencies, lower losses and increased reliability in power supply for renewable energy systems. The need for polished SiC wafers intended for various applications has been driven by the expansion of renewable energy projects globally.

High Initial Investment

The machinery and equipment needed for SiC wafer polishing, such as as polishing pads, metrology instruments and Chemical-Mechanical Planarization systems, interest a substantial financial investment. The specialist tools are essential for achieving precisely the surface smoothness and flatness demanded by the semiconductor industry. Cleanroom conditions with regulated humidity and particle levels are frequently required for the polishing of SiC wafers to prevent contamination and guarantee process repeatability. The initial investment expenses increase with the maintenance and establishment of cleanroom facilities, which include HVAC systems, filtration units and ongoing cleanroom maintenance.

Abrasives and polishing pads used in SiC wafer polishing are consumables that contribute to operational expenses. Procuring high-quality materials and consumables that meet industry standards and process requirements adds to the initial investment and ongoing operational costs for polishing facilities. Operating SiC wafer polishing equipment requires skilled technicians, engineers and operators with expertise in materials science, semiconductor manufacturing, polishing techniques and metrology. Training personnel and building a qualified workforce capable of operating and maintaining sophisticated polishing systems represent additional costs and investment in human capital.

Segment Analysis

The global SiC wafer polishing market is segmented based on process, product, application and region.

Growing Adoption of Mechanical SiC Wafer Polishing process Globally

Based on the Process, the SiC wafer polishing market is segmented into mechanical, chemical-mechanical, electropolishing, chemical, plasma-assisted and others.

Mechanical polishing processes, such as chemical-mechanical planarization and grinding, result in superior surface quality compared to other polishing methods. The mechanical action removes surface defects and contaminants, producing smooth, uniform and defect-free SiC wafer surfaces. High-quality surfaces are essential for semiconductor device fabrication and electronic components. Mechanical polishing techniques offer precise control over material removal rates, surface flatness, roughness parameters and thickness uniformity. Manufacturers can achieve tight tolerances and specifications required for SiC wafers used in high-performance semiconductor devices, Micro-Electro-Mechanical Systems, sensors, power electronics and photonic applications. The ability to control polishing parameters enhances product quality and reliability.

The growing major key player's demand for the Mechanical SiC Wafer Polishing method helps to boost segment growth over the ofrecast period. F0r instance, on July 06, 2023, Revasum announced the launch of a 200 mm conversion kit for their flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) platform. The 6EZ has proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field.

Geographical Penetration

North America is Dominating the Hardware Products Market

Innovation in technology focuses on North America, particularly in the semiconductor and materials industries. Leading businesses, academic institutions and research centres that propel the development of SiC wafer polishing technologies are based in the area. Global demand for SiC wafers with superior quality and performance is met by constant innovation. With a concentration on power electronics, RF devices and high-frequency applications, North America has a strong semiconductor field. High-power and high-frequency semiconductors utilized in data centers, renewable energy systems, automobile electronics and aerospace applications are made possible by SiC wafers. The need for SiC wafer polishing services is fueled by the existence of significant OEMs and semiconductor firms in North America.

Growing product launches by the major key players in the region help to boost regional segment growth over the forecast period. For instance, on February 21, 2023, Amtech Systems, Inc. booked the 20th new OnTrak double-sided wafer scrubber system sold into SiC manufacturing applications. The product booking came from an existing Entrepix OnTrak customer in North America. The new OnTrak double-sided scrubber is suitable for compound semiconductor applications with configurations for 100-200mm wafers and accommodation for even smaller wafers with custom-designed carriers.

Competitive Landscape

The major global players in the market include Kemnet International, Entegris, Ijin Diamond, Fujimi Corporation, Saint-Gobain, JSR Corporation, Engis Corporation, Ferro Corporation, 3M and DuPont Incorporated.

COVID-19 Impact Analysis

The globally epidemic of health Global supply chains, particularly those about minerals and semiconductor manufacture, were impacted by the COVID-19 epidemic. The disruption resulted in difficulties in obtaining components and raw materials required for SiC wafer polishing operations. The distribution and fabrication of SiC wafers were impacted by lower capacity for production. The demand for SiC wafers and associated items fluctuated as a result of the pandemic. Demand decreased as a result of manufacturing firms cutting back on activities as a result of lockdowns. However, the demand for SiC wafers for applications including power electronics, renewable energy and telecommunications showed indications of revival as sectors adjusted to remote labor and digitalization trends increased.

The pandemic's impact varied across different end-user industries of SiC wafers.For instance, SiC wafer sales for automotive electronics and power modules were first impacted by a decline in demand in the automobile sector. However, as these sectors adapted to remote work, digital connection and sustainable energy solutions, the demand for SiC wafers surged in areas including data centers, telecommunications and renewable energy. During the pandemic, certain semiconductor manufacturers revamped their manufacturing processes to concentrate on vital parts and technology required for medical equipment, healthcare devices and pandemic response initiatives. The supply of SiC wafers for non-essential applications and production volumes were momentarily impacted by this change in manufacturing priorities.

Russia-Ukraine War Impact Analysis

One of the major producers of raw materials and minerals such as silicon carbide, is Ukraine. Supply networks might be disrupted by the war, which could cause shortages or delays in the availability of SiC wafers for polishing. The operations and production schedules of businesses in the SiC wafer polishing sector may be impacted by this interruption. Price volatility in raw materials specifically silicon carbide caused by supply chain disruptions. Price fluctuations for raw materials can have an effect on SiC wafer polishing firms' manufacturing costs, which could result in changes to product pricing and profit margins.

Customers, producers and investors in the SiC wafer polishing industry are hesitant due to the instability and unpredictability brought on by the conflict between Ukraine and Russia. Market growth is impacted if businesses postpone plans for growth, research and development expenditures or the introduction of new products until the geopolitical environment stabilizes. The European and Eurasian markets, respectively, include Russia and Ukraine. Any disruptions in these regions can influence the regional demand for SiC wafer polishing products. Changes in regional demand patterns can affect market dynamics, competition and pricing strategies for SiC wafer polishing companies operating in these areas.

By Process

Mechanical
Chemical-Mechanical
Electropolishing
Chemical
Plasma-Assisted
Others

By Product

Abrasive Powders
Polishing Pads
Diamond Slurries
Colloidal Silica Suspensions

By Application

Power Electronics
LED
Sensors and Detectors
RF and Microwave Devices

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On May 22, 2020, Sumitomo Electric Industries, Ltd. launched a SiC 150mm diameter single crystal substrate CrystEra for power devices. The new product is used in the production of Sumitomo SiC epitaxial wafer EpiEra. Semiconductor devices are used for various applications such as power transmission, automotive, train, solar power, home appliances and other sectors.
On March 28, 2022, Showa Denko launched mass production of 6-inch sic single crystal wafers in the market with a diameter of 6 inches which are used as materials for SiC epitaxial wafers to be installed and processed into SiC-based power semiconductors.
On December 02, 2021, Soitec, a manufacturer and designer of semiconductor materials acquired NovaSiC, a technology company specialized in polishing and reclaiming wafers on silicon carbide, to accelerate the company's technology development and strengthen its positioning on the industrial and automotive markets.

Why Purchase the Report?

To visualize the global SiC wafer polishing market segmentation based on process, product, application and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of SiC wafer polishing market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global SiC wafer polishing market report would provide approximately 62 tables, 57 figures and 187 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Process
3.2.Snippet by Product
3.3.Snippet by Application
3.4.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Rise in Electric Vehicle (EV) Adoption Globally
  - 4.1.1.2.Growing Adoption of SiC Wafers in Power Electronics and Semiconductor Devices
- 4.1.2.Restraints
  - 4.1.2.1.High Initial Investment
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Process

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 7.1.2.Market Attractiveness Index, By Process
7.2.Mechanical*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Chemical-Mechanical
7.4.Electropolishing
7.5.Chemical
7.6.Plasma-Assisted
7.7.Others

8.By Product

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 8.1.2.Market Attractiveness Index, By Product
8.2.Abrasive Powders*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Polishing Pads
8.4.Diamond Slurries
8.5.Colloidal Silica Suspensions

9.By Application

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 9.1.2.Market Attractiveness Index, By Application
9.2.Power Electronics*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.LED
9.4.Sensors and Detectors
9.5.RF and Microwave Devices

10.By Region

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2.Market Attractiveness Index, By Region
10.2.North America
- 10.2.1.Introduction
- 10.2.2.Key Region-Specific Dynamics
- 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1.U.S.
  - 10.2.6.2.Canada
  - 10.2.6.3.Mexico
10.3.Europe
- 10.3.1.Introduction
- 10.3.2.Key Region-Specific Dynamics
- 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1.Germany
  - 10.3.6.2.UK
  - 10.3.6.3.France
  - 10.3.6.4.Italy
  - 10.3.6.5.Spain
  - 10.3.6.6.Rest of Europe
10.4.South America
- 10.4.1.Introduction
- 10.4.2.Key Region-Specific Dynamics
- 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1.Brazil
  - 10.4.6.2.Argentina
  - 10.4.6.3.Rest of South America
10.5.Asia-Pacific
- 10.5.1.Introduction
- 10.5.2.Key Region-Specific Dynamics
- 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1.China
  - 10.5.6.2.India
  - 10.5.6.3.Japan
  - 10.5.6.4.Australia
  - 10.5.6.5.Rest of Asia-Pacific
10.6.Middle East and Africa
- 10.6.1.Introduction
- 10.6.2.Key Region-Specific Dynamics
- 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

11.Competitive Landscape

11.1.Competitive Scenario
11.2.Market Positioning/Share Analysis
11.3.Mergers and Acquisitions Analysis

12.Company Profiles

12.1.Kemnet International*
- 12.1.1.Company Overview
- 12.1.2.Product Portfolio and Description
- 12.1.3.Financial Overview
- 12.1.4.Key Developments
12.2.Entegris
12.3.Ijin Diamond
12.4.Fujimi Corporation
12.5.Saint-Gobain
12.6.JSR Corporation
12.7.Engis Corporation
12.8.Ferro Corporation
12.9.3M
12.10.DuPont Incorporated

LIST NOT EXHAUSTIVE