查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1580897

電子封裝市場：按材料、技術和應用分類 - 2025-2030 年全球預測

Electronic Packaging Market by Material (Glass, Metal, Plastic), Technology (Chip-on-Board, Surface Mount Technology, Through-Hole Technology), Application - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 184 Pages | 商品交期: 最快1-2個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

2023年電子封裝市場價值為31.9億美元，預計到2024年將達到36.9億美元，複合年成長率為16.55%，到2030年將達到93.2億美元。

電子封裝市場包括用於保護和整合設備內電子元件的材料和方法。免受物理、熱和電磁干擾的保護可確保功能性、可靠性和使用壽命。電子封裝的需求源自於對更小、更輕和更有效率的電子產品日益成長的需求。先進封裝在家用電子電器、汽車、醫療保健、航太和通訊等多個領域都有應用，而先進封裝技術對於最佳化設備性能至關重要。最終用途範圍廣泛，包括半導體、印刷基板(PCB)、感測器、光電元件等。主要市場促進因素包括快速成長的消費性電子市場、物聯網 (IoT) 設備的進步以及需要先進電力電子封裝解決方案的電動車的日益普及。 5G和人工智慧等新興技術也正在重振市場，為更高密度整合和增強溫度控管解決方案提供機會。然而，市場面臨挑戰，例如與先進封裝技術相關的高成本以及需要持續創新以滿足不斷變化的設備要求。包裝材料也存在嚴格的法規和環境影響等限制。機會在於提高性能同時縮小尺寸和成本的創新，例如 3D 封裝、系統級封裝(SiP) 解決方案以及奈米技術的進步。環保永續的包裝材料也是解決市場需求和監管壓力的重要研究途徑。隨著公司尋求成長，投資智慧包裝解決方案和環保替代品的研發至關重要。市場動態是動態的，趨勢傾向於整合、小型化和永續性，需要不斷適應和投資最尖端科技以保持競爭力。探索跨行業應用並專注於客製化也將為這個不斷發展的領域的擴展和創新開闢新的途徑。

主要市場統計
基準年[2023] 31.9億美元
預測年份 [2024] 36.9億美元
預測年份 [2030] 93.2億美元
複合年成長率（%） 16.55%

市場動態：揭示快速發展的電子封裝市場的關鍵市場洞察

電子封裝市場正因供需的動態交互作用而轉變。透過了解這些不斷變化的市場動態，公司可以準備好做出明智的投資決策、完善策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險，並了解消費行為及其對製造成本的影響，並更清楚地了解對採購趨勢的影響。

  • 市場促進因素
    • 半導體產業的成長對先進電子封裝的需求
    • 汽車產業擴張，重點是電子元件和感測器
    • 對環境永續性的興趣日益濃厚，導致環保包裝材料的開發
    • 政府法規和標準要求提高電子封裝的可靠性和性能
  • 市場限制因素
    • 持續的技術進步對維持電子封裝標準提出了挑戰
    • 原物料價格波動影響整個電子封裝市場的製造成本與價格穩定性
  • 市場機會
    • 5G技術的擴展及其對電子封裝要求的影響
    • 擴大系統級封裝(SiP) 技術在高效能應用的使用
    • 創新電子封裝溫度控管解決方案，防止過熱並提高可靠性
  • 市場挑戰
    • 解決密集電子電路中的電磁干擾與訊號完整性問題
    • 整合先進材料和奈米技術，滿足特定行業的電子封裝要求

波特五力：駕馭電子封裝市場的策略工具

波特的五力架構是了解電子封裝市場競爭格局的重要工具。波特的五力框架為評估公司的競爭地位和探索策略機會提供了清晰的方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢，解決弱點並避免潛在的挑戰，從而確保更強大的市場地位。

PESTLE分析：了解電子封裝市場的外部影響

外部宏觀環境因素在塑造電子封裝市場的表現動態方面發揮著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素，公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化，並幫助他們做出積極主動的決策。

市場佔有率分析 了解電子封裝市場的競爭格局

對電子封裝市場的詳細市場佔有率分析可以對供應商績效進行全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、分散和整合的趨勢，為供應商提供了製定策略決策所需的洞察力，使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV定位矩陣電子封裝市場供應商績效評估

FPNV定位矩陣是評估電子封裝市場供應商的重要工具。此矩陣允許業務組織根據供應商的商務策略和產品滿意度評估供應商，從而做出符合其目標的明智決策。這四個象限使您能夠清晰、準確地分類供應商，並確定最能滿足您的策略目標的合作夥伴和解決方案。

制定電子封裝市場成功之路的策略分析與建議

電子封裝市場的策略分析對於旨在加強其在全球市場的影響力的公司至關重要。透過審查關鍵資源、能力和績效指標，公司可以識別成長機會並努力改進。這種方法使您能夠克服競爭環境中的挑戰，利用新的商機並取得長期成功。

本報告對市場進行了全面分析，涵蓋關鍵重點領域：

1. 市場滲透率：詳細檢視當前市場環境、主要企業的廣泛資料、評估其在市場中的影響力和整體影響力。

2. 市場開拓：辨識新興市場的成長機會，評估現有領域的擴張潛力，並提供未來成長的策略藍圖。

3. 市場多元化：分析近期產品發布、開拓地區、關鍵產業進展、塑造市場的策略投資。

4. 競爭評估與情報：徹底分析競爭格局，檢驗市場佔有率、業務策略、產品系列、認證、監理核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新：重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題，幫助相關人員做出明智的決策：

1.目前的市場規模和未來的成長預測是多少？

2. 哪些產品、區隔市場和地區提供最佳投資機會？

3.塑造市場的主要技術趨勢和監管影響是什麼？

4.主要廠商的市場佔有率和競爭地位如何？

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 半導體產業的成長推動了對先進技術的需求
      • 汽車產業擴張，重點是電子元件和感測器
      • 人們對環境永續性的興趣日益濃厚，導致了環保包裝材料的開發。
      • 政府法規和標準要求提高電子封裝的可靠性和性能
    • 抑制因素
      • 不斷的技術進步創造了一個難以跟上電子封裝標準的環境
      • 原物料價格的波動影響整體製造成本和價格穩定性。電子封裝市場
    • 機會
      • 5G技術的擴展及其對電子封裝要求的影響
      • 提高高效能應用系統級封裝(SiP) 技術的使用率
      • 電子封裝溫度控管解決方案的創新，可防止過熱並提高可靠性
    • 任務
      • 解決密集電子電路中的電磁干擾與訊號完整性問題
      • 整合尖端材料和奈米技術，滿足特定產業的電子封裝要求
  • 市場區隔分析
    • 材質：熱穩定性增加了玻璃在電子封裝中的使用
    • 應用：電子包裝在醫療保健領域的新興應用與生物相容性包裝
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社群
    • 技術的
    • 合法地
    • 環境

第6章電子封裝市場：依材料分類

  • 玻璃
  • 金屬
  • 塑膠

第7章電子封裝市場：依技術分類

  • 板載晶片
  • 表面黏著技術
  • 通孔技術

第8章電子封裝市場：依應用分類

  • 車
  • 家電
  • 衛生保健
  • 產業
  • 通訊

第9章美洲電子封裝市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第10章亞太地區電子封裝市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第11章歐洲、中東和非洲電子封裝市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第12章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
    • Specialized Packaging Group 收購 Clark Foam，增強泡棉包裝領域的能力和市場覆蓋範圍
    • 美光和 Namtech 合作培養技術純熟勞工並加強印度半導體封裝行業
    • 肖特透過先進的封裝解決方案提高航太電子產品的可靠性
  • 戰略分析和建議

公司名單

  • Advanced Micro Devices, Inc.
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co, Ltd
  • Avnet, Inc.
  • Broadcom Inc.
  • DuPont de Nemours, Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Jabil, Inc.
  • Microchip Technology Inc.
  • Micron Technology, Inc.
  • NXP BV
  • ON Semiconductor Corporation
  • Power Integrations, Inc.
  • Qualcomm Technologies, Inc
  • Renesas Electronics Corporation
  • ROHM Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Schott AG
  • Skyworks Solutions, Inc.
  • Smart Global Holdings, Inc
  • Smurfit Kappa Group PLC
  • Sonoco Products Company
  • Specialized Packaging Group, Inc.
  • STMicroelectronics International NV
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • Vishay Intertechnology, Inc.
Product Code: MRR-3C68ED2D0EE7

The Electronic Packaging Market was valued at USD 3.19 billion in 2023, expected to reach USD 3.69 billion in 2024, and is projected to grow at a CAGR of 16.55%, to USD 9.32 billion by 2030.

The electronic packaging market encompasses the materials and methods used to protect and integrate electronic components within devices. It ensures functionality, reliability, and longevity by shielding from physical, thermal, and electromagnetic interference. The necessity for electronic packaging arises from the growing demand for miniaturized, lightweight, and more efficient electronic products. Applications span across multiple sectors, including consumer electronics, automotive, healthcare, aerospace, and telecommunications, where advanced packaging technologies are crucial for optimal device performance. The end-use scope is broad, covering semiconductors, printed circuit boards (PCBs), sensors, and optoelectronic components. Key growth drivers include the burgeoning consumer electronics market, advancements in Internet of Things (IoT) devices, and the increasing adoption of electric vehicles, which demand sophisticated packaging solutions for power electronics. Emerging technologies such as 5G and AI also fuel the market, presenting opportunities for high-density integration and enhanced thermal management solutions. However, the market faces challenges such as high costs associated with advanced packaging technologies and the need for continuous innovation to meet evolving device requirements. Limitations include stringent regulations and the environmental impact associated with packaging materials. Opportunities lie in innovations like 3D packaging, system-in-package (SiP) solutions, and advancements in nanotechnology that can enhance performance while reducing size and cost. Eco-friendly and sustainable packaging materials also represent a critical research avenue, addressing both market demand and regulatory pressures. As businesses seek growth, investing in R&D for smart packaging solutions and eco-friendly alternatives will be pivotal. The electronic packaging market is dynamic, with trends leaning towards integration, miniaturization, and sustainability, necessitating continuous adaptation and investment in cutting-edge technology to maintain competitive edge. Exploring cross-industry applications and focusing on customization will also open new avenues for expansion and innovation in this evolving field.

KEY MARKET STATISTICS
Base Year [2023] USD 3.19 billion
Estimated Year [2024] USD 3.69 billion
Forecast Year [2030] USD 9.32 billion
CAGR (%) 16.55%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Electronic Packaging Market

The Electronic Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growth in semiconductor industry driving the need for advanced electronic packaging
    • Expansion of the automotive industry with emphasis on electronic components and sensors
    • Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
    • Government regulations and standards mandating improved reliability and performance of electronic packaging
  • Market Restraints
    • Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
    • Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
  • Market Opportunities
    • Expansion of 5G technology and its impact on electronic packaging requirements
    • Increased utilization of system-in-package (SiP) technology for high-performance applications
    • Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
  • Market Challenges
    • Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
    • Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements

Porter's Five Forces: A Strategic Tool for Navigating the Electronic Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Electronic Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Electronic Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Electronic Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Electronic Packaging Market

A detailed market share analysis in the Electronic Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Electronic Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Electronic Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Electronic Packaging Market

A strategic analysis of the Electronic Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Electronic Packaging Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Amkor Technology, Inc., Analog Devices, Inc., ASE Technology Holding Co, Ltd, Avnet, Inc., Broadcom Inc., DuPont de Nemours, Inc., Infineon Technologies AG, Intel Corporation, Jabil, Inc., Microchip Technology Inc., Micron Technology, Inc., NXP B.V., ON Semiconductor Corporation, Power Integrations, Inc., Qualcomm Technologies, Inc, Renesas Electronics Corporation, ROHM Co., Ltd., Samsung Electronics Co., Ltd., Schott AG, Skyworks Solutions, Inc., Smart Global Holdings, Inc, Smurfit Kappa Group PLC, Sonoco Products Company, Specialized Packaging Group, Inc., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company, Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Electronic Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Glass, Metal, and Plastic.
  • Based on Technology, market is studied across Chip-on-Board, Surface Mount Technology, and Through-Hole Technology.
  • Based on Application, market is studied across Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growth in semiconductor industry driving the need for advanced electronic packaging
      • 5.1.1.2. Expansion of the automotive industry with emphasis on electronic components and sensors
      • 5.1.1.3. Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
      • 5.1.1.4. Government regulations and standards mandating improved reliability and performance of electronic packaging
    • 5.1.2. Restraints
      • 5.1.2.1. Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
      • 5.1.2.2. Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
    • 5.1.3. Opportunities
      • 5.1.3.1. Expansion of 5G technology and its impact on electronic packaging requirements
      • 5.1.3.2. Increased utilization of system-in-package (SiP) technology for high-performance applications
      • 5.1.3.3. Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
    • 5.1.4. Challenges
      • 5.1.4.1. Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
      • 5.1.4.2. Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Material: Increasing applications of Glass in electronic packaging due to thermal stability
    • 5.2.2. Application: Emerging applications of electronic packaging in healthcare owing to biocompatible packaging
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Electronic Packaging Market, by Material

  • 6.1. Introduction
  • 6.2. Glass
  • 6.3. Metal
  • 6.4. Plastic

7. Electronic Packaging Market, by Technology

  • 7.1. Introduction
  • 7.2. Chip-on-Board
  • 7.3. Surface Mount Technology
  • 7.4. Through-Hole Technology

8. Electronic Packaging Market, by Application

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Consumer Electronics
  • 8.4. Healthcare
  • 8.5. Industrial
  • 8.6. Telecommunications

9. Americas Electronic Packaging Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Electronic Packaging Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Electronic Packaging Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Specialized Packaging Group Acquires Clark Foam to Boost Capabilities and Market Reach in Foam Packaging Sector
    • 12.3.2. Micron and Namtech Join Forces to Train Skilled Workforce, Strengthening India's Semiconductor Packaging Industry
    • 12.3.3. Schott Enhances Reliability of Aerospace Electronics with Advanced Packaging Solution
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Advanced Micro Devices, Inc.
  • 2. Amkor Technology, Inc.
  • 3. Analog Devices, Inc.
  • 4. ASE Technology Holding Co, Ltd
  • 5. Avnet, Inc.
  • 6. Broadcom Inc.
  • 7. DuPont de Nemours, Inc.
  • 8. Infineon Technologies AG
  • 9. Intel Corporation
  • 10. Jabil, Inc.
  • 11. Microchip Technology Inc.
  • 12. Micron Technology, Inc.
  • 13. NXP B.V.
  • 14. ON Semiconductor Corporation
  • 15. Power Integrations, Inc.
  • 16. Qualcomm Technologies, Inc
  • 17. Renesas Electronics Corporation
  • 18. ROHM Co., Ltd.
  • 19. Samsung Electronics Co., Ltd.
  • 20. Schott AG
  • 21. Skyworks Solutions, Inc.
  • 22. Smart Global Holdings, Inc
  • 23. Smurfit Kappa Group PLC
  • 24. Sonoco Products Company
  • 25. Specialized Packaging Group, Inc.
  • 26. STMicroelectronics International N.V.
  • 27. Taiwan Semiconductor Manufacturing Company, Ltd.
  • 28. Texas Instruments Incorporated
  • 29. Toshiba Corporation
  • 30. Vishay Intertechnology, Inc.

LIST OF FIGURES

  • FIGURE 1. ELECTRONIC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. ELECTRONIC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. ELECTRONIC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. ELECTRONIC PACKAGING MARKET DYNAMICS
  • TABLE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY GLASS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP-ON-BOARD, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH-HOLE TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 26. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 27. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 29. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 30. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 32. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 33. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 34. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 35. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 36. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 37. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 38. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 39. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 41. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 42. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 43. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 45. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 46. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 47. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 49. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 50. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 52. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 55. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 56. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 57. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 58. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 59. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 60. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 61. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 62. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 64. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 65. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 66. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 67. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 70. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 71. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 72. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 73. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 74. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 76. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 77. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 78. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 79. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 82. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 83. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 84. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 85. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 86. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 87. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 89. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 90. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 91. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 92. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 93. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 94. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 95. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 98. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 99. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 100. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 101. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 102. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 103. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 104. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 105. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 106. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 107. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 109. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 110. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 111. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 112. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 113. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 114. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 115. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 116. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 117. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 118. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 119. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 120. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 121. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 122. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 123. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 124. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 125. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 126. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 127. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 128. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 129. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 130. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 131. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 132. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 133. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 134. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 135. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 136. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 137. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 138. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 139. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 140. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 141. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 142. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 143. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 148. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 149. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023