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市場調查報告書
商品編碼
1685068

電子膠合劑市場機會、成長動力、產業趨勢分析及 2025 - 2034 年預測

Electronic Adhesives Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034

出版日期: | 出版商: Global Market Insights Inc. | 英文 235 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024 年全球電子膠合劑市場價值為 50 億美元,預計 2025 年至 2034 年期間的年複合成長率(CAGR) 為 6%。這項擴張是由汽車、醫療、航太和消費性電子等各行業對電子設備的快速應用所推動的。隨著技術的不斷進步,對具有增強的熱性能和電氣性能的高性能黏合劑的需求變得越來越重要。

電子黏合劑市場 - IMG1

向電動車 (EV) 和高級駕駛輔助系統 (ADAS) 的轉變進一步推動了對能夠滿足現代電子元件嚴格要求的專用黏合劑的需求。此外,5G 網路、物聯網應用和智慧型設備的普及也加劇了對具有優異黏合強度、耐用性和抗環境因素能力的黏合劑的需求。領先的製造商正致力於開發環保和永續的黏合劑解決方案,以符合全球永續發展計畫。促進使用低排放材料和節能電子元件的監管政策預計將在塑造市場發展軌跡方面發揮關鍵作用。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 50億美元
預測值 90億美元
複合年成長率 6%

環氧樹脂市場價值到 2024 年將達到 20 億美元,預計在預測期內的複合年成長率為 5.7%。環氧基黏合劑可保護電子元件免受濕氣、高溫和電氣干擾等環境因素的影響,從而為其提供卓越的保護。這些黏合劑廣泛用於封裝、灌封和保形塗層,在確保電子電路的壽命和可靠性方面發揮關鍵作用。電子設備日益小型化,加上電動車和下一代技術的日益普及,繼續推動對環氧膠黏劑的需求。此外,正在進行的研究和開發工作致力於創造永續的環氧樹脂配方,以在不影響性能的情況下最大限度地減少對環境的影響。該公司正在將生物基材料整合到環氧黏合劑中,以增強永續性,同時保持其在電子製造中的高性能應用的基本特性。

2024 年表面貼裝部分佔據電子膠合劑市場最大佔有率,佔總收入的 47.9%。表面貼裝技術 (SMT) 黏合劑對於將電子元件固定到印刷電路板 (PCB) 上至關重要,可確保高性能應用中的耐用性和穩定性。隨著消費者對緊湊、輕巧、功能豐富的電子設備的需求不斷成長,SMT 膠合劑已成為現代電子製造中不可或缺的一部分。這些黏合劑具有優異的機械強度、耐熱性和電絕緣性,對於維持電子產品的可靠性至關重要。製造商正專注於開發固化時間更快、黏合性能更強的高性能 SMT 黏合劑,以滿足電子產業不斷變化的需求。

2024 年美國電子膠合劑市值為 8.832 億美元,預計預測期內複合年成長率為 5.1%。中國在先進電子製造業領域的強大影響力,加上智慧設備的日益普及,正在推動市場大幅擴張。隨著汽車越來越依賴電子系統來實現安全、導航和連接,汽車產業對高性能黏合劑的需求尤其大。此外,美國受益於強大的研發生態系統,促進了黏合劑配方的創新,以滿足嚴格的行業標準。隨著半導體技術、5G基礎設施和永續製造實踐的不斷進步,美國電子膠合劑市場在整個預測期內都具有持續成長的潛力。

目錄

第 1 章:方法論與範圍

  • 市場範圍和定義
  • 基礎估算與計算
  • 預測計算
  • 資料來源
    • 基本的
    • 次要
      • 付費來源
      • 公共資源

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
    • 影響價值鏈的因素
    • 利潤率分析
    • 中斷
    • 未來展望
    • 製造商
    • 經銷商
  • 供應商概況
  • 利潤率分析
  • 重要新聞及舉措
  • 監管格局
  • 衝擊力
    • 成長動力
      • 電子設備小型化
      • 智慧製造與工業 4.0 概念的採用日益廣泛
      • 穿戴式裝置和物聯網 (IoT) 應用日益普及
    • 產業陷阱與挑戰
      • 原料成本上漲
  • 成長潛力分析
  • 波特的分析
  • PESTEL 分析

第4章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按樹脂類型,2021-2034 年

  • 主要趨勢
  • 環氧樹脂
  • 丙烯酸樹脂
  • 聚氨酯
  • 矽酮
  • 其他

第 6 章:市場估計與預測:按應用,2021 年至 2034 年

  • 主要趨勢
  • 保形塗層
  • 表面安裝
  • 封裝
  • 電線定位
  • 其他

第 7 章:市場估計與預測:按最終用途產業,2021 年至 2034 年

  • 主要趨勢
  • 消費性電子產品
  • 汽車
  • 通訊
  • 醫療的
  • 航太和國防
  • 其他

第 8 章:市場估計與預測:按地區,2021 年至 2034 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • 中東及非洲
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國

第9章:公司簡介

  • 3M
  • Avery Dennison Corporation
  • Dow Chemical Company
  • Dymax Corporation
  • Evonik Industries
  • Ellsworth Adhesives
  • Henkel
  • HB Fuller Company
  • Hitachi Chemical
  • Indium Corporation
  • Kyocera Chemical Corporation
  • Mitsui Chemicals
  • Master Bond
  • Nagase Chemtex Corporation
  • Shin-Etsu Chemical
簡介目錄
Product Code: 7501

The Global Electronic Adhesives Market, valued at USD 5 billion in 2024, is poised for steady growth, with projections indicating a compound annual growth rate (CAGR) of 6% between 2025 and 2034. This expansion is driven by the rapid adoption of electronic devices across diverse industries, including automotive, medical, aerospace, and consumer electronics. As technology continues to advance, the need for high-performance adhesives with enhanced thermal and electrical properties is becoming increasingly crucial.

Electronic Adhesives Market - IMG1

The shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) has further fueled demand for specialized adhesives capable of meeting the rigorous requirements of modern electronic components. Additionally, the proliferation of 5G networks, IoT applications, and smart devices has intensified the need for adhesives that offer superior bonding strength, durability, and resistance to environmental factors. Leading manufacturers are focusing on the development of eco-friendly and sustainable adhesive solutions to align with global sustainability initiatives. Regulatory policies promoting the use of low-emission materials and energy-efficient electronic components are expected to play a pivotal role in shaping the market's trajectory.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$5 Billion
Forecast Value$9 Billion
CAGR6%

The epoxy segment, valued at USD 2 billion in 2024, is projected to grow at a CAGR of 5.7% over the forecast period. Epoxy-based adhesives provide exceptional protection to electronic components by shielding them from environmental stressors such as moisture, heat, and electrical interference. Widely used for encapsulation, potting, and conformal coatings, these adhesives play a critical role in ensuring the longevity and reliability of electronic circuits. The increasing miniaturization of electronic devices, coupled with the rising adoption of EVs and next-generation technologies, continues to drive demand for epoxy adhesives. Furthermore, ongoing research and development efforts are focused on creating sustainable epoxy formulations that minimize environmental impact without compromising performance. Companies are integrating bio-based materials into epoxy adhesives to enhance sustainability while maintaining their essential properties for high-performance applications in electronics manufacturing.

The surface-mounting segment held the largest share of the electronic adhesives market in 2024, accounting for 47.9% of total revenue. Surface-mount technology (SMT) adhesives are essential for securing electronic components onto printed circuit boards (PCBs), ensuring durability and stability in high-performance applications. As consumer demand for compact, lightweight, and feature-rich electronic devices continues to grow, SMT adhesives have become indispensable in modern electronics manufacturing. These adhesives provide excellent mechanical strength, thermal resistance, and electrical insulation, making them crucial for maintaining the reliability of electronic products. Manufacturers are focusing on developing high-performance SMT adhesives with faster curing times and enhanced adhesion properties to meet the evolving needs of the electronics industry.

The U.S. electronic adhesives market, valued at USD 883.2 million in 2024, is expected to grow at a CAGR of 5.1% over the forecast period. The country's strong presence in advanced electronics manufacturing, coupled with the increasing adoption of smart devices, is driving significant market expansion. The automotive sector, in particular, is fueling demand for high-performance adhesives as vehicles become more reliant on electronic systems for safety, navigation, and connectivity. Additionally, the U.S. benefits from a robust research and development ecosystem, fostering innovation in adhesive formulations to meet stringent industry standards. With ongoing advancements in semiconductor technology, 5G infrastructure, and sustainable manufacturing practices, the U.S. electronic adhesives market is well-positioned for sustained growth throughout the forecast period.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2034

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1 Miniaturization of electronic devices
      • 3.6.1.2 Increasing adoption of smart manufacturing and Industry 4.0 concepts
      • 3.6.1.3 The growing popularity of wearable devices and Internet of Things (IoT) applications
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 Rising raw material costs
  • 3.7 Growth potential analysis
  • 3.8 Porter’s analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Resin Type, 2021-2034 (USD Billion) (Kilo Tons)

  • 5.1 Key trends
  • 5.2 Epoxy
  • 5.3 Acrylics
  • 5.4 Polyurethane
  • 5.5 Silicone
  • 5.6 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021-2034 (USD Billion) (Kilo Tons)

  • 6.1 Key trends
  • 6.2 Conformal coatings
  • 6.3 Surface mounting
  • 6.4 Encapsulation
  • 6.5 Wire tacking
  • 6.6 Others

Chapter 7 Market Estimates & Forecast, By End Use Industry, 2021-2034 (USD Billion) (Kilo Tons)

  • 7.1 Key trends
  • 7.2 Consumer electronics
  • 7.3 Automotive
  • 7.4 Communications
  • 7.5 Medical
  • 7.6 Aerospace and defense
  • 7.7 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2034 (USD Billion) (Kilo Tons)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 UK
    • 8.3.2 Germany
    • 8.3.3 France
    • 8.3.4 Italy
    • 8.3.5 Spain
    • 8.3.6 Russia
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 South Korea
    • 8.4.5 Australia
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
  • 8.6 MEA
    • 8.6.1 South Africa
    • 8.6.2 Saudi Arabia
    • 8.6.3 UAE

Chapter 9 Company Profiles

  • 9.1 3M
  • 9.2 Avery Dennison Corporation
  • 9.3 Dow Chemical Company
  • 9.4 Dymax Corporation
  • 9.5 Evonik Industries
  • 9.6 Ellsworth Adhesives
  • 9.7 Henkel
  • 9.8 H.B. Fuller Company
  • 9.9 Hitachi Chemical
  • 9.10 Indium Corporation
  • 9.11 Kyocera Chemical Corporation
  • 9.12 Mitsui Chemicals
  • 9.13 Master Bond
  • 9.14 Nagase Chemtex Corporation
  • 9.15 Shin-Etsu Chemical