市場調查報告書
商品編碼
1351138
2030 年電子封裝市場預測:按材料、類型、封裝技術、技術、最終用戶和地區進行的全球分析Electronic Packaging Market Forecasts to 2030 - Global Analysis By Material, Type, Packaging Technology (Chip Scale Packages, Surface Mount Technology and Through Hole Mounting), Technology, End User and By Geography |
根據Stratistics MRC的數據,2023年全球電子封裝市場規模為17.6億美元,預計到2030年將達到64.9億美元,預測期內年複合成長率為20.51%。
電子封裝是指從大型電腦和單一半導體等電子零件到整個系統的各種機殼的設計和製造。這可以防止機械損壞、冷卻、射頻雜訊發射和靜電放電。高效的電氣和半導體封裝用於智慧型手機、電視、平板電腦、機上盒和數位適配器等消費性電子設備的生產,以保護零件免受灰塵、腐蝕、水和靜電放電的影響。
據 IBEF 稱,到 2025 年,印度電動車(EV) 市場規模預計將達到 5,000 億印度盧比(70.9 億美元)。此外,根據CEEW能源金融中心的一項研究,到2030年,印度的電動車商機將達到2,060億美元。
消費性電子產品之所以成為引人注目的產業,是因為其內建的技術進步能夠降低成本並增加利潤。隨著產業包裝設計的快速發展,電子封裝業務面臨產業技術進步的壓力。此外,隨著技術的進步,對電子封裝的需求也不斷增加和變化。矽IC技術的快速進步是電子封裝市場的主要特徵之一。
人們對環境永續性的興趣日益濃厚,對環保包裝材料和製造技術的需求也隨之增加。然而,找到滿足性能目標、預算限制和環境法規的可行替代方案可能很困難。此外,潛在的可靠性問題可能會限制市場擴張,因為將零件焊接到電路基板會使零件承受壓力,並且需要複雜且困難的維護。
消費性電子產品的商品化、消費者購買趨勢的變化以及產品生命週期的縮短是推動電子封裝市場擴張的主要要素。此外,智慧型手機、穿戴式科技、電視、數位相機和平板電腦等消費性電子產品以及用於抵禦惡劣天氣的泡沫包裝和氣枕等創新包裝產品的使用日益增多,也導致了市場的擴大。此外,路由器、網路伺服器和感測器等敏感電子產品對防風雨保護包裝的需求也不斷增加。由於各個新興經濟體中行動電話和智慧運算設備的使用不斷增加,預計該市場將會擴大。
電子封裝產業涉及尖端封裝概念、方法和技術的創造。智慧財產權 (IP) 保護對於促進創新和防止未經授權的使用和複製至關重要。保護智慧財產權的挑戰可能很困難,特別是在智慧財產權法律和執法實踐寬鬆的地區。然而,電子封裝對材料成本、製造工序和設備要求較高。這使得業務資源有限的中小型企業難以採用尖端的包裝方法。
政府為應對 COVID-19 疫情而實施的限制迫使電子封裝製造商暫停生產,擾亂了半導體製造和供應業務的供應鏈。由於 COVID-19 的爆發,對配備半導體的產品的需求正在減少。由於封鎖情況,小工具的生產已經停止。全球電子封裝市場的整個供應鏈因此被擾亂。
由於對資料處理設備、資料顯示設備、電腦以及飛機導引和控制組件等軍事和航太設備的需求不斷增加,預計航太和國防領域在預測期內將佔據最大的市場佔有率。此外,航太航太和國防領域(例如海軍軍艦、衛星通訊載通道和武器控制系統)對優質軍用級封裝的需求也推動了電子封裝市場收入的成長。
預計金屬類別在預測期內將經歷最高的年複合成長率,因為金屬機械強度高,提供電磁屏蔽,並且可以以最小的原型和小批量生產的特殊模具成本快速製造。此外,金屬由於其優異的機械性能、導電性、導熱性和屏蔽性能而經常用於各種包裝用途。
由於汽車基礎設施的擴張和電動車銷量的增加,預計亞太地區在預測期內將佔據最大的市場佔有率。由於充滿活力的年輕人口和不斷成長的中等收入群體,汽車領域的需求可能會增加。 IBEF 預測,到 2022 年 6 月,小客車、三輪車、兩輪車和四輪車的產量將總合2,081,148 輛,為該地區的市場擴張提供動力。
由於電子領域的需求、技術進步以及醫療保健設備和包裝解決方案的大量應用領域,預計亞太地區將實現盈利成長。在不久的將來,預計該地區的市場成長將受到各種電子產品的電子設備和商品日益萎縮的推動。根據國家投資促進和便利化局(NIPFA)的報告,印度對電子產品的需求大幅增加。憑藉強力的法規支持、多個相關人員的大量投資以及對電子產品不斷成長的需求,預計到 2025 年,電子設備部門將達到 2,200 億美元。
According to Stratistics MRC, the Global Electronic Packaging Market is accounted for $1.76 billion in 2023 and is expected to reach $6.49 billion by 2030 growing at a CAGR of 20.51% during the forecast period. Electronic packaging is the design and manufacture of enclosures for electronic components, such as mainframe computers or individual semiconductors, up to entire systems. This guards against mechanical harm, cooling, the emission of radio frequency noise, and electrostatic discharge. When making consumer electronics like smartphones, TVs, tablets, set-top boxes, and digital media adapters, efficient electrical and semiconductor packaging is used to shield the components from dust, corrosion, water, and electrostatic discharge.
According to IBEF, India's electric vehicle (EV) market is expected to reach INR 50,000 crores (USD 7.09 billion) by 2025. Further, a CEEW Centre for Energy Finance study shows India's USD 206 billion in opportunities for electric vehicles by 2030.
Consumer electronics products have a compelling case for business because of the technological advancement that is integrated into them and has the ability to lower costs and boost profits. Electronic packaging businesses are under pressure from technological advancements in the industry since the industry's package design is developing rapidly. Additionally, the requirements for electronic packaging increase and change as technology advances. The rapid advancement of silicon IC technology is one of the key characteristics of the electronics packaging market.
There is a rising demand for environmentally friendly packaging materials and manufacturing techniques as environmental sustainability becomes more and more of a concern. However, it can be difficult to locate viable alternatives that satisfy performance objectives, budgetary restrictions, and environmental regulations. Also, potential reliability difficulties could limit market expansion because soldering components onto circuit boards exposes them to stress and requires complicated, challenging maintenance.
The commoditization of consumer electronics devices, evolving consumer purchasing trends, and shortening product life cycles are key drivers boosting the electronics packaging market's expansion. Additionally, the market is expanding due to the increasing use of consumer electronics devices like smartphones, wearable technology, televisions, digital cameras, and tablets that have innovative packaging products like air bubble wrap and air pillows to protect them from bad weather. Moreover, demand for all-weather protective packaging for delicate electronic products, including routers, network servers, and sensors, is also increasing. The market is expected to rise as a result of the increasing use of mobile phones and smart computing devices in various developing economies.
The industry of electronic packaging involves the creation of cutting-edge packaging concepts, methods, and technology. It is essential to protect intellectual property (IP) rights to promote innovation and prevent unauthorized use or replication. Enforcing IP protection, can be challenging, especially in areas with lax IP laws and enforcement practices. However, electronic packaging can have expensive material costs, production procedures, and equipment requirements. This may make it more difficult for smaller businesses with limited resources to adopt cutting-edge packaging methods.
Government limitations placed into effect in the wake of the COVID-19 epidemic have prompted the manufacturers of electronic packages to halt production, disrupting the supply chain for the whole semiconductor manufacturing and supply business. The demand for products powered by semiconductors has decreased as a result of the COVID-19 epidemic. Due to the lockdown situation, gadget production has stopped. The worldwide electronic packaging market's entire supply chain has been disrupted as a result.
Due to the rising demand for military and aerospace devices, such as data processing units, data display devices, computers, and aircraft guidance-control assemblies, the aerospace and defense segment is anticipated to hold the largest market share over the projection period. Furthermore, boosting the market revenue for electronic packaging is the need for high-grade military-grade packaging in the aerospace and defense sectors for naval warships, satellite communication onboard channels, and weapon control systems.
Because metal is mechanically robust, offers electromagnetic shielding, and can be quickly fabricated for prototypes and small production runs with minimal special tooling expense, the metal category is predicted to have the highest CAGR throughout the projection period. Moreover, because of their superior mechanical qualities, electrical conductivity, thermal conductivity, and shielding characteristics, metals are frequently used in a variety of packaging applications.
Due to expanding automotive infrastructure and rising sales of electric vehicles, the Asia-Pacific region is anticipated to hold the largest share of the market over the projection period. A strong youth population and rising middle-class incomes could increase demand in the automotive sector. IBEF estimates that 2,081,148 units of passenger cars, three-wheelers, two-wheelers, and quadricycles were produced in total in June 2022, which will fuel market expansion in the region.
Because of the demand from the electronics sector, technological advances, and substantial utilization areas in healthcare devices and packaging solutions, Asia-Pacific is predicted to have profitable growth. In the near future, market growth in the region is anticipated to be driven by an increase in the shrinking of electronic devices and goods across a wide range of electronic products. The National Investment Promotion and Facilitation Agency (NIPFA) reports that the demand for electronic products has significantly increased in India. Due to strong regulatory support, significant investments made by numerous stakeholders, and an increase in demand for electronic goods, it is predicted that the electronic manufacturing sector will reach US$220 billion by 2025.
Some of the key players in Electronic Packaging market include: AMETEK Inc., Blue Spark Technology, Dordan Manufacturing Company, E. I. du Pont de Nemours and Company, Excellatron Solid State, GY Packaging, Plastiform Inc., Infinite Power Solutions, Kiva Container Corporation, Primex Design & Fabrication, Quality Foam Packaging Inc., Sealed Air Corporation, The Box Co-Op and UFP Technologies, Inc.
In June 2022, Digimarc Corporation announced a partnership with Sealed Air, a global leader in digital printing and packaging, to bring product digitization to markets such as eCommerce fulfillment, industrials, and consumer goods at scale via smart packaging.
In March 2022, Intel revealed the first phase of its efforts to invest up to EUR 80 billion (USD 84 billion) in the European Union over the following decade across the semiconductor value chain, from Research and Development to production to advanced packaging technologies.