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市場調查報告書
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1427673

2024年3D IC/2.5D IC封裝全球市場報告

3D IC And 2.5D IC Packaging Global Market Report 2024
出版日期: | 出版商: The Business Research Company | 英文 175 Pages | 商品交期: 2-10個工作天內

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簡介目錄

3D IC和2.5D IC封裝的市場規模預計在未來幾年將快速成長。預計到 2028 年將以 10.7% 的複合年成長率 (CAGR) 成長至 816.7 億美元。預測期內的預期成長是由穿戴式和行動裝置的出現、對能源效率的需求不斷成長、對高效能運算 (HPC) 的需求不斷成長、向系統晶片(SoC) 設計的轉變以及半導體的複雜性推動的這可能與物聯網（IoT）等的日益普及有關。預測期內預計將出現的顯著趨勢包括5G技術的進步、創新互連技術、產業協作和標準合規性的加強、半導體技術的技術進步、封裝材料的持續創新等。

消費性電子產品需求的不斷成長預計將推動未來3D IC和2.5D IC封裝市場的擴張。消費性電子產品包括為消費者購買和個人非商業性用途而設計的電子設備。 3D IC（積體電路）和2.5D IC封裝代表了先進的封裝技術，可提高電子設備的效能、擴展功能並縮小尺寸。消費性電子產品和遊戲設備的需求激增是由技術進步、可支配收入增加、遊戲產業擴張、數位轉型、遠距工作趨勢、娛樂偏好、不斷變化的生活方式、社交媒體和內容消費的影響所推動的。經過例如，韓國家電製造商LG在2023年1月發布的年度財務報告中宣布， 與前一年同期比較成長12.9%，年比銷售額超過約527億美元。此外，LG 家電與空氣解決方案公司 (LG Home Appliance & Air Solution Company) 2022 年收益達 225 億美元，與前一年同期比較去年同期成長 10.3%，表現出色。因此，消費性電子產品需求的不斷成長是3D IC和2.5D IC封裝市場成長的驅動力。

電動車 (EV) 的日益普及預計將在不久的將來推動 3D IC 和 2.5D IC封裝市場的成長。電動車是部分或全部由可充電電池中儲存的電力提供動力的車輛。在電動車內部，3D IC 技術用於垂直堆疊積體電路，以最佳化空間並促進將電源管理、馬達控制和通訊系統整合到緊湊的佈局中。例如，根據國際能源總署（IEA）2022年5月發布的《世界電動車展望報告》，2021年電動車銷量與前一年同期比較，達到約660萬輛。此外，2022年第一季，全球電動車銷量達200萬輛，甚至更多。因此，電動車的日益普及已成為3D IC和2.5D IC封裝市場擴大的主要驅動力。

目錄

第1章執行摘要

第2章 市場特點

第3章 市場趨勢與策略

第4章宏觀經濟情景

  • 高通膨對市場的影響
  • 烏克蘭與俄羅斯戰爭對市場的影響
  • COVID-19 對市場的影響

第5章世界市場規模與成長

  • 全球3D IC/2.5D IC封裝市場驅動與限制因素
    • 市場驅動力
    • 市場限制
  • 2018-2023年全球3D IC/2.5D IC封裝市場規模表現及成長
  • 2023-2028、2033年全球3D IC/2.5D IC封裝市場規模及成長預測

第6章市場區隔

  • 全球3D IC/2.5D IC封裝市場，依技術、效能及預測細分，2018-2023年、2023-2028年、2033年
  • 3D晶圓級晶片規模封裝
  • 3D TSV（穿透矽通孔）
  • D
  • 全球3D IC/2.5D IC封裝市場，依應用、效能及預測細分，2018-2023年、2023-2028年、2033年
  • 邏輯
  • 記憶
  • 成像和光電
  • MEMS 或感測器
  • 發光二極體（LED）
  • 其他用途
  • 全球3D IC/2.5D IC封裝市場，依最終用戶細分，實際與預測，2018-2023年、2023-2028年、2033年
  • 通訊
  • 消費性電子產品
  • 車
  • 軍事和航太
  • 醫療設備
  • 智慧科技
  • 其他最終用戶

第 7 章 區域與國家分析

  • 全球3D IC/2.5D IC封裝市場，依地區、績效及預測，2018-2023年、2023-2028年、2033年
  • 全球3D IC/2.5D IC封裝市場，依國家、績效與預測，2018-2023年、2023-2028年、2033年

第8章亞太市場

第9章 中國市場

第10章 印度市場

第11章 日本市場

第12章 澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第17章 德國市場

第18章 法國市場

第19章 義大利市場

第20章 西班牙市場

第21章 東歐市場

第22章 俄羅斯市場

第23章 北美市場

第24章美國市場

第25章加拿大市場

第26章 南美洲市場

第27章 巴西市場

第28章 中東市場

第29章 非洲市場

第30章 競爭形勢及公司概況

  • 3D IC/2.5D IC封裝市場競爭形勢
  • 3D IC/2.5D IC封裝市場公司概況
    • Samsung Electronics Co. Ltd.
    • Siemens AG
    • Intel Corporation
    • Taiwan Semiconductor Manufacturing Company Limited
    • SK Hynix Inc.

第31章 其他大型創新公司

  • Broadcom Inc.
  • Fujitsu Limited
  • Toshiba Corporation
  • ASE Technology Holding Co. Ltd.
  • Texas Instruments Incorporated
  • STMicroelectronics NV
  • Infineon Technologies AG
  • Renesas Electronics Corporation
  • United Microelectronics Corporation
  • GlobalFoundries Inc.
  • Amkor Technology Inc.
  • Unimicron Technology Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Cadence Design Systems Inc.
  • Siliconware Precision Industries Co. Ltd.

第32章競爭基準化分析

第 33 章. 競爭對手儀表板

第34章 重大併購

第35章 未來前景與可能性分析

第36章附錄

簡介目錄
Product Code: r13517

3D Integrated Circuit (IC) and 2.5D IC packaging represent advanced technologies within the semiconductor industry, aimed at enhancing chip density and overall performance. In 3D IC packaging, multiple integrated circuits are vertically stacked, facilitating heightened interconnect density and shorter interconnect lengths. On the other hand, 2.5D IC packaging achieves connectivity among multiple chips through an interposer, typically a silicon substrate.

The principal categories of 3D IC and 2.5D IC packaging encompass 3D wafer-level chip-scale packaging, 3D Through-Silicon Via (TSV), and 2.5D technology. 3D wafer-level chip-scale packaging entails integrating numerous dies or chips into a singular package at the wafer level. This technology finds applications across diverse sectors such as logic, memory, imaging, optoelectronics, MEMS or sensors, LEDs, and others. It caters to various end-users including telecommunications, consumer electronics, automotive, military and aerospace, medical devices, smart technologies, among others.

The 3D IC and 2.5D IC packaging market research report is one of a series of new reports from The Business Research Company that provides 3D IC and 2.5D IC packaging market statistics, including 3D IC and 2.5D IC packaging industry global market size, regional shares, competitors with a 3D IC and 2.5D IC packaging market share, detailed 3D IC and 2.5D IC packaging market segments, 3D IC and 2.5D IC packaging market trends and opportunities, and any further data you may need to thrive in the 3D IC and 2.5D IC packaging industry. This 3D IC and 2.5D IC packaging market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The 3D IC and 2.5D IC packaging market size has grown rapidly in recent years. It will grow from $48.6 billion in 2023 to $54.39 billion in 2024 at a compound annual growth rate (CAGR) of 11.9%. The expansion observed in the historical period can be attributed to several factors, including the miniaturization of electronic devices, an increased need for enhanced power efficiency, a growing demand for improved signal integrity, a surge in consumer electronics and gaming devices, and a focus on overall performance enhancement.

The 3D IC and 2.5D IC packaging market size is expected to see rapid growth in the next few years. It will grow to $81.67 billion in 2028 at a compound annual growth rate (CAGR) of 10.7%. The anticipated growth in the forecast period can be linked to the emergence of wearable and portable devices, an escalating demand for energy efficiency, a heightened need for high-performance computing (HPC), a shift towards System-on-Chip (SoC) designs, the increasing complexity of semiconductor devices, and the proliferation of the Internet of Things (IoT). Prominent trends expected in the forecast period encompass advancements in 5G technology, innovative interconnect technologies, increased industry collaboration and adherence to standards, technological strides in semiconductor technology, and ongoing innovations in packaging materials.

The rising demand for consumer electronics is anticipated to fuel the expansion of the 3D IC and 2.5D IC packaging market in the future. Consumer electronics encompass electronic devices designed for purchase and personal, non-commercial use by consumers. 3D IC (Integrated Circuit) and 2.5D IC packaging represent advanced packaging technologies that deliver improved performance, expanded functionalities, and the downsizing of electronic gadgets. The upsurge in demand for consumer electronics and gaming devices is propelled by technological advancements, increased disposable income, the expansion of the gaming industry, digital transformation, remote work trends, entertainment preferences, evolving lifestyles, and the impact of social media and content consumption. As an illustration, LG, a South Korea-based consumer electronics company, reported a 12.9% growth in sales for 2022 in its annual financial report released in January 2023, surpassing approximately $52.70 billion in sales from the previous year. Moreover, the LG Home Appliance & Air Solution Company experienced a remarkable year, generating a revenue of $22.5 billion in 2022, marking a 10.3% surge from the preceding year. Consequently, the escalating demand for consumer electronics is a driving force behind the growth of the 3D IC and 2.5D IC packaging market.

The increasing acceptance of electric vehicles (EVs) is projected to drive the growth of the 3D IC and 2.5D IC packaging market in the foreseeable future. Electric vehicles are automobiles powered, either partially or entirely, by electricity stored in rechargeable batteries. Within electric vehicles, 3D IC technology is utilized to vertically stack integrated circuits, optimizing space and facilitating the integration of power management, motor control, and communication systems in a compact layout. For instance, as per the Global Electric Vehicle Outlook report by the International Energy Agency (IEA) released in May 2022, electric vehicle sales doubled in 2021 compared to the previous year, reaching approximately 6.6 million units. Furthermore, the first quarter of 2022 witnessed a further increase with 2 million electric cars sold globally. Thus, the growing adoption of electric vehicles stands as a key driver behind the expansion of the 3D IC and 2.5D IC packaging market.

Technological advancements stand as a prominent trend gaining traction within the 3D IC and 2.5D IC packaging market. Leading firms engaged in this sector are embracing novel technologies to maintain their market standing. A prime example occurred in June 2022 when ASE Technology Holding Co. Ltd., a semiconductor manufacturing services provider based in Taiwan, introduced VIPack. This cutting-edge packaging platform, an evolution in 3D heterogeneous integration architecture, broadens design parameters while delivering exceptionally high performance and density. VIPack empowers companies to achieve unparalleled innovation by integrating multiple chips into a single package. It leverages advanced redistribution layer (RDL) technologies, embedded integration, and 2.5D and 3D technologies. VIPack encompasses six fundamental packaging technology pillars, complemented by a comprehensive co-design ecosystem. These pillars encompass ASE's high-density through Silicon Via (TSV)-based 2.5D and 3D IC, Co-Packaged Optics processing capabilities, along with Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP)-based technologies.

Key players within the 3D IC and 2.5D IC packaging market are spearheading innovative technologies, particularly focusing on next-generation 2.5D technologies, to gain a competitive edge. 2.5D packaging technology represents an advanced method of semiconductor integration, involving the stacking of multiple integrated circuit (IC) components, such as logic and memory dies, onto a single substrate or interposer. Notably, in May 2021, Samsung Electronics Co. Ltd., a South Korea-based consumer electronics company, unveiled its 2.5D packaging technology, Interposer-Cube4 (I-Cube4). This technology showcases four High Bandwidth Memory (HBM) dies and one logic die on an ultra-thin silicon interposer, succeeding the I-Cube2. I-Cube4 aims to propel chip packaging technology, enhancing communication and power efficiency across diverse applications spanning high-performance computing (HPC), artificial intelligence (AI), 5G, and large-scale data center operations. The thinner interposer facilitates improved thermal management and stable power supply, effectively addressing concerns related to interposer warpage, thereby contributing to heightened product quality and reliability.

In February 2021, Siemens Digital Industries Software, a U.S.-based computer software company specializing in 3D & 2D product lifecycle management software, entered into a collaboration with Advanced Semiconductor Engineering, a Taiwan-based provider of semiconductor assembly and test manufacturing services. This partnership aims to create two new enablement products, tailored to aid shared clients in the seamless development and assessment of diverse integrated circuit (IC) package assembly and interconnect scenarios. These tools are designed to offer an intuitive, data-rich graphical environment, facilitating the exploration and refinement of such scenarios both before and during the physical design execution phase.

Major companies operating in the 3d ic and 2.5d ic packaging market report are Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc., Broadcom Inc., Fujitsu Limited, Toshiba Corporation, ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, STMicroelectronics NV, Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Unimicron Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Cadence Design Systems Inc., Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Ansys Inc., STATS ChipPAC Pte. Ltd., Synopsys Inc, UTAC Holdings Ltd., Tessolve Semiconductor Private Limited, Invensas Corporation, National Center for Advanced Packaging Co. Ltd., Tohoku-MicroTec Co. Ltd, TechSearch International Inc.

Asia-Pacific was the largest region in the 3D IC and 2.5D IC market in 2023. It is expected to be the fastest-growing region in the forecast period. The regions covered in the 3d ic and 2.5d ic packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the 3d ic and 2.5d ic packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The 3D IC and 2.5D IC packaging market consists of revenues earned by entities by providing ultra-high routing density, AI accelerator for AI training, and power or optics integration. The market value includes the value of related goods sold by the service provider or included within the service offering. The 3D IC and 2.5D IC packaging market also includes sales of memory modules, system-on-chip devices, graphics processing units (GPU), electronic components, and single semiconductor wafer. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

3D IC And 2.5D IC Packaging Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on 3d ic and 2.5d ic packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
  • Understand how the market has been affected by the coronavirus and how it is responding as the impact of the virus abates.
  • Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for 3d ic and 2.5d ic packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The 3d ic and 2.5d ic packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of covid 19 on supply chains and consumption patterns.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

Markets Covered:

  • 1) By Technology: 3D Wafer-Level Chip-Scale Packaging; 3D TSV (Through-Silicon Via); 2.5D
  • 2) By Application: Logic; Memory; Imaging And Optoelectronics; MEMS Or Sensors; LED; Other Applications
  • 3) By End-user: Telecommunication; Consumer Electronics; Automotive; Military And Aerospace; Medical Devices; Smart Technologies; Other End Users
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Siemens AG; Intel Corporation; Taiwan Semiconductor Manufacturing Company Limited; SK Hynix Inc.
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. 3D IC And 2.5D IC Packaging Market Characteristics

3. 3D IC And 2.5D IC Packaging Market Trends And Strategies

4. 3D IC And 2.5D IC Packaging Market - Macro Economic Scenario

  • 4.1. Impact Of High Inflation On The Market
  • 4.2. Ukraine-Russia War Impact On The Market
  • 4.3. COVID-19 Impact On The Market

5. Global 3D IC And 2.5D IC Packaging Market Size and Growth

  • 5.1. Global 3D IC And 2.5D IC Packaging Market Drivers and Restraints
    • 5.1.1. Drivers Of The Market
    • 5.1.2. Restraints Of The Market
  • 5.2. Global 3D IC And 2.5D IC Packaging Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
  • 5.3. Global 3D IC And 2.5D IC Packaging Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. 3D IC And 2.5D IC Packaging Market Segmentation

  • 6.1. Global 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 3D Wafer-Level Chip-Scale Packaging
  • 3D TSV (Through-Silicon Via)
  • 2.5D
  • 6.2. Global 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Logic
  • Memory
  • Imaging And Optoelectronics
  • MEMS Or Sensors
  • Light-Emitting Diode (LED)
  • Other Applications
  • 6.3. Global 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Telecommunication
  • Consumer Electronics
  • Automotive
  • Military And Aerospace
  • Medical Devices
  • Smart Technologies
  • Other End Users

7. 3D IC And 2.5D IC Packaging Market Regional And Country Analysis

  • 7.1. Global 3D IC And 2.5D IC Packaging Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 7.2. Global 3D IC And 2.5D IC Packaging Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific 3D IC And 2.5D IC Packaging Market

  • 8.1. Asia-Pacific 3D IC And 2.5D IC Packaging Market Overview
  • Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.3. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.4. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China 3D IC And 2.5D IC Packaging Market

  • 9.1. China 3D IC And 2.5D IC Packaging Market Overview
  • 9.2. China 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.3. China 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.4. China 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India 3D IC And 2.5D IC Packaging Market

  • 10.1. India 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.2. India 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.3. India 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan 3D IC And 2.5D IC Packaging Market

  • 11.1. Japan 3D IC And 2.5D IC Packaging Market Overview
  • 11.2. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.3. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.4. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia 3D IC And 2.5D IC Packaging Market

  • 12.1. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.2. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.3. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia 3D IC And 2.5D IC Packaging Market

  • 13.1. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.2. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.3. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea 3D IC And 2.5D IC Packaging Market

  • 14.1. South Korea 3D IC And 2.5D IC Packaging Market Overview
  • 14.2. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.3. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.4. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe 3D IC And 2.5D IC Packaging Market

  • 15.1. Western Europe 3D IC And 2.5D IC Packaging Market Overview
  • 15.2. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.3. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.4. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK 3D IC And 2.5D IC Packaging Market

  • 16.1. UK 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.2. UK 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.3. UK 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany 3D IC And 2.5D IC Packaging Market

  • 17.1. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.2. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.3. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France 3D IC And 2.5D IC Packaging Market

  • 18.1. France 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.2. France 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.3. France 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy 3D IC And 2.5D IC Packaging Market

  • 19.1. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.2. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.3. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain 3D IC And 2.5D IC Packaging Market

  • 20.1. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.2. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.3. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe 3D IC And 2.5D IC Packaging Market

  • 21.1. Eastern Europe 3D IC And 2.5D IC Packaging Market Overview
  • 21.2. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.3. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.4. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia 3D IC And 2.5D IC Packaging Market

  • 22.1. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.2. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.3. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America 3D IC And 2.5D IC Packaging Market

  • 23.1. North America 3D IC And 2.5D IC Packaging Market Overview
  • 23.2. North America 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.3. North America 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.4. North America 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA 3D IC And 2.5D IC Packaging Market

  • 24.1. USA 3D IC And 2.5D IC Packaging Market Overview
  • 24.2. USA 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.3. USA 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.4. USA 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada 3D IC And 2.5D IC Packaging Market

  • 25.1. Canada 3D IC And 2.5D IC Packaging Market Overview
  • 25.2. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.3. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.4. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America 3D IC And 2.5D IC Packaging Market

  • 26.1. South America 3D IC And 2.5D IC Packaging Market Overview
  • 26.2. South America 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.3. South America 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.4. South America 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil 3D IC And 2.5D IC Packaging Market

  • 27.1. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.2. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.3. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East 3D IC And 2.5D IC Packaging Market

  • 28.1. Middle East 3D IC And 2.5D IC Packaging Market Overview
  • 28.2. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.3. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.4. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa 3D IC And 2.5D IC Packaging Market

  • 29.1. Africa 3D IC And 2.5D IC Packaging Market Overview
  • 29.2. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.3. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.4. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. 3D IC And 2.5D IC Packaging Market Competitive Landscape And Company Profiles

  • 30.1. 3D IC And 2.5D IC Packaging Market Competitive Landscape
  • 30.2. 3D IC And 2.5D IC Packaging Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd.
      • 30.2.1.1. Overview
      • 30.2.1.2. Products and Services
      • 30.2.1.3. Strategy
      • 30.2.1.4. Financial Performance
    • 30.2.2. Siemens AG
      • 30.2.2.1. Overview
      • 30.2.2.2. Products and Services
      • 30.2.2.3. Strategy
      • 30.2.2.4. Financial Performance
    • 30.2.3. Intel Corporation
      • 30.2.3.1. Overview
      • 30.2.3.2. Products and Services
      • 30.2.3.3. Strategy
      • 30.2.3.4. Financial Performance
    • 30.2.4. Taiwan Semiconductor Manufacturing Company Limited
      • 30.2.4.1. Overview
      • 30.2.4.2. Products and Services
      • 30.2.4.3. Strategy
      • 30.2.4.4. Financial Performance
    • 30.2.5. SK Hynix Inc.
      • 30.2.5.1. Overview
      • 30.2.5.2. Products and Services
      • 30.2.5.3. Strategy
      • 30.2.5.4. Financial Performance

31. 3D IC And 2.5D IC Packaging Market Other Major And Innovative Companies

  • 31.1. Broadcom Inc.
  • 31.2. Fujitsu Limited
  • 31.3. Toshiba Corporation
  • 31.4. ASE Technology Holding Co. Ltd.
  • 31.5. Texas Instruments Incorporated
  • 31.6. STMicroelectronics NV
  • 31.7. Infineon Technologies AG
  • 31.8. Renesas Electronics Corporation
  • 31.9. United Microelectronics Corporation
  • 31.10. GlobalFoundries Inc.
  • 31.11. Amkor Technology Inc.
  • 31.12. Unimicron Technology Corporation
  • 31.13. Jiangsu Changjiang Electronics Technology Co. Ltd.
  • 31.14. Cadence Design Systems Inc.
  • 31.15. Siliconware Precision Industries Co. Ltd.

32. Global 3D IC And 2.5D IC Packaging Market Competitive Benchmarking

33. Global 3D IC And 2.5D IC Packaging Market Competitive Dashboard

34. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market

35. 3D IC And 2.5D IC Packaging Market Future Outlook and Potential Analysis

  • 35.1 3D IC And 2.5D IC Packaging Market In 2028 - Countries Offering Most New Opportunities
  • 35.2 3D IC And 2.5D IC Packaging Market In 2028 - Segments Offering Most New Opportunities
  • 35.3 3D IC And 2.5D IC Packaging Market In 2028 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer