市場調查報告書
商品編碼
1625313
2030 年多媒體 IC 市場預測:按類型、通路類型、應用和地區分類的全球分析Multimedia ICs Market Forecasts to 2030 - Global Analysis By Type (Multimedia Misc and Video ICs), Channel Type (1-16 Channel, 16-32 Channel, 32-64 Channel and Above 64 Channel), Application and by Geography |
根據Stratistics MRC預測,2024年全球多媒體IC市場規模將達417.2億美元,預計2030年將達到882.5億美元,預測期內複合年成長率為13.3%。
多媒體 IC 是專門用於處理和管理音訊、視訊和影像訊號等多媒體資料的半導體元件。編碼、解碼、壓縮和訊號處理只是這些積體電路 (IC) 組合在一起為各種設備提供流暢的多媒體性能的部分功能。多媒體 IC 有助於高畫質視訊播放、提高音訊品質和有效的電源管理。
根據美國國際貿易委員會(USITC)統計,截至2021年,全球約有8,000個實體資料中心,顯著推動了對用於資料處理和儲存的多媒體IC的需求。
家電需求擴大
智慧型手機、平板電腦、智慧型電視、筆記型電腦、遊戲機和穿戴式科技的普及極大地推動了對多媒體 IC 的需求。處理高解析度音訊、視訊和影像內容的現代設備依賴這些整合電路。全球每年售出超過 12 億部智慧型手機,多媒體 IC 透過提供先進的相機功能、引人入勝的遊戲和流暢的串流媒體來改善用戶體驗至關重要。此外,由於 4K 和 8K 電視以及超薄筆記型電腦的使用增加,對能夠管理大量多媒體資料的有效多媒體 IC 的需求也在增加。
設計和製造成本高
多媒體積體電路是利用先進的半導體製造技術、複雜的設計程序以及龐大的研發成本開發的。 7nm和5nm節點等創新技術的設計、測試和製造成本都非常高。此外,將人工智慧功能、音訊管理和視訊處理等多種功能整合到單一晶片中也會增加開發成本。這些高昂的成本是新興企業和小型企業進入的主要障礙,抑制了競爭和創新。
AR/VR 和遊戲應用程式的成長
隨著擴增實境(AR)、虛擬實境(VR)和遊戲應用的快速發展,多媒體IC有很多機會。 AR/VR 設備需要 IC 能夠提供即時視訊處理、3D 渲染和音訊同步,同時保持低延遲和高功效。同樣,遊戲產業對具有強大多媒體積體電路的裝置(例如遊戲機、個人電腦和手持裝置)的需求也在激增。此外,多媒體IC在實現下一代身臨其境型體驗方面具有巨大潛力,特別是在教育、醫療保健和娛樂等領域。
市場競爭加劇
多媒體IC市場的競爭異常激烈,既有許多老牌競爭對手,也有新進業者不斷進入該市場。行業領導者高通、博通、聯發科、英特爾和德克薩斯憑藉其尖端產品控制著大部分市場,使得小型企業和新興企業難以擴大市場佔有率。此外,科技的快速發展迫使企業不斷創新以保持競爭力,從而增加了研發(R&D)成本。競爭對手公司之間爭奪市場佔有率的價格競爭進一步降低了利潤率,尤其是在消費者對價格敏感的行業。
由於供應鏈中斷、工廠關閉以及中國、台灣和韓國等主要半導體中心的製造能力下降,COVID-19 大流行對多媒體積體電路市場造成了嚴重破壞。由於全球晶片短缺,整合電路製造商被迫提高產量,而筆記型電腦、智慧型手機以及用於遠端工作和教育的遊戲機等消費性電子產品的需求不斷成長,加劇了這種短缺。此外,疫情也減緩了汽車和產業部門的發展,最初推遲了產品發布,但加速了數位化和串流媒體服務,推動了對智慧電視、AR/VR設備和視訊會議系統等多媒體IC的需求增加。
視訊IC領域預計在預測期內規模最大
預計多媒體積體電路市場將由視訊IC領域主導。此類別包括專門用於管理視訊處理功能(例如解碼、編碼、縮放和壓縮)的積體電路。許多應用都依賴視訊積體電路 (IC),包括消費性電子產品(智慧型手機、智慧電視、遊戲機)、車載資訊娛樂系統、安全監控和串流服務。此外,對 4K/8K 視訊內容、高清顯示器和視訊會議技術不斷成長的需求也大大增加了對先進視訊積體電路 (IC) 的需求。
預計超過 64 個通路細分市場在預測期內複合年成長率最高
在多媒體IC市場中,64通道及以上細分市場預計將以最高的複合年成長率成長。此細分市場專注於高通道數商務用(IC)。由於對高清多媒體內容的需求不斷成長以及擴增實境(AR)和虛擬實境(VR)等身臨其境型技術的出現,該市場正在不斷擴大。此外,消費性電子和汽車對先進音響系統的需求,例如多區域音訊應用和環繞音響系統,也推動了市場的爆炸性成長。
亞太地區擁有重要的半導體製造商和消費性電子產品的強勁需求,佔據了多媒體積體電路市場的最大佔有率。中國、韓國、日本和台灣等國家擁有強大的電子工業和先進的半導體製造能力,是重要的多媒體積體電路生產中心。由於該地區智慧型手機、智慧型電視、遊戲機和汽車資訊娛樂系統的快速普及,多媒體 IC 的需求量很大。此外,亞太市場的成長也得益於該地區對5G基礎設施、人工智慧和物聯網技術投資的增加。
多媒體 IC 市場預計將以北美地區最高的複合年成長率成長。這一成長是由於擴大使用尖端多媒體技術(例如 5G 連接、人工智慧影像處理以及高清音訊和視訊系統)推動的。該地區智慧家電、無人駕駛汽車以及AR和VR等身臨其境型娛樂技術的快速發展也推動了對多媒體IC的需求。此外,半導體行業主要參與者的存在以及消費者對下一代多媒體設備的高支出也推動了北美市場的快速擴張。
According to Stratistics MRC, the Global Multimedia ICs Market is accounted for $41.72 billion in 2024 and is expected to reach $88.25 billion by 2030 growing at a CAGR of 13.3% during the forecast period. Multimedia Integrated Circuits (ICs) are specialized semiconductor components designed to process and manage multimedia data, including audio, video, and image signals. Encoding, decoding, compression, and signal processing are just a few of the functions that these integrated circuits (ICs) combine to provide smooth multimedia performance across a range of devices. Multimedia integrated circuits (ICs) facilitate high-resolution video playback, improved audio quality, and effective power management.
According to the United States International Trade Commission (USITC), the world had approximately 8,000 physical data centers as of 2021, which significantly drives the demand for multimedia ICs used in data processing and storage.
Growing consumer electronics demand
Multimedia IC demand has been greatly boosted by the growing use of smartphones, tablets, smart TVs, laptops, gaming consoles, and wearable technology. Modern devices that process high-definition audio, video, and image content depend on these integrated circuits. With over 1.2 billion smartphones sold worldwide each year, multimedia integrated circuits (ICs) are essential for enhancing user experience through the provision of sophisticated camera features, engaging gaming, and smooth streaming. Additionally, the demand for effective multimedia ICs that can manage massive volumes of multimedia data is also being fueled by the increasing use of 4K and 8K TVs as well as ultra-thin laptops.
High costs of design and production
Multimedia integrated circuits are developed using sophisticated semiconductor fabrication techniques, intricate design procedures, and substantial R&D expenditures. Innovative technologies such as 7nm and 5nm nodes come with extraordinarily high design, testing, and manufacturing costs. Furthermore, the cost of development goes up when several features, like AI capabilities, audio management, and video processing, are combined into a single chip. These exorbitant expenses present a significant obstacle to entry for startups or smaller businesses, stifling competition and innovation.
Growth of AR/VR and gaming applications
Multimedia ICs have lots of opportunities due to the quick development of augmented reality (AR), virtual reality (VR), and gaming applications. ICs that can provide real-time video processing, 3D rendering, and audio synchronization while preserving low latency and high power efficiency are necessary for AR/VR devices. Similar to this, the gaming industry is seeing a sharp increase in demand for gadgets with potent multimedia integrated circuits, such as gaming consoles, PCs, and handhelds. Moreover, multimedia ICs have a lot of potential to power next-generation immersive experiences, especially in sectors like education, healthcare, and entertainment.
Intensive competition in the market
Due to the large number of well-established competitors and the ongoing influx of new ones, the market for multimedia integrated circuits is extremely competitive. With their cutting-edge products, industry leaders Qualcomm, Broadcom, MediaTek, Intel, and Texas Instruments control a large portion of the market, making it difficult for smaller or more recent firms to increase their market share. Furthermore, because of the speed at which technology is developing, businesses must constantly innovate in order to remain competitive, which drives up research and development (R&D) expenses. Price wars between rivals for market share further reduce profit margins, particularly in areas where consumers are price sensitive.
Due to supply chain disruptions, factory closures, and decreased manufacturing capacity in major semiconductor hubs like China, Taiwan, and South Korea, the COVID-19 pandemic severely disrupted the multimedia integrated circuits market. IC manufacturers were under tremendous pressure to increase production due to the global chip shortage, which was made worse by the growing demand for consumer electronics like laptops, smartphones, and gaming consoles for remote work and education. Moreover, the pandemic slowed down the automotive and industrial sectors and delayed product launches at first, but it also sped up digitization and streaming services, which increased demand for multimedia integrated circuits (ICs) in smart TVs, AR/VR devices, and video conferencing systems.
The Video ICs segment is expected to be the largest during the forecast period
The market for multimedia integrated circuits is expected to be dominated by the video ICs segment. Integrated circuits made especially for managing video processing functions like decoding, encoding, scaling, and compression are included in this category. Numerous applications, such as consumer electronics (smartphones, smart TVs, and game consoles), automotive infotainment systems, security surveillance, and streaming services, depend on video integrated circuits (ICs). Additionally, the demand for advanced video integrated circuits (ICs) has increased dramatically due to the growing demand for 4K/8K video content, high-definition displays, and video conferencing technologies.
The Above 64 Channel segment is expected to have the highest CAGR during the forecast period
In the market for multimedia ICs, the above 64-channel segment is anticipated to grow at the highest CAGR. For cutting-edge applications like 4K/8K video streaming, high-performance audio systems, and multichannel audio-video processing for sectors like broadcasting, home entertainment, and professional audio-video equipment, this segment comprises integrated circuits (ICs) with high channel counts. This market is expanding due to the growing need for high-definition multimedia content and the emergence of immersive technologies like augmented reality (AR) and virtual reality (VR). Furthermore, the demand for sophisticated sound systems in consumer electronics and automobiles, such as multi-zone audio applications and surround sound systems is also fueling the market's explosive growth.
Due to the presence of important semiconductor manufacturers and the strong demand for consumer electronics, the Asia-Pacific region has the largest share of the multimedia integrated circuits market. Because of their strong electronics industries and sophisticated semiconductor manufacturing capabilities, nations like China, South Korea, Japan, and Taiwan are important centers for the production of multimedia integrated circuits. Multimedia ICs are in high demand due to the region's quick adoption of smartphones, smart TVs, gaming consoles, and car infotainment systems. Moreover, the market's growth in APAC is also aided by the region's increasing investments in 5G infrastructure, AI, and IoT technologies.
The multimedia ICs market is anticipated to grow at the highest CAGR in the North American region. The growing use of cutting-edge multimedia technologies like 5G connectivity, AI-driven video processing, and high-definition audio-video systems is what is causing this growth. Multimedia IC demand is also being driven by the region's fast development of smart home appliances, driverless cars, and immersive entertainment technologies like AR and VR. Additionally, the market's rapid expansion in North America is also being aided by the presence of significant players in the semiconductor sector and high consumer spending on next-generation multimedia devices.
Key players in the market
Some of the key players in Multimedia ICs market include FTDI Company, Analog Devices Inc, Infineon, STMicroelectronics, Fairchild Semiconductor, Texas Instruments, ROHM Semiconductor, Maxim Integrated Inc, Pericom, NXP Semiconductors, Cypress Semiconductor, Semtech, Microchip Technology Incorporated, ON Semiconductor and MACOM.
In November 2024, Infineon Technologies AG and multinational electric vehicle (EV) automaker Stellantis N.V. announced that they signed an agreement to work together on the power architecture for Stellantis' EVs. Stellantis and Infineon, the number one automotive microcontroller supplier in the world, have already been collaborating since 2022, with Infineon providing silicon carbide (SiC) semiconductors to the EV manufacturer.
In November 2024, STMicroelectronics announced a 21-year Power Purchase Agreement (PPA) with BKH Solar Sdn Bhd, an entity jointly established by ENGIE Renewable SEA Pte Ltd (ENGIE), a renowned global leader in low-carbon energy and services, and Conextone Energy Sdn Bhd, a rapidly emerging solar energy developer in Malaysia.
In September 2024, Analog Devices, Inc. and Tata Group announced a strategic alliance to explore potential cooperative manufacturing opportunities. Tata Electronics, Tata Motors, and Tejas Networks signed a Memorandum of Understanding (MoU) with ADI to enhance strategic and business cooperation, explore opportunities for semiconductor manufacturing in India, and use ADI's products in Tata applications like electric vehicles and network infrastructure.