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1698458

先進半導體基板市場：未來預測（2025-2030）

Semiconductor Advanced Substrate Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計2025-2030年預測期內全球半導體先進基板市場將以8.65%的複合年成長率成長。

印刷基板（PCB）和半導體晶片透過先進的半導體基板連接，該基板充當基板。它具有出色的散熱性、成本效益、堅固、輕巧且節能。此外，它還提高了 PCB 的功能性和尺寸控制，減少了 PCB 的整體重量，並提供了卓越的可靠性和出色的電氣品質。因此，它現在被廣泛用於製造具有現代功能的小型電器。

市場趨勢：

  • 半導體產業對小型化的需求不斷成長：半導體先進基板市場受到快速技術進步推動，小型化趨勢日益增強。這些技術創新使得將多種功能整合到單一平台上以滿足廣泛的應用成為可能。運算、網路、通訊和消費性電子產品的擴展推動了對小型、可靠半導體元件的需求。
  • 此外，攜帶式電子設備需要更小、更薄的封裝解決方案，以節省空間並降低成本。改善電氣性能以最大限度地減少噪音干擾對於航太和家用電子電器等領域的高度整合、高速應用尤為重要。
  • 物聯網設備製造應用的不斷成長：全球消費和工業領域物聯網應用的激增正在推動對專用晶片組的需求。供應商正在開發用於物聯網應用的專用晶片組，主要參與者包括 Altea、華為、英特爾、高通、三星和 Sierra。隨著物聯網設備數量的不斷成長，物聯網開發所使用的晶片的需求預計也將大幅增加。隨著晶片的小型化，降低能耗的創新將成為製造商關注的重點，進一步推動半導體先進基板市場的成長。
  • 按地區分類的市場：半導體先進基板市場細分為美洲、歐洲、中東和非洲以及亞太地區。預計亞太地區將在預測期內佔據市場主導地位，其中台灣憑藉其眾多製造商和對半導體行業的大量投資將發揮關鍵作用。日月光集團、欣興電子、景碩等主要製造商的總部均設在台灣，生產力高。台灣的積體電路產業擁有從上游設計到下游IDM、IC封裝和測試的完整供應鏈，並由熟練的勞動力支撐。台灣也正在推動5G基礎建設。例如，中華電信宣布加速部署5G基地台，目標是實現全國96%的人口覆蓋率。

本報告涉及的主要參與者包括日月光集團、富士通有限公司、IBIDEN電株式會社、景碩互聯股份有限公司、景碩互聯科技有限公司、韓國電路株式會社、京瓷株式會社、LG Innotek 株式會社、南亞 PCB 科技有限公司、TTM 科技有限公司。

本報告的主要優點

  • 深刻分析：獲得涵蓋主要地區和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
  • 競爭格局：了解全球主要企業所採用的策略策略，並了解正確策略帶來的潛在市場滲透。
  • 市場促進因素和未來趨勢：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
  • 可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
  • 適用範圍廣：對於新興企業、研究機構、顧問公司、中小企業和大型企業來說，它都是實用且具有成本效益的。

它有什麼用途？

產業與市場洞察、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

分析範圍

  • 歷史資料（2022-2024）和預測資料（2025-2030）
  • 成長機會、挑戰、供應鏈前景、法規結構、顧客行為、趨勢分析
  • 競爭對手定位、策略和市場佔有率分析
  • 按部門和地區（國家）分類的收益成長和預測分析
  • 公司概況（策略、產品、財務資訊、主要趨勢等）

半導體先進基板市場分析涵蓋以下幾個部分：

按類型

  • 先進IC基板
  • FC BGA
  • FC CSP
  • SLP (Substrate-like PCB)
  • 嵌入式晶粒

按包裝類型

  • SiP (System in Package)
  • QFP (Quad Flat Package)
  • BG (Ball Grid Array)
  • CSP (Chip Scale Packaging)
  • 其他

按應用

  • 家電
  • 汽車和運輸機械
  • 資訊科技/通訊
  • 其他

按地區

  • 美洲
  • 美國
  • 歐洲、中東和非洲
  • 德國
  • 荷蘭
  • 其他
  • 亞太地區
  • 中國
  • 日本
  • 台灣
  • 韓國
  • 其他

目錄

第1章 引言

  • 市場概覽
  • 市場定義
  • 分析範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章分析方法

  • 分析設計
  • 分析過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章 市場動態

  • 市場促進因素
  • 市場限制
  • 波特五力分析
  • 產業價值鏈分析

第5章半導體先進基板市場（按類型）

  • 介紹
  • 先進IC基板
    • FC BGA
    • FC CSP
  • SLP (Substrate-like-PCB)
  • 嵌入式晶粒

第6章 半導體先進基板市場（依封裝類型）

  • 介紹
  • SiP (System in Package)
  • QFP (Quad Flat Package)
  • BG (Ball Grid Array)
  • CSP (Chip Scale Packaging)
  • 其他

第7章半導體先進基板市場（依應用）

  • 介紹
  • 家電
  • 汽車和運輸機械
  • 資訊科技/通訊
  • 其他

第8章半導體先進基板市場（按區域）

  • 世界概況
  • 美洲
    • 美國
  • 歐洲、中東和非洲
    • 德國
    • 荷蘭
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 台灣
    • 韓國
    • 其他

第9章競爭格局及分析

  • 主要企業和策略分析
  • 市場佔有率分析
  • 企業合併、協議、商業合作
  • 競爭儀錶板

第10章 公司簡介

  • ASE Group
  • Fujitsu Limited
  • Ibiden Co. Ltd.
  • Kinsus Interconnect Technology Corp.
  • Korea Circuit Co. Ltd.
  • KYOCERA Corporation
  • LG Innotek Co. Ltd.
  • Nan Ya PCB Co. Ltd.
  • TTM Technologies Inc.
  • Unimicron Technology Corporation
簡介目錄
Product Code: KSI061615491

The global semiconductor advanced substrate market is expected to grow at a CAGR of 8.65% during the forecast period between 2025 and 2030.

The printed circuit boards (PCBs) and semiconductor chips are connected by an advanced semiconductor substrate, which serves as a baseboard. It has great heat dissipation performance and is cost-effective, strong, lightweight, and energy-efficient. Additionally, it boosts PCB functionality and dimensional control, reduces overall PCB weight, and offers excellent dependability and exceptional electrical qualities. Because of this, it is now commonly employed to create miniaturized electrical goods with the newest features.

Market Trends:

  • Growing demand for miniaturization in the semiconductor industry: The semiconductor advanced substrate market is being driven by the increasing trend of miniaturization, fueled by rapid technological advancements. These innovations have enabled the integration of multiple functionalities onto a single platform, catering to diverse applications. The expansion of computing, networking, communications, and consumer electronics has heightened the need for compact, reliable semiconductor devices. This, in turn, has increased the demand for materials used in producing high-performance semiconductor components.
  • Additionally, portable electronic devices require smaller and thinner packaging solutions to save space and reduce costs. Enhancing electrical performance to minimize noise interference is particularly critical for highly integrated, high-speed applications in sectors like aerospace and consumer electronics.
  • Rising adoption in IoT equipment manufacturing: The global surge in IoT adoption across consumer and industrial sectors is driving demand for specialized chipsets. Vendors are developing chipsets specifically designed for IoT applications, with key players including Altair, Huawei, Intel, Qualcomm, Samsung, and Sierra. As the number of IoT devices continues to grow, the demand for chips used in IoT development is expected to rise significantly. Alongside chip miniaturization, innovations aimed at reducing energy consumption will be a key focus for manufacturers, further propelling the growth of the semiconductor advanced substrate market.
  • Regional market segmentation: The semiconductor advanced substrate market is segmented into the Americas, Europe, the Middle East and Africa, and Asia Pacific. Asia Pacific is expected to dominate the market during the forecast period, with Taiwan playing a significant role due to its large number of manufacturers and substantial investments in the semiconductor industry. Major producers such as ASE Group, Unimicron, and Kinsus are headquartered in Taiwan and operate at high production rates. Taiwan's IC industry boasts a comprehensive supply chain, spanning upstream design, downstream IDM, IC packaging, and testing, supported by a skilled workforce. The country is also advancing in 5G infrastructure development. For example, Chunghwa Telecom Co., Ltd. has announced plans to accelerate 5G base station deployment, aiming for 96% population coverage nationwide.

Some of the major players covered in this report include ASE Group, Fujitsu Limited, Ibiden Co. Ltd., Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd., TTM Technologies Inc., Unimicron Technology Corporation, among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Advanced Substrate Market is analyzed into the following segments:

By Type

  • Advanced IC Substrate
  • FC BGA
  • FC CSP
  • Substrate-like-PCB
  • Embedded Die

By Packaging Type

  • System in Package(SiP)
  • Quad Flat Package (QFP)
  • Ball Grid Array (BG)
  • Chip Scale Packaging( CSP)
  • Others

By Application

  • Consumer Electronics
  • Automotive and Transportation
  • IT and Telecom
  • Others

By Geography

  • Americas
  • § US
  • Europe, the Middle East, and Africa
  • § Germany
  • § Netherlands
  • § Others
  • Asia Pacific
  • § China
  • § Japan
  • § Taiwan
  • § South Korea
  • § Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study

1.4. Market Segmentation

  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Advanced IC Substrate
    • 5.2.1. FC BGA
    • 5.2.2. FC CSP
  • 5.3. Substrate-like-PCB (SLP)
  • 5.4. Embedded Die

6. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY PACKAGING TYPE

  • 6.1. Introduction
  • 6.2. System in Package (SiP)
  • 6.3. Quad Flat Package (QFP)
  • 6.4. Ball Grid Array (BG)
  • 6.5. Chip Scale Packaging (CSP)
  • 6.6. Others

7. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Automotive and Transportation
  • 7.4. IT and Telecom
  • 7.5. Others

8. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY GEOGRAPHY

  • 8.1. Global Overview
  • 8.2. Americas
    • 8.2.1. US
  • 8.3. Europe, Middle East, and Africa
    • 8.3.1. Germany
    • 8.3.2. Netherlands
    • 8.3.3. Others
  • 8.4. Asia-Pacific
    • 8.4.1. China
    • 8.4.2. Japan
    • 8.4.3. Taiwan
    • 8.4.4. South Korea
    • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. ASE Group
  • 10.2. Fujitsu Limited
  • 10.3. Ibiden Co. Ltd.
  • 10.4. Kinsus Interconnect Technology Corp.
  • 10.5. Korea Circuit Co. Ltd.
  • 10.6. KYOCERA Corporation
  • 10.7. LG Innotek Co. Ltd.
  • 10.8. Nan Ya PCB Co. Ltd.
  • 10.9. TTM Technologies Inc.
  • 10.10. Unimicron Technology Corporation