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市場調查報告書
商品編碼
1535684

被動和互連電子元件市場 - 按類型(被動、互連)、按應用(消費電子、汽車、醫療保健、IT 和電信、工業、航太和國防)和預測,2024 年至 2032 年

Passive and Interconnecting Electronic Components Market - By Type (Passive, Interconnecting), By Application (Consumer Electronics, Automotive, Healthcare, IT & Telecom, Industrial, Aerospace & defense) & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3個工作天內

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簡介目錄

由於物聯網 (IoT) 和智慧型裝置的激增,2024 年至 2032 年全球被動和互連電子元件市場的複合年成長率將超過 5%。根據國際數據公司 (IDC) 的報告,到 2025 年,全球連網物聯網設備數量將超過 416 億台,高於 2021 年的 309 億台,年成長率為 8.6%。隨著這些設備的普及,對確保可靠連接、能源效率和訊號完整性的先進組件的需求不斷增加。被動互連電子元件支援複雜網路並增強智慧型設備的效能。物聯網應用對無縫運作和效率的需求有利於產品需求。

此外,消費性電子產品的激增、汽車的進步以及電信基礎設施的擴張正在推動市場成長。小型化和增強性能的推動正在導致組件設計和材料的創新。

整個被動和互連電子元件市場根據類型、應用和地區進行分組。

由於先進醫療設備和電子健康監測系統的日益整合,醫療保健領域將在預測期內大幅擴張。被動和互連電子元件對於確保診斷工具、成像設備和穿戴式健康監視器等醫療設備的準確資料傳輸、可靠運作和強大連接至關重要。隨著醫療保健技術的進步,對支援高精度和穩定性的組件的需求不斷成長,從而促進了產品的採用。

由於電子系統的複雜性不斷增加以及各種應用之間對可靠連接的需求,到 2032 年,互連電子元件領域將獲得顯著的吸引力。隨著電子產品變得越來越複雜,對確保穩定、高效的資料傳輸的高效能互連解決方案的需求不斷增加。技術的進步需要增強訊號完整性和最小化干擾,這使得互連組件對於維持現代電子系統的性能至關重要。

由於對技術創新和先進製造的高度重視,北美被動和互連電子元件市場在 2024 年至 2032 年間將錄得顯著的複合年成長率。高科技產業的激增和智慧基礎設施項目的擴展正在推動對可靠電子元件的需求。此外,對研發的關注,加上強大的電子製造業,也支持了這些組件的採用。該地區對技術和基礎設施的策略性投資促進了對高品質電子元件的持續需求。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商矩陣
  • 利潤率分析
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 消費性電子產業快速擴張
      • 對先進汽車電子產品的需求不斷成長
      • 物聯網 (IoT) 的興起
      • 再生能源解決方案的普及
      • 不斷發展的工業自動化
    • 產業陷阱與挑戰
      • 原料成本高
      • 環境和永續發展議題
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按類型,2021-2032 年

  • 主要趨勢
  • 被動的
    • 電阻器
    • 電容器
    • 電感器
    • 變形金剛
    • 其他
  • 互連
    • 印刷電路板
    • 連接器
    • 開關和繼電器
    • 其他

第 6 章:市場估計與預測:按應用分類,2021-2032 年

  • 主要趨勢
  • 消費性電子產品
  • 汽車
  • 衛生保健
  • 資訊科技與電信
  • 工業的
  • 航太與國防
  • 其他

第 7 章:市場估計與預測:按地區,2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 南非
    • 沙烏地阿拉伯
    • MEA 的其餘部分

第 8 章:公司簡介

  • Ametek Inc.
  • Amphenol Corporation
  • AVX Corporation
  • Fenghua (HK) Electronics Ltd.
  • Fujitsu Component Limited
  • Hirose Electric Co. Ltd
  • Hosiden Corporation
  • KEMET Corporation
  • Molex Incorporated
  • Murata Manufacturing Co., Ltd.
  • Nichicon Corporation
  • Panasonic Corporation
  • Rohm Co., Ltd.
  • Samsung Electro-Mechanics Co., Ltd.
  • Taiyo Yuden Co., Ltd.
  • TDK Corporation
  • TE Connectivity Ltd.
  • Toyo Connectors
  • TT Electronics PLC
  • United Chemi-Con
  • Vishay Intertechnology, Inc.
  • Walsin Technology Corporation
  • Yageo Corporation
簡介目錄
Product Code: 9848

Global Passive and Interconnecting Electronic Components Market will show over 5% CAGR from 2024 to 2032, attributable to the surge on the Internet of Things (IoT) and smart devices. According to International Data Corporation (IDC) reports, there will be over 41.6 billion connected IoT devices globally by 2025, up from 30.9 billion in 2021, indicating a robust growth rate of 8.6% annually. As these devices become prevalent, there is a heightened need for advanced components that ensure reliable connectivity, energy efficiency, and signal integrity. The passive and interconnecting electronic components support complex networks and enhance the performance of smart devices. The need for seamless operation and efficiency of IoT applications is favoring the product demand.

Moreover, the proliferation of consumer electronics, automotive advancements, and the expansion of telecommunications infrastructure are propelling market growth. The push towards miniaturization and enhanced performance is leading to innovations in component design and materials.

The overall passive and interconnecting electronic components market is grouped based on type, application, and region.

The healthcare segment will expand significantly during the forecast period, because of the increasing integration of advanced medical devices and electronic health monitoring systems. Passive & interconnecting electronic components are crucial for ensuring accurate data transmission, reliable operation, and robust connectivity in medical devices such as diagnostic tools, imaging equipment, and wearable health monitors. As healthcare technology advances, there is a growing need for components that support high precision and stability, bolstering the product adoption.

The interconnecting electronic component segment will gain notable traction through 2032, owing to the increasing complexity of electronic systems and the need for reliable connections across various applications. As electronics become more sophisticated, the demand for high-performance interconnect solutions that ensure stable and efficient data transfer rises. The advancements in technology that require enhanced signal integrity and minimized interference, make interconnecting components essential for maintaining the performance of modern electronic systems.

North America passive and interconnecting electronic components market will record a remarkable CAGR between 2024 and 2032, because of the strong emphasis on technological innovation and advanced manufacturing. The proliferation of high-tech industries and the expansion of smart infrastructure projects are driving the need for reliable electronic components. Additionally, the focus on R&D, coupled with a robust electronics manufacturing sector, supports the adoption of these components. The region's strategic investments in technology and infrastructure contribute to a sustained demand for high-quality electronic components.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data Sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Rapid expansion of the consumer electronics industry
      • 3.8.1.2 Increasing demand for advanced automotive electronics
      • 3.8.1.3 Rise of the internet of things (IoT)
      • 3.8.1.4 Proliferation of renewable energy solutions
      • 3.8.1.5 Growing industrial automation
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 High raw material costs
      • 3.8.2.2 Environmental and sustainability concerns
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Billion and Units)

  • 5.1 Key trends
  • 5.2 Passive
    • 5.2.1 Resistors
    • 5.2.2 Capacitors
    • 5.2.3 Inductors
    • 5.2.4 Transformers
    • 5.2.5 Others
  • 5.3 Interconnecting
    • 5.3.1 PCB
    • 5.3.2 Connectors
    • 5.3.3 Switches & relays
    • 5.3.4 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion and Units)

  • 6.1 Key trends
  • 6.2 Consumer electronics
  • 6.3 Automotive
  • 6.4 Healthcare
  • 6.5 IT & telecom
  • 6.6 Industrial
  • 6.7 Aerospace & defense
  • 6.8 Others

Chapter 7 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion and Units)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 South Africa
    • 7.6.3 Saudi Arabia
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Ametek Inc.
  • 8.2 Amphenol Corporation
  • 8.3 AVX Corporation
  • 8.4 Fenghua (HK) Electronics Ltd.
  • 8.5 Fujitsu Component Limited
  • 8.6 Hirose Electric Co. Ltd
  • 8.7 Hosiden Corporation
  • 8.8 KEMET Corporation
  • 8.9 Molex Incorporated
  • 8.10 Murata Manufacturing Co., Ltd.
  • 8.11 Nichicon Corporation
  • 8.12 Panasonic Corporation
  • 8.13 Rohm Co., Ltd.
  • 8.14 Samsung Electro-Mechanics Co., Ltd.
  • 8.15 Taiyo Yuden Co., Ltd.
  • 8.16 TDK Corporation
  • 8.17 TE Connectivity Ltd.
  • 8.18 Toyo Connectors
  • 8.19 TT Electronics PLC
  • 8.20 United Chemi-Con
  • 8.21 Vishay Intertechnology, Inc.
  • 8.22 Walsin Technology Corporation
  • 8.23 Yageo Corporation