查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1518644

2024-2032 年按類型（FC BGA、FC CSP）、應用（消費電子、汽車和運輸、IT 和電信等）和地區分類的先進 IC 基板市場報告

Advanced IC Substrate Market Report by Type (FC BGA, FC CSP), Application (Consumer Electronics, Automotive and Transportation, IT and Telecom, and Others), and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 139 Pages | 商品交期: 2-3個工作天內

價格

2023年，全球先進IC載板市場規模達100億美元。對高效能電子設備的需求不斷成長，擴大採用更小、更輕、更節能的設備，以及資料中心和雲端運算服務數量的增加是推動市場的一些主要因素。

先進的積體電路 (IC) 基板是關鍵組件，也是電子設備內安裝和互連 IC 的基礎。它利用先進的材料和技術來提供最佳的電氣性能、熱管理和訊號完整性。它旨在滿足智慧型手機、平板電腦、電腦和其他電子設備中高效能應用的特定要求。由於它有助於提供增強的連接性、降低的功耗和高效的散熱，全球對先進 IC 基板的需求正在不斷成長。

目前，擴大採用先進的 IC 基板，因為它使複雜的電子系統能夠無縫運行，對市場產生了積極的影響。此外，第五代（5G）技術的不斷興起，以及人工智慧（AI）的日益普及，正在加強市場的成長。除此之外，對能夠適應更高資料傳輸速率和更複雜處理任務的先進 IC 基板的需求不斷成長，這提供了良好的市場前景。此外，工業應用中對遠端控制電氣設備的需求不斷成長，為行業投資者提供了利潤豐厚的成長機會。除此之外，消費者對擴增實境 (AR)、虛擬實境 (VR) 和高清 (HD) 顯示器等先進功能的偏好不斷增加，也促進了市場的成長。此外，全球物聯網（IoT）設備的利用率不斷上升正在推動市場的成長。

先進 IC 載板市場趨勢/促進因素：

對高性能電子設備的需求不斷成長

對智慧型手機、平板電腦、個人電腦 (PC)、穿戴式裝置和筆記型電腦等先進電子設備的需求不斷成長，推動了市場的成長。此外，消費者越來越喜歡有助於提供無縫多工、高速連接和增強圖形性能的電子設備。他們還採用為個人提供沉浸式體驗的設備。除此之外，對能夠容納強大處理器、記憶體模組和通訊組件整合的先進 IC 基板的需求也在增加。因此，製造商正在投資具有最佳化電氣通路和訊號完整性的基板，以確保高效的資料傳輸和最小的延遲。

小型化日益普及

個人對更小、更輕、更節能的設備的需求不斷成長，加上小型化在全球的日益普及，正在支撐市場的成長。與此相適應，對緊湊且高密度的先進 IC 基板的需求不斷增加。除此之外，這些基板還可以堆疊多層組件並減少設備的佔地面積，同時保持最佳功能。在單一基板上整合各種組件的能力提高了效率，降低了訊號干擾的風險，並提高了整體設備性能，這提供了積極的市場前景。

資料中心數量不斷增加

全球資料中心和雲端運算服務數量的不斷增加正在推動市場的成長。企業和個人越來越依賴雲端運算、巨量資料分析和線上服務來儲存和管理大量資訊。資料中心擁有無數的伺服器、儲存系統和網路設備，會產生大量熱量。因此，需要有效的散熱以防止過熱並確保不間斷運作。除此之外，先進的 IC 基板還提供增強的熱管理能力和散熱特性，有助於維持這些系統的可靠性和使用壽命。此外，對能夠有效管理熱量的高性能基材的需求不斷成長，也推動了市場的成長。

目錄

第1章：前言

第 2 章：範圍與方法

  • 研究目的
  • 利害關係人
  • 資料來源
    • 主要資源
    • 二手資料
  • 市場預測
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第 3 章：執行摘要

第 4 章：簡介

  • 概述
  • 主要行業趨勢

第 5 章：全球先進 IC 載板市場

  • 市場概況
  • 市場業績
  • COVID-19 的影響
  • 市場預測

第 6 章：市場區隔：按類型

  • FC球柵陣列
    • 市場走向
    • 市場預測
  • 光纖通訊光熱發電
    • 市場走向
    • 市場預測

第 7 章：市場區隔：按應用

  • 消費性電子產品
    • 市場走向
    • 市場預測
  • 汽車和交通
    • 市場走向
    • 市場預測
  • 資訊科技和電信
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 8 章：市場區隔：按地區

  • 北美洲
    • 美國
    • 加拿大
  • 亞太
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙
    • 俄羅斯
    • 其他
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 其他
  • 中東和非洲
    • 市場走向
    • 市場細分：按國家/地區
    • 市場預測

第 9 章：SWOT 分析

  • 概述
  • 優勢
  • 弱點
  • 機會
  • 威脅

第 10 章：價值鏈分析

第 11 章：波特五力分析

  • 概述
  • 買家的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第 12 章：價格分析

第13章：競爭格局

  • 市場結構
  • 關鍵參與者
  • 關鍵參與者簡介
    • ASE Group
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Fujitsu Limited
    • Ibiden Co. Ltd.
    • JCET Group Co. Ltd
    • Kinsus Interconnect Technology Corp.
    • Korea Circuit Co. Ltd.
    • KYOCERA Corporation
    • LG Innotek Co. Ltd.
    • Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
    • TTM Technologies Inc.
    • Unimicron Technology Corporation (United Microelectronics Corporation)
Product Code: SR112024A5612

The global advanced IC substrate market size reached US$ 10.0 Billion in 2023. Looking forward, the market is expected to reach US$ 16.5 Billion by 2032, exhibiting a growth rate (CAGR) of 5.6% during 2024-2032. The growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and increasing number of data centers and cloud computing services are some of the major factors propelling the market.

An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.

At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.

Advanced IC Substrate Market Trends/Drivers:

Rising demand for high-performance electronic devices

The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.

Increasing popularity of miniaturization

The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.

Growing number of data centers

The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.

Advanced IC Substrate Industry Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country levels for 2024-2032. Our report has categorized the market based on type and application.

Breakup by Type:

FC BGA

FC CSP

FC BGA represents the largest market segment

The report has provided a detailed breakup and analysis of the market based on the type. This includes FC BGA and FC CSP. According to the report, FC BGA represented the largest segment. FC BGA is a packaging technology that facilitates the connection of integrated circuits directly to the substrate and enhances performance. In FC BGA, the IC is flipped, and its active side is connected to the substrate using tiny solder balls, which serve as conductive connections. This configuration offers numerous advantages, such as shorter signal paths, improved electrical performance, and enhanced thermal dissipation due to direct contact with the substrate. FC BGA technology is particularly advantageous in high-density applications where space is limited, such as smartphones, tablets, and high-performance computing systems.

Breakup by Application:

Consumer Electronics

Automotive and Transportation

IT and Telecom

Others

Consumer electronics accounts for the majority of the market share

The report has provided a detailed breakup and analysis of the market based on the application. This includes consumer electronics, automotive and transportation, IT and telecom, and others. According to the report, consumer electronics represented the largest segment. Consumer electronics comprises a wide range of devices, such as smartphones, laptops, tablets, gaming consoles, and wearable gadgets. Advanced IC substrates play a vital role in enhancing the performance and functionality of these devices. In consumer electronics, these substrates enable the integration of powerful processors, memory modules, and connectivity components and ensure seamless multitasking, high-speed data transfer, and immersive user experiences. Additionally, these substrates support advanced features, such as high-definition displays, augmented reality (AR), and artificial intelligence (AI). The rising demand for sleeker designs and extended battery life with efficient thermal management and optimized power consumption is propelling the growth of the market.

Breakup by Region:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.

Competitive Landscape:

Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.

The report has provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

ASE Group

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Fujitsu Limited

Ibiden Co. Ltd.

JCET Group Co. Ltd

Kinsus Interconnect Technology Corp.

Korea Circuit Co. Ltd.

KYOCERA Corporation

LG Innotek Co. Ltd.

Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)

TTM Technologies Inc.

Unimicron Technology Corporation (United Microelectronics Corporation)

Recent Developments:

In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.

In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.

In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.

Key Questions Answered in This Report

  • 1. What was the size of the global advanced IC substrate market in 2023?
  • 2. What is the expected growth rate of the global advanced IC substrate market during 2024-2032?
  • 3. What are the key factors driving the global advanced IC substrate market?
  • 4. What has been the impact of COVID-19 on the global advanced IC substrate market?
  • 5. What is the breakup of the global advanced IC substrate market based on the type?
  • 6. What is the breakup of the global advanced IC substrate market based on the application?
  • 7. What are the key regions in the global advanced IC substrate market?
  • 8. Who are the key players/companies in the global advanced IC substrate market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Advanced IC Substrate Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 FC BGA
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 FC CSP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Application

  • 7.1 Consumer Electronics
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Automotive and Transportation
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IT and Telecom
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 ASE Group
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
    • 13.3.2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Fujitsu Limited
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 Financials
      • 13.3.3.4 SWOT Analysis
    • 13.3.4 Ibiden Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
      • 13.3.4.4 SWOT Analysis
    • 13.3.5 JCET Group Co. Ltd
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Kinsus Interconnect Technology Corp.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 Financials
    • 13.3.7 Korea Circuit Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 KYOCERA Corporation
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
      • 13.3.8.4 SWOT Analysis
    • 13.3.9 LG Innotek Co. Ltd.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 TTM Technologies Inc.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
      • 13.3.11.4 SWOT Analysis
    • 13.3.12 Unimicron Technology Corporation (United Microelectronics Corporation)
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials

List of Figures

  • Figure 1: Global: Advanced IC Substrate Market: Major Drivers and Challenges
  • Figure 2: Global: Advanced IC Substrate Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Advanced IC Substrate Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Advanced IC Substrate Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Advanced IC Substrate Market: Breakup by Application (in %), 2023
  • Figure 6: Global: Advanced IC Substrate Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Advanced IC Substrate (FC BGA) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Advanced IC Substrate (FC BGA) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Advanced IC Substrate (FC CSP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Advanced IC Substrate (FC CSP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Advanced IC Substrate (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Advanced IC Substrate (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Advanced IC Substrate (Automotive and Transportation) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Advanced IC Substrate (Automotive and Transportation) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Advanced IC Substrate (IT and Telecom) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Advanced IC Substrate (IT and Telecom) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Advanced IC Substrate (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Advanced IC Substrate (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: North America: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: North America: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: United States: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: United States: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Canada: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Canada: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Asia-Pacific: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Asia-Pacific: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: China: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: China: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Japan: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Japan: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: India: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: India: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: South Korea: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: South Korea: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Australia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Australia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Indonesia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Indonesia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Europe: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Europe: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Germany: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Germany: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: France: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: France: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United Kingdom: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United Kingdom: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Italy: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Italy: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Spain: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Spain: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Russia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Russia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Latin America: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Latin America: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Brazil: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Brazil: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Mexico: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Mexico: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Middle East and Africa: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Middle East and Africa: Advanced IC Substrate Market: Breakup by Country (in %), 2023
  • Figure 67: Middle East and Africa: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Global: Advanced IC Substrate Industry: SWOT Analysis
  • Figure 69: Global: Advanced IC Substrate Industry: Value Chain Analysis
  • Figure 70: Global: Advanced IC Substrate Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Advanced IC Substrate Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Advanced IC Substrate Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Advanced IC Substrate Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 4: Global: Advanced IC Substrate Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Advanced IC Substrate Market: Competitive Structure
  • Table 6: Global: Advanced IC Substrate Market: Key Players