市場調查報告書
商品編碼
1465983
Chiplet 市場:按處理器、封裝技術和最終用途分類 - 2024-2030 年全球預測Chiplet Market by Processor, Packaging Technology, End-use - Global Forecast 2024-2030 |
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預計2023年Chiplet市場規模為97.5億美元,2024年將達128.4億美元,2030年將達到836.2億美元,複合年成長率為35.91%。
小晶片是單獨的晶粒,每個晶片都封裝了精心製作的子系統或較大積體電路 (IC) 的組件,並將它們精確有效地互連。這種模組化的系統設計方法允許製造商透過組合較小的晶片組件(小晶片)來建造大型、複雜的半導體裝置。 Chiplet 為傳統單晶片 IC 設計提供了一種經濟高效的變體,對於電子和數位系統的發展至關重要,尤其是在半導體領域。這種技術市場的擴張主要是由對半導體經濟高效生產和性能改進的追求、資料量的快速增加以及人工智慧 (AI)、機器學習 (ML) 和物聯網 (IoT) 的進步所推動的。 。然而,複雜的設計要求和互通性障礙給全球小晶片市場帶來了重大挑戰。 Chiplet 設計流程的改進、新應用的探索以及新 Chiplet 封裝技術的發明描述了 Chiplet 市場創新和成長的巨大潛力。
主要市場統計 | |
---|---|
基準年[2023] | 97.5億美元 |
預測年份 [2024] | 128.4億美元 |
預測年份 [2030] | 836.2億美元 |
複合年成長率(%) | 35.91% |
處理器:更多採用 FPGA,透過 AI 整合提供硬體客製化
APU,也稱為加速處理單元,是一種在單一晶片上整合中央處理單元 (CPU) 和圖形處理單元 (GPU) 的晶片,使其能夠有效平衡地執行圖形和數位密集型任務。 APU 的需求經常出現在小型系統、單板電腦和攜帶式設備中,其中電源效率和緊湊性至關重要。 AI ASIC Compressor 是一款專用AI 工作負載設計的自訂晶片。這些專用晶片透過實現高效能運算同時降低功耗來加速人工智慧應用。這種小晶片解決方案是人工智慧高度整合的地方的首選,例如雲端伺服器、機器學習系統和機器人。中央處理器是電腦的主要部件,執行電腦內部的大部分處理工作。 CPU 具有高度通用性,可處理各種工作負載。 CPU 需求偏好最常見於日常電腦系統、筆記型電腦、伺服器環境、資料中心等。 FPGA 是一種具有可程式邏輯元件和互連的半導體裝置。 FPGA 是原型製作、雷達和影像處理、軟體定義無線電、加密、訊號處理等領域的首選,具體取決於您的需求。 GPU 旨在處理圖形渲染任務,並大量用於遊戲、影片編輯、動畫、3D 渲染以及最近的機器學習任務。
封裝技術:採用覆晶球柵陣列技術,降低寄生電感和電容,提供優越的電氣性能。
隨著最終用途設備變得更小,家用電子電器中小晶片的新可能性
在汽車領域,小晶片因其高能源效率和高性能而在 ADAS(高級駕駛輔助系統)和電動車 (EV) 中發揮的作用而受到關注。小晶片在消費性電子產品、智慧型手機、智慧電視、筆記型電腦和其他設備中至關重要。在電子產業中,基於需求的小晶片偏好圍繞著提高性能同時減小產品尺寸的能力。在國防和航太領域,小晶片促進了先進雷達系統、太空船和軍事設備的開發。國防和航太領域青睞小晶片的性能、耐用性和能源效率。在醫療領域,小晶片用於醫療成像設備、穿戴式健康監視器和其他設備。 Chiplet 因其高可靠性、低功耗和緊湊的尺寸而受到青睞。在製造領域,小晶片正在納入自動化和機器人應用。 Chiplet 在這一領域受到青睞,因為它們可以提高生產效率。 IT 和通訊業正在其龐大的網路基礎設施中利用小晶片,為 5G 及其他技術提供堅實的支柱。 Chiplet 在通訊業中受到青睞,因為它們可以以低延遲處理大量資料。
區域洞察
在美洲,特別是在美國和加拿大,對小晶片的需求主要是由高科技和雲端應用的成長所推動的。就消費趨勢而言,對混合運算平台和小型電子產品的日益偏好正在加速對美洲小晶片市場的需求。在歐盟 (EU) 各國主要供應商的引領下,歐洲小晶片市場正在蓬勃發展。最近成立了一個德國聯盟,以確保小晶片供應鏈的安全並促進歐洲的最終組裝,從而為該地區的小晶片市場創造潛在需求。中東及非洲地區Chiplet市場潛力大,大力推動Chiplet在地化生產,提高技術自給率。亞太地區是日本、中國和韓國等主要技術先進國家和半導體製造商的所在地,為全球小晶片市場提供了利潤豐厚的機會。亞太地區小晶片市場的擴張是由政府和私人對電子製造投資的大幅成長所推動的。
FPNV定位矩陣
FPNV定位矩陣對於評估chiplet市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標,以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估,供應商被分為四個成功程度不同的像限。最前線 (F)、探路者 (P)、利基 (N) 和重要 (V)。
市場佔有率分析
市場佔有率分析是一種綜合工具,可以對 Chiplet 市場供應商的現狀進行深入而深入的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻,以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外,該分析還提供了對該細分市場競爭特徵的寶貴見解,包括在研究基準年觀察到的累積、碎片化主導地位和合併特徵等因素。詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略,從而在市場上獲得競爭優勢。
1. 市場滲透率:提供有關主要企業所服務的市場的全面資訊。
2. 市場開拓:我們深入研究利潤豐厚的新興市場,並分析其在成熟細分市場的滲透率。
3. 市場多元化:包括新產品發布、開拓地區、最新發展和投資的詳細資訊。
4.競爭力評估與資訊:對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況、製造能力等進行全面評估。
5. 產品開發與創新:包括對未來技術、研發活動以及突破性產品開發的見解。
1. Chiplet市場的市場規模和預測是多少?
2.在chiplet市場的預測期內,我們應該考慮投資哪些產品和應用?
3. Chiplet市場的技術趨勢和法規結構是什麼?
4.chiplet市場主要廠商的市場佔有率是多少?
5.進入chiplet市場的合適型態和策略手段是什麼?
[186 Pages Report] The Chiplet Market size was estimated at USD 9.75 billion in 2023 and expected to reach USD 12.84 billion in 2024, at a CAGR 35.91% to reach USD 83.62 billion by 2030.
Chiplets are individual silicon dies, each encapsulating a carefully crafted subsystem or component of a larger Integrated Circuit (IC), which are then interconnected precisely and efficiently. This modular approach in system design allows manufacturers to build large, complex semiconductor devices by combining smaller chip components, or chiplets, which can be tailor-made for specific functionalities. Chiplets are pivotal in formulating electronic and digital systems, especially in the semiconductor sector, providing cost-efficient variants to traditional monolithic IC design. This technology market's expansion is primarily propelled by the quest for cost-effective production and enhanced performance in semiconductors, spiked data volumes, and progressions in artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). However, intricate design requirements and interoperability obstacles pose significant challenges for the global chiplet market. Refining the chiplet design process, investigating new applications, and inventing new packaging techniques for chiplets offer immense potential for innovation and growth for the chiplet market.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 9.75 billion |
Estimated Year [2024] | USD 12.84 billion |
Forecast Year [2030] | USD 83.62 billion |
CAGR (%) | 35.91% |
Processor: Growing deployment of FPGAs offering hardware customization with integrated AI
The APU, also known as an accelerated processing unit, is a chip that integrates both a central processing unit (CPU) and graphic processing unit (GPU) on one piece of silicon, efficiently balancing graphic and numeric intensive tasks. The need-based preference for an APU is often seen in small form-factor systems, single-board computers, and portable devices where power efficiency and compactness are paramount. The AI ASIC Compressor is a custom chip designed specifically for AI workloads. These dedicated chips accelerate AI applications by enabling high-performance calculations with reduced power consumption. This chiplet solution is preferred where AI is heavily integrated, such as in cloud servers, machine learning systems, and robotics. The central processing unit is a primary component of a computer that performs the majority of processing inside the computer. CPUs are highly versatile and can manage a wide variety of workloads. The need-based preference for CPUs is seen most generically in everyday computer systems, laptops, server environments, and data centers. FPGA is a semiconductor device that has programmable logic components and interconnects. FPGAs have a need-based preference in prototyping, radar and image processing, software-defined radios, encryption, signal processing, and more. GPU is designed to handle graphics rendering tasks with proficiency and is heavily used in gaming, video editing, animation, 3D rendering, and, more recently, machine learning tasks.
Packaging Technology: Higher adoption of flip chip ball grid array technology for lower parasitic inductance and capacitance for superior electrical performance
End-use: Emerging potential of chiplets in consumer electronics with a trend of miniaturizing devices
In the automotive sector, chiplets are heavily favored for their role in advanced driver-assistance systems (ADAS) and electric vehicles (EVs) due to their energy efficiency and high performance. Chiplets are crucial in consumer electronics, smartphones, smart TVs, laptops, and other devices. The need-based preference for chiplets here revolves around their ability to enhance performance while reducing product size in the electronics industry. In defense and aerospace, chiplets facilitate the development of advanced radar systems, spacecraft, and military-grade equipment. The defense & aerospace sector prefers chiplets with superior performance, durability, and energy efficiency. Within the healthcare sector, chiplets are used in medical imaging devices, wearable health monitors, and other equipment. Chiplets are preferred here for their high reliability, low power consumption, and compact size. In manufacturing, chiplets are incorporated for automation and robotics applications. The preference for chiplets in this sector is influenced by their ability to augment efficiency in production. The telecommunication industry leverages chiplets for its vast network infrastructure, providing a solid backbone for 5G and beyond. The preference for chiplets in telecommunication is attributed to their capabilities to handle high data volumes and low latency.
Regional Insights
In the Americas, especially the United States and Canada, the demand for chiplets is predominantly driven by the growth in high technology and cloud applications. Consumer trends show an escalating preference for hybrid computing platforms and small electronic products, accelerating the demand for the Americas' chiplet market. The market of chiplets in Europe is expanding dynamically, driven by major vendors from different European Union countries. A recent German consortium to secure the supply chain for chiplets and boost final assembly in Europe has been creating potential demand for the chiplet market across the region. The Middle East and Africa's chiplet market showcases great potential attributed to initiatives for fostering local chiplet production and improving technological self-sufficiency. The APAC region, with major technologically advanced countries, such as Japan, China, and South Korea, and predominant semiconductor manufacturers, presents lucrative opportunities for the global chiplet market. The expansion of the chiplet market in the APAC region is driven by a substantial surge in government and private investments in electronic manufacturing.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Chiplet Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Chiplet Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Chiplet Market, highlighting leading vendors and their innovative profiles. These include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., Alphawave Semi, Ambarella, Inc., Apple Inc., ASE Technology Holding Co, Ltd, Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., Broadcom Inc., Cadence Design Systems, Inc., CHIPLET.US, Chipuller, Eliyan, GlobalFoundries Inc., Huawei Technologies Co., Ltd., Intel Corporation, International Business Machines Corporation, JCET Group, Kandou Bus, S.A., Marvell Technology, Inc., MediaTek Inc., Mercury Systems, Inc., Netronome Systems, Inc., NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., Qualcomm Incorporated, RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., STMicroelectronics N.V., Synopsys, Inc., Tachyum, Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint.
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Chiplet Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Chiplet Market?
3. What are the technology trends and regulatory frameworks in the Chiplet Market?
4. What is the market share of the leading vendors in the Chiplet Market?
5. Which modes and strategic moves are suitable for entering the Chiplet Market?