底部填充材市場:市場規模及預測(2024年～2025年)

該報告調查了全球底部填充材料市場，並提供了詳細的市場信息，例如市場規模、底部填充材料數量和到 2028 年的收入預測、市場佔有率、影響行業的供應鏈以及技術趨勢。

目錄

執行摘要

第一章簡介

第 2 章底部填充材料

• 毛細管底部填充
• 模壓底部填充膠
• 非導電膏
• 非導電薄膜
• 技術趨勢
• 唇片和 WLP 的底部填充材料市場
• 封裝底部填充膠
• 底部填充膠供應商

This report:

• Provides detailed market analysis including market size, forecasts, and market share of the global underfill materials market.
• Covered information includes revenues & units, and a regional market analysis
• Forecasts for underfill materials and revenues out to 2028
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the underfill materials industry.

TABLE OF CONTENTS

EXECUTIVE SUMMARY

1. INTRODUCTION

• 1.1. Methodology
• 1.2. Assumptions
• 1.3. Report Organization

7. UNDERFILL MATERIALS

• 7.1. Capillary Underfill
• 7.2. Molded Underfill
• 7.3. Non-conductive Paste
• 7.4. Non-conductive Film
• 7.5. Technology Trends
• 7.6. Underfill Material Market for lip Chip and WLPs
• 7.7. Package Underfill
• 7.8. Underfill Suppliers