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市場調查報告書
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1289720

全球PCB市場IC載板：趨勢、機遇與競爭分析[2023-2028]

IC Substrate in the Global PCB Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

PCB市場IC載板的市場趨勢及預測

就 IC 基板利用率而言，全球 PCB 市場預計到 2028 年將達到約 153 億美元，2023 年至 2028 年復合年增長率為 14.2%。 該市場的主要驅動力是晶圓級封裝和倒裝芯片封裝等先進封裝技術的日益普及、智能手錶和健身手環等智能可穿戴設備的日益普及以及小型化趨勢的日益增強。 全球PCB市場IC載板前景廣闊，在平板電腦、智能手機、筆記本電腦和可穿戴設備等領域都有應用機會。

PCB市場IC載板廠商列表

市場上的公司通過其提供的產品質量進行競爭。 該市場的主要參與者專注於擴大製造設施、投資研發、開發基礎設施以及利用整個價值鏈的整合機會。 這些策略使PCB市場的IC載板公司能夠滿足日益增長的需求、確保競爭力、開發創新產品和技術、降低生產成本並擴大客戶群。

PCB市場IC載板市場洞察

根據 Lucintel 的預測，FC BGA 預計在預測期內仍將是較大的類型細分市場，因為其佈線密度更高，並且能夠進行定制以最大限度地提高電氣性能。

由於對高性能移動設備的需求不斷增長以及先進技術的滲透，預計智能手機在預測期內仍將是市場上最大的細分市場。

由於電子行業的強勁增長、先進封裝技術的不斷增長趨勢以及該地區成熟的半導體和電子製造商的存在，亞太地區將繼續成為最大的地區。

本報告回答了 11 個關鍵問題：

  • Q.1.您的細分市場中最有前途和高增長的機會是什麼？
  • Q.2.哪些細分市場未來將加速增長？為什麼？
  • Q.3.您認為哪些地區未來會加速增長？為什麼？
  • Q.4.影響市場動態的關鍵因素有哪些？ 主要的市場挑戰和業務風險是什麼？
  • Q.5.這個市場的業務風險和競爭威脅是什麼？
  • Q.6.這個市場有哪些新趨勢？為什麼？
  • Q.7.市場上客戶需求有何變化？
  • 問題 8.新興市場的發展有哪些？ 引領這些發展的公司在哪裡？
  • Q.9.誰是市場上的主要參與者？ 領先公司正在採取哪些戰略舉措來發展業務？
  • Q.10.這個市場上的競爭產品有哪些？因材料或產品替代而失去市場份額的威脅是什麼？
  • Q.11.過去五年發生了哪些類型的併購？對行業產生了哪些影響？

內容

第 1 章執行摘要

第二章全球PCB市場IC載板：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 行業驅動因素和挑戰

第三章2017-2028年市場趨勢及預測分析

  • 宏觀經濟趨勢（2017-2022 年）和預測（2023-2028 年）
  • 全球PCB市場IC載板趨勢（2017-2022年）及預測（2023-2028年）
  • 按 IC 載板類型劃分的全球 PCB 市場
    • FC BGA
    • FC CSP
  • 全球 PCB 市場 IC 載板（按應用）
    • 平板電腦
    • 智能手機
    • 筆記本電腦
    • 可穿戴設備
    • 其他

第四章2017-2028年分地區市場趨勢及預測分析

  • 全球PCB市場IC載板（按地區）
  • 北美PCB市場的IC載板
  • 歐洲PCB市場的IC載板
  • 亞太地區 PCB 市場的 IC 載板
  • ROW PCB 市場中的 IC 載板

第 5 章：競爭分析

  • 產品組合分析
  • 運營整合
  • 波特五力分析

第 6 章增長機會和戰略分析

  • 增長機會分析
    • 全球 PCB 市場按 IC 基板類型劃分的增長機會
    • 全球 PCB 市場中 IC 載板應用的增長機會
    • 按地區劃分的全球 PCB 市場 IC 載板的增長機會
  • 全球PCB市場IC載板新趨勢
  • 戰略分析
    • 新產品開發
    • 全球PCB市場IC載板產能擴張
    • 全球PCB市場IC載板併購及合資企業
    • 身份驗證和許可

第 7 章主要公司簡介

  • ASE Group
  • TTM Technologies
  • Simmtech
  • Fujitsu Limited
  • Ibiden
  • JCET Group
  • Kinsus Interconnect Technology
  • Korea Circuit
  • KYOCERA Corporation
  • LG Innotek
簡介目錄

IC Substrate in PCB Market Trends and Forecast

The future of the global IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device applications. The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028 with a CAGR of 14.2% from 2023 to 2028. The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable, like smart watches and fitness bands, and growing trend of miniaturization.

IC Substrate in PCB Market

A more than 150-page report is developed to help in your business decisions.

IC Substrate in PCB Market by Segments

The study includes trends and forecast for IC substrate in the global PCB market by type, application, and region, as follows:

IC Substrate in PCB Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • FC BGA
  • FC CSP

IC Substrate in PCB Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Tablet PC
  • Smart Phones
  • Laptops
  • Wearable Devices
  • Others

IC Substrate in PCB Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of IC Substrate in PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IC substrate companies in the PCB market cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of IC substrate companies in the PCB market profiled in this report include.

  • ASE Group
  • TTM Technologies
  • Simmtech
  • Fujitsu Limited
  • Ibiden
  • JCET Group
  • Kinsus Interconnect Technology
  • Korea Circuit
  • KYOCERA Corporation
  • LG Innotek

IC Substrate in PCB Market Insights

Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.

Within this market, smartphones are expected to remain the largest segment over the forecast period due to rising demand for high-performance mobile devices and increasing penetration of advanced technologies.

APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.

Features of IC Substrate in PCB Market

  • Market Size Estimates: IC substrate in the global PCB market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: IC substrate in the global PCB market size by various segments, such as by raw material usage, end use industry, and region
  • Regional Analysis: IC substrate in the global PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different raw material usages, end use industries, and regions for IC substrate in PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for IC substrate in PCB market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

  • Q1. What is IC substrate in PCB market size?
  • Answer: The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028.
  • Q2. What is the growth forecast for IC substrate in PCB market?
  • Answer: The global PCB market in terms of IC substrate usage is expected to grow with a CAGR of 14.2% from 2023 to 2028.
  • Q3. What are the major drivers influencing the growth of IC substrate in PCB market?
  • Answer: The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable's like smart watches and fitness bands, and growing trend of miniaturization.
  • Q4. What are the major segments for IC substrate in PCB market?
  • Answer: The future of IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device markets.
  • Q5. Who is the key IC substrate in PCB companies?
  • Answer: Some of the key IC substrate in PCB companies are as follows:
  • ASE Group
  • TTM Technologies
  • Simmtech
  • Fujitsu Limited
  • Ibiden
  • JCET Group
  • Kinsus Interconnect Technology
  • Korea Circuit
  • KYOCERA Corporation
  • LG Innotek
  • Q6. Which IC substrate in PCB segment will be the largest in future?
  • Answer: Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
  • Q7. In IC substrate in PCB market, which region is expected to be the largest in next 5 years?
  • Answer: APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
  • Q8. Do we receive customization in this report?
  • Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for IC substrate in the global PCB market by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. IC Substrate in the Global PCB Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: IC Substrate in the Global PCB Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: IC Substrate in the Global PCB Market by Type
    • 3.3.1: FC BGA
    • 3.3.2: FC CSP
  • 3.4: IC Substrate in the Global PCB Market by Application
    • 3.4.1: Tablet PC
    • 3.4.2: Smart Phones
    • 3.4.3: Laptops
    • 3.4.4: Wearable Devices
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: IC Substrate in the Global PCB Market by Region
  • 4.2: IC Substrate in the North American PCB Market
    • 4.2.1: IC Substrate in the North American PCB Market by Type: FC BGA and FC CSP
    • 4.2.2: IC Substrate in the North American PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
  • 4.3: IC Substrate in the European PCB Market
    • 4.3.1: IC Substrate in the European PCB Market by Type: FC BGA and FC CSP
    • 4.3.2: IC Substrate in the European PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
  • 4.4: IC Substrate in the APAC PCB Market
    • 4.4.1: IC Substrate in the APAC PCB Market by Type: FC BGA and FC CSP
    • 4.4.2: IC Substrate in the APAC PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
  • 4.5: IC Substrate in the ROW PCB Market
    • 4.5.1: IC Substrate in the ROW PCB Market by Type: FC BGA and FC CSP
    • 4.5.2: IC Substrate in the ROW PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for IC Substrate in the Global PCB Market by Type
    • 6.1.2: Growth Opportunities for IC Substrate in the Global PCB Market by Application
    • 6.1.3: Growth Opportunities for IC Substrate in the Global PCB Market by Region
  • 6.2: Emerging Trends for IC Substrate in the Global PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of IC Substrate in the Global PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures of IC Substrate in the Global PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ASE Group
  • 7.2: TTM Technologies
  • 7.3: Simmtech
  • 7.4: Fujitsu Limited
  • 7.5: Ibiden
  • 7.6: JCET Group
  • 7.7: Kinsus Interconnect Technology
  • 7.8: Korea Circuit
  • 7.9: KYOCERA Corporation
  • 7.10: LG Innotek