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市場調查報告書
商品編碼
1518644
2024-2032 年按類型(FC BGA、FC CSP)、應用(消費電子、汽車和運輸、IT 和電信等)和地區分類的先進 IC 基板市場報告Advanced IC Substrate Market Report by Type (FC BGA, FC CSP), Application (Consumer Electronics, Automotive and Transportation, IT and Telecom, and Others), and Region 2024-2032 |
2023年,全球先進IC載板市場規模達100億美元。對高效能電子設備的需求不斷成長,擴大採用更小、更輕、更節能的設備,以及資料中心和雲端運算服務數量的增加是推動市場的一些主要因素。
先進的積體電路 (IC) 基板是關鍵組件,也是電子設備內安裝和互連 IC 的基礎。它利用先進的材料和技術來提供最佳的電氣性能、熱管理和訊號完整性。它旨在滿足智慧型手機、平板電腦、電腦和其他電子設備中高效能應用的特定要求。由於它有助於提供增強的連接性、降低的功耗和高效的散熱,全球對先進 IC 基板的需求正在不斷成長。
目前,擴大採用先進的 IC 基板,因為它使複雜的電子系統能夠無縫運行,對市場產生了積極的影響。此外,第五代(5G)技術的不斷興起,以及人工智慧(AI)的日益普及,正在加強市場的成長。除此之外,對能夠適應更高資料傳輸速率和更複雜處理任務的先進 IC 基板的需求不斷成長,這提供了良好的市場前景。此外,工業應用中對遠端控制電氣設備的需求不斷成長,為行業投資者提供了利潤豐厚的成長機會。除此之外,消費者對擴增實境 (AR)、虛擬實境 (VR) 和高清 (HD) 顯示器等先進功能的偏好不斷增加,也促進了市場的成長。此外,全球物聯網(IoT)設備的利用率不斷上升正在推動市場的成長。
對高性能電子設備的需求不斷成長
對智慧型手機、平板電腦、個人電腦 (PC)、穿戴式裝置和筆記型電腦等先進電子設備的需求不斷成長,推動了市場的成長。此外,消費者越來越喜歡有助於提供無縫多工、高速連接和增強圖形性能的電子設備。他們還採用為個人提供沉浸式體驗的設備。除此之外,對能夠容納強大處理器、記憶體模組和通訊組件整合的先進 IC 基板的需求也在增加。因此,製造商正在投資具有最佳化電氣通路和訊號完整性的基板,以確保高效的資料傳輸和最小的延遲。
小型化日益普及
個人對更小、更輕、更節能的設備的需求不斷成長,加上小型化在全球的日益普及,正在支撐市場的成長。與此相適應,對緊湊且高密度的先進 IC 基板的需求不斷增加。除此之外,這些基板還可以堆疊多層組件並減少設備的佔地面積,同時保持最佳功能。在單一基板上整合各種組件的能力提高了效率,降低了訊號干擾的風險,並提高了整體設備性能,這提供了積極的市場前景。
資料中心數量不斷增加
全球資料中心和雲端運算服務數量的不斷增加正在推動市場的成長。企業和個人越來越依賴雲端運算、巨量資料分析和線上服務來儲存和管理大量資訊。資料中心擁有無數的伺服器、儲存系統和網路設備,會產生大量熱量。因此,需要有效的散熱以防止過熱並確保不間斷運作。除此之外,先進的 IC 基板還提供增強的熱管理能力和散熱特性,有助於維持這些系統的可靠性和使用壽命。此外,對能夠有效管理熱量的高性能基材的需求不斷成長,也推動了市場的成長。
The global advanced IC substrate market size reached US$ 10.0 Billion in 2023. Looking forward, the market is expected to reach US$ 16.5 Billion by 2032, exhibiting a growth rate (CAGR) of 5.6% during 2024-2032. The growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and increasing number of data centers and cloud computing services are some of the major factors propelling the market.
An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.
At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.
Rising demand for high-performance electronic devices
The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.
Increasing popularity of miniaturization
The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.
Growing number of data centers
The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.
IMARC Group provides an analysis of the key trends in each segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country levels for 2024-2032. Our report has categorized the market based on type and application.
FC BGA
FC CSP
FC BGA represents the largest market segment
The report has provided a detailed breakup and analysis of the market based on the type. This includes FC BGA and FC CSP. According to the report, FC BGA represented the largest segment. FC BGA is a packaging technology that facilitates the connection of integrated circuits directly to the substrate and enhances performance. In FC BGA, the IC is flipped, and its active side is connected to the substrate using tiny solder balls, which serve as conductive connections. This configuration offers numerous advantages, such as shorter signal paths, improved electrical performance, and enhanced thermal dissipation due to direct contact with the substrate. FC BGA technology is particularly advantageous in high-density applications where space is limited, such as smartphones, tablets, and high-performance computing systems.
Consumer Electronics
Automotive and Transportation
IT and Telecom
Others
Consumer electronics accounts for the majority of the market share
The report has provided a detailed breakup and analysis of the market based on the application. This includes consumer electronics, automotive and transportation, IT and telecom, and others. According to the report, consumer electronics represented the largest segment. Consumer electronics comprises a wide range of devices, such as smartphones, laptops, tablets, gaming consoles, and wearable gadgets. Advanced IC substrates play a vital role in enhancing the performance and functionality of these devices. In consumer electronics, these substrates enable the integration of powerful processors, memory modules, and connectivity components and ensure seamless multitasking, high-speed data transfer, and immersive user experiences. Additionally, these substrates support advanced features, such as high-definition displays, augmented reality (AR), and artificial intelligence (AI). The rising demand for sleeker designs and extended battery life with efficient thermal management and optimized power consumption is propelling the growth of the market.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share
The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.
Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.
Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.
ASE Group
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Fujitsu Limited
Ibiden Co. Ltd.
JCET Group Co. Ltd
Kinsus Interconnect Technology Corp.
Korea Circuit Co. Ltd.
KYOCERA Corporation
LG Innotek Co. Ltd.
Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
TTM Technologies Inc.
Unimicron Technology Corporation (United Microelectronics Corporation)
In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.
In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.