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市場調查報告書
商品編碼
1434596

3D IC 和 2.5D IC封裝市場：按技術、最終用戶、應用分類 - 2024-2030 年全球預測

3D IC & 2.5D IC Packaging Market by Technology (2.5D, 3D TSV, 3D Wafer-Level Chip-Scale Packaging), End User (Automotive, Consumer Electronics, Industrial Sector), Application - Global Forecast 2024-2030
出版日期: | 出版商: 360iResearch | 英文 196 Pages | 商品交期: 最快1-2個工作天內

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預計2023年3D IC和2.5D IC封裝市場規模為923.6億美元，2024年達到1,181.9億美元，2030年達5,214.9億美元，複合年成長率為28.05%。

全球3D IC和2.5D IC封裝市場

主要市場統計
基準年[2023] 923.6億美元
預測年份 [2024] 1181.9億美元
預測年份 [2030] 5214.9億美元
複合年成長率（%） 28.05%
3D IC &2.5D IC封裝市場-IMG1

FPNV定位矩陣

FPNV定位矩陣對於評估3D IC和2.5D IC封裝市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標，以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估，供應商被分為四個成功程度不同的像限：前沿（F）、探路者（P）、利基（N）和重要（V）。

市場佔有率分析

市場佔有率分析是一款綜合工具，可對 3D IC 和 2.5D IC封裝市場供應商的現狀進行深入而詳細的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻，以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外，該分析還提供了對該行業競爭特徵的寶貴見解，包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。這種詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略，從而在市場上獲得競爭優勢。

該報告對以下幾個方面提供了寶貴的見解：

1-市場滲透率：提供有關主要企業所服務的市場的全面資訊。

2-市場開拓：我們深入研究利潤豐厚的新興市場並分析其在成熟細分市場的滲透率。

3- 市場多元化：提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。

4-競爭力評估與資訊：對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況、製造能力等進行全面評估。

5- 產品開發與創新：提供對未來技術、研發活動和突破性產品開發的見解。

本報告解決了以下關鍵問題：

1-3D IC和2.5D IC封裝市場的市場規模和預測是多少？

在2-3D IC和2.5D IC封裝市場的預測期間內，有哪些產品、細分市場、應用和領域需要考慮投資？

3-3D IC和2.5D IC封裝市場的技術趨勢和法律規範是什麼？

4-3D IC和2.5D IC封裝市場主要廠商的市場佔有率是多少？

5-進入3D IC和2.5D IC封裝市場合適的型態和策略手段是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 電子產品的先進設計要求
      • 電子設備小型化趨勢日益明顯
      • 遊戲機和平板智慧型手機的擴展
    • 抑制因素
      • 提高整合度會帶來散熱問題
    • 機會
      • 對高階運算、資料中心和伺服器的需求不斷成長
      • 引進製造商的創新產品與先進包裝
    • 任務
      • 3D IC 和 2.5D IC 的單位成本較高
  • 市場區隔分析
  • 市場趨勢分析
  • 高通膨的累積效應
  • 波特五力分析
  • 價值鍊和關鍵路徑分析
  • 法律規範

第6章 3D IC 和 2.5D IC封裝市場：依技術分類

  • 2.5D
  • 3D TSV
  • 3D晶圓級晶片規模封裝

第 7 章 3D IC 與 2.5D IC封裝市場：依最終使用者分類

  • 車
  • 家用電器
  • 工業部門
  • 醫療設備
  • 軍事和航太
  • 智慧科技
  • 通訊

第 8 章 3D IC 和 2.5D IC封裝市場：依應用分類

  • 成像和光電
  • LED
  • 邏輯
  • 記憶
  • MEMS/感測器
  • 光電
  • RF

第9章美洲3D IC和2.5D IC封裝市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第10章亞太3D IC和2.5D IC封裝市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第11章 歐洲、中東和非洲3D IC和2.5D IC封裝市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第12章競爭形勢

  • FPNV定位矩陣
  • 市場佔有率分析：主要企業
  • 主要企業競爭情境分析

第13章競爭產品組合

  • 主要公司簡介
    • 3M Company
    • Amkor Technology, Inc.
    • ASE Technology Holding Co, Ltd.
    • Broadcom Inc.
    • Fujitsu Limited
    • Intel Corporation
    • International Business Machines Corporation
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • MonolithIC 3D Inc.
    • Samsung Electronics Co. Ltd
    • STMicroelectronics NV
    • Texas Instruments Incorporated
    • Tezzaron Semiconductor Corporation
    • Toshiba Electronic Devices & Storage Corporation
    • United Microelectronics Corporation
    • Xilinx Inc.
  • 主要產品系列

第14章附錄

  • 討論指南
  • 關於許可證和定價
Product Code: MRR-4369010656DB

[196 Pages Report] The 3D IC & 2.5D IC Packaging Market size was estimated at USD 92.36 billion in 2023 and expected to reach USD 118.19 billion in 2024, at a CAGR 28.05% to reach USD 521.49 billion by 2030.

Global 3D IC & 2.5D IC Packaging Market

KEY MARKET STATISTICS
Base Year [2023] USD 92.36 billion
Estimated Year [2024] USD 118.19 billion
Forecast Year [2030] USD 521.49 billion
CAGR (%) 28.05%
3D IC & 2.5D IC Packaging Market - IMG1

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the 3D IC & 2.5D IC Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the 3D IC & 2.5D IC Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the 3D IC & 2.5D IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amkor Technology, Inc., ASE Technology Holding Co, Ltd., Broadcom Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., MonolithIC 3D Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..

Market Segmentation & Coverage

This research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Technology
    • 2.5D
    • 3D TSV
    • 3D Wafer-Level Chip-Scale Packaging
  • End User
    • Automotive
    • Consumer Electronics
    • Industrial Sector
    • Medical Devices
    • Military & Aerospace
    • Smart Technologies
    • Telecommunication
  • Application
    • Imaging & Optoelectronics
    • LED
    • Logic
    • Memory
    • MEMS/Sensors
    • Photonics
    • RF
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the 3D IC & 2.5D IC Packaging Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the 3D IC & 2.5D IC Packaging Market?

3. What are the technology trends and regulatory frameworks in the 3D IC & 2.5D IC Packaging Market?

4. What is the market share of the leading vendors in the 3D IC & 2.5D IC Packaging Market?

5. Which modes and strategic moves are suitable for entering the 3D IC & 2.5D IC Packaging Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Limitations
  • 1.7. Assumptions
  • 1.8. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. 3D IC & 2.5D IC Packaging Market, by Region

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Demand for advanced design in electronic products
      • 5.1.1.2. Increasing inclination to miniaturization of electronic devices
      • 5.1.1.3. Augment of gaming devices and tablet smartphones
    • 5.1.2. Restraints
      • 5.1.2.1. Greater levels of integration causes thermal issues
    • 5.1.3. Opportunities
      • 5.1.3.1. Rising demand for high-end computing, data centers, and servers
      • 5.1.3.2. Advent of innovative products from manufacturers and advanced packaging
    • 5.1.4. Challenges
      • 5.1.4.1. High cost per unit of 3D IC and 2.5D IC
  • 5.2. Market Segmentation Analysis
  • 5.3. Market Trend Analysis
  • 5.4. Cumulative Impact of High Inflation
  • 5.5. Porter's Five Forces Analysis
    • 5.5.1. Threat of New Entrants
    • 5.5.2. Threat of Substitutes
    • 5.5.3. Bargaining Power of Customers
    • 5.5.4. Bargaining Power of Suppliers
    • 5.5.5. Industry Rivalry
  • 5.6. Value Chain & Critical Path Analysis
  • 5.7. Regulatory Framework

6. 3D IC & 2.5D IC Packaging Market, by Technology

  • 6.1. Introduction
  • 6.2. 2.5D
  • 6.3. 3D TSV
  • 6.4. 3D Wafer-Level Chip-Scale Packaging

7. 3D IC & 2.5D IC Packaging Market, by End User

  • 7.1. Introduction
  • 7.2. Automotive
  • 7.3. Consumer Electronics
  • 7.4. Industrial Sector
  • 7.5. Medical Devices
  • 7.6. Military & Aerospace
  • 7.7. Smart Technologies
  • 7.8. Telecommunication

8. 3D IC & 2.5D IC Packaging Market, by Application

  • 8.1. Introduction
  • 8.2. Imaging & Optoelectronics
  • 8.3. LED
  • 8.4. Logic
  • 8.5. Memory
  • 8.6. MEMS/Sensors
  • 8.7. Photonics
  • 8.8. RF

9. Americas 3D IC & 2.5D IC Packaging Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific 3D IC & 2.5D IC Packaging Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. FPNV Positioning Matrix
  • 12.2. Market Share Analysis, By Key Player
  • 12.3. Competitive Scenario Analysis, By Key Player

13. Competitive Portfolio

  • 13.1. Key Company Profiles
    • 13.1.1. 3M Company
    • 13.1.2. Amkor Technology, Inc.
    • 13.1.3. ASE Technology Holding Co, Ltd.
    • 13.1.4. Broadcom Inc.
    • 13.1.5. Fujitsu Limited
    • 13.1.6. Intel Corporation
    • 13.1.7. International Business Machines Corporation
    • 13.1.8. Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 13.1.9. MonolithIC 3D Inc.
    • 13.1.10. Samsung Electronics Co. Ltd
    • 13.1.11. STMicroelectronics NV
    • 13.1.12. Texas Instruments Incorporated
    • 13.1.13. Tezzaron Semiconductor Corporation
    • 13.1.14. Toshiba Electronic Devices & Storage Corporation
    • 13.1.15. United Microelectronics Corporation
    • 13.1.16. Xilinx Inc.
  • 13.2. Key Product Portfolio

14. Appendix

  • 14.1. Discussion Guide
  • 14.2. License & Pricing

LIST OF FIGURES

  • FIGURE 1. 3D IC & 2.5D IC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. 3D IC & 2.5D IC PACKAGING MARKET DYNAMICS
  • FIGURE 7. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 8. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2030 (%)
  • FIGURE 10. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 12. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 14. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 16. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 21. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
  • FIGURE 22. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023

LIST OF TABLES

  • TABLE 1. 3D IC & 2.5D IC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 6. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 7. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 8. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 10. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 18. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 26. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 27. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 29. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 30. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 31. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 32. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 33. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 34. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 35. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 36. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 37. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 39. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 40. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 41. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 42. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 43. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 45. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 46. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 47. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 49. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 50. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 51. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 52. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 54. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 56. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 57. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 58. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 59. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 60. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 62. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 63. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 64. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 65. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 66. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 67. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 69. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 70. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 71. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 72. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 74. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 75. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 76. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 77. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 78. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 81. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 82. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 83. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 84. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 86. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 87. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 89. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 90. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 91. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 92. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 93. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 94. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 97. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 98. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 99. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 100. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 102. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 103. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 104. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 105. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 106. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 107. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 109. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 110. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 111. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 112. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 113. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 114. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 115. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 116. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 117. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 118. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 119. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 120. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 121. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 122. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 123. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 124. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 125. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 126. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 127. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 128. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 129. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 130. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 131. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 132. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 133. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 134. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 135. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 136. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 137. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 138. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 139. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 140. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 141. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 142. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 143. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 144. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 145. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 148. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 149. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 150. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 151. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 152. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
  • TABLE 153. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 154. 3D IC & 2.5D IC PACKAGING MARKET LICENSE & PRICING