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市場調查報告書
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1598759

底部填充材料市場：按材料和應用分類 - 2025-2030 年全球預測

Underfill Materials Market by Material (Capillary Underfill, Molded Underfill, No Flow Underfill), Application (Ball Grid Array, Chip Scale Packaging, Flip Chips) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 189 Pages | 商品交期: 最快1-2個工作天內

價格

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2023年底部填充材料市場價值為9.8476億美元，預計到2024年將達到10.2418億美元，複合年成長率為7.02%，到2030年將達到15.8433億美元。

底部填充材料在微電子領域至關重要，可確保機械支撐、提高可靠性並保護敏感元件免受環境應力和熱膨脹不匹配的影響。隨著電子元件小型化的趨勢，這些材料主要應用於晶片級封裝、覆晶應用和先進封裝技術等領域。最終用途跨越多個領域，包括消費性電子、汽車、通訊和軍事，反映了其多功能性和廣泛的影響。對更高性能和更緊湊設備的需求正在推動底部填充材料的採用。該市場的主要成長要素包括家用電子電器需求的增加、5G引入帶來的通訊基礎設施的進步以及電動車和自動駕駛汽車帶來的汽車電子產品產業的快速成長。此外，加大研發投入以創新環保、高效能的底部填充解決方案也正在創造新的機會。公司可以透過專注於生物相容性和生物分解性材料並響應消費者向永續性的轉變來利用這些優勢。然而，市場也面臨挑戰，例如先進底部填充材料的高成本以及與其整合和應用流程相關的複雜性，阻礙了廣泛採用。產業的快速發展需要持續的技術進步，因此持續創新和跨產業合作可以產生顯著的效益。潛在的創新領域包括開發具有改進的導熱性和穩定性的材料，以及減少固化時間以提高組裝過程的效率。此外，探索能夠承受極端溫度和機械應力的新組合物可能會開闢新的市場途徑。整體而言，為了保持競爭力並在競爭格局中展現領導地位，公司必須透過投資創新研究和採用綠色實踐來克服自身限制。

主要市場統計
基準年[2023] 98476萬美元
預計年份 [2024] 1,024,180,000 美元
預測年份 [2030] 1,584.33 百萬美元
複合年成長率（%） 7.02%

市場動態：快速發展的底部填充材料市場的關鍵市場洞察

供需的動態交互作用正在改變底部填充材料市場。透過了解這些不斷變化的市場動態，公司可以準備好做出明智的投資決策、完善策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險，同時也能幫助消費行為及其對製造業的影響。

  • 市場促進因素
    • 全球對電子設備小型化的關注日益增加
    • 半導體製造領域的投資與舉措不斷增加
    • 電子元件在航太和汽車領域的使用增加
  • 市場限制因素
    • 開發和生產高品質底部填充材料的成本較高
  • 市場機會
    • 開發環保底部填充材料以滿足永續性計劃
    • 新產品的推出以及底部填充材料成分和製造程序的創新
  • 市場挑戰
    • 與底部填充材料相關的技術限制

波特五力：駕馭底部填充材料市場的策略工具

波特的五力框架是了解底部填充材料市場競爭格局的重要工具。波特的五力框架為評估公司的競爭地位和探索策略機會提供了清晰的方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢，解決弱點並避免潛在的挑戰，從而確保更強大的市場地位。

PESTLE分析：了解底部填充材料市場的外部影響

外部宏觀環境因素在塑造底部填充材料市場的績效動態方面發揮著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素，公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化，並幫助他們做出積極主動的決策。

市場佔有率分析 了解底部填充材料市場的競爭狀況

對底部填充材料市場的詳細市場佔有率分析可以對供應商的表現進行全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、分散和整合的趨勢，為供應商提供了製定策略決策所需的洞察力，使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV定位矩陣底部填充材料市場供應商績效評估

FPNV定位矩陣是評估底部填充材料市場供應商的重要工具。此矩陣允許業務組織根據商務策略和產品滿意度評估供應商，從而做出與其目標相符的明智決策。這四個象限使您能夠清晰、準確地分類供應商，並確定最能滿足您的策略目標的合作夥伴和解決方案。

策略分析和建議描繪了底部填充材料市場的成功之路

底部填充材料市場的策略分析對於旨在加強其在全球市場的影響力的公司至關重要。透過考慮關鍵資源、能力和績效指標，公司可以識別成長機會並努力改進。這種方法使您能夠克服競爭環境中的挑戰，利用新的商機並取得長期成功。

本報告對市場進行了全面分析，涵蓋關鍵重點領域：

1. 市場滲透率：詳細檢視當前市場環境、主要企業的廣泛資料、評估其在市場中的影響力和整體影響力。

2. 市場開拓：辨識新興市場的成長機會，評估現有領域的擴張潛力，並提供未來成長的策略藍圖。

3. 市場多元化：分析近期產品發布、開拓地區、關鍵產業進展、塑造市場的策略投資。

4. 競爭評估與情報：徹底分析競爭格局，檢驗市場佔有率、業務策略、產品系列、認證、監管核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新：重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題，幫助相關人員做出明智的決策：

1.目前的市場規模和未來的成長預測是多少？

2. 哪些產品、區隔市場和地區提供最佳投資機會？

3.塑造市場的主要技術趨勢和監管影響是什麼？

4.主要廠商的市場佔有率和競爭地位如何？

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 電子設備的小型化正在引起全世界越來越多的關注。
      • 加大半導體製造投入與力度
      • 航太和汽車領域電子元件的增加
    • 抑制因素
      • 開發和生產高品質底部填充材料的成本很高。
    • 機會
      • 開發環保底部填充材料以滿足永續性計劃
      • 新產品的推出以及底部填充材料成分和製造程序的創新
    • 任務
      • 與底部填充材料相關的技術限制
  • 市場區隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社群
    • 技術的
    • 合法地
    • 環境

第6章底部填充材料市場：依材料分類

  • 毛細管底部填充
  • 模壓底部填充
  • 無流動底部填充

第7章底部填充材料市場：依應用分類

  • 球柵陣列
  • 晶片級封裝
  • 覆晶

第8章北美和南美底部填充材料市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第9章亞太地區底部填充材料市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第10章歐洲、中東和非洲底部填充材料市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第11章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
  • 戰略分析和建議

公司名單

  • AI Technology, Inc.
  • AIM Metals & Alloys LP
  • Bondline Electronic Adhesives, Inc.
  • CAPLINQ Corporation
  • Chemtronics International Ltd
  • Dycotec Materials Ltd
  • Epoxy Technology Inc
  • Essemtec AG
  • HB Fuller Company
  • Henkel AG & Co. KGaA
  • Hitachi Chemical Company
  • Indium Corporation
  • MacDermid Alpha Electronics Solutions
  • Master Bond, Inc.
  • NAGASE（EUROPA）GmbH
  • Namics Corporation
  • Nordson Corporation
  • Panasonic Corporation
  • Parker Hannifin Corporation
  • Shenzhen Cooteck Electronic Material Technology Co., Ltd
  • SOMAR Corporation
  • Sumitomo Bakelite Co., Ltd.
  • Won Chemical Co.,Ltd.
  • YINCAE Advanced Materials, LLC
  • Zymet, Inc.
Product Code: MRR-C002B1C9975E

The Underfill Materials Market was valued at USD 984.76 million in 2023, expected to reach USD 1,024.18 million in 2024, and is projected to grow at a CAGR of 7.02%, to USD 1,584.33 million by 2030.

Underfill materials are crucial in microelectronics for ensuring mechanical support, enhancing reliability, and protecting delicate components from environmental stress and thermal expansion mismatches. Necessitated by the growing trend towards miniaturization in electronic devices, these materials are primarily applied in areas such as chip-scale packaging, flip-chip applications, and advanced packaging technologies. The end-use scope spans across various sectors including consumer electronics, automotive, telecommunications, and military sectors, reflecting their versatility and wide-reaching impact. The demand for higher performance, more compact devices drives the adoption of underfill materials. Key growth factors in this market include the rising consumer electronics demand, advancements in telecommunication infrastructure with 5G implementation, and the burgeoning automotive electronics sector driven by electric and autonomous vehicles. Additionally, the increasing investments in research and development to innovate environmentally friendly and high-performance underfill solutions present fresh opportunities. Companies can capitalize on these by focusing on biocompatible and biodegradable materials, meeting the consumer shift towards sustainability. However, the market does face challenges, including the high cost of advanced underfill materials and the complexities associated with their integration and application processes, which can hinder widespread adoption. The industry's rapid evolution requires consistent technological advancements; hence, continuous innovation and cross-industry collaborations can present significant benefits. Potential areas for innovation include developing materials with enhanced thermal conductivity and stability, alongside reduced curing times to improve efficiency in the assembly processes. Additionally, exploring new compositions that can withstand extreme temperatures and mechanical stresses could open new market avenues. Overall, while the market for underfill materials is vibrant and poised for growth, businesses must navigate its limitations by investing in innovative research and embracing environmentally friendly practices to sustain competitiveness and leadership in this evolving landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 984.76 million
Estimated Year [2024] USD 1,024.18 million
Forecast Year [2030] USD 1,584.33 million
CAGR (%) 7.02%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Underfill Materials Market

The Underfill Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing focus on miniaturization of electronic devices worldwide
    • Rising investments and initiatives for semiconductor manufacturing
    • Increasing deployment of electronic components across aerospace and automotive sectors
  • Market Restraints
    • High cost of development and production of high-quality underfill materials
  • Market Opportunities
    • Development of eco-friendly underfills materials to meet sustainability initiatives
    • Novel product launches and innovations in underfill material composition and manufacturing procedures
  • Market Challenges
    • Technical limitations associated with underfill materials

Porter's Five Forces: A Strategic Tool for Navigating the Underfill Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Underfill Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Underfill Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Underfill Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Underfill Materials Market

A detailed market share analysis in the Underfill Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Underfill Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Underfill Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Underfill Materials Market

A strategic analysis of the Underfill Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Underfill Materials Market, highlighting leading vendors and their innovative profiles. These include AI Technology, Inc., AIM Metals & Alloys LP, Bondline Electronic Adhesives, Inc., CAPLINQ Corporation, Chemtronics International Ltd, Dycotec Materials Ltd, Epoxy Technology Inc, Essemtec AG, H.B. Fuller Company, Henkel AG & Co. KGaA, Hitachi Chemical Company, Indium Corporation, MacDermid Alpha Electronics Solutions, Master Bond, Inc., NAGASE (EUROPA) GmbH, Namics Corporation, Nordson Corporation, Panasonic Corporation, Parker Hannifin Corporation, Shenzhen Cooteck Electronic Material Technology Co., Ltd, SOMAR Corporation, Sumitomo Bakelite Co., Ltd., Won Chemical Co.,Ltd., YINCAE Advanced Materials, LLC, and Zymet, Inc..

Market Segmentation & Coverage

This research report categorizes the Underfill Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Capillary Underfill, Molded Underfill, and No Flow Underfill.
  • Based on Application, market is studied across Ball Grid Array, Chip Scale Packaging, and Flip Chips.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing focus on miniaturization of electronic devices worldwide
      • 5.1.1.2. Rising investments and initiatives for semiconductor manufacturing
      • 5.1.1.3. Increasing deployment of electronic components across aerospace and automotive sectors
    • 5.1.2. Restraints
      • 5.1.2.1. High cost of development and production of high-quality underfill materials
    • 5.1.3. Opportunities
      • 5.1.3.1. Development of eco-friendly underfills materials to meet sustainability initiatives
      • 5.1.3.2. Novel product launches and innovations in underfill material composition and manufacturing procedures
    • 5.1.4. Challenges
      • 5.1.4.1. Technical limitations associated with underfill materials
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Underfill Materials Market, by Material

  • 6.1. Introduction
  • 6.2. Capillary Underfill
  • 6.3. Molded Underfill
  • 6.4. No Flow Underfill

7. Underfill Materials Market, by Application

  • 7.1. Introduction
  • 7.2. Ball Grid Array
  • 7.3. Chip Scale Packaging
  • 7.4. Flip Chips

8. Americas Underfill Materials Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Underfill Materials Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Underfill Materials Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. AI Technology, Inc.
  • 2. AIM Metals & Alloys LP
  • 3. Bondline Electronic Adhesives, Inc.
  • 4. CAPLINQ Corporation
  • 5. Chemtronics International Ltd
  • 6. Dycotec Materials Ltd
  • 7. Epoxy Technology Inc
  • 8. Essemtec AG
  • 9. H.B. Fuller Company
  • 10. Henkel AG & Co. KGaA
  • 11. Hitachi Chemical Company
  • 12. Indium Corporation
  • 13. MacDermid Alpha Electronics Solutions
  • 14. Master Bond, Inc.
  • 15. NAGASE (EUROPA) GmbH
  • 16. Namics Corporation
  • 17. Nordson Corporation
  • 18. Panasonic Corporation
  • 19. Parker Hannifin Corporation
  • 20. Shenzhen Cooteck Electronic Material Technology Co., Ltd
  • 21. SOMAR Corporation
  • 22. Sumitomo Bakelite Co., Ltd.
  • 23. Won Chemical Co.,Ltd.
  • 24. YINCAE Advanced Materials, LLC
  • 25. Zymet, Inc.

LIST OF FIGURES

  • FIGURE 1. UNDERFILL MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. UNDERFILL MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL UNDERFILL MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. UNDERFILL MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. UNDERFILL MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. UNDERFILL MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL UNDERFILL MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. UNDERFILL MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY CAPILLARY UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MOLDED UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY NO FLOW UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY CHIP SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY FLIP CHIPS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 17. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 18. ARGENTINA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 19. ARGENTINA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 20. BRAZIL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 21. BRAZIL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 22. CANADA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 23. CANADA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 24. MEXICO UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 25. MEXICO UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 26. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 27. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 29. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 30. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 32. AUSTRALIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 33. AUSTRALIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 34. CHINA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 35. CHINA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 36. INDIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 37. INDIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. INDONESIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 39. INDONESIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. JAPAN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 41. JAPAN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 42. MALAYSIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 43. MALAYSIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. PHILIPPINES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 45. PHILIPPINES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 46. SINGAPORE UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 47. SINGAPORE UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. SOUTH KOREA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 49. SOUTH KOREA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 50. TAIWAN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 51. TAIWAN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 52. THAILAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 53. THAILAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. VIETNAM UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 55. VIETNAM UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 56. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 57. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 58. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 59. DENMARK UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 60. DENMARK UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. EGYPT UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 62. EGYPT UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. FINLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 64. FINLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 65. FRANCE UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 66. FRANCE UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 67. GERMANY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 68. GERMANY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. ISRAEL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 70. ISRAEL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 71. ITALY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 72. ITALY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. NETHERLANDS UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 74. NETHERLANDS UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. NIGERIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 76. NIGERIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 77. NORWAY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 78. NORWAY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. POLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 80. POLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. QATAR UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 82. QATAR UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 83. RUSSIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 84. RUSSIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. SAUDI ARABIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 86. SAUDI ARABIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 87. SOUTH AFRICA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 88. SOUTH AFRICA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 89. SPAIN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 90. SPAIN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 91. SWEDEN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 92. SWEDEN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 93. SWITZERLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 94. SWITZERLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. TURKEY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 96. TURKEY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. UNITED ARAB EMIRATES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED ARAB EMIRATES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 99. UNITED KINGDOM UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 100. UNITED KINGDOM UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. UNDERFILL MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 102. UNDERFILL MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023