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1664983

寬頻電力線通訊組市場報告：2031 年趨勢、預測與競爭分析

Broadband Power Line Communication Chipset Market Report: Trends, Forecast and Competitive Analysis to 2031
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

全球寬頻通訊（PLC）晶片組市場前景光明，在智慧電網、網路、照明、安全和監控、遠距和 M2M（機器對機器）市場都存在機會。預計到 2031 年全球寬頻通訊通訊晶片組市場規模將達到 98 億美元，2025 年至 2031 年的複合年成長率為 14.6%。該市場的主要促進因素是智慧電網技術的日益普及、對高速網際網路的需求不斷成長、政府推動智慧城市市場發展的舉措活性化以及對能源效率的日益關注。

  • Lucintel 預測，獨立式市場在預測期內仍將是最大的技術類別，因為獨立 PLC 晶片組易於安裝，只需要連接到電網，非常適合維修現有住宅和建築物。
  • 根據地區，由於網路接取需求強勁，預計亞太地區在預測期內仍將是最大的地區。

寬頻通訊通訊晶片組市場的策略成長機會

寬頻 PLC 晶片組市場應用領域似乎為廣泛的應用領域提供了眾多策略成長機會。識別這些機會對於相關人員充分利用市場現有趨勢並相應地滿足供應至關重要。

  • 智慧家庭應用：對智慧家庭解決方案的需求不斷成長，為 PLC 晶片組創造了機會。該技術促進了智慧型設備的無縫互動和控制，增強了家庭自動化。
  • 工業自動化：PLC晶片組在工業自動化的應用日益增加。這些晶片組在工業環境中提供有效的通訊和控制，促進自動化系統和智慧製造的發展。
  • 智慧電網整合：針對智慧電網應用而開發的 PLC 晶片組市場正在不斷成長。這些晶片組在能源管理、監控和控制方面提供了新的功能，從而推動了更好、更有效率的能源系統的發展。
  • 農村連通解決方案：PLC 晶片組的使用也越來越多，以改善農村和偏遠地區的連結性。這些解決方案有利於通訊和寬頻存取基礎設施有限的地區實現發展。
  • 能源管理系統：能源管理系統可以是 PLC 晶片組。這些技術使得對能源消耗的觀察和控制更加容易，從而能夠實現永續性和效率目標。

智慧家庭、工業自動化、智慧電網整合等應用領域的不斷擴大，為寬頻PLC晶片組市場創造了策略成長機會。農村連通性和能源管理策略也在影響市場成長並推動創新。

寬頻電力線通訊組市場促進因素與挑戰

寬頻 PLC 晶片組市場受到技術創新、經濟狀況和監管因素等多種因素的影響。了解這些因素對於有效的市場管理至關重要。

推動寬頻電力線通訊組市場的因素如下：

  • 技術進步：PLC晶片組技術的不斷改進，提高了其整合度、速度和效能。新技術有助於創造更有效、更可靠的通訊解決方案。
  • 對高速網路的需求不斷增加：隨著越來越多的人需要更快的寬頻連接，對 PLC 晶片組的需求也在增加。進階應用需要更快的資料傳輸速度和增強的網路技術。
  • 智慧電網和智慧家庭解決方案的使用日益增多：智慧電網和智慧家庭技術的部署將推動 PLC 晶片組的採用。單純的經營模式限制了開發後的能源協同效應和整合。
  • 政府推動寬頻存取的措施：政府為擴大寬頻存取而採取的優惠政策和措施將推動對 PLC 晶片組的需求。對通訊技術和基礎設施升級的投資將增加市場機會。
  • 重視能源效率：隨著對節能技術的重視，PLC晶片組正朝著更低功耗的方向發展。這一發展符合全球節能目標並為市場帶來了利益。

寬頻通訊通訊晶片組市場挑戰包括：

  • 初始成本高：PLC 晶片組的初始成本高是其廣泛採用的障礙之一，尤其是在小規模 PLC 應用中。成本問題限制了先進通訊技術的可負擔性和可用性。
  • 複雜的整合要求：在現有框架內採用 PLC 晶片組可能會帶來許多挑戰。技術困難、相容性問題、實施挑戰和採用障礙都可能減慢或阻礙部署。
  • 監管合規問題：雖然存在許多通訊技術，但對法律和標準的追求可能會限制許多公司的成長潛力。合規成本和監管變化影響市場平等和整合。
  • 來自替代技術的競爭：使用其他通訊方法（例如無線和光纖）往往會限制 PLC 晶片組的採用。區分並有效行銷這些產品的優勢對於在市場上取得成功至關重要。
  • 技術限制和干擾：技術限制和與其他通訊通道干擾的可能性會影響 PLC 晶片組的功能。為了提供有效的通訊系統，必須解決這些問題。

雖然寬頻通訊通訊晶片組市場受益於技術的不斷發展和用戶對電子活動日益成長的需求，高成本和監管政策等限制因素限制了其成長。管理所有這些因素對於發揮成長潛力和克服市場挑戰至關重要。

目錄

第1章執行摘要

第 2 章全球寬頻通訊通訊晶片組市場：市場動態

  • 簡介、背景和分類
  • 供應鏈
  • 產業促進因素與挑戰

第 3 章 市場趨勢與預測分析（2019-2031）

  • 宏觀經濟趨勢（2019-2024）與預測（2025-2031）
  • 全球寬頻電力線通訊組市場趨勢（2019-2024）及預測（2025-2031）
  • 全球寬頻通訊通訊晶片組市場（依規格）
    • 家插AV
    • HomePlug AV1
    • HomePlug AV2
    • IEEE 1901
    • IEEE 1905.1
    • G.Hn
    • HomePNA
    • 其他
  • 全球寬頻電力線通訊組市場（按技術）
    • 獨立
    • 混合
    • Wi-Fi
    • Zigbee
    • Ethernet
    • 其他
  • 全球寬頻電力線通訊組市場（按應用）
    • 智慧電網
    • 聯網
    • 照明設備
    • 安全與監控
    • 遠距
    • M2M (Machine to Machine)
    • 其他

第 4 章區域市場趨勢與預測分析（2019-2031 年）

  • 全球寬頻電力線通訊組市場（按區域）
  • 北美寬頻通訊線通訊晶片組市場
  • 歐洲寬頻通訊通訊晶片組市場
  • 亞太地區寬頻電力線通訊組市場
  • 世界其他地區的寬頻通訊通訊晶片組市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球寬頻電力線通訊組市場成長機會（依標準）
    • 全球寬頻電力線通訊組市場成長機會（按技術）
    • 全球寬頻電力線通訊組市場成長機會（按應用）
    • 全球寬頻電力線通訊組市場成長機會（按地區）
  • 全球寬頻通訊通訊晶片組市場的新趨勢
  • 戰略分析
    • 新產品開發
    • 全球寬頻通訊通訊晶片組市場產能擴張
    • 全球寬頻通訊通訊晶片組市場的企業合併
    • 認證和許可

第7章主要企業簡介

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies
簡介目錄

The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets. The global broadband power line communication chipset market is expected to reach an estimated $9.8 billion by 2031 with a CAGR of 14.6% from 2025 to 2031. The major drivers for this market are the rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

  • Lucintel forecasts that, within the technology category, the standalone segment will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.
  • In terms of region, APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

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Emerging Trends in the Broadband Power Line Communication Chipset Market

Emerging trends in the broadband PLC chipset market are transforming this industry by embracing new technologies and applications. These trends are affecting the way PLC solutions are developed and deployed in many parts of the world.

  • Integration with Smart Grid Technologies: PLC chipsets are increasingly coupled with smart grids for enhanced energy management and efficiency. This integration enhances real-time monitoring and control, improving the reliability of the grid and lowering energy costs.
  • Advancements in Data Transmission Speeds: Improving data transmission speed using new PLC chipsets is gaining popularity. Newer and higher speeds help develop high-bandwidth applications and dependable communication networks, which are essential due to the rising need for fast internet access.
  • Expansion into IoT Applications: The PLC chipsets are utilized as elements to enhance the Internet of Things (IoT). This trend helps meet the increasing demand for connected and smart systems that aid in communication and control in an IoT ecosystem.
  • Development of Cost-Effective Solutions: In the market, the trend of developing affordable PLC chipsets is becoming more common. Due to the reduction in production costs, these technologies are spreading rapidly, especially in developing countries with a high demand for broadband.
  • Focus on Energy Efficiency: The new PLC chipsets focus on energy efficiency in design and use, thereby reducing power consumption and increasing performance simultaneously. This aligns with the global appetite for sustainability and will help bring about eco-friendlier communication technologies.

These trends are revolutionizing the broadband PLC chipset market by facilitating new levels of integration with smart technologies, increasing data transmission speeds, and opening new markets. The emphasis on affordability and energy efficiency will foster wider acceptance, propelling the advancement of the communication solutions market.

Recent Developments in the Broadband Power Line Communication Chipset Market

The broadband PLC chipset has undergone numerous key developments that influence its future and the market's trajectory. These improvements have aimed at enhancing technology performance, widening its use, and satisfying market needs.

  • Launch of High-Speed PLC Chipsets: The last decade has witnessed the introduction of next-generation high-speed PLC chipsets, which have made it possible to transfer data at much higher rates, consequently improving network efficiency. Such chipsets are critical in high-bandwidth applications and enhance overall communication efficiency.
  • Integration with Smart Grid Technologies: Smart grid planning solutions have recently been identified as one of the new applications of PLC chipsets. This integration improves energy management and the performance of advanced grid management and control systems.
  • Improvements in Energy Efficiency: New PLC chipsets come with enhanced energy efficiency features, improving overall performance with low power consumption. This advancement dovetails with sustainability efforts and the quest to reduce energy consumption globally.
  • Growth in Industrial Sector Applications: More PLC chipsets are being adopted in the industrial sector. These developments cater to the growing demand for reliable and high-speed communication systems for industrial automation and control applications.
  • Reduction of Costs: Technologies and materials emerging from current manufacturing systems will help reduce the price of PLC chipsets. This price reduction enables broader adoption of these technologies across more applications and markets.

These developments are positively impacting the broadband PLC chipset market by enhancing technology performance, increasing the number of applications, and reducing costs. Integration with smart grids, improved energy efficiency, and cost reductions are enhancing growth and innovation within the market.

Strategic Growth Opportunities for Broadband Power Line Communication Chipset Market

The application of the broadband PLC chipset market appears to provide numerous strategic growth opportunities across a wide range of applications. Identifying these opportunities is crucial for stakeholders to maximize available trends in the market and meet supply accordingly.

  • Smart Home Applications: The increasing demand for smart home solutions creates potential for PLC chipsets. The technology promotes seamless interaction and control of smart devices, thereby enhancing home automation.
  • Industrial Automation: There is a rise in the application of PLC chipsets in industrial automation. These chipsets provide effective communication and control in industrial environments, thereby enhancing the growth of automated systems and smart manufacturing.
  • Smart Grid Integration: There is a market for further development of PLC chipsets for applications in smart grids. These chipsets offer new features in energy management, monitoring, and control, leading to the evolution of better and more efficient energy systems.
  • Rural Connectivity Solutions: There is also an increase in the use of PLC chipsets for improved rural and remote area connectivity. These solutions enable the development of communication and broadband access infrastructure in areas with limited provision.
  • Energy Management Systems: There is potential for PLC chipsets in energy management systems. These technologies enable enhanced observation and control of energy consumption, resulting in the achievement of sustainability and efficiency goals.

The expanding application of smart homes, industrial automation, and smart grid integration represents strategic growth opportunities in the broadband PLC chipset market. Strategies for rural connectivity and energy management are also influencing market growth and fostering innovation.

Broadband Power Line Communication Chipset Market Driver and Challenges

The broadband PLC chipset market is influenced by various factors, including but not limited to technological innovations, economic conditions, and regulatory factors. Understanding these factors is essential for effective market management.

The factors driving the broadband power line communication chipset market include:

  • Technological Advancement: The constant improvement of PLC chipset technology enhances its integration, speed, and performance. New technologies help create more effective and reliable communication solutions.
  • Growing Demand for High-Speed Internet: As more people require faster broadband connectivity, the demand for PLC chipsets increases. Advanced applications require greater data transmission rates and enhanced networking technologies.
  • Increase in Usage of Smart Grid and Smart Home Solutions: The deployment of smart grid and smart home technologies drives the adoption of PLC chipsets. Purely business models would limit energy synergies and integration post-development.
  • Government Efforts to Promote Broadband Access: Favorable government policies and measures aimed at increasing broadband access create demand for PLC chipsets. Investments in communication technologies and infrastructure upgrades enhance opportunities in the market.
  • Focus on Energy Efficiency: The emphasis on energy-saving technologies drives the evolution of PLC chipsets towards lower power consumption. This development aligns with global conservation goals and benefits the market.

Challenges in the broadband power line communication chipset market are:

  • High Initial Costs: The high initial cost of PLC chipsets constitutes one of the barriers to adoption, especially for small-scale PLC applications. Cost issues limit the affordability and availability of advanced communication technologies.
  • Complex Integration Requirements: Numerous challenges may arise when adopting PLC chipsets within existing frameworks. Technical difficulties, compatibility issues, implementation challenges, and adoption hurdles can all slow down or impede deployment.
  • Regulatory Compliance Issues: While many communication technologies exist, pursuing laws and standards can limit the growth potential of many companies. Compliance costs and regulatory changes affect the market's leveling and enhancement.
  • Competition from Alternative Technologies: The use of other communication methods, such as wireless and fiber optics, tends to limit the adoption of PLC chipsets. Effectively marketing these products by differentiating their advantages is essential for success in the market.
  • Technical Limitations and Interference: Technical limitations and potential interference with other communication channels can impact the functionality of PLC chipsets. These issues must be addressed to provide effective communication systems.

The broadband power line communication chipset market benefits from ongoing technological development and an increased need for e-activities among users, while constraints such as high costs and regulatory policies restrict growth. Managing all these factors is crucial to taking advantage of growth potential and overcoming market challenges.

List of Broadband Power Line Communication Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. through these strategies broadband power line communication chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the broadband power line communication chipset companies profiled in this report include-

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Broadband Power Line Communication Chipset by Segment

The study includes a forecast for the global broadband power line communication chipset market by standards, technology, application, and region.

Broadband Power Line Communication Chipset Market by Standards [Analysis by Value from 2019 to 2031]:

  • Homeplug AV
  • HomePlug AV1
  • HomePlug AV2
  • IEEE 1901
  • IEEE 1905.1
  • G.Hn
  • HomePNA
  • Others

Broadband Power Line Communication Chipset Market by Technology [Analysis by Value from 2019 to 2031]:

  • Standalone
  • Hybrid
  • Wi-Fi
  • Zigbee
  • Ethernet
  • Others

Broadband Power Line Communication Chipset Market by Application [Analysis by Value from 2019 to 2031]:

  • Smart Grids
  • Networking
  • Lighting
  • Security & Surveillance
  • Long Haul
  • Machine to Machine
  • Others

Broadband Power Line Communication Chipset Market by Region [Analysis by Value from 2019 to 2031]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Broadband Power Line Communication Chipset Market

Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. The following highlights recent developments by major broadband power line communication chipset producers in key regions: the USA, China, India, Japan, and Germany.

  • United States: Progress has been made in developing high-speed PLC chipsets in the U.S., which are faster and more reliable for data transmission. There is an emphasis on integrating these chipsets with smart grids to improve energy management and connectivity.
  • China: The PLC chipset market in China is set to witness significant growth, with a strong focus on smart home and industrial application expansion. The country is building high-performance PLC chipsets suitable for large infrastructure and smart city projects.
  • Germany: Camp ICC is enhancing its PLC technology by integrating chipsets with IoT solutions for applications in smart buildings and industrial automation. The focus is on improving energy efficiency and network stability to achieve the country's climate goals.
  • India: In India, the embedded PLC chip market is growing, focusing on developing affordable solutions for extending rural broadband. The emphasis is on inexpensive chipsets that will improve broadband penetration in rural areas and support the country's digital development.
  • Japan: Japan is introducing unique innovations with new designs of PLC chipsets that utilize high bandwidth for data transmission while connecting to improved energy control systems. Developments are targeted at enhancing efficiency and reliability to support high-end technological systems in Japan.

Features of the Global Broadband Power Line Communication Chipset Market

Market Size Estimates: Broadband power line communication chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Broadband power line communication chipset market size by various segments, such as by standards, technology, application, and region in terms of value ($B).

Regional Analysis: Broadband power line communication chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different standards, technology, application, and regions for the broadband power line communication chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the broadband power line communication chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the broadband power line communication chipset market by standards (homeplug AV, homeplug AV1, homeplug AV2, IEEE 1901, IEEE 1905.1, G.Hn, homePNA, and others), technology (standalone, hybrid, Wi-Fi, ZigBee, ethernet, and others), application (smart grids, networking, lighting, security & surveillance, long haul, machine to machine, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Broadband Power Line Communication Chipset Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

  • 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
  • 3.2. Global Broadband Power Line Communication Chipset Market Trends (2019-2024) and Forecast (2025-2031)
  • 3.3: Global Broadband Power Line Communication Chipset Market by Standards
    • 3.3.1: Homeplug AV
    • 3.3.2: HomePlug AV1
    • 3.3.3: HomePlug AV2
    • 3.3.4: IEEE 1901
    • 3.3.5: IEEE 1905.1
    • 3.3.6: G.Hn
    • 3.3.7: HomePNA
    • 3.3.8: Others
  • 3.4: Global Broadband Power Line Communication Chipset Market by Technology
    • 3.4.1: Standalone
    • 3.4.2: Hybrid
    • 3.4.3: Wi-Fi
    • 3.4.4: Zigbee
    • 3.4.5: Ethernet
    • 3.4.6: Others
  • 3.4: Global Broadband Power Line Communication Chipset Market by Application
    • 3.4.1: Smart Grids
    • 3.4.2: Networking
    • 3.4.3: Lighting
    • 3.4.4: Security & Surveillance
    • 3.4.5: Long Haul
    • 3.4.6: Machine to Machine
    • 3.4.7: Others

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

  • 4.1: Global Broadband Power Line Communication Chipset Market by Region
  • 4.2: North American Broadband Power Line Communication Chipset Market
    • 4.2.1: North American Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.2.2: North American Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.3: European Broadband Power Line Communication Chipset Market
    • 4.3.1: European Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.3.2: European Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.4: APAC Broadband Power Line Communication Chipset Market
    • 4.4.1: APAC Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.4.2: APAC Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.5: ROW Broadband Power Line Communication Chipset Market
    • 4.5.1: ROW Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.5.2: ROW Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Standards
    • 6.1.2: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Technology
    • 6.1.3: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Application
    • 6.1.4: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Region
  • 6.2: Emerging Trends in the Global Broadband Power Line Communication Chipset Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Broadband Power Line Communication Chipset Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Broadband Power Line Communication Chipset Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: Intel
  • 7.3: Marvell Technology
  • 7.4: Maxim Integrated
  • 7.5: Megachips
  • 7.6: Qualcomm
  • 7.7: Semtech
  • 7.8: ST Microelectronics
  • 7.9: Vango Technologies
  • 7.10: Yitran Technologies