Embedded World 2024：活動報告分析師的要點

本報告總結了 IoT Analytics 分析師團隊從 2024 年嵌入式世界 (EW) 博覽會上收集的主要亮點（媒體分析/關鍵公告）和 17 個詳細見解。 這項見解是基於超過 45 個展位參觀和超過 35 次個人訪談。 四位分析師參加了為期三天的活動。

範例視圖

範例視圖

報告內容：

• 摘要與重點：整體印象、主題焦點、主題重點、主要演示
• 工業運算設備 OEM 比較：AsusIoT、Advantech、Axiomtek、Eurotech、Cincoze、NexAIoT
• 17 個主要趨勢和詳細見解：包括案例研究/證據點和訪談要點
  • 一般人工智慧見解
  • 晶片組級邊緣人工智慧：低功耗晶片組、CPU、GPU、NPU、設備端人工智慧推理流程、邊緣人工智慧推理、NPU 集成
  • 硬體層面的邊緣AI：本地AI模型訓練硬體、AI-in-a-box、GPU與工業PC（IPC）/控制器結合、智慧遠端資訊處理網關、TinyML
  • 連接與相關模組： 5G RedCap、AI IoT 晶片組
  • 其他見解：永續發展、區域網關

上市公司

AMD Analog Devices ASUS IoT Advantech Axiomtek Eurotech NVIDIA Aetina MediaTek Intel Subaru NXP Semiconductors ST Imagination Technologies Alif Semiconductor Infineon Technologies SiFive

Synaptics IBASE Technology TDK Eseye Quectel SG Wireless Sequence Ceva Variscite Avnet STMicroelectronics PUFsecurity InvenSense Qt Innominds Blackberry

目錄

• 1.活動概述
• 2.摘要/主要見解
• 3.主題演講亮點
• 4.重要公告/發佈
• 5.工業電腦OEM廠商比較
• 6.詳細見解
• 7.關於 IoT 分析

A report presenting key highlights and in-depth insights assembled by the IoT Analytics analyst team from one of the world's leading fairs for the embedded community.

SAMPLE VIEW

The "Embedded World 2024 Event Report-Analyst Takeaways" contains a comprehensive summary of the key highlights (media analysis and key announcements) and 17 in-depth insights assembled by the IoT Analytics analyst team from the Embedded World (EW) fair 2024. The insights are based on >45 booth visits and >35 individual interviews. Four analysts were present for a total of three days.

SAMPLE VIEW

This document's main purpose is for our readers to keep up with the latest IoT developments and stay ahead of the tidal changes in current market trends.

The report includes:

• Summary & key highlights (General impressions, topic focus, keynote highlights, key announcements)
• Comparison of industrial compute device OEMs (AsusIoT, Advantech, Axiomtek, Eurotech, Cincoze, NexAIoT)
• 17 key trends and in-depth insights with examples/proof-points and interview highlights.
  • General AI insights
  • Edge AI at the chipset level (low-power chipsets, CPUs, GPUs, NPUs, on-device AI inferencing processes, AI inference at the edge, NPU integration)
  • Edge AI at the hardware level (hardware for on-premises AI model training, AI-in-a-box, GPUs paired with industrial PCs (IPCs)/controllers, intelligent telematics gateways, TinyML)
  • Connectivity and related modules (5G RedCap, AI IoT chipsets)
  • Other insights (sustainability, zonal gateways)

Companies mentioned:

Table of Contents

• 1. Event overview
• 2. Summary and key insights
• 3. Highlights from the keynotes
• 4. Important announcements/launches
• 5. Comparison of industrial compute OEMs
• 6. In-depth insights
• 7. About IoT Analytics