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市場調查報告書
商品編碼
1433360
全球電子黏合劑市場 2023-2030Global Electronic Adhesives Market 2023-2030 |
預計在預測期內(2023-2030年),全球電子黏合劑市場將以9.1%的CAGR成長。黏合劑廣泛用於電子電路和產品的製造和組裝。半導體和電路組裝以及晶片連接應用對無毒且環保的電子黏合劑的需求不斷成長,促使電子黏合劑的使用不斷增加。擴大採用能夠支援高效和自動化組裝流程的黏合劑是支援全球市場成長的關鍵因素。導熱黏合劑是將散熱器黏合到 PCB 上的理想選擇。這些黏合劑可以快速有效地將熱量從敏感電子設備中轉移出去,同時具有電絕緣性以防止短路。市場參與者也專注於為半導體製造商推出電子黏合劑解決方案,以進一步促進市場成長。例如,2023 年 11 月,DELO 推出了一種軟性電子黏合劑,可永久密封感測器外殼,從而可靠地保護影像感測器等組件。 DELO DUALBOND BS3770 滿足半導體和汽車產業的嚴格要求,有助於推動自動駕駛領域的創新。
全球電子黏合劑市場依樹脂類型、產品類型和最終用途產業進行區隔。根據樹脂類型,市場區隔為環氧樹脂、矽酮、聚氨酯 (pu)、丙烯酸和其他樹脂(聚醯胺、聚碳酸酯)。根據產品類型,市場分為導電膠、導熱膠和其他膠合劑(熱熔膠、厭氧膠)。此外,根據最終用途產業,市場區隔為電腦、通訊、消費性電子、工業、醫療、運輸以及商業航空和國防。在最終用途行業中,消費電子區隔市場預計將佔據相當大的市場佔有率,因為黏合劑的發展不斷增加,以提供牢固的黏合,同時保護組件免受過度振動、高溫、潮濕的破壞性影響、腐蝕、機械衝擊和極端環境條件。
在樹脂類型中,環氧樹脂區隔市場預計將在全球電子黏合劑市場中佔據相當大的佔有率。部分成長歸因於環氧黏合劑在保護電子元件免受機械應力損壞方面的影響力日益增強。底部填充環氧樹脂是智慧型手機、筆記型電腦和其他攜帶式設備等電子設備製造中的重要組成部分。例如,2022年5月,高品質環氧黏合劑製造商和供應商DeepMaterial推出了兩款新產品,徹底改變了嚴重依賴表面保護材料以及各種半導體和電子電器的晶片測試和封裝行業——底部填充環氧樹脂和一款-組分環氧黏合劑。
全球電子黏合劑市場根據地理位置進一步區隔,包括北美(美國和加拿大)、歐洲(英國、義大利、西班牙、德國、法國和歐洲其他地區)、亞太地區(印度、中國、日本) 、韓國和亞洲其他地區)以及世界其他地區(中東和非洲以及拉丁美洲)。其中,由於用於微型設備的先進電子黏合劑的開發,北美預計將在全球市場中佔據顯著佔有率,這些黏合劑具有特定的特性,以滿足微電子應用的要求。
2023-2030 年全球電子黏合劑市場成長(依地區)
Global Electronic Adhesives Market Size, Share & Trends Analysis Report by Resin Type (Epoxy, Silicone, Polyurethane (PU), Acrylic, and Others), by Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, and Others), and by End-Use Industry (Computers, Communications, Consumer Electronics, Industrial, Medical, Transportation and Commercial Aviation, and Defense), Forecast Period (2023-2030)
The global electronic adhesives market is anticipated to grow at a CAGR of 9.1% during the forecast period (2023-2030). Adhesives are widely used in the manufacture and assembly of electronic circuits and products. The growing demand for non-toxic and eco-friendly electronic adhesives in semiconductor & circuit assembly and die-attachment applications has led to the increasing use of electronic adhesives. The growing adoption of adhesives that can support efficient and automated assembly processes is the key factor supporting the growth of the market globally. Thermally conductive adhesives are ideal for bonding heat sinks to PCBs. These adhesives transfer heat quickly and efficiently away from sensitive electronics, whilst being electrically insulative to prevent short circuits. The market players are also focusing on introducing electronics adhesive for semiconductor manufacturers solutions that further bolster the market growth. For instance, in November 2023, DELO, launched a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.
The global electronic adhesives market is segmented on the resin type, product type, and end-use industry. Based on the resin type, the market is sub-segmented into epoxy, silicone, polyurethane (pu), acrylic and others (polyamide, polycarbonate). Based on the Product Type, the market is sub-segmented into electrically conductive adhesives, thermally conductive adhesives and others (hot melt adhesives, anaerobic adhesive). Further, on the basis of end-use industry, the market is sub-segmented into computers, communications, consumer electronics, industrial, medical, transportation and commercial aviation and defense. Among the end-use industry, the consumer electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in development of adhesive for provide a strong bond while protecting components against the damaging effects of excessive vibration, heat, moisture, corrosion, mechanical shock, and extreme environmental conditions.
Among the resin type, the epoxy sub-segment is expected to hold a considerable share of the global electronic adhesives market. The segmental growth is attributed to the growing influence of epoxy adhesive to protect electronic components from damage caused by mechanical stress. Underfill epoxy is an essential component in the manufacturing of electronic devices such as smartphones, laptops, and other portable devices. For instance, in May 2022, DeepMaterial, a manufacturer and supplier of high-quality epoxy adhesives, launched two new products that revolutionize the chip testing and packaging industry that heavily relies on surface protection materials and various semiconductor and electronic appliances - underfill epoxy and one-component epoxy adhesive.
The global electronic adhesives market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among these, North America is anticipated to hold a prominent share of the market across the globe, owing to the development of advanced electronics adhesives used for miniaturized devices formulated with specific characteristics to meet the requirements of microelectronic applications.
Global Electronic Adhesives Market Growth, by Region 2023-2030
Source: OMR Analysis
Among all regions, the Asia-Pacific regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to increasing demand for wearable devices is a driving the growth of the electronics adhesives market. Wearable devices have gained immense demand in region owing to their ability to integrate technology into accessories, providing convenience, connectivity, and enhanced functionalities to users.
Various adhesives based on physical properties such as solubility, compatibility, thermal properties, water absorbency and electrical properties are designed in a functional unit. For instance, in May 2022, JSR Corp. launched a new material (HAG) that is highly adhesive and dispersive to full-scale development of fifth-generation (5G) and sixth-generation (6G) mobile communications systems and autonomous driving technology, various applications and devices are being developed in the fields of communications and mobility electronics.
The major companies serving the electronic adhesives market include 3M, DELO Industrie Klebstoffe GmbH & Co. KGaA, H.B. Fuller, Henkel AG & Co. KGaA, The Dow Chemical Company, and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in May 2023, Arkema acquired Polytec PT, which specialized in adhesives for batteries and electronics. This bolt-on acquisition is part of the Group's strategy to become a full system provider and support its customers to develop sustainable solutions for the batteries and electronics markets.