查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1476302

2030 年 Chiplet 市場預測：按處理器、封裝技術、應用和地區進行的全球分析

Chiplets Market Forecasts to 2030 - Global Analysis By Processor, By Packaging Technologies, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC預測，2023年全球chiplet市場規模將達到68.2億美元，預計2030年將達到4,494.6億美元，預測期內複合年成長率為81.9%。

小晶片是在積體電路 (IC) 系統中執行特定功能的模組化半導體組件。這些小型晶片在組裝成更大的 IC 封裝之前均經過單獨設計、製造和測試。小晶片支援靈活且可擴展的系統設計，使 CPU、GPU 和 AI 加速器等複雜電子產品能夠提高效能、降低開發成本並加快上市時間。

根據消費者科技協會的數據，2020 年 10 月假期季節期間，美國在遊戲機、筆記型電腦、穿戴式裝置和電視等科技相關商品上平均花費約 528 美元。

對更高性能和效率的需求

隨著電子設備對技術創新的不斷追求，對更高性能和效率的需求已成為chiplet市場的主要促進因素。 Chiplet 能夠將具有最佳化效能特徵的專用元件（例如 CPU、GPU 和 AI 加速器）整合到一個系統中。這種模組化方法為設計高效能產品提供了更大的靈活性，同時也提高了能源效率。隨著消費者對速度更快、功能更強大的設備的期望不斷提高，基於小晶片的架構的採用有望顯著成長。

標準化和互通性

缺乏普遍接受的標準會導致不同供應商的小晶片之間出現相容性問題，從而阻礙無縫互通性和整合到不同的系統中。標準化的缺乏使系統設計變得複雜，增加了開發時間，並增加了製造商的成本。此外，缺乏標準化介面限制了生態系統開發和協作的潛力，抑制了創新和市場成長。

生態系發展

半導體公司、晶圓代工廠、封裝供應商和系統整合商之間的協作可以建立標準化介面、開發參考設計並建立供應鏈合作夥伴關係。這促進了創新、互通性和擴充性，從而能夠在各種應用中快速部署基於小晶片的解決方案。此外，強大的生態系統可以促進知識共用，加速技術進步並刺激投資，從而促進小晶片市場的擴張，並使相關人員能夠利用新的趨勢和需求帶來最佳機會。

智慧財產權（IP）風險

由於技術開發和整合的生態系統複雜，智慧財產權 (IP) 風險對 Chiplet 市場構成重大威脅。由於chiplet由多個營業單位開發並整合到各種系統中，因此存在知識產權侵權、詐欺以及詐欺其專有設計、演算法和技術的風險。這可能會導致法律糾紛、競爭優勢喪失和業務關係受損，並抑制小晶片產業的創新和市場成長。

COVID-19 的影響：

COVID-19 大流行擾亂了小型晶片市場，導致供應鏈中斷、工廠關閉和消費者需求減少。不確定性和景氣衰退推遲了產品發布和半導體技術投資。然而，對數位基礎設施和遠端工作解決方案的需求不斷成長，推動了chiplet在資料中心和通訊網路中的採用，在一定程度上緩解了市場低迷。

預計中央處理器 (CPU) 細分市場在預測期內將是最大的

在小晶片市場中，由於 CPU 在電子設備中發揮至關重要的作用，因此預計中央處理器 (CPU) 領域將在預測期內佔據主導地位。隨著 CPU 處理從基本運算到複雜運算的廣泛任務，對基於小晶片的高級 CPU 設計的需求不斷成長。由於資料中心、遊戲和人工智慧等各種應用對高效能運算的需求不斷成長，CPU 領域預計將在市場佔有率和收益處於領先地位。

汽車業預計在預測期內複合年成長率最高

由於 ADAS（高級駕駛輔助系統）、電動和連網汽車技術的日益普及，汽車產業預計將出現小晶片市場中最高的複合年成長率。 Chiplet 將人工智慧處理器、感測器和通訊模組等複雜功能整合到汽車系統中，以提高車輛的安全性、效率和連接性。此外，對電動車和自動駕駛汽車的需求正在推動汽車產業小晶片的成長。

比例最高的地區：

在預測期內，亞太地區將以其強大的半導體製造生態系統（包括晶圓代工廠、封裝設施和組裝廠）預計將主導小晶片市場。此外，中國、日本、韓國和台灣等國家對家用電子電器、汽車和工業自動化的需求不斷成長，正在推動小晶片的採用。此外，政府措施、技術基礎設施投資和熟練勞動力正在進一步加強亞太地區小晶片市場的領導地位。

複合年成長率最高的地區：

在預測期內，由於各種因素，亞太地區的chiplet市場預計將快速擴張。該地區擁有強大的半導體製造基礎設施、不斷增加的研發投資、不斷成長的家用電子電器需求以及擴大採用人工智慧和5G等先進技術。此外，中國、日本、韓國和台灣等主要市場參與者的存在也促進了該地區小晶片市場的良好成長軌跡。

免費客製化服務：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 應用分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球 Chiplet 市場：按處理器分類

  • 現場可程式閘陣列(FPGA)
  • 圖形處理單元（GPU）
  • 中央處理器（CPU）
  • 應用處理單元（APU）
  • 人工智慧專用積體電路（AI ASIC）

第6章全球 Chiplet 市場：依封裝技術分類

  • 2.5D封裝
  • 3D包裝
  • 板載晶片(COB)
  • 覆晶薄膜(COF)
  • 玻璃上晶片 (COG)
  • 晶圓上晶片 (COW)
  • 晶圓級封裝 (WLP)
  • 扇出晶圓級封裝 (FO-WLP)
  • 其他封裝技術

第7章全球Chiplet 市場：依應用分類

  • 家用電器
    • 智慧型手機
    • 藥片
    • 穿戴式裝置
    • 遊戲機
    • 電腦
    • 智慧家庭設備
  • 衛生保健
    • 醫療設備
    • 穿戴式健康監測器
    • 植入式醫療設備
    • 診斷設備
  • 車
    • ADAS（進階駕駛輔助系統）（ADAS）
    • 資訊娛樂系統
    • 引擎控制單元（ECU）
    • 先進的感測器
  • 航太和國防
    • 雷達系統
    • 航空電子設備
    • 通訊系統
    • 監視系統
  • 產業
    • 工業自動化
    • 機器人技術
    • 過程控制系統
    • 物聯網 (IoT) 設備
  • 通訊
    • 網路交換機
    • 路由器
    • 基地台
    • 光纖傳輸系統
  • 半導體
    • 小晶片開發
    • 整合到 SoC 中
    • 異質整合
  • 其他用途

第8章全球 Chiplet 市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第9章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第 10 章 公司概況

  • Advanced Micro Devices, Inc.（AMD）
  • Applied Materials, Inc.
  • ARM Holdings
  • Broadcom Inc.
  • GlobalFoundries Inc.
  • IBM Corporation
  • Infineon Technologies AG
  • Intel Corporation
  • Marvell Technology Group Ltd.
  • MediaTek Inc.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Qualcomm Incorporated
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Synopsys, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited（TSMC）
  • Texas Instruments Incorporated
  • United Microelectronics Corporation（UMC）
  • Xilinx, Inc.
Product Code: SMRC25848

According to Stratistics MRC, the Global Chiplets Market is accounted for $6.82 billion in 2023 and is expected to reach $449.46 billion by 2030 growing at a CAGR of 81.9% during the forecast period. Chiplets are modular semiconductor components that perform specific functions within an integrated circuit (IC) system. These small, individual chips can be independently designed, manufactured, and tested before being assembled into a larger IC package. Chiplets enable flexible and scalable system designs, allowing for improved performance, reduced development costs, and faster time-to-market for complex electronic devices such as CPUs, GPUs, and AI accelerators.

According to Consumer Technology Association, in October 2020, the population in the U.S. in the holiday season spent about US$ 528, on average, on technology-based items, which included video game consoles, laptops, wearable's and television sets.

Market Dynamics:

Driver:

Demand for higher performance and efficiency

The demand for higher performance and efficiency is a key driver in the chiplets market due to the relentless pursuit of innovation in electronic devices. Chiplets enable manufacturers to integrate specialized components with optimized performance characteristics, such as CPUs, GPUs, and AI accelerators, into a single system. This modular approach allows for greater flexibility in designing high-performance products while also improving energy efficiency. As consumer expectations for faster and more powerful devices continue to rise, the adoption of chiplet-based architectures is poised for significant growth.

Restraint:

Standardization and interoperability

Without universally accepted standards, compatibility issues arise between chiplets from different vendors, hindering seamless interoperability and integration into heterogeneous systems. This lack of standardization complicates system design, increases development time, and raises costs for manufacturers. Furthermore, the absence of standardized interfaces limits the potential for ecosystem development and collaboration, stifling innovation and market growth.

Opportunity:

Ecosystem development

Collaborative efforts among semiconductor companies, foundries, packaging suppliers, and system integrators can establish standardized interfaces, develop reference designs, and create supply chain partnerships. This fosters innovation, interoperability, and scalability, enabling faster adoption of chiplet-based solutions across various applications. Additionally, a robust ecosystem promotes knowledge sharing, accelerates technological advancements, and stimulates investment, driving the expansion of the chiplets market and unlocking new opportunities for stakeholders to capitalize on emerging trends and demands.

Threat:

Intellectual property (IP) risks

Intellectual property (IP) risks pose a significant threat to the chiplets market due to the complex ecosystem of technology development and integration. With chiplets being developed by multiple entities and integrated into various systems, there's a risk of IP infringement, unauthorized use, or misappropriation of proprietary designs, algorithms, or technologies. This can lead to legal disputes, loss of competitive advantage, and damage to business relationships, potentially hampering innovation and market growth in the chiplets industry.

Covid-19 Impact:

The COVID-19 pandemic disrupted the chiplets market, causing supply chain disruptions, factory closures, and reduced consumer demand. Uncertainty and economic downturns led to delays in product launches and investments in semiconductor technologies. However, the increased demand for digital infrastructure and remote work solutions has driven the adoption of chiplets in data centers and telecommunication networks, mitigating some of the market's downturns.

The central processing unit (CPU) segment is expected to be the largest during the forecast period

In the chiplets market, the central processing unit (CPU) segment is anticipated to dominate during the forecast period due to the critical role CPUs play in electronic devices. CPUs handle tasks ranging from basic operations to complex computations, driving demand for advanced chiplet-based CPU designs. With the increasing need for high-performance computing in various applications such as data centers, gaming, and artificial intelligence, the CPU segment is expected to lead in market share and revenue.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive segment is poised for the highest CAGR in the chiplets market due to the increasing adoption of advanced driver assistance systems (ADAS), electrification, and connected vehicle technologies. Chiplets enable the integration of complex functionalities, such as AI processors, sensors, and communication modules, into automotive systems, enhancing vehicle safety, efficiency, and connectivity. Additionally, the demand for electric and autonomous vehicles further drives the growth of chiplets in the automotive sector.

Region with largest share:

Over the forecast period, Asia Pacific is poised to dominate the chiplets market due to the region's robust semiconductor manufacturing ecosystem, including foundries, packaging facilities, and assembly plants. Additionally, the growing demand for consumer electronics, automotive vehicles, and industrial automation in countries like China, Japan, South Korea, and Taiwan drives the adoption of chiplets. Moreover, government initiatives, investments in technology infrastructure, and a skilled workforce further bolster Asia Pacific's leadership in the chiplets market.

Region with highest CAGR:

During the forecast period, the Asia Pacific region is expected to experience rapid expansion in the chiplets market due to various factors. These include the region's robust semiconductor manufacturing infrastructure, increasing investments in research and development, growing demand for consumer electronics and rising adoption of advanced technologies such as artificial intelligence and 5G. Additionally, the presence of key market players in countries like China, Japan, South Korea, and Taiwan contribute to the region's promising growth trajectory in the chiplets market.

Key players in the market

Some of the key players in Chiplets Market include Advanced Micro Devices, Inc. (AMD), Applied Materials, Inc., ARM Holdings, Broadcom Inc., GlobalFoundries Inc., IBM Corporation, Infineon Technologies AG, Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., Micron Technology, Inc., NVIDIA Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Synopsys, Inc., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Texas Instruments Incorporated, United Microelectronics Corporation (UMC) and Xilinx, Inc.

Key Developments:

In January 2024, Intel Corportion announced its intention to collaborate with an R&D hub named IMEC, to ensure Intel's advanced chiplet packaging technologies satisfy the stringent quality and reliability requirements required for automotive use cases.

In August 2023, Google Cloud (US) and NVIDIA Corporation (US) collaborated to offer advanced AI infrastructure and software for deploying large generative AI models and accelerating data science tasks. This partnership streamlines AI supercomputer deployment via Google Cloud's NVIDIA-powered solutions, leveraging the same technology utilized by Google DeepMind and research teams. The integration optimizes PaxML, Google's LLM framework, for NVIDIA, accelerated computing, enhancing experimentation and scalability with H100 and A100 Tensor Core GPUs.

In June 2023, Intel Corporation (US) announced a partnership with Taiwan Semiconductor Manufacturing Company Limited (Taiwan) to manufacture chips for Intel's high-performance computing and graphics products. The partnership would help Intel reduce its reliance on external foundries.

Processors Covered:

  • Field-Programmable Gate Array (FPGA)
  • Graphics Processing Unit (GPU)
  • Central Processing Unit (CPU)
  • Application Processing Unit (APU)
  • Artificial Intelligence Application-specific Integrated Circuit (AI ASIC)

Packaging Technologies Covered:

  • 2.5D Packaging
  • 3D Packaging
  • Chip-on-Board (COB)
  • Chip-on-Flex (COF)
  • Chip-on-Glass (COG)
  • Chip-on-Wafer (COW)
  • Wafer-Level Packaging (WLP)
  • Fan-Out Wafer-Level Packaging (FO-WLP)
  • Other Packaging Technologies

Applications Covered:

  • Consumer Electronics
  • Healthcare
  • Automotive
  • Aerospace and Defense
  • Industrial
  • Telecommunications
  • Semiconductor
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Chiplets Market, By Processor

  • 5.1 Introduction
  • 5.2 Field-Programmable Gate Array (FPGA)
  • 5.3 Graphics Processing Unit (GPU)
  • 5.4 Central Processing Unit (CPU)
  • 5.5 Application Processing Unit (APU)
  • 5.6 Artificial Intelligence Application-specific Integrated Circuit (AI ASIC)

6 Global Chiplets Market, By Packaging Technology

  • 6.1 Introduction
  • 6.2 2.5D Packaging
  • 6.3 3D Packaging
  • 6.4 Chip-on-Board (COB)
  • 6.5 Chip-on-Flex (COF)
  • 6.6 Chip-on-Glass (COG)
  • 6.7 Chip-on-Wafer (COW)
  • 6.8 Wafer-Level Packaging (WLP)
  • 6.9 Fan-Out Wafer-Level Packaging (FO-WLP)
  • 6.10 Other Packaging Technologies

7 Global Chiplets Market, By Application

  • 7.1 Introduction
  • 7.2 Consumer Electronics
    • 7.2.1 Smartphones
    • 7.2.2 Tablets
    • 7.2.3 Wearable Devices
    • 7.2.4 Gaming Consoles
    • 7.2.5 Personal Computers
    • 7.2.6 Smart Home Devices
  • 7.3 Healthcare
    • 7.3.1 Medical Devices
    • 7.3.2 Wearable Health Monitors
    • 7.3.3 Implantable Medical Devices
    • 7.3.4 Diagnostic Equipment
  • 7.4 Automotive
    • 7.4.1 Advanced Driver Assistance Systems (ADAS)
    • 7.4.2 Infotainment Systems
    • 7.4.3 Engine Control Units (ECUs)
    • 7.4.4 Advanced Sensors
  • 7.5 Aerospace and Defense
    • 7.5.1 Radar Systems
    • 7.5.2 Avionics
    • 7.5.3 Communication Systems
    • 7.5.4 Surveillance Systems
  • 7.6 Industrial
    • 7.6.1 Industrial Automation
    • 7.6.2 Robotics
    • 7.6.3 Process Control Systems
    • 7.6.4 Internet of Things (IoT) Devices
  • 7.7 Telecommunications
    • 7.7.1 Network Switches
    • 7.7.2 Routers
    • 7.7.3 Base Stations
    • 7.7.4 Optical Transport Systems
  • 7.8 Semiconductor
    • 7.8.1 Chiplet Development
    • 7.8.2 Incorporation into SoCs
    • 7.8.3 Heterogeneous Integration
  • 7.9 Other Applications

8 Global Chiplets Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Advanced Micro Devices, Inc. (AMD)
  • 10.2 Applied Materials, Inc.
  • 10.3 ARM Holdings
  • 10.4 Broadcom Inc.
  • 10.5 GlobalFoundries Inc.
  • 10.6 IBM Corporation
  • 10.7 Infineon Technologies AG
  • 10.8 Intel Corporation
  • 10.9 Marvell Technology Group Ltd.
  • 10.10 MediaTek Inc.
  • 10.11 Micron Technology, Inc.
  • 10.12 NVIDIA Corporation
  • 10.13 Qualcomm Incorporated
  • 10.14 Renesas Electronics Corporation
  • 10.15 Samsung Electronics Co., Ltd.
  • 10.16 Synopsys, Inc.
  • 10.17 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • 10.18 Texas Instruments Incorporated
  • 10.19 United Microelectronics Corporation (UMC)
  • 10.20 Xilinx, Inc.

List of Tables

  • Table 1 Global Chiplets Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Chiplets Market Outlook, By Processor (2021-2030) ($MN)
  • Table 3 Global Chiplets Market Outlook, By Field-Programmable Gate Array (FPGA) (2021-2030) ($MN)
  • Table 4 Global Chiplets Market Outlook, By Graphics Processing Unit (GPU) (2021-2030) ($MN)
  • Table 5 Global Chiplets Market Outlook, By Central Processing Unit (CPU) (2021-2030) ($MN)
  • Table 6 Global Chiplets Market Outlook, By Application Processing Unit (APU) (2021-2030) ($MN)
  • Table 7 Global Chiplets Market Outlook, By Artificial Intelligence Application-specific Integrated Circuit (AI ASIC) (2021-2030) ($MN)
  • Table 8 Global Chiplets Market Outlook, By Packaging Technology (2021-2030) ($MN)
  • Table 9 Global Chiplets Market Outlook, By 2.5D Packaging (2021-2030) ($MN)
  • Table 10 Global Chiplets Market Outlook, By 3D Packaging (2021-2030) ($MN)
  • Table 11 Global Chiplets Market Outlook, By Chip-on-Board (COB) (2021-2030) ($MN)
  • Table 12 Global Chiplets Market Outlook, By Chip-on-Flex (COF) (2021-2030) ($MN)
  • Table 13 Global Chiplets Market Outlook, By Chip-on-Glass (COG) (2021-2030) ($MN)
  • Table 14 Global Chiplets Market Outlook, By Chip-on-Wafer (COW) (2021-2030) ($MN)
  • Table 15 Global Chiplets Market Outlook, By Wafer-Level Packaging (WLP) (2021-2030) ($MN)
  • Table 16 Global Chiplets Market Outlook, By Fan-Out Wafer-Level Packaging (FO-WLP) (2021-2030) ($MN)
  • Table 17 Global Chiplets Market Outlook, By Other Packaging Technologies (2021-2030) ($MN)
  • Table 18 Global Chiplets Market Outlook, By Application (2021-2030) ($MN)
  • Table 19 Global Chiplets Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 20 Global Chiplets Market Outlook, By Smartphones (2021-2030) ($MN)
  • Table 21 Global Chiplets Market Outlook, By Tablets (2021-2030) ($MN)
  • Table 22 Global Chiplets Market Outlook, By Wearable Devices (2021-2030) ($MN)
  • Table 23 Global Chiplets Market Outlook, By Gaming Consoles (2021-2030) ($MN)
  • Table 24 Global Chiplets Market Outlook, By Personal Computers (2021-2030) ($MN)
  • Table 25 Global Chiplets Market Outlook, By Smart Home Devices (2021-2030) ($MN)
  • Table 26 Global Chiplets Market Outlook, By Healthcare (2021-2030) ($MN)
  • Table 27 Global Chiplets Market Outlook, By Medical Devices (2021-2030) ($MN)
  • Table 28 Global Chiplets Market Outlook, By Wearable Health Monitors (2021-2030) ($MN)
  • Table 29 Global Chiplets Market Outlook, By Implantable Medical Devices (2021-2030) ($MN)
  • Table 30 Global Chiplets Market Outlook, By Diagnostic Equipment (2021-2030) ($MN)
  • Table 31 Global Chiplets Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 32 Global Chiplets Market Outlook, By Advanced Driver Assistance Systems (ADAS) (2021-2030) ($MN)
  • Table 33 Global Chiplets Market Outlook, By Infotainment Systems (2021-2030) ($MN)
  • Table 34 Global Chiplets Market Outlook, By Engine Control Units (ECUs) (2021-2030) ($MN)
  • Table 35 Global Chiplets Market Outlook, By Advanced Sensors (2021-2030) ($MN)
  • Table 36 Global Chiplets Market Outlook, By Aerospace and Defense (2021-2030) ($MN)
  • Table 37 Global Chiplets Market Outlook, By Radar Systems (2021-2030) ($MN)
  • Table 38 Global Chiplets Market Outlook, By Avionics (2021-2030) ($MN)
  • Table 39 Global Chiplets Market Outlook, By Communication Systems (2021-2030) ($MN)
  • Table 40 Global Chiplets Market Outlook, By Surveillance Systems (2021-2030) ($MN)
  • Table 41 Global Chiplets Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 42 Global Chiplets Market Outlook, By Industrial Automation (2021-2030) ($MN)
  • Table 43 Global Chiplets Market Outlook, By Robotics (2021-2030) ($MN)
  • Table 44 Global Chiplets Market Outlook, By Process Control Systems (2021-2030) ($MN)
  • Table 45 Global Chiplets Market Outlook, By Internet of Things (IoT) Devices (2021-2030) ($MN)
  • Table 46 Global Chiplets Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 47 Global Chiplets Market Outlook, By Network Switches (2021-2030) ($MN)
  • Table 48 Global Chiplets Market Outlook, By Routers (2021-2030) ($MN)
  • Table 49 Global Chiplets Market Outlook, By Base Stations (2021-2030) ($MN)
  • Table 50 Global Chiplets Market Outlook, By Optical Transport Systems (2021-2030) ($MN)
  • Table 51 Global Chiplets Market Outlook, By Semiconductor (2021-2030) ($MN)
  • Table 52 Global Chiplets Market Outlook, By Chiplet Development (2021-2030) ($MN)
  • Table 53 Global Chiplets Market Outlook, By Incorporation into SoCs (2021-2030) ($MN)
  • Table 54 Global Chiplets Market Outlook, By Heterogeneous Integration (2021-2030) ($MN)
  • Table 55 Global Chiplets Market Outlook, By Other Applications (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.