市場調查報告書
商品編碼
1433313
2023-2030 年全球小晶片(Chiplet)市場Global Chiplet Market 2023-2030 |
在預測期內(2023-2030 年),小晶片市場預計將以 6.4% 的CAGR成長。小晶片是一個子處理單元,通常由同一封裝內的 I/O 控制器晶片控制。小晶片設計的概念涉及建構處理器的模組化方法。 AMD 和英特爾公司等 CPU 製造商在其產品系列中使用小晶片設計,透過提高矽產量來提高生產效率。更高的產量和模組化結構有助於減少製造高核心數組件時的浪費。與單晶片 CPU 設計相比,使用小晶片可讓製造商提高晶片產量,單晶片 CPU 設計中處理單元的所有部件都內建在一塊矽晶圓中。
全球小晶片市場依類型和最終用戶行業區隔。依類型,市場區隔為 CP) 小晶片、GPU 小晶片、FPGA 小晶片、ASIC 小晶片和記憶體小晶片。依最終用戶行業分類,市場區隔為汽車電子、消費性電子、工業自動化、醫療保健、軍事、IT 和電信。在最終用戶中,汽車電子領域對小晶片的需求預計將成長。這一成長主要是由於對先進駕駛輔助系統(ADAS) 和資訊娛樂系統等軟體支援用例的需求不斷增加。此外,汽車技術的不斷進步和全球電動車 (EV) 市場的成長也推動了對小晶片的需求。根據國際能源總署(IEA) 的2023 年全球電動車展望,電動車市場呈指數級成長,2022 年銷量突破1000 萬輛。2022 年,電動車佔所有新車銷量的14%,高於2022 年的14 %. 2021 年為 9%,2020 年將低於 5%。在汽車領域,小晶片比傳統的單晶片設計具有多種優勢。它們的模組化特性有利於快速客製化和升級,從而減少開發時間和成本。這種適應性使製造商能夠快速回應不斷變化的市場趨勢並擁抱技術突破。此外,汽車製造商(及其一級供應商)在混合和匹配來自不同分包商的組件方面獲得了更大的靈活性,消除了供應商鎖定的風險,並培育了更具彈性、健康和動態的供應鏈。考慮到汽車中使用小晶片的需求和優勢不斷成長,業界也開始關注研發和合作,這進一步推動了需求。例如,2023 年 5 月,聯發科與 NVIDIA 合作,為汽車提供轉型 AI 和加速運算解決方案。此次合作將促進整合 NVIDIA GPU 小晶片的汽車 SoC 的開發。這些小晶片將使用超快速且一致的小晶片互連技術進行互連。此外,聯發科還將在這些新型汽車 SoC 上實施 NVIDIA DRIVE OS、DRIVE IX、CUDA 和 TensorRT 軟體技術,以實現連網資訊娛樂、車內便利性和安全功能。此次合作預計將擴大汽車製造商在 NVIDIA DRIVE 平台上可用的車載資訊娛樂選項的範圍。
資訊科技 (IT) 和電信領域對 小晶片的需求預計將成長
Global Chiplet Market Size, Share & Trends Analysis Report by Type (Central Processing Unit (CPU) Chiplets, Graphics Processing Unit (GPU) Chiplets, Field-Programmable Gate Array (FPGA) Chiplets, Application-Specific Integrated Circuit (ASIC) Chiplets, and Memory Chiplets) and by End-User Industry (Automotive electronics, Consumer electronics, Industrial Automation, Healthcare, Military, and IT & Telecommunication) Forecast Period (2023-2030)
The Chiplet market is anticipated to grow at a CAGR of 6.4% during the forecast period (2023-2030). a chiplet is a sub-processing unit that is typically controlled by an I/O controller chip within the same package. The concept of chiplet design involves a modular method for constructing processors. CPU manufacturers such as AMD and Intel Corporation use chiplet designs in their product lineups which enhance production efficiency through improved silicon yields. Higher yields and modular construction help to reduce waste when manufacturing high core count components. Using chiplets allows manufacturers to increase yields of chips over monolithic CPU designs where all pieces of a processing unit are built into a single piece of silicon.
The global chiplet market is segmented by type and end-user industry. By type, the market is sub-segmented into CP) chiplet, GPU chiplet, FPGA chiplet, ASIC chiplet, and memory chiplet. By end-user industry, the market is sub-segmented into automotive electronics, consumer electronics, industrial automation, healthcare, military, IT, and telecommunication. Among the end-users, the demand for chiplets is expected to grow in automotive electronics. The growth is primarily owing to the increasing demand for software-enabled use cases such as advanced driver assistance systems (ADAS), and infotainment systems. Additionally, growing technological advancements in automobiles and the growth of the global electric vehicles (EV) market is also driving demand for chiplets. According to the 2023 Global EV outlook by the International Energy Agency (IEA), the electric car market has seen exponential growth as sales exceeded 10 million in 2022. A total of 14% of all new cars sold were electric in 2022, up from around 9% in 2021 and less than 5% in 2020. In automobiles, chiplets offer multiple advantages over conventional monolithic chip designs. Their modular nature facilitates rapid customization and upgrades, leading to reduced development time and costs. This adaptability enables manufacturers to swiftly respond to shifting market trends and embrace technological breakthroughs. Additionally, car manufacturers (along with their tier 1 suppliers) gain greater flexibility in mixing and matching components from various subcontractors, eliminating the risk of vendor lock-in and fostering a more resilient, healthy, and dynamic supply chain. Considering the growing demand and advantages of using chiplets in automobiles, industries are also focusing on research and development and collaborations which is further driving demand. For instance, in May 2023, MediaTek partnered With NVIDIA to offer transform AI and accelerated computing solutions for automobiles. This collaboration will result in the development of automotive SoCs that incorporate NVIDIA GPU chiplets. These chiplets will be interconnected using an ultra-fast and coherent chiplet interconnect technology. Additionally, MediaTek will implement NVIDIA DRIVE OS, DRIVE IX, CUDA, and TensorRT software technologies on these new automotive SoCs to enable connected infotainment, in-cabin convenience, and safety features. This partnership is expected to expand the range of in-vehicle infotainment options available to automakers on the NVIDIA DRIVE platform.
The Demand for Chiplets Is Expected to Grow in the Information Technology (IT) and Telecommunications
In IT and telecommunications, with technological advancements, demand for higher processing power and performance is also growing. Using chiplets allows manufacturers to scale up performance by integrating multiple specialized chips into a single package. Chiplets can also be designed with specific power consumption profiles, allowing for more efficient use of energy and cost reduction. Additionally, growing use cases and research, and development activities in the chiplet industry are also driving demand for the overall chiplet industry.
In the field of information technology and telecommunications, rapid technological progress has resulted in a growing need for enhanced processing capabilities and performance. The adoption of chiplets within this domain offers manufacturers a solution to augment system performance by integrating numerous specialized semiconductor chips into a unified package. These chiplets can be easily engineered to adhere to specific power consumption profiles, thereby affording a more judicious and economical use of energy resources. Also, the expanding array of applications and ongoing research and development in the chiplet industry drive overall growth and demand within this sector. For instance, in October 2023, TSMC's 2 nm manufacturing process is currently in development, and a Japanese company is making a chiplet-based CPU that incorporates the Arm Neoverse architecture. With the inclusion of customized chiplets, this novel chip can cater to diverse purposes while optimizing performance. Socionext, a Japanese provider of System-on-Chip (SoC) designs catering to various industries such as automotive, data centers, networks, and smart devices, unveiled a new 32-core Arm CPU that leverages chiplet technology. According to the company, this innovative approach is capable of delivering scalable performance ideally suited for deployment in hyperscale data centers and cutting-edge mobile infrastructures, including those designed to support 5G and 6G networks.
The global chiplet market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among the, the market is expected to grow significantly in the North American region owing to factors including the significant presence of semiconductor and end-user industries such as Intel Corp., Nvidia, and Texas Instruments among others. These players are focusing on adopting strategic initiatives and product launches. For instance, in November 2023, Mercury Systems, Inc., a technology firm specializing in providing essential processing power at the edge, disclosed a collaboration with the US Navy to establish manufacturing capabilities aimed at enabling the utilization of commercial photonics chiplets for enhancing edge processing in defense-related contexts.
In addition, over the past few years, the regional government is increasingly inclined towards the R&D activities in semiconductor industry is further propelling the market growth in North America. For instance, in 2022, the US government passed the CHIPS and Science Act which includes $52.0 billion in chip manufacturing incentives and research investments, as well as an investment tax credit for semiconductor manufacturing and semiconductor equipment manufacturing. According to the 2022 report of the Semiconductor Industry Association, the US semiconductor companies continue to invest roughly one-fifth of annual revenue in R&D amounting to $50.2 billion in 2021.
The Chiplet Market is Expected to Grow Significantly in the Asia-Pacific Region
Among these, the demand for Chiplet solutions and services is expected to grow significantly in the Asia Pacific region. The region holds the highest share in production and sales of end-user industries such as automobiles, consumer electronics, IT, and telecommunications among others. According to the International Organization of Motor Vehicle Manufacturers, 4 out of the top countries are from Asia Pacific in terms of annual automobile production in 2022 which were China, Japan, India, and South Korea. Also, the region holds a significant share in the global semiconductor industry. According to the Semiconductor Industry Association, the Asia Pacific semiconductor industry has grown from $39.8 billion in 2001 to over $330.94 billion in 2022. Additionally, growing support for the chiplet and the semiconductor industry from regional governments is also driving the demand. For instance, in May 2023, India's Center for Development of Advanced Computing (C-DAC) announced that be working on a series of ARM-based CPUs including the flagship AUM chip. Also, in January 2023, China-based electronic design automation (EDA) company Empyrean Technology announced it to be working on research and development of chiplet-based advanced packaging as well as AI-based design automation.
The major companies serving the global chiplet market are Ampere Computing, Inc., Taiwan Semiconductor Manufacturing Co., Ltd., Intel Corp., and Marvell Technology, Inc. among others. With growing demand, companies are working on R&D and collaboration to cater to the demand and stay competitive. For instance, in November 2022, Lam Research, a US-based semiconductor equipment manufacturer, acquired Semsysco, a company located in Austria, to enhance its chiplet packaging technology. This acquisition includes the integration of cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This encompasses support for fan-out panel-level packaging, a method in which chips or chiplets are cut from a large, rectangular substrate sheet significantly larger than a conventional silicon wafer. This approach allows chip manufacturers to improve yield and reduce waste.