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市場調查報告書
商品編碼
1457004

密封包裝市場－2024年至2029年預測

Hermetic Packaging Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 144 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計密封包裝市場在整個預測期內的複合年成長率為 4.89%，到 2029 年市場規模將達到 58.57 億美元。這比 2022 年的 41.93 億美元大幅成長。

氣密包裝市場是更廣泛的包裝行業中的一個專業領域，專注於氣密包裝解決方案的創建和生產。密封包裝為敏感電子和光電元件製造氣密和完全密封的外殼。這種特殊的封裝型態對於保護這些組件免受環境因素（例如濕氣、氣體和其他可能損害功能和可靠性的污染物）的影響至關重要。

市場促進因素：

  • 對可靠耐用包裝不斷成長的需求推動了成長

有幾個因素促進了密封包裝市場的成長。關鍵促進因素之一是電子產業對可靠耐用的包裝解決方案的需求不斷成長。隨著電子設備變得越來越小、越來越複雜，越來越需要保護精密組件免受外部因素的影響。

即使在惡劣的環境下，密封封裝也能確保電子和光電設備的長壽命和最佳性能，使其成為航太、汽車、醫療設備、IT 和通訊各種應用的重要解決方案。此外，汽車和航太等需要嚴格安全和可靠性標準的行業的成長正在推動對密封包裝的需求。這些產業要求電子元件能夠在高溫、壓力差和接觸刺激性化學品等極端條件下成功運作。密封包裝可針對這些惡劣條件提供可靠的屏蔽，有助於市場擴張。

此外，醫療領域對密封包裝市場做出了重大貢獻。植入式醫療設備、感測器和其他電子元件在醫療應用中的使用越來越多，需要封裝解決方案來確保這些關鍵設備的使用壽命和可靠性。氣密包裝可以提供安全且受保護的環境，在醫療產業中變得越來越重要。

  • 電子業的成長帶動市場

電子產業的成長已成為密封封裝市場擴張的關鍵催化劑。隨著電子產業不斷發展和創新，對在多樣化和充滿挑戰的環境中運行的小型高性能電子元件的需求不斷成長。

氣密包裝在滿足這些需求方面發揮關鍵作用，它提供了一個保護屏障，保護精密的電子元件免受外部因素的影響，並確保可靠性和長壽命。印度電子業國內生產的成長對電子產品出口的成長做出了重大貢獻，並推動了密封包裝市場的成長。隨著印度成為電子製造的參與企業，對密封包裝等可靠包裝解決方案的需求對於確保優質電子產品的出口變得至關重要。隨著印度電子產品出口的擴大，影響密封包裝市場成長的關鍵因素之一是專注於生產符合國際品質標準的零件。

許多進口電子產品的國家都有嚴格的品質和可靠性要求。氣密包裝為敏感電子元件提供了氣密的保護外殼，使這些元件在運輸和使用過程中保持功能性和完整性。這種可靠性是增強海外買家信心、促進印度電子產品出口的關鍵因素。

此外，隨著印度國內電子產品產能的增加，人們越來越關注複雜和先進電子產品的製造。據印度投資局稱，印度國內生產目前正以 13% 的複合年成長率成長，從 2017 會計年度的 490 億美元增至 2023 會計年度的 1,010 億美元。到2026會計年度，該國的電子產品出口預計將達到1,200億美元。

這些先進設備通常包含對環境因敏感的組件，因此密封封裝成為保持其性能的重要元素。在製造過程中採用密封包裝可以確保最終用戶和全球市場的產品耐用性和可靠性，使印度在電子產品出口方面更具競爭力。

  • 北美市場預計將穩定成長。

密封包裝提供的高性能特性，例如防止氣體和濕氣傳輸以及幫助組件形成系統，使得此類設備對於航太、汽車、軍事和電子等關鍵領域至關重要。在美國，由於這些關鍵最終用戶的加速成長以及保護敏感電氣元件的努力，未來幾年對密封包裝的需求可能會成長。

例如，根據通用航空製造商協會的數據，2023年第二季度美國製造的由活塞、渦輪螺旋槳和渦輪飛機組成的飛機總數為538架，比2022年第三季度成長18.5% ，以及2023年。比今年第一季成長了55.5%。

此外，除了航太領域外，汽車領域還依賴氣密包裝和密封來確保感測器、安全氣囊和防翻滾裝置的功能。根據國際汽車工業組織預測，2022年美國汽車產量將達到1,006萬輛，較2021年增加10%。

同樣，消費性電子產品需求的蓬勃發展以及能源領域的投資正在推動市場呈上升趨勢。此外，大氣壓力和環境條件的變化正在加速提高電子元件生產率並防止其損壞的需求，進一步刺激了氣密包裝和密封產品的整體市場需求。

主要進展

  • 2023 年 3 月，CPS Technologies Corporation 宣布已收到一家著名航太電子製造商的 500 萬美元密封封裝訂單。這些訂單旨在支援美國的各種太空任務和大規模生產戰術計劃。 CPS 專門提供 H 級和 K 級密封包裝，專為承受低地球軌道、中地球軌道、地球靜止赤道軌道衛星和其他深空探勘環境中遇到的惡劣條件而設計。
  • 2022 年 1 月，肖特利用其在玻璃和金屬密封方面的豐富專業知識，推出專為擴增實境 (AR) 應用設計的氣密封裝組件。這些創新解決方案滿足了 RGB 雷射晶片和 MEMS 鏡子等 AR 技術的需求。肖特首次在 SPIE AR/VR/MR 展會上展示 SCHOTT(R) LightView 封裝元件。這些尖端封裝解決方案的主要目標是小型化和提高擴增實境光引擎系統的光電性能。

目錄

第1章 簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章密封包裝市場：依構成

  • 介紹
  • 多層陶瓷封裝
  • 金屬罐包裝
  • 壓製陶瓷包裝

第6章密封包裝市場：依類型

  • 介紹
  • 陶瓷金屬密封
  • 玻璃材質的封裝
  • 鈍化玻璃
  • 應答器玻璃
  • 簧片玻璃

第7章密封包裝市場：依應用分類

  • 介紹
  • 電晶體
  • 雷射
  • 光電二極體
  • 氣囊點火器
  • 其他

第8章密封包裝市場：按最終用戶行業

  • 介紹
  • 軍事和國防
  • 航太
  • 車
  • 能源
  • 其他

第9章密封包裝市場：按地區

  • 介紹
  • 北美洲
  • 南美洲
  • 歐洲
  • 中東/非洲
  • 亞太地區

第10章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第11章 公司簡介

  • Vertiv Group Corporation
  • SCHOTT AG
  • AMETEK
  • Amkor Technology
  • Texas Instruments
  • Teledyne Microelectronics
  • Kyocera Corporation
  • Materion Corporation
  • Egide
  • Micross Components
  • Legacy Technologies
  • Hermetic Solutions Group
簡介目錄
Product Code: KSI061612330

The hermetic packaging market is expected to experience a CAGR of 4.89% throughout the forecast period, reaching a market size of US$5.857 billion by 2029. This represents a substantial increase from US$4.193 billion recorded in 2022.

The Hermetic packaging market is a specialized sector within the broader packaging industry, focusing on the creation and production of hermetically sealed packaging solutions. Hermetic packaging involves creating airtight and completely sealed enclosures for sensitive electronic and optoelectronic components. This specialized form of packaging is crucial in protecting these components from environmental factors such as moisture, gases, and other contaminants that could compromise their functionality and reliability.

Market Drivers:

  • Rise in demand for reliable and durable packaging fuels the growth

Several factors are contributing to the Hermetic packaging market growth. One significant driver is the increasing demand for reliable and durable packaging solutions in the electronics industry. As electronic devices become more compact and sophisticated, the need to protect sensitive components from external elements becomes paramount.

Hermetic packaging ensures the longevity and optimal performance of electronic and optoelectronic devices in challenging environments, making it an indispensable solution for various applications, including aerospace, automotive, medical devices, and telecommunications. Furthermore, the growth of industries like automotive and aerospace, where stringent safety and reliability standards are essential, is propelling the demand for Hermetic packaging. These industries often require electronic components to function flawlessly under extreme conditions, such as high temperatures, pressure differentials, and exposure to harsh chemicals. Hermetic packaging provides a reliable shield against these challenging conditions, contributing to the market's expansion.

In addition, the healthcare sector is emerging as a significant contributor to the Hermetic packaging market. The increasing use of implantable medical devices, sensors, and other electronic components in medical applications necessitates packaging solutions that ensure the longevity and reliability of these critical devices. Hermetic packaging, with its ability to provide a secure and protective environment, is becoming increasingly integral in the healthcare industry.

  • Growth in the electronics industry propels the market.

The growth in the electronic industry has emerged as a significant catalyst for the Hermetic packaging market expansion. As the electronic industry continues to evolve and innovate, there is an increasing demand for compact, high-performance electronic components that can operate in diverse and challenging environments.

Hermetic packaging plays a crucial role in meeting these demands by providing a protective barrier that shields sensitive electronic elements from external factors, ensuring their reliability and longevity. The growth of India's domestic production in the electronics sector has significantly contributed to an increase in electronics exports, consequently driving the Hermetic packaging market growth. As India establishes itself as a prominent player in electronics manufacturing, the need for reliable packaging solutions, such as Hermetic packaging, becomes crucial to ensure the export of high-quality electronic products. One of the key factors influencing the Hermetic packaging market growth in tandem with India's electronics export expansion is the emphasis on producing components that meet international quality standards.

Many countries that import electronic goods have stringent quality and reliability requirements. Hermetic packaging, with its ability to provide airtight and protective enclosures for sensitive electronic components, ensures that these components maintain their functionality and integrity during transportation and use. This reliability is a significant factor in boosting the confidence of international buyers and promoting the export of Indian electronic products.

Furthermore, as India's domestic electronics production capabilities grow, there is an increased focus on manufacturing complex and advanced electronic devices. According to Invest India, at present, India's domestic production has increased at a CAGR of 13% from $49 Bn in FY17 to $101 Bn in FY23. The country's electronics exports are expected to reach $120 Bn by FY26.

These sophisticated devices often contain components that are sensitive to environmental factors, making Hermetic packaging an essential element in preserving their performance. The adoption of Hermetic packaging in the manufacturing process enhances the export competitiveness of Indian electronics by assuring end-users and global markets of the durability and reliability of the products.

  • It is projected that the market in North America will grow steadily.

High-performance features provided by hermetic packages such as preventing gas & moisture permeation and helping components form systems have made such instruments an integral part of major sectors such as aerospace, automotive, military, and electronics. With the bolstering growth of such major end-users in the United States coupled with the favourable efforts to protect sensitive electrical components, the demand for hermetic packages is expected to experience a growing trend in the coming years.

For instance, according to the General Aviation Manufacturers Association, in Q2 of 2023, the total number of aircraft consisting of piston, turboprop, and turbine planes manufactured in the United States stood at 538 units which signified an increase of 18.5% over Q3 2022 and 55.5% over Q1 2023.

Moreover, besides aerospace, the automotive sector relies upon hermetic packages & seals to ensure the functionality of sensors, airbags, and rollover devices. According to the International Organization of Motor Vehicle Manufacturers, in 2022, the USA's automotive production witnessed a 10% increase over 2021's production with volume reaching up to 10.06 million units.

Likewise, booming consumer electronic demand coupled with investments in the energy sector has resulted in an upward market trajectory. Additionally, the changes in atmospheric pressure and environmental conditions have accelerated the need for providing better production to electronics components and preventing their damage which has further stimulated the overall market demand for hermetic packages and seal products.

Key Developments:

  • In March 2023, CPS Technologies Corporation revealed that it had received $5.0M worth of purchase orders for hermetic packages from a prominent aerospace electronics manufacturer. These orders are intended to support various U.S. space missions and large-scale production tactical programs. CPS specializes in providing hermetic packages classified as Class-H and Class-K, which are designed to withstand extreme conditions encountered in environments like Low Earth Orbit, Medium Earth Orbit, and Geosynchronous Equatorial Orbit satellites, as well as other deep space initiatives.
  • In January 2022, SCHOTT introduced hermetic packaging components designed specifically for augmented reality (AR) applications, leveraging its extensive expertise in glass-to-metal sealing. These innovative solutions cater to the needs of AR technologies, including RGB laser chips and MEMS mirrors. SCHOTT, for the first time, will be unveiling its SCHOTT(R) LightView packaging components at SPIE AR/VR/MR. The primary goal of these cutting-edge packaging solutions is to downsize and improve the optoelectronic performance of augmented reality light engine systems.

Segmentation:

By Configuration:

  • Multilayer Ceramic Packages
  • Metal Can Packages
  • Pressed Ceramic Packages

By Type:

  • Ceramic Metal Sealing
  • Glass Material Sealing
  • Passivation Glass
  • Transponder Glass
  • Reed Glass

By Application:

  • Transistors
  • Lasers
  • Photo Diodes
  • Airbag Ignitors
  • Others

By End-User Industry:

  • Military and Defence
  • Aerospace
  • Automotive
  • Energy
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • UK
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Indonesia
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. HERMETIC PACKAGING MARKET, BY CONFIGURATION

  • 5.1. Introduction
  • 5.2. Multilayer Ceramic Packages
    • 5.2.1. Market Opportunities and Trends
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. Metal Can Packages
    • 5.3.1. Market Opportunities and Trends
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. Pressed Ceramic Packages
    • 5.4.1. Market Opportunities and Trends
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness

6. HERMETIC PACKAGING MARKET, BY TYPE

  • 6.1. Introduction
  • 6.2. Ceramic Metal Sealing
    • 6.2.1. Market Opportunities and Trends
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Glass Material Sealing
    • 6.3.1. Market Opportunities and Trends
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Passivation Glass
    • 6.4.1. Market Opportunities and Trends
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Transponder Glass
    • 6.5.1. Market Opportunities and Trends
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness
  • 6.6. Reed Glass
    • 6.6.1. Market Opportunities and Trends
    • 6.6.2. Growth Prospects
    • 6.6.3. Geographic Lucrativeness

7. HERMETIC PACKAGING MARKET, BY APPLICATION

  • 7.1. Introduction
  • 7.2. Transistors
    • 7.2.1. Market Opportunities and Trends
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. Lasers
    • 7.3.1. Market Opportunities and Trends
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. Photo Diodes
    • 7.4.1. Market Opportunities and Trends
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Airbag Ignitors
    • 7.5.1. Market Opportunities and Trends
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness
  • 7.6. Others
    • 7.6.1. Market Opportunities and Trends
    • 7.6.2. Growth Prospects
    • 7.6.3. Geographic Lucrativeness

8. HERMETIC PACKAGING MARKET, BY END-USER INDUSTRY

  • 8.1. Introduction
  • 8.2. Military and Defence
    • 8.2.1. Market Opportunities and Trends
    • 8.2.2. Growth Prospects
    • 8.2.3. Geographic Lucrativeness
  • 8.3. Aerospace
    • 8.3.1. Market Opportunities and Trends
    • 8.3.2. Growth Prospects
    • 8.3.3. Geographic Lucrativeness
  • 8.4. Automotive
    • 8.4.1. Market Opportunities and Trends
    • 8.4.2. Growth Prospects
    • 8.4.3. Geographic Lucrativeness
  • 8.5. Energy
    • 8.5.1. Market Opportunities and Trends
    • 8.5.2. Growth Prospects
    • 8.5.3. Geographic Lucrativeness
  • 8.6. Others
    • 8.6.1. Market Opportunities and Trends
    • 8.6.2. Growth Prospects
    • 8.6.3. Geographic Lucrativeness

9. HERMETIC PACKAGING MARKET, BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. North America
    • 9.2.1. By Configuration
    • 9.2.2. By Type
    • 9.2.3. By Application
    • 9.2.4. By End User
    • 9.2.5. By Country
      • 9.2.5.1. United States
        • 9.2.5.1.1. Market Opportunities and Trends
        • 9.2.5.1.2. Growth Prospects
      • 9.2.5.2. Canada
        • 9.2.5.2.1. Market Opportunities and Trends
        • 9.2.5.2.2. Growth Prospects
      • 9.2.5.3. Mexico
        • 9.2.5.3.1. Market Opportunities and Trends
        • 9.2.5.3.2. Growth Prospects
  • 9.3. South America
    • 9.3.1. By Configuration
    • 9.3.2. By Type
    • 9.3.3. By Application
    • 9.3.4. By End User
    • 9.3.5. By Country
      • 9.3.5.1. Brazil
        • 9.3.5.1.1. Market Opportunities and Trends
        • 9.3.5.1.2. Growth Prospects
      • 9.3.5.2. Argentina
        • 9.3.5.2.1. Market Opportunities and Trends
        • 9.3.5.2.2. Growth Prospects
      • 9.3.5.3. Others
        • 9.3.5.3.1. Market Opportunities and Trends
        • 9.3.5.3.2. Growth Prospects
  • 9.4. Europe
    • 9.4.1. By Configuration
    • 9.4.2. By Type
    • 9.4.3. By Application
    • 9.4.4. By End User
    • 9.4.5. By Country
      • 9.4.5.1. Germany
        • 9.4.5.1.1. Market Opportunities and Trends
        • 9.4.5.1.2. Growth Prospects
      • 9.4.5.2. France
        • 9.4.5.2.1. Market Opportunities and Trends
        • 9.4.5.2.2. Growth Prospects
      • 9.4.5.3. United Kingdom
        • 9.4.5.3.1. Market Opportunities and Trends
        • 9.4.5.3.2. Growth Prospects
      • 9.4.5.4. Spain
        • 9.4.5.4.1. Market Opportunities and Trends
        • 9.4.5.4.2. Growth Prospects
      • 9.4.5.5. Others
        • 9.4.5.5.1. Market Opportunities and Trends
        • 9.4.5.5.2. Growth Prospects
  • 9.5. Middle East and Africa
    • 9.5.1. By Configuration
    • 9.5.2. By Type
    • 9.5.3. By Application
    • 9.5.4. By End User
    • 9.5.5. By Country
      • 9.5.5.1. Saudi Arabia
        • 9.5.5.1.1. Market Opportunities and Trends
        • 9.5.5.1.2. Growth Prospects
      • 9.5.5.2. Israel
        • 9.5.5.2.1. Market Opportunities and Trends
        • 9.5.5.2.2. Growth Prospects
      • 9.5.5.3. Others
        • 9.5.5.3.1. Market Opportunities and Trends
        • 9.5.5.3.2. Growth Prospects
  • 9.6. Asia Pacific
    • 9.6.1. By Configuration
    • 9.6.2. By Type
    • 9.6.3. By Application
    • 9.6.4. By End User
    • 9.6.5. By Country
      • 9.6.5.1. China
        • 9.6.5.1.1. Market Opportunities and Trends
        • 9.6.5.1.2. Growth Prospects
      • 9.6.5.2. Japan
        • 9.6.5.2.1. Market Opportunities and Trends
        • 9.6.5.2.2. Growth Prospects
      • 9.6.5.3. South Korea
        • 9.6.5.3.1. Market Opportunities and Trends
        • 9.6.5.3.2. Growth Prospects
      • 9.6.5.4. India
        • 9.6.5.4.1. Market Opportunities and Trends
        • 9.6.5.4.2. Growth Prospects
      • 9.6.5.5. Indonesia
        • 9.6.5.5.1. Market Opportunities and Trends
        • 9.6.5.5.2. Growth Prospects
      • 9.6.5.6. Taiwan
        • 9.6.5.6.1. Market Opportunities and Trends
        • 9.6.5.6.2. Growth Prospects
      • 9.6.5.7. Others
        • 9.6.5.7.1. Market Opportunities and Trends
        • 9.6.5.7.2. Growth Prospects

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. Vertiv Group Corporation
  • 11.2. SCHOTT AG
  • 11.3. AMETEK
  • 11.4. Amkor Technology
  • 11.5. Texas Instruments
  • 11.6. Teledyne Microelectronics
  • 11.7. Kyocera Corporation
  • 11.8. Materion Corporation
  • 11.9. Egide
  • 11.10. Micross Components
  • 11.11. Legacy Technologies
  • 11.12. Hermetic Solutions Group