市場調查報告書
商品編碼
1494824
2030 年密封包裝市場預測:按產品、成分、應用、最終用戶和地區分類的全球分析Hermetic Packaging Market Forecasts to 2030 - Global Analysis By Product, Configuration, Application, End User and By Geography |
根據 Stratistics MRC 的數據,2024 年全球氣密包裝市場規模為 41.3 億美元,預計在預測期內將以 8.6% 的複合年成長率成長,到 2030 年達到 67.7 億美元。
氣密封裝是一種用於在氣密和防潮環境中密封電子元件、電子機械系統 (MEMS) 和其他敏感裝置的方法。這種封裝技術可防止氣體、濕氣和污染物的進入,確保封裝組件的可靠性和使用壽命。這對於航太、醫療設備和通訊等惡劣環境中的應用至關重要。氣密包裝對於保護高價值組件免受環境暴露造成的劣化和故障至關重要。
根據電動車銷售報告,2022年全球電動車年銷量將比與前一年同期比較成長55%,達到1,020萬輛,創下新高。根據國務院新聞辦預計,2024年,主要項目中,我國行動電話產量將比與前一年同期比較15.7億部,其中手機產量將比上年成長6.9 %。部。
半導體產業的成長
半導體產業的成長是密封封裝市場的關鍵促進因素。隨著對先進電子和小型化設備的需求增加,對可靠和耐用的半導體元件的需求變得至關重要。氣密包裝提供氣密密封,並保護敏感的半導體元件免受濕氣、灰塵和溫度波動等環境因素的影響。隨著消費性電子、汽車、醫療保健和航太領域應用的激增,半導體產業的擴張直接推動了對密封封裝解決方案的需求,以確保電子元件的最佳功能和可靠性。
有限的應用
氣密包裝市場面臨幾個阻礙其成長的因素。關鍵挑戰之一是與氣密密封材料和工藝相關的高成本,這對於中小型企業來說可能令人望而卻步。此外,製造密封零件所需的複雜性和精度可能會限制生產的擴充性。法規遵從性和對專用設備的需求進一步增加了營運成本和複雜性。高品質氣密密封所需的技術純熟勞工和技術專業知識有限,也限制了市場的成長。
航太和國防需求不斷成長
航太和國防領域不斷成長的需求為氣密密封市場創造了巨大的機會。氣密密封包裝以其氣密密封的能力而聞名,對於在惡劣環境(例如航太和國防應用中的環境)中保護敏感電子元件至關重要。技術的進步推動了對更小、更強大的電子設備的需求,增加了對可靠密封封裝解決方案的需求。航太和國防相關企業需要堅固的包裝來確保關鍵系統的完整性和性能,這使得密封包裝成為其供應鏈的重要組成部分。隨著這些行業的不斷擴張和創新,這一趨勢預計將推動密封包裝市場的成長。
消費者偏好的變化
消費者偏好的變化對密封包裝市場構成了重大威脅。由於永續性、便利性和健康意識等因素,消費者需求不斷變化,傳統密封包裝可能面臨挑戰。消費者對環保包裝解決方案的要求越來越高,並且傾向於減少廢棄物的簡約設計。此外,對保證新鮮度和產品安全的包裝的需求仍然很高。為了減輕這一威脅,密封包裝領域的公司必須透過創新永續材料、融入智慧包裝技術並改進產品美觀來適應不斷變化的消費者偏好。
最近的 COVID-19 疫情正在影響密封包裝供應商的資源和財務狀況。疫情引發的全球健康危機正對全球金融市場、國家經濟和密封包裝商品最終用途業務產生負面影響。預計這將引發經濟衰退並對密封電氣元件的需求產生負面影響。 COVID-19對密封包裝市場的長期影響預計取決於許多變量,包括大流行的全球傳播和持續時間、世界各國政府的反應以及疾病的嚴重程度。
預計鉛玻璃產業在預測期內將是最大的
預計簧片玻璃產業將出現良好的成長。磁簧玻璃可在數百萬次開關週期內為磁簧開關提供極為穩定的封裝。當分立電子元件需要密封、絕緣和保護時,玻璃管經常用於電子應用。然而,這種玻璃的用途通常是用於被動元件的氣密密封或電隔離。熱水鍋爐開關、皮帶感應器和汽車中控鎖系統均採用含鉛玻璃。
軍事和國防部門預計在預測期內複合年成長率最高
預計軍事和國防部門在預測期內將以最快的複合年成長率成長。這是因為,由於安全問題的加劇、國防預算的擴大和政治動態的變化,預計在預測期內對密封包裝的需求將會增加。由於公共和私人太空探勘支出的增加,密封包裝預計將成長。
由於政府在航太和國防工業方面的支出增加,預計北美在預測期內將佔據最大佔有率。航空業也依賴新飛機來推動氣密包裝的需求,使氣密包裝產業受益。在汽車產業,氣密密封用於確保翻車和安全氣囊系統中的感測器性能。因此,隨著安全氣囊裝置變得越來越普遍,市場可能需要氣密包裝。
由於能源需求增加、新興經濟體和國防支出增加等因素,亞太地區預計在預測期內將維持最高的複合年成長率。隨著中國、印度和韓國等新興國家軍事能力的增強,對敏感電子元件密封包裝的需求不斷增加。
According to Stratistics MRC, the Global Hermetic Packaging Market is accounted for $4.13 billion in 2024 and is expected to reach $6.77 billion by 2030 growing at a CAGR of 8.6% during the forecast period. Hermetic packaging is a method used to seal electronic components, microelectromechanical systems (MEMS), and other sensitive devices in an airtight and moisture-resistant environment. This packaging technique prevents the ingress of gases, moisture, and contaminants, ensuring the reliability and longevity of the enclosed components. It is crucial for applications in harsh environments, such as aerospace, medical devices, and telecommunications. Hermetic packaging is essential for protecting high-value components from degradation and failure due to environmental exposure.
According to the EV volumes report, annual sales of EVs reached a new high of 10.2 million units globally in 2022, up 55% from the previous year. According to the State of Council Information Office of The People's Republic of China, in 2024, in China among main items, mobile phone output increased 6.9 percent year on year to 1.57 billion units, with smartphone production up 1.9 percent year on year to 1.14 billion.
Growth in the semiconductor industry
The growth in the semiconductor industry is a significant driver of the hermetic packaging market. As demand for advanced electronics and miniaturized devices increases, the need for reliable and durable semiconductor components becomes critical. Hermetic packaging provides an airtight seal, protecting sensitive semiconductor components from environmental factors such as moisture, dust, and temperature fluctuations, which can compromise their performance and longevity. With the proliferation of applications in consumer electronics, automotive, healthcare, and aerospace sectors, the semiconductor industry's expansion directly boosts the demand for hermetic packaging solutions to ensure optimal functionality and reliability of electronic components.
Limited applications
The hermetic packaging market faces several restraints that could hinder its growth. One significant challenge is the high cost associated with hermetic packaging materials and processes, which can be prohibitive for smaller companies. Additionally, the complexity and precision required in manufacturing hermetically sealed components can limit production scalability. Regulatory compliance and the need for specialized equipment further add to operational costs and complexity. Market growth is also tempered by the limited availability of skilled labor and technical expertise necessary for high-quality hermetic sealing.
Increasing demand in aerospace and defense
The increasing demand in the aerospace and defense sectors presents a significant opportunity for the hermetic packaging market. Hermetic packaging, known for its ability to provide airtight seals, is crucial for protecting sensitive electronic components in harsh environments like those found in aerospace and defense applications. With advancements in technology driving the need for smaller and more powerful electronics, the demand for reliable hermetic packaging solutions is on the rise. Aerospace and defense companies require robust packaging to ensure the integrity and performance of critical systems, making hermetic packaging a vital component in their supply chain. This trend is expected to drive growth in the hermetic packaging market as these industries continue to expand and innovate.
Shifts in consumer preferences
Shifts in consumer preferences pose a significant threat to the hermetic packaging market. As consumer demands evolve, driven by factors such as sustainability, convenience, and health consciousness, traditional hermetic packaging may face challenges. Consumers increasingly seek eco-friendly packaging solutions and are inclined towards minimalist designs that reduce waste. Moreover, the demand for packaging that ensures freshness and product safety remains high. To mitigate this threat, companies in the hermetic packaging sector must adapt by innovating sustainable materials, incorporating smart packaging technologies, and enhancing product aesthetics to align with changing consumer preferences.
The latest COVID-19 epidemic has impacted the resources and financial situation of hermetic packaging suppliers. A worldwide health crisis brought on by the pandemic is having a negative impact on global financial markets, national economies, and end-use businesses for hermetic packaged goods. This is anticipated to trigger an economic slump and have a detrimental impact on the demand for electrical components that are hermetically sealed. The overall long-term impact of COVID-19 on the hermetic packaging market is anticipated to rely on a number of variables, including the pandemic's global spread and length, the response of different governments around the world, and the disease's severity.
The reed glass segment is expected to be the largest during the forecast period
The reed glasses segment is estimated to have a lucrative growth. Through millions of switching cycles, Reed Glasses offer incredibly stable encapsulation of reed switches. Where discrete electronic components need to be sealed, isolated, or protected, glass tubes are frequently employed in electronic applications. Yet, the purpose of this glass is typically to hermetically seal or electrically insulate passive components. Hot water boiler switches, belt sensors, and centralised locking systems for automobiles have all utilised reed glass.
The military & defense segment is expected to have the highest CAGR during the forecast period
The military & defense segment is anticipated to witness the fastest CAGR growth during the forecast period, due to the demand for hermetic packaging is anticipated to increase over the course of the forecast period as a result of rising security concerns, expanding defence budgets, and shifting political dynamics. Hermetic packaging is likely to experience growth due to rising public and private expenditure in space exploration.
North America is projected to have the highest largest share over the forecast period, owing to the region's government's increased spending on the aerospace and defence industries. Also, the aviation sector boosts demand for hermetic packaging by relying on new aircraft, which benefits the hermetic packaging sector. In the automotive industry, hermetic is utilised to guarantee sensor performance in rollover devices and airbag apparatus. As a result, the market might require hermetic packaging if airbag equipment becomes more common.
Asia Pacific is projected to hold the highest market CAGR during the forecast period owing to factors like rising energy needs, developing economies, and rising defence spending, this market is expanding in the area. The demand for hermetic packaging for delicate electronic components is increasing as a result of the growing military prowess of emerging nations like China, India, and South Korea.
Key players in the market
Some of the key players in Hermetic Packaging market include Ametek, Inc., Amkor Technology, Egide S.A., Kyocera Corporation, Mackin Technologies, Materion Corporation, NGK Spark Plug Co., Ltd., Schott AG, SGA Technologies, Sinclair Manufacturing Company, Special Hermetic Products, Inc., SST International, Teledyne Microelectronic Technologies and Willow Technologies
In May 2024, AMETEK Level Measurement Solutions (LMS) has launched BrightTEK, a state-of-the-art wireless Industrial Internet of Things (IIoT) solution designed to redefine operational efficiency and cost-effectiveness in various industries. Initially available for the North American market, BrightTEK leverages wireless technology to facilitate seamless data transmission from AMETEK LMS branded transmitters - including Magnetrol, Orion Instruments, Drexelbrook, SWI and B/W Controls, offering visibility to key variables to help optimise on-site operations.
In January 2024, Lumus Ltd., a developer of reflective waveguide technology for augmented reality (AR) eyewear, is expanding its five-year long partnership with international technology group Schott AG. To support this partnership, Schott is adding a new production facility to its site in Penang, Malaysia.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.