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市場調查報告書
商品編碼
1495559

物聯網晶片組市場- 按硬體(處理器、連接IC、感測器、記憶體、邏輯裝置等)、按功耗(小於1 W、1 - 3 W、3 - 5 W、5 - 10 W、超過10 ) W),依最終用途產業,2024 - 2032 年預測

IoT Chipset Market - By Hardware (Processors, Connectivity ICs, Sensors, Memory Devices, Logic Devices, Others), By Power Consumption (Less than 1 W, 1 - 3 W, 3 - 5 W, 5 - 10 W, more than 10 W), By End-use Industry, Forecast 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3個工作天內

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簡介目錄

由於物聯網設備在醫療保健、農業和智慧城市等各個領域的激增,預計 2024 年至 2032 年物聯網晶片組市場規模的複合年成長率將超過 6.4%。半導體技術的突破性發展(例如小型化和能源效率)正在增強物聯網晶片組的效能和功能。例如,2023 年 6 月,高通推出了兩款晶片組 212S 和 9205S,促進透過地球同步衛星實現物聯網的資料鏈路。這兩款晶片組均支援 Qualcomm Aware 雲端平台,可在離網、偏遠地區實現即時資產追蹤和裝置管理。

對物聯網基礎設施和連接解決方案的投資不斷增加,加上雲端運算和邊緣運算平台的日益普及,進一步增強了這些晶片組的吸引力。將人工智慧和機器學習演算法整合到物聯網晶片組中還可以實現高級資料分析和自動化功能,推動物聯網技術在不同應用中的採用。

物聯網晶片組產業分為硬體、功耗、最終用途產業和地區。

基於硬體,由於對處理物聯網設備產生的大量資料的高效能運算能力的需求激增,預計到 2032 年,處理器領域的行業佔有率複合年成長率將超過 6%。半導體技術的重大進步,包括開發強大且節能的處理器,正在增強物聯網晶片組的處理能力。物聯網應用日益複雜以及對即時資料處理的需求不斷成長也刺激了產品需求。

預計從2024 年到2032 年,航空航太和國防最終用途領域的物聯網晶片組市場將以令人稱讚的速度成長。和安全性。對即時資料分析、遠端監控和預測性維護的需求不斷成長,正在推動物聯網晶片組在國防應用中的整合。感測器技術和通訊系統的快速進步也將加速航空航太和國防領域的產品部署。

從地區來看,由於智慧城市計畫、工業自動化和互聯醫療保健解決方案的日益普及,歐洲物聯網晶片組市場預計在 2024 年至 2032 年間將以超過 6.5% 的複合年成長率強勁成長。支持性政府政策的推出正在促進物聯網的部署,例如研發資金和創建物聯網友善的監管框架的措施。領先半導體製造商的存在和該行業的創新也正在推動區域市場的擴張。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商格局
  • 利潤率分析
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 智慧家庭對互聯設備的需求不斷成長
      • 工業自動化中擴大採用物聯網技術
      • 穿戴式裝置日益普及
      • 物流和供應鏈管理中對物聯網解決方案的需求不斷成長
      • 人們對智慧零售解決方案的興趣日益濃厚
    • 產業陷阱與挑戰
      • 能量消耗
      • 成本和複雜性
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按硬體分類,2018 年 - 2032 年

  • 主要趨勢
  • 處理器
  • 連接IC
  • 感應器
  • 儲存裝置
  • 邏輯元件
  • 其他

第 6 章:市場估計與預測:依功耗分類,2018 年 - 2032 年

  • 主要趨勢
  • 小於1W
  • 1 - 3 瓦
  • 3-5瓦
  • 5 - 10 瓦
  • 10W以上

第 7 章:市場估計與預測:依最終用途產業,2018 - 2032 年

  • 主要趨勢
  • 航太與國防
  • 汽車與運輸
  • BFSI
  • 建築自動化
  • 消費性電子產品
  • 衛生保健
  • 零售
  • 製造業
  • 石油和天然氣
  • 其他

第 8 章:市場估計與預測:按地區分類,2018 年 - 2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 沙烏地阿拉伯
    • 南非
    • MEA 的其餘部分

第 9 章:公司簡介

  • Analog Devices Inc.
  • Cypress Semiconductor Corporation
  • Intel Corporation
  • Invensense Inc.
  • Mediatek Inc.
  • Microchip Technology Inc.
  • Nordic Semiconductor ASA
  • NXP Semiconductors NV
  • Qualcomm Technologies Inc.
  • Samsung Electronics Co. Ltd
  • Silicon Laboratories Inc.
  • STMicroelectronics NV
  • Texas Instruments Incorporated
簡介目錄
Product Code: 8727

IoT Chipset Market size is expected to depict over 6.4% CAGR from 2024 to 2032, due to the proliferation of IoT devices across various sectors, including healthcare, agriculture, and smart cities. Groundbreaking developments in semiconductor technology, like miniaturization and energy efficiency are enhancing the performance and capabilities of IoT chipsets. For instance, in June 2023, Qualcomm launched two chipsets, the 212S and the 9205S, facilitating data links via geostationary satellites for IoT. Both chipsets support the Qualcomm Aware cloud platform, enabling real-time asset tracking and device management in off-grid, remote areas.

The increasing investments in IoT infrastructure and connectivity solutions, coupled with the growing adoption of cloud computing and edge computing platforms are further accelerating the appeal of these chipsets. The integration of AI and machine learning algorithms into IoT chipsets is also enabling advanced data analytics and automation capabilities, driving the adoption of IoT technologies across diverse applications.

The IoT chipsets industry is bifurcated into hardware, power consumption, end-use industry, and region.

Based on hardware, the industry share from the processors segment is estimated to witness over 6% CAGR notable rate through 2032, driven by the surging demand for high-performance computing capabilities to process vast amounts of data generated by IoT devices. Significant advancements in semiconductor technology, including the development of powerful and energy-efficient processors are enhancing the processing capabilities of IoT chipsets. The increasing complexity of IoT applications and the rising need for real-time data processing is also spurring the product demand.

IoT chipsets market from the aerospace & defense end-use segment is estimated to rise at commendable rate from 2024 to 2032. This can be attributed to the increasing adoption of IoT technologies for enhancing aircraft performance, maintenance, and security. The ever-increasing demand for real-time data analytics, remote monitoring, and predictive maintenance are driving the integration of IoT chipsets in defense applications. Rapid advancements in sensor technologies and communication systems will also accelerate the product deployment in aerospace and defense sectors.

Regionally, the Europe IoT chipsets market is anticipated to experience robust growth at over 6.5% CAGR between 2024 and 2032, due to the increasing adoption of smart city initiatives, industrial automation, and connected healthcare solutions. The launch of supportive government policies is promoting IoT deployment, such as funding for R&D and initiatives to create IoT-friendly regulatory frameworks. The presence of leading semiconductor manufacturers and innovations in the sector are also driving the regional market expansion.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 IoT chipset industry 360 degree synopsis, 2018 - 2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news & initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Increasing demand for connected devices in smart homes
      • 3.8.1.2 Growing adoption of IoT technology in industrial automation
      • 3.8.1.3 Rising popularity of wearable devices
      • 3.8.1.4 Growing demand for IoT solutions in logistics and supply chain management
      • 3.8.1.5 Growing interest in smart retail solutions
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 Power consumption
      • 3.8.2.2 Cost and complexity
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Hardware, 2018 - 2032 (USD Billion)

  • 5.1 Key trends
  • 5.2 Processors
  • 5.3 Connectivity ICs
  • 5.4 Sensors
  • 5.5 Memory devices
  • 5.6 Logic devices
  • 5.7 Others

Chapter 6 Market Estimates & Forecast, By Power Consumption, 2018 - 2032 (USD Billion)

  • 6.1 Key trends
  • 6.2 Less than 1 W
  • 6.3 1 - 3 W
  • 6.4. 3 - 5 W
  • 6.5. 5 - 10 W
  • 6.6 More than 10 W

Chapter 7 Market Estimates & Forecast, By End-Use Industry, 2018 - 2032 (USD Billion)

  • 7.1 Key trends
  • 7.2 Aerospace & Defense
  • 7.3 Automotive & Transportation
  • 7.4 BFSI
  • 7.5 Building automation
  • 7.6 Consumer electronics
  • 7.7 Healthcare
  • 7.8 Retail
  • 7.9 Manufacturing
  • 7.10 Oil & Gas
  • 7.11 Others

Chapter 8 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Billion)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 UK
    • 8.3.2 Germany
    • 8.3.3 France
    • 8.3.4 Italy
    • 8.3.5 Spain
    • 8.3.6 Russia
    • 8.3.7 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 South Korea
    • 8.4.5 ANZ
    • 8.4.6 Rest of Asia Pacific
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
    • 8.5.3 Rest of Latin America
  • 8.6 MEA
    • 8.6.1 UAE
    • 8.6.2 Saudi Arabia
    • 8.6.3 South Africa
    • 8.6.4 Rest of MEA

Chapter 9 Company Profiles

  • 9.1 Analog Devices Inc.
  • 9.2 Cypress Semiconductor Corporation
  • 9.3 Intel Corporation
  • 9.4 Invensense Inc.
  • 9.5 Mediatek Inc.
  • 9.6 Microchip Technology Inc.
  • 9.7 Nordic Semiconductor ASA
  • 9.8 NXP Semiconductors NV
  • 9.9 Qualcomm Technologies Inc.
  • 9.10 Samsung Electronics Co. Ltd
  • 9.11 Silicon Laboratories Inc.
  • 9.12 STMicroelectronics NV
  • 9.13 Texas Instruments Incorporated