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市場調查報告書
商品編碼
1517530

抗輻射電子市場 - 按組件、製造技術、類型、應用、預測 2024 - 2032 年

Radiation Hardened Electronics Market - By Component, By Manufacturing Technique, By Type, By Application, Forecast 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3個工作天內

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簡介目錄

由於衛星和太空探索任務的增加,從 2024 年到 2032 年,抗輻射電子市場的複合年成長率將超過 5%。根據世界經濟論壇稱,政府將在2022年將太空探索支出增加90億美元,佔國防支出的45%,高於去年的41%。隨著航太機構和私人公司將業務擴展到地球大氣層之外,對能夠承受太空輻射嚴酷的電子元件的需求不斷增加。

抗輻射電子元件在確保太空船、衛星和深空偵測器關鍵系統的可靠性和使用壽命方面發揮關鍵作用。從通訊衛星到探索遙遠行星的科學儀器,對靈活電子解決方案的需求正在推動抗輻射技術的創新和投資。

增加衛星在通訊和科學用途的使用是一個重要的市場趨勢。隨著對衛星通訊和研究的需求不斷成長,對能夠承受太空惡劣輻射的電子元件的需求也在不斷成長。這一趨勢鼓勵了抗輻射電子設備的開發和部署,以確保衛星系統的可靠性和使用壽命。隨著衛星技術的進步實現了更複雜的任務和應用,抗輻射電子市場對滿足商業和科學領域衛星部署需求的靈活電子解決方案的需求不斷增加。

抗輻射電子產業根據組件、製造技術、類型、應用和地區進行分類。

到 2032 年,抗輻射設計領域將快速成長,因為 RHBD 由於設計原理和材料選擇而提供了更好的抗輻射能力。透過在設計階段將耐輻射功能融入電子元件的架構中,RHBD 技術可以減少輻射引起的故障,並確保在惡劣環境中的持續性能。從積體電路到微處理器,RHBD 方法使電子系統的生產能夠承受太空探索、國防行動和核子應用的嚴酷考驗。

到 2032 年,軍事和國防領域將繼續穩步成長,因為從通訊系統和雷達設備到飛彈導引系統和無人機 (UAV),軍事行動嚴重依賴能夠在惡劣環境中承受輻射的電子元件。隨著國防機構優先考慮關鍵的可靠性和耐用性,軍事應用中對抗輻射電子產品的需求正在顯著增加,推動了國防工業的創新和技術進步。

在技​​術專業知識、戰略合作夥伴關係和監管舉措融合的推動下,到 2032 年,歐洲抗輻射電子產業將獲得顯著的實力。由於歐洲在太空探索、國防技術和核子研究方面發揮重要作用,該地區為抗輻射電子產品的開發和部署提供了肥沃的土壤。法國、德國和英國等國家在輻射防護技術方面處於領先地位,利用其研究能力和工業基礎設施來開拓電氣彈性。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商矩陣
  • 利潤率分析
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 增加太空探索任務和衛星部署
      • 軍事和國防應用的需求
      • 核電廠和反應爐的使用不斷增加
      • 航空航太業的擴張
      • 惡劣環境下對可靠通訊系統的需求不斷成長
    • 產業陷阱與挑戰
      • 開發和製造成本高
      • 專用組件的可用性有限
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按組成部分,2018 年 - 2032 年

  • 主要趨勢
  • 積體電路 (IC)
  • 處理器和控制器
  • 能源管理
  • 記憶

第 6 章:市場估計與預測:按製造技術,2018 - 2032 年

  • 主要趨勢
  • 輻射強化設計 (RHBD)
  • 依製程進行輻射硬化 (RHBP)

第 7 章:市場估計與預測:按類型,2018 - 2032

  • 主要趨勢
  • 客製化
  • 商業現貨 (COTS)

第 8 章:市場估計與預測:按應用分類,2018 年 - 2032 年

  • 主要趨勢
  • 航太
  • 醫療的
  • 軍事與國防
  • 核電廠
  • 其他

第 9 章:市場估計與預測:按地區分類,2018 年 - 2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 南非
    • 沙烏地阿拉伯
    • MEA 的其餘部分

第 10 章:公司簡介

  • Advanced Micro Devices, Inc.
  • Analog Devices, Inc.
  • BAE Systems
  • Cobham Limited
  • Everspin Technologies Inc.
  • GSI Technology, Inc.
  • Honeywell International Inc.
  • Infineon Technologies AG
  • Mercury Systems, Inc.
  • Microchip Technology Inc.
  • Micropac Industries, Inc.
  • PCB Piezotronics, Inc.
  • Renesas Electronics Corporation
  • Semiconductor Components Industries, LLC
  • Space Micro, Inc.
  • STMicroelectronics
  • Teledyne Technologies Inc.
  • Texas Instruments Incorporated
  • Triad Semiconductor
  • TTM Technologies, Inc.
簡介目錄
Product Code: 8918

Radiation Hardened Electronics Market will witness over 5% CAGR from 2024 to 2032 due to increasing satellites and space exploration missions. According to the World Economic Forum, the government will increase spending on space exploration by $9 billion in 2022, accounting for 45 percent of defense spending, up from 41% last year. As space agencies and private companies expand their presence beyond Earth's atmosphere, demand for electronic components that can withstand the rigors of space radiation is increasing.

Radiation hardened electronics play a key role in ensuring the reliability and longevity of critical systems on spacecraft, satellites, and deep space probes. From communications satellites to scientific instruments exploring distant planets, the need for flexible electronics solutions is driving innovation and investment in radiation-hardening technologies.

Increasing the use of satellites for communication and scientific purposes is an important market trend. As the demand for satellite-based communications and research grows, so does the need for electronic components that can withstand the harsh radiation of space. This trend encourages the development and deployment of radiation hardened electronics that ensure the reliability and longevity of satellite systems. With advances in satellite technology enabling more complex missions and applications, the radiation hardened electronics market has seen increased demand for flexible electronics solutions tailored to the needs of satellite deployments in the commercial and scientific sectors.

The Radiation Hardened Electronics industry is classified based on component, manufacturing technology, type, application, and region.

The radiation hardened by design segment will grow rapidly through 2032, as RHBD offers better radiation resistance due to design principles and material selection. By incorporating radiation-tolerant features into the architecture of electronic components at the design stage, RHBD technologies reduce exposure to radiation-induced failures and ensure continuous performance in harsh environments. From integrated circuits to microprocessors, RHBD methodologies enable the production of electronic systems that can withstand the rigors of space exploration, defense operations, and nuclear applications.

The military and defense segment will continue to grow at a steady pace through 2032, as, from communication systems and radar equipment to missile guidance systems and unmanned aerial vehicles (UAVs), military operations rely heavily on electronic components that can withstand radiation in hostile environments. As defense agencies prioritize critical reliability and durability, the demand for radiation hardened electronics in military applications is increasing significantly, driving innovation and technological advancement in the defense industry.

Europe Radiation Hardened Electronics industry will gain significant strength through 2032, driven by the convergence of technological expertise, strategic partnerships, and regulatory initiatives. With Europe's important role in space exploration, defense technology, and nuclear research, the region offers fertile ground for the development and deployment of radiation hardened electronics. Countries such as France, Germany, and the UK are leading innovations in radiation protection technologies, leveraging their research capacity and industrial infrastructure to pioneer electrical flexibility.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Radiation hardened electronics industry 360 degree synopsis, 2018 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Increasing space exploration missions and satellite deployments
      • 3.8.1.2 Demand from military and defense applications
      • 3.8.1.3 Rising use in nuclear power plants and reactors
      • 3.8.1.4 Expansion of the aerospace and aviation industries
      • 3.8.1.5 Growing need for reliable communication systems in harsh environments
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 High development and manufacturing costs
      • 3.8.2.2 Limited availability of specialized components
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Component, 2018 - 2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Integrated circuits (ICs)
  • 5.3 Processors & controllers
  • 5.4 Power management
  • 5.5 Memory

Chapter 6 Market Estimates & Forecast, By Manufacturing Technique, 2018 - 2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Radiation hardening by design (RHBD)
  • 6.3 Radiation hardening by process (RHBP)

Chapter 7 Market Estimates & Forecast, By Type, 2018 - 2032 (USD Million)

  • 7.1 Key trends
  • 7.2 Custom made
  • 7.3 Commercial-off-the-shelf (COTS)

Chapter 8 Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Aerospace
  • 8.3 Medical
  • 8.4 Military & defense
  • 8.5 Nuclear power plant
  • 8.6 Others

Chapter 9 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 South Africa
    • 9.6.3 Saudi Arabia
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 Advanced Micro Devices, Inc.
  • 10.2 Analog Devices, Inc.
  • 10.3 BAE Systems
  • 10.4 Cobham Limited
  • 10.5 Everspin Technologies Inc.
  • 10.6 GSI Technology, Inc.
  • 10.7 Honeywell International Inc.
  • 10.8 Infineon Technologies AG
  • 10.9 Mercury Systems, Inc.
  • 10.10 Microchip Technology Inc.
  • 10.11 Micropac Industries, Inc.
  • 10.12 PCB Piezotronics, Inc.
  • 10.13 Renesas Electronics Corporation
  • 10.14 Semiconductor Components Industries, LLC
  • 10.15 Space Micro, Inc.
  • 10.16 STMicroelectronics
  • 10.17 Teledyne Technologies Inc.
  • 10.18 Texas Instruments Incorporated
  • 10.19 Triad Semiconductor
  • 10.20 TTM Technologies, Inc.