Product Code: GVR-4-68040-272-5
Radiation Hardened Electronics Market Growth & Trends:
The global radiation hardened electronics market size is anticipated to reach USD 2.42 billion by 2030, growing at a CAGR of 5.7% from 2024 to 2030, according to a new report by Grand View Research, Inc. This growth is primarily driven by the increasing demand for electronics globally, especially in sectors where dependability and safety are critical. The ongoing research and development efforts in material science, design techniques, and testing methodologies lead to enhanced performance, reliability, and affordability of radiation-hardened (rad-hard) electronics.
In space applications, rad-hard chips are crucial due to the harsh environment, including exposure to high levels of damaging radiation. New generations of radiation-hardened electronics are expected to revolutionize space-based devices by enabling onboard processing capabilities that enhance spacecraft autonomy, artificial intelligence/machine learning applications, and overall reliability.
Furthermore, in the nuclear energy sector, rad-hard chips are vital in making modern atomic power plants safer and more efficient. As the focus shifts towards fusion energy as a cleaner and more powerful alternative to traditional fission reactors, the demand for radiation-hardened electronics is expected to increase over the forecast period.
Radiation Hardened Electronics Market Report Highlights:
- Based on component, the power management segment accounted for the largest revenue share of 29.2% in 2023. Power management is essential for ensuring the reliable operation of electronic systems in environments with high radiation levels
- Based on manufacturing technique, the Radiation Hardening by Device (RHBD) segment held the largest revenue share in 2023. This component plays a crucial role in ensuring the reliability and functionality of electronic systems in radiation-prone environments like space by implementing specific design strategies to mitigate the effects of radiation on electronic components
- Based on product type, the custom-made segment is anticipated to register the fastest CAGR from 2024 to 2030. They are tailored to resist various types of radiation and prevent physical damage, ensuring reliable performance over an extended period.
- Based on the application, the space sector accounted for the largest market revenue share in 2023. The radiation sources such as cosmic rays, nuclear explosions, and residual radiation from isotopes pose significant challenges to electronic systems, making radiation hardening crucial for satellites, spacecraft, and military aircraft.
- In April 2022, Infineon Technologies AG introduced the first radiation-hardened, serial interface Ferroelectric RAM (F-RAM) for space applications, offering exceptional reliability, data retention, and energy efficiency compared to non-volatile EEPROM and serial NOR Flash devices in extreme environments.
Table of Contents
Chapter 1. Methodology and Scope
- 1.1. Market Segmentation and Scope
- 1.2. Market Definitions
- 1.3. Research Methodology
- 1.3.1. Information Procurement
- 1.3.2. Information or Data Analysis
- 1.3.3. Market Formulation & Data Visualization
- 1.3.4. Data Validation & Publishing
- 1.4. Research Scope and Assumptions
- 1.4.1. List of Data Sources
Chapter 2. Executive Summary
- 2.1. Market Outlook
- 2.2. Segment Outlook
- 2.3. Competitive Insights
Chapter 3. Radiation-Hardened Electronics Market Variables, Trends, & Scope
- 3.1. Market Introduction/Lineage Outlook
- 3.2. Market Size and Growth Prospects (USD Million)
- 3.3. Industry Value Chain Analysis
- 3.4. Market Dynamics
- 3.4.1. Market Drivers Analysis
- 3.4.1.1. Economical parallel processing set-up
- 3.4.1.2. Potential R&D in Radiation-Hardened Electronics systems
- 3.4.2. Market Restraints Analysis
- 3.4.2.1. Lack of skilled workforce and high implementation cost
- 3.4.2.2. Vast demonstrative data requirement
- 3.4.3. Industry Opportunities
- 3.4.4. Industry Challenges
- 3.5. Radiation-Hardened Electronics Market Analysis Tools
- 3.5.1. Porter's Analysis
- 3.5.1.1. Bargaining power of the suppliers
- 3.5.1.2. Bargaining power of the buyers
- 3.5.1.3. Threats of substitution
- 3.5.1.4. Threats from new entrants
- 3.5.1.5. Competitive rivalry
- 3.5.2. PESTEL Analysis
- 3.5.2.1. Political landscape
- 3.5.2.2. Economic and Social landscape
- 3.5.2.3. Technological landscape
- 3.5.2.4. Environmental landscape
- 3.5.2.5. Legal landscape
Chapter 4. Radiation-Hardened Electronics Market: Component Estimates & Trend Analysis
- 4.1. Segment Dashboard
- 4.2. Radiation-Hardened Electronics Market: Component Movement Analysis, 2023 & 2030 (USD Million)
- 4.3. Mixed Signal ICs
- 4.3.1. Mixed Signal ICs Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 4.4. Processors & Controllers
- 4.4.1. Processors & Controllers Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 4.5. Memory
- 4.5.1. Memory Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 4.6. Power Management
- 4.6.1. Power Management Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
Chapter 5. Radiation-Hardened Electronics Market: Manufacturing Technique Estimates & Trend Analysis
- 5.1. Segment Dashboard
- 5.2. Radiation-Hardened Electronics Market: Manufacturing Technique Movement Analysis, 2023 & 2030 (USD Million)
- 5.3. Radiation Hardening by Design (RHBD)
- 5.3.1. Radiation Hardening by Design (RHBD) Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 5.4. Radiation Hardening by Process (RHBP)
- 5.4.1. Radiation Hardening by Process (RHBP) Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
Chapter 6. Radiation-Hardened Electronics Market: Product Type Estimates & Trend Analysis
- 6.1. Segment Dashboard
- 6.2. Radiation-Hardened Electronics Market: Product Type Movement Analysis, 2023 & 2030 (USD Million)
- 6.3. Commercial off-the-shelf
- 6.3.1. Commercial off-the-shelf Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 6.4. Custom Made
- 6.4.1. Custom Made Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
Chapter 7. Radiation-Hardened Electronics Market: Application Estimates & Trend Analysis
- 7.1. Segment Dashboard
- 7.2. Radiation-Hardened Electronics Market: Application Movement Analysis, 2023 & 2030 (USD Million)
- 7.3. Aerospace & Defense
- 7.3.1. Aerospace & Defense Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 7.4. Medical
- 7.4.1. Medical Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 7.5. Nuclear Power Plants
- 7.5.1. Nuclear Power Plants Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 7.6. Space
- 7.6.1. Space Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
- 7.7. Others
- 7.7.1. Others Market Revenue Estimates and Forecasts, 2017 - 2030 (USD Million)
Chapter 8. Radiation-Hardened Electronics Market: Regional Estimates & Trend Analysis
- 8.1. Radiation-Hardened Electronics Market Share, By Region, 2023 & 2030 (USD Million)
- 8.2. North America
- 8.2.1. North America Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.2.2. U.S.
- 8.2.2.1. U.S. Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.2.3. Canada
- 8.2.3.1. Canada Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.3. Europe
- 8.3.1. Europe Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.3.2. UK.
- 8.3.2.1. UK Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.3.3. Germany
- 8.3.3.1. Germany Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.3.4. France
- 8.3.4.1. France Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.4. Asia Pacific
- 8.4.1. Asia Pacific Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.4.2. China
- 8.4.2.1. China Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.4.3. Japan
- 8.4.3.1. Japan Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.4.4. India
- 8.4.4.1. India Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.4.5. South Korea
- 8.4.5.1. South Korea Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.4.6. Australia
- 8.4.6.1. Australia Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.5. Latin America
- 8.5.1. Latin America Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.5.2. Brazil
- 8.5.2.1. Brazil Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.5.3. Mexico
- 8.5.3.1. Mexico Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.6. Middle East and Africa
- 8.6.1. Middle East and Africa Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.6.2. Saudi Arabia
- 8.6.2.1. Saudi Arabia Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.6.3. UAE
- 8.6.3.1. UAE Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
- 8.6.4. South Africa
- 8.6.4.1. South Africa Radiation-Hardened Electronics Market Estimates and Forecasts, 2017 - 2030 (USD Million)
Chapter 9. Competitive Landscape
- 9.1. Recent Developments & Impact Analysis by Key Market Participants
- 9.2. Company Categorization
- 9.3. Company Market Positioning
- 9.4. Company Heat Map Analysis
- 9.5. Strategy Mapping
- 9.5.1. Expansion
- 9.5.2. Mergers & Acquisition
- 9.5.3. Partnerships & Collaborations
- 9.5.4. New Product Launches
- 9.5.5. Research And Development
- 9.6. Company Profiles
- 9.6.1. Advanced Micro Devices, Inc.
- 9.6.1.1. Participant's Overview
- 9.6.1.2. Financial Performance
- 9.6.1.3. Product Benchmarking
- 9.6.1.4. Recent Developments/ Strategic Initiatives
- 9.6.2. BAE Systems
- 9.6.2.1. Participant's Overview
- 9.6.2.2. Financial Performance
- 9.6.2.3. Product Benchmarking
- 9.6.2.4. Recent Developments/ Strategic Initiatives
- 9.6.3. Honeywell International Inc.
- 9.6.3.1. Participant's Overview
- 9.6.3.2. Financial Performance
- 9.6.3.3. Product Benchmarking
- 9.6.3.4. Recent Developments/ Strategic Initiatives
- 9.6.4. Infineon Technologies Inc.
- 9.6.4.1. Participant's Overview
- 9.6.4.2. Financial Performance
- 9.6.4.3. Product Benchmarking
- 9.6.4.4. Recent Developments/ Strategic Initiatives
- 9.6.5. Microchip Technology Inc.
- 9.6.5.1. Participant's Overview
- 9.6.5.2. Financial Performance
- 9.6.5.3. Product Benchmarking
- 9.6.5.4. Recent Developments/ Strategic Initiatives
- 9.6.6. Renesas Electronics Corporation.
- 9.6.6.1. Participant's Overview
- 9.6.6.2. Financial Performance
- 9.6.6.3. Product Benchmarking
- 9.6.6.4. Recent Developments/ Strategic Initiatives
- 9.6.7. STMicroelectronics
- 9.6.7.1. Participant's Overview
- 9.6.7.2. Financial Performance
- 9.6.7.3. Product Benchmarking
- 9.6.7.4. Recent Developments/ Strategic Initiatives
- 9.6.8. Teledyne Technologies Incorporated.
- 9.6.8.1. Participant's Overview
- 9.6.8.2. Financial Performance
- 9.6.8.3. Product Benchmarking
- 9.6.8.4. Recent Developments/ Strategic Initiatives
- 9.6.9. Texas Instruments Incorporated
- 9.6.9.1. Participant's Overview
- 9.6.9.2. Financial Performance
- 9.6.9.3. Product Benchmarking
- 9.6.9.4. Recent Developments/ Strategic Initiatives
- 9.6.10. TTM Technologies
- 9.6.10.1. Participant's Overview
- 9.6.10.2. Financial Performance
- 9.6.10.3. Product Benchmarking
- 9.6.10.4. Recent Developments/ Strategic Initiatives