全球小型晶片市場

Global Chiplets Market

出版日期: 2024年12月09日 | 出版商:

BCC Research | 英文 84 Pages | 訂單完成後即時交付

價格

簡介目錄圖表

本報告調查了全球小晶片市場，並提供了市場概況、市場影響因素和市場機會、法律制度、新興技術和技術發展趨勢、市場規模趨勢和預測，各種區分、各地區的詳細分析，競爭情況，主要企業簡介等彙整資料。

市場區隔明細
市場細分：按處理器
CPU
圖形處理單元
現場可程式閘陣列
AI-ASIC協處理器
應用處理單元
市場細分：依封裝技術
3D
系統級封裝
晶圓級構裝
覆晶尺寸封裝
覆晶球柵陣列
扇出
市場細分：依最終用戶產業
企業電子
CE產品
工業自動化
車輛
衛生保健
軍事/航太
其他
地域分佈
市場細分：依地區
北美洲
歐洲
亞太地區
其他領域

第7章競爭格局

市場生態系分析
主要企業分析
戰略分析

第8章附錄

調查方法
參考
簡稱
公司簡介
ACHRONIX SEMICONDUCTOR CORP.
ADVANCED MICRO DEVICES INC.
BROADCOM
GLOBALFOUNDRIES INC.
IBM CORP.
INTEL CORP.
NVIDIA CORP.
RANOVUS
SAMSUNG
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

簡介目錄圖表

Product Code: SMC137A

This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.

Report Scope

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024-2029.

Report Includes

In-depth assessment of the global market for semiconductor chiplets
Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
Analysis of the industry structure, including companies' market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
Company profiles

Chapter 1 Executive Summary

Market Outlook
Scope of the Report
Market Summary

Chapter 2 Market Overview

Overview
Macroeconomic Factors
Advanced Packaging Technologies
Geopolitical Tensions
Outlook

Chapter 3 Market Dynamics

Overview
Market Drivers
High-Performance Computing
5G's Growing Need for Chiplets
Market Restraints/Challenges
Shortage of Skilled Labor
Global Political and Financial Crises
Market Opportunities
Continuing Investment in the Semiconductor Industry
Use in Advanced Driver-Assistance Systems (ADAS)

Chapter 4 Regulatory Landscape

Overview
North America
Asia-Pacific
Europe
RoW

Chapter 5 Emerging Technologies

Emerging Technologies
Heterogeneous Integration
3D Integration
Advanced Packaging
Co-Packaged Optics
Chiplet-Based Systems-on-Chip

Chapter 6 Market Segmentation Analysis

Segmentation Breakdown
Market Breakdown by Processor
CPUs
Graphics Processing Units
Field-Programmable Gate Arrays
AI-ASIC Coprocessors
Application Processing Units
Market Breakdown by Packaging Technology
2.5D/3D
System-in-Package
Wafer-Level Chip-Scale Packaging
Flip Chip Chip-Scale Package
Flip Chip Ball Grid Array
Fan-Out
Market Breakdown by End-User Industry
Enterprise Electronics
Consumer Electronics
Industrial Automation
Automotive
Healthcare
Military and Aerospace
Other End-User Industries
Geographical Breakdown
Market Breakdown by Region
North America
Europe
Asia-Pacific
Rest of the World

Chapter 7 Competitive Landscape

Market Ecosystem Analysis
Analysis of Leading Companies
Strategic Analysis

Recent Developments

Chapter 8 Appendix

Research Methodology
References
Abbreviations
Company Profiles
ACHRONIX SEMICONDUCTOR CORP.
ADVANCED MICRO DEVICES INC.
BROADCOM
GLOBALFOUNDRIES INC.
IBM CORP.
INTEL CORP.
NVIDIA CORP.
RANOVUS
SAMSUNG
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

簡介目錄圖表

List of Tables

Summary Table : Global Market for Chiplets, by Region, Through 2029
Table 1 : Global Market for Chiplets, by Processor, Through 2029
Table 2 : Global Market for Chiplets, by Packaging Technology, Through 2029
Table 3 : Global Market for Chiplets, by End-User Industry, Through 2029
Table 4 : Global Market for Chiplets, by Region, Through 2029
Table 5 : North American Market for Chiplets, by Country, Through 2029
Table 6 : North American Market for Chiplets, by Processor, Through 2029
Table 7 : North American Market for Chiplets, by Packaging Technology, Through 2029
Table 8 : North American Market for Chiplets, by End-User Industry, Through 2029
Table 9 : European Market for Chiplets, by Country, Through 2029
Table 10 : European Market for Chiplets, by Processor, Through 2029
Table 11 : European Market for Chiplets, by Packaging Technology, Through 2029
Table 12 : European Market for Chiplets, by End-User Industry, Through 2029
Table 13 : Asia-Pacific Market for Chiplets, by Country, Through 2029
Table 14 : Asia-Pacific Market for Chiplets, by Processor, Through 2029
Table 15 : Asia-Pacific Market for Chiplets, by Packaging Technology, Through 2029
Table 16 : Asia-Pacific Market for Chiplets, by End-User Industry, Through 2029
Table 17 : RoW Market for Chiplets, by Country, Through 2029
Table 18 : RoW Market for Chiplets, by Processor, Through 2029
Table 19 : RoW Market for Chiplets, by Packaging Technology, Through 2029
Table 20 : RoW Market for Chiplets, by End-User Industry, Through 2029
Table 21 : Recent Developments Related to Chiplets, 2022-2024
Table 22 : Report Information Sources
Table 23 : Abbreviations Used in the Report
Table 24 : Achronix Semiconductor Corp.: Company Snapshot
Table 25 : Achronix Semiconductor Corp.: Product Portfolio
Table 26 : Achronix Semiconductor Corp.: News/Key Developments, 2023 and 2024
Table 27 : Advanced Micro Devices Inc.: Company Snapshot
Table 28 : Advanced Micro Devices Inc.: Financial Performance, FY 2022 and 2023
Table 29 : Advanced Micro Devices Inc.: Product Portfolio
Table 30 : Advanced Micro Devices Inc.: News/Key Developments, 2022 and 2023
Table 31 : Broadcom: Company Snapshot
Table 32 : Broadcom: Financial Performance, FY 2022 and 2023
Table 33 : Broadcom: Product Portfolio
Table 34 : Broadcom: News/Key Developments, 2022 and 2023
Table 35 : GlobalFoundries Inc.: Company Snapshot
Table 36 : GlobalFoundries Inc.: Financial Performance, FY 2022 and 2023
Table 37 : GlobalFoundries Inc.: Product Portfolio
Table 38 : GlobalFoundries Inc.: News/Key Developments, 2022-2024
Table 39 : IBM Corp.: Company Snapshot
Table 40 : IBM Corp.: Financial Performance, FY 2022 and 2023
Table 41 : IBM Corp.: Product Portfolio
Table 42 : IBM Corp.: News/Key Developments, 2024
Table 43 : Intel Corp.: Company Snapshot
Table 44 : Intel Corp.: Financial Performance, FY 2022 and 2023
Table 45 : Intel Corp.: Product Portfolio
Table 46 : Intel Corp.: News/Key Developments, 2022
Table 47 : NVIDIA Corp.: Company Snapshot
Table 48 : NVIDIA Corp.: Financial Performance, FY 2022 and 2023
Table 49 : NVIDIA Corp.: Product Portfolio
Table 50 : NVIDIA Corp.: News/Key Developments, 2022-2024
Table 51 : RANOVUS: Company Snapshot
Table 52 : RANOVUS: Product Portfolio
Table 53 : Samsung: Company Snapshot
Table 54 : Samsung: Financial Performance, FY 2022 and 2023
Table 55 : Samsung: Product Portfolio
Table 56 : Samsung: News/Key Developments, 2024
Table 57 : Taiwan Semiconductor Manufacturing Co. Ltd.: Company Snapshot
Table 58 : Taiwan Semiconductor Manufacturing Co. Ltd.: Financial Performance, FY 2022 and 2023
Table 59 : Taiwan Semiconductor Manufacturing Co. Ltd.: Product Portfolio
Table 60 : Taiwan Semiconductor Manufacturing Co. Ltd.: News/Key Developments, 2022

List of Figures

Summary Figure : Global Market Shares of Chiplets, by Region, 2023
Figure 1 : Market Dynamics for the Chiplet Industry
Figure 2 : Emerging Chiplet Technologies
Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
Figure 4 : Global Market Shares of Chiplets, by Packaging Technology, 2023
Figure 5 : Global Market Shares of Chiplets, by End-User Industry, 2023
Figure 6 : Global Market Shares of Chiplets, by Region, 2023
Figure 7 : Global Chiplet Ecosystem
Figure 8 : Advanced Micro Devices Inc.: Revenue Share, by Business Unit, FY 2023
Figure 9 : Advanced Micro Devices Inc.: Revenue Share, by Region, FY 2023
Figure 10 : Broadcom: Revenue Share, by Business Unit, FY 2023
Figure 11 : Broadcom: Revenue Share, by Region, FY 2023
Figure 12 : GlobalFoundries Inc.: Revenue Share, by Country/Region, FY 2023
Figure 13 : IBM Corp.: Revenue Share, by Business Unit, FY 2023
Figure 14 : IBM Corp.: Revenue Share, by Region, FY 2023
Figure 15 : Intel Corp.: Revenue Share, by Business Unit, FY 2023
Figure 16 : Intel Corp.: Revenue Share, by Region, FY 2023
Figure 17 : NVIDIA Corp.: Revenue Share, by Business Unit, FY 2023
Figure 18 : NVIDIA Corp.: Revenue Share, by Region, FY 2023
Figure 19 : Samsung: Revenue Share, by Business Unit, FY 2023
Figure 20 : Samsung: Revenue Share, by Country/Region, FY 2023
Figure 21 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Business Unit, FY 2023
Figure 22 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Share, by Region, FY 2023