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1602423

先進IC封裝市場：按類型、應用分類 - 2025-2030 年全球預測

Advanced IC Packaging Market by Type (2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit), Application (Aerospace & Defense, Automotive & Transportation, Consumer Electronics) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 184 Pages | 商品交期: 最快1-2個工作天內

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預計2023年先進IC封裝市場規模為450.2億美元，2024年預計將達485.1億美元，複合年成長率為8.26%，2030年將達785億美元。

先進IC封裝是指用於組裝和封裝積體電路（IC）以提高其性能、效率和擴充性的技術。消費性電子、汽車、通訊和醫療保健等領域對更高性能、低耗電量和更小尺寸電子產品的持續需求推動了對先進IC封裝的需求。先進IC封裝的應用包括行動電話、穿戴式裝置、人工智慧、物聯網設備和汽車電子，其中在不同條件下的高可靠性和穩健性能是關鍵要求。最終用途範圍廣泛，涵蓋雲端運算、邊緣設備和半導體製造等垂直領域。該市場受到5G技術興起、人工智慧使用增加以及智慧設備增加等關鍵成長要素的推動。此外，消費性電子產品的發展和汽車電子產品市場的擴張提供了新的成長途徑。然而，初始成本高、製造流程複雜、供應鏈瓶頸等挑戰是主要限制因素。目前市場在異質整合和系統級封裝（SiP）技術等領域提供了潛在的機會。公司可以透過投資研發來利用這些機會，以增強溫度控管和電氣性能。最佳創新領域包括開發提供卓越電氣和熱性能、更低功耗和更小佔地面積的封裝解決方案。半導體製造商和最終用戶公司之間的合作也可以促進價值創造。在全球範圍內，市場競爭激烈，主要參與者不斷創新以獲得優勢。儘管面臨挑戰，但對高效、緊湊和強大電子產品不斷成長的需求確保了持續成長。對於希望在先進IC封裝領域實現業務成長最大化的市場參與者來說，策略重點關注人工智慧和物聯網的新興應用至關重要。

主要市場統計
基準年[2023] 450.2億美元
預測年份 [2024] 485.1億美元
預測年份 [2030] 785億美元
複合年成長率（%） 8.26%

市場動態：揭示快速發展的先進IC封裝市場的關鍵市場洞察

供應和需求的動態相互作用正在改變先進IC封裝市場。了解這些不斷變化的市場動態可以幫助企業做出明智的投資決策、策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險，同時消費行為及其對製造成本的影響以及對採購趨勢的影響。

  • 市場促進因素
    • 消費性電子產品的需求不斷成長和激增
    • 國防部門對小型電子產品的需求不斷成長
    • 各經濟區域的交通運輸業電氣化正在取得進展
  • 市場限制因素
    • 先進IC封裝製程高成本
  • 市場機會
    • 新型先進IC封裝解決方案的演變與開發
    • 加大半導體製造業投資
  • 市場挑戰
    • 與先進IC封裝相關的可靠性、功率損耗和用電挑戰

波特五力：駕馭先進IC封裝市場的策略工具

波特的五力架構是了解先進IC封裝市場競爭格局的重要工具。波特的五力框架為評估公司的競爭地位和探索策略機會提供了清晰的方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢，解決弱點並避免潛在的挑戰，從而確保更強大的市場地位。

PESTLE分析：了解先進IC封裝市場的外部影響

外部宏觀環境因素在塑造先進IC封裝市場的表現動態方面發揮著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素，公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化，並為他們做出積極主動的決策做好準備。

市場佔有率分析 了解先進IC封裝市場的競爭狀況

對先進IC封裝市場的詳細市場佔有率分析可以對供應商績效進行全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、分散和整合的趨勢，為供應商提供了製定策略決策所需的洞察力，使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV 定位矩陣供應商在先進IC封裝市場的績效評估

FPNV定位矩陣是評估先進IC封裝市場供應商的重要工具。此矩陣允許業務組織根據供應商的商務策略和產品滿意度評估供應商，從而做出符合其目標的明智決策。這四個象限使您能夠清晰、準確地分類供應商，以確定最能滿足您的策略目標的合作夥伴和解決方案。

策略分析和建議描繪了先進IC封裝市場的成功之路

對於想要加強在全球市場的影響力的公司來說，先進IC封裝市場的策略分析至關重要。透過考慮關鍵資源、能力和績效指標，公司可以識別成長機會並努力改進。這種方法使您能夠克服競爭環境中的挑戰，利用新的商機並取得長期成功。

本報告對市場進行了全面分析，涵蓋關鍵重點領域：

1. 市場滲透率：詳細檢視當前市場環境、主要企業的廣泛資料、評估其在市場中的影響力和整體影響力。

2. 市場開拓：辨識新興市場的成長機會，評估現有領域的擴張潛力，並提供未來成長的策略藍圖。

3. 市場多元化：分析近期產品發布、開拓地區、關鍵產業進展、塑造市場的策略投資。

4. 競爭評估與情報：徹底分析競爭格局，檢驗市場佔有率、業務策略、產品系列、認證、監理核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新：重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題，幫助相關人員做出明智的決策：

1.目前的市場規模和未來的成長預測是多少？

2. 哪些產品、區隔市場和地區提供最佳投資機會？

3.塑造市場的主要技術趨勢和監管影響是什麼？

4.主要廠商的市場佔有率和競爭地位如何？

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 消費性電子產品的需求和採用增加
      • 國防部門對小型電子產品的需求增加
      • 各國交通系統電氣化正在取得進展
    • 抑制因素
      • 先進IC封裝製程高成本
    • 機會
      • 新型先進IC封裝解決方案的演變與開發
      • 加大半導體製造業投資
    • 任務
      • 與先進IC封裝相關的可靠性、電力消耗和用電挑戰
  • 市場區隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社群
    • 技術的
    • 合法地
    • 環境

第6章先進IC封裝市場：依類型

  • 2.5D積體電路
  • 2D積體電路
  • 3D積體電路
  • 扇出矽封裝
  • 扇出晶圓級封裝
  • 覆晶
  • 晶圓級晶片規模封裝

第7章先進IC封裝市場：依應用分類

  • 航太和國防
  • 汽車/交通
  • 家電
  • 資訊科技和通訊

第8章美洲先進IC封裝市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第9章亞太地區先進IC封裝市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第10章 歐洲、中東和非洲先進IC封裝市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第11章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
  • 戰略分析和建議

公司名單

  • Amkor Technology, Inc.
  • ASE Technology Holding Co, Ltd.
  • ASMPT
  • Broadcom, Inc.
  • Cadence Design Systems, Inc.
  • Carsem（M）Sdn Bhd
  • Faraday Technology Corporation
  • FormFactor, Inc.
  • Intel Corporation
  • Jiangsu Changdian Technology Co., Ltd.
  • KYOCERA Corporation
  • Microchip Technology Inc.
  • Micross Components, Inc.
  • NHanced Semiconductors, Inc.
  • NXP Semiconductors NV
  • Optima Technology Associates, Inc.
  • Pac Tech-Packaging Technologies GmbH
  • Powertech Technology Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Tektronix, Inc.
  • Texas Instruments Incorporated
  • United Microelectronics Corporation
Product Code: MRR-8903005C4AE1

The Advanced IC Packaging Market was valued at USD 45.02 billion in 2023, expected to reach USD 48.51 billion in 2024, and is projected to grow at a CAGR of 8.26%, to USD 78.50 billion by 2030.

Advanced IC Packaging refers to the technologies used in the assembly and encapsulation of integrated circuits (ICs) that improve their performance, efficiency, and scalability. The necessity for advanced IC packaging stems from the continual demand for increased performance, reduced power consumption, and miniaturization in electronics across sectors like consumer electronics, automotive, telecommunications, and healthcare. Applications of advanced IC packaging include mobile phones, wearables, AI, IoT devices, and automotive electronics, where the demand for high reliability and robust performance under diverse conditions is critical. The end-use scope is vast, touching verticals such as cloud computing, edge devices, and semiconductor manufacturing. The market is propelled by key growth factors like the rise of 5G technology, increased use of AI, and the growth of smart devices. Furthermore, evolving consumer electronics and expanding automotive electronics markets present new growth avenues. However, challenges such as high initial costs, complex manufacturing processes, and supply chain bottlenecks pose considerable limitations. The market currently offers potential opportunities in areas such as heterogeneous integration and System-in-Package (SiP) technologies. Companies can capitalize on these opportunities by investing in R&D to enhance thermal management and electrical performance. Best areas for innovation include developing packaging solutions that offer superior electrical and thermal performance, lower power consumption, and smaller footprints. Collaborations between semiconductor manufacturers and end-user companies could also drive value creation. Globally, the market is competitive with key players constantly innovating to gain an edge. Despite the challenges, the increasing need for efficient, compact, and powerful electronics ensures ongoing growth. A strategic focus on emerging applications in AI and IoT will be crucial for market players aiming to maximize business growth in the advanced IC packaging domain.

KEY MARKET STATISTICS
Base Year [2023] USD 45.02 billion
Estimated Year [2024] USD 48.51 billion
Forecast Year [2030] USD 78.50 billion
CAGR (%) 8.26%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Advanced IC Packaging Market

The Advanced IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing demand and adoption of consumer electronic devices
    • Gowing demand for miniaturized electronic products from defense sector
    • Ongoing electrification of transportation sector across economies
  • Market Restraints
    • High cost of advanced IC packaging processes
  • Market Opportunities
    • Evolution and development of new advanced IC packaging solutions
    • Rising investment in semiconductor manufacturing industry
  • Market Challenges
    • Reliablity, power dissipation and power usage challenges associated with advanced IC packaging

Porter's Five Forces: A Strategic Tool for Navigating the Advanced IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Advanced IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Advanced IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Advanced IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Advanced IC Packaging Market

A detailed market share analysis in the Advanced IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Advanced IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Advanced IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Advanced IC Packaging Market

A strategic analysis of the Advanced IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech - Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.
  • Based on Application, market is studied across Aerospace & Defense, Automotive & Transportation, Consumer Electronics, and IT & Telecom.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing demand and adoption of consumer electronic devices
      • 5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
      • 5.1.1.3. Ongoing electrification of transportation sector across economies
    • 5.1.2. Restraints
      • 5.1.2.1. High cost of advanced IC packaging processes
    • 5.1.3. Opportunities
      • 5.1.3.1. Evolution and development of new advanced IC packaging solutions
      • 5.1.3.2. Rising investment in semiconductor manufacturing industry
    • 5.1.4. Challenges
      • 5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Advanced IC Packaging Market, by Type

  • 6.1. Introduction
  • 6.2. 2.5D Integrated Circuit
  • 6.3. 2D Integrated Circuit
  • 6.4. 3D Integrated Circuit
  • 6.5. Fan Out Silicon In Package
  • 6.6. Fan Out Wafer Level Package
  • 6.7. Flip Chip
  • 6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application

  • 7.1. Introduction
  • 7.2. Aerospace & Defense
  • 7.3. Automotive & Transportation
  • 7.4. Consumer Electronics
  • 7.5. IT & Telecom

8. Americas Advanced IC Packaging Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Advanced IC Packaging Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amkor Technology, Inc.
  • 2. ASE Technology Holding Co, Ltd.
  • 3. ASMPT
  • 4. Broadcom, Inc.
  • 5. Cadence Design Systems, Inc.
  • 6. Carsem (M) Sdn Bhd
  • 7. Faraday Technology Corporation
  • 8. FormFactor, Inc.
  • 9. Intel Corporation
  • 10. Jiangsu Changdian Technology Co., Ltd.
  • 11. KYOCERA Corporation
  • 12. Microchip Technology Inc.
  • 13. Micross Components, Inc.
  • 14. NHanced Semiconductors, Inc.
  • 15. NXP Semiconductors N.V.
  • 16. Optima Technology Associates, Inc.
  • 17. Pac Tech - Packaging Technologies GmbH
  • 18. Powertech Technology Inc.
  • 19. Renesas Electronics Corporation
  • 20. Samsung Electronics Co., Ltd.
  • 21. Taiwan Semiconductor Manufacturing Company, Ltd.
  • 22. Tektronix, Inc.
  • 23. Texas Instruments Incorporated
  • 24. United Microelectronics Corporation

LIST OF FIGURES

  • FIGURE 1. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. ADVANCED IC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. ADVANCED IC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. ADVANCED IC PACKAGING MARKET DYNAMICS
  • TABLE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE & TRANSPORTATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY IT & TELECOM, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 23. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 25. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 26. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 27. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 29. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 32. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 33. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 34. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 36. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 37. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 38. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 39. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 41. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 43. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 45. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 46. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 47. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 49. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 53. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 57. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 58. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 59. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 64. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 65. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 66. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 67. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 68. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 70. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 72. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 73. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 74. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 76. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 78. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 80. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 82. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 83. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 84. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 86. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 89. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 90. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 92. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 94. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 95. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 96. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 98. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 100. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 101. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 102. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 104. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 106. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 107. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023